CN101765352A - Flat type heat conducting pipe and heat radiating module using same - Google Patents
Flat type heat conducting pipe and heat radiating module using same Download PDFInfo
- Publication number
- CN101765352A CN101765352A CN200810306488A CN200810306488A CN101765352A CN 101765352 A CN101765352 A CN 101765352A CN 200810306488 A CN200810306488 A CN 200810306488A CN 200810306488 A CN200810306488 A CN 200810306488A CN 101765352 A CN101765352 A CN 101765352A
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- heat
- type heat
- platypelloid type
- electronic elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a heat radiating module used for radiating heat of heating electronic elements. The heat radiating module comprises a flat type heat conducting pipe and a heat radiator, wherein the flat type heat conducting pipe comprises an evaporation section and a condensation section; the evaporation section is used for contacting the heating electronic elements; and the condensation section is connected with the heat radiator. The flat type heat conducting pipe also comprises a shell with an internal steam cavity and a capillary structure accommodated in the shell, wherein at least one concave part is concavely formed on a surface of the shell combined with the heating electronic elements towards the steam cavity; and the concave parts are used for accommodating the heating electronic elements.
Description
Technical field
The present invention relates to a kind of heat radiation module, particularly a kind of platypelloid type heat pipe and use the heat radiation module of this heat pipe.
Background technology
Along with developing rapidly of computer industry, CPU pursues high-speedization, and the heat dissipation problem that multifunction and miniaturization are derived is more and more serious, and this is more outstanding in the narrow and small electronic equipment in inner spaces such as notebook computer.If the heats that electronic component produced such as CPU in the notebook computer can't be distributed timely and effectively, will greatly influence the service behaviour of electronic component, also can reduce the useful life of electronic component simultaneously, therefore must dispel the heat to electronic component.
At present in the narrow and small electronic equipment in inner spaces such as notebook computer, because of being subject to narrow space, the heat radiation module of its use adopts the template heat pipe to conduct heat usually.Fig. 1 is that a traditional template heat pipe 70 places a situation that is provided with on the circuit board 80 of heat-generating electronic elements 90.The upper plate 71 of this template heat pipe 70 and lower plate 72 are the plane and are parallel to each other, the height of the steam cavity 75 of this heat pipe 70 no change in heat pipe 70.This heat-generating electronic elements 90 is convexly set in the top of this circuit board 80, the lower plate 72 of this heat pipe 70 contacts with heat-generating electronic elements 90, thereby make top plane the space 92 or more of the design space limit of heat pipe 70 at heat-generating electronic elements 90, like this, the volume of the steam cavity 75 of this heat pipe 70 is restricted, and then the heat transfer efficiency of heat pipe 70, the radiating efficiency of final influence heat radiation module have been limited.
Summary of the invention
In view of this, be necessary to provide a kind of heat radiation module that in narrow space, still has the platypelloid type heat pipe of good heat transfer efficiency and use this heat pipe.
A kind of platypelloid type heat pipe, be used to conduct the heat that heat-generating electronic elements produces, this platypelloid type heat pipe comprises the housing of an inner formation steam cavity and is contained in the interior capillary structure of this housing, be recessed to form at least one inner fovea part towards this steam cavity on this housing and the surface that heat-generating electronic elements combines, this inner fovea part is used to accommodate this heat-generating electronic elements.
A kind of heat radiation module, be used for dispelling the heat to heat-generating electronic elements, comprise a platypelloid type heat pipe and a radiator, this platypelloid type heat pipe comprises an evaporation section and a condensation segment, this evaporation section is used for contacting with heat-generating electronic elements, this condensation segment is connected with this radiator, this platypelloid type heat pipe comprises the housing of an inner formation steam cavity and is contained in the interior capillary structure of this housing, be recessed to form at least one inner fovea part towards this steam cavity on this housing and the surface that heat-generating electronic elements combines, this inner fovea part is used to accommodate this heat-generating electronic elements.
The inner fovea part of above-mentioned platypelloid type heat pipe is contained in heat-generating electronic elements wherein, thereby this platypelloid type heat pipe has made full use of the volume of heat-generating electronic elements space expansion steam cavity on every side.Under identical space, the volume of the steam cavity of this platypelloid type heat pipe still can guarantee bigger steam cavity greater than the volume of the steam cavity of traditional hot conduit in inner narrow spaces such as notebook computer, thereby increases the efficiency of thermal transfer of this heat pipe.
Description of drawings
Fig. 1 places a generalized section that is provided with on the circuit board of heat-generating electronic elements for traditional platypelloid type heat pipe.
Fig. 2 is the dispel the heat three-dimensional combination figure of rollover states of module preferred embodiment of the present invention.
Fig. 3 is the three-dimensional exploded view of Fig. 2.
Fig. 4 places a generalized section that is provided with on the circuit board of heat-generating electronic elements for platypelloid type heat pipe shown in Figure 2.
Fig. 5 is the generalized section of platypelloid type heat pipe second embodiment of the present invention.
Embodiment
See also Fig. 2 and Fig. 3, this heat radiation module comprises a centrifugal fan 10, a radiator 20 and a platypelloid type heat pipe 30.
This centrifugal fan 10 comprises a fan frame 12 and an impeller 14.Form an accommodation space in this fan frame 12, this impeller 14 is contained in this accommodation space.The axial relative both sides of fan frame 12 are that top and bottom forms one first air intake vent 120 and one second air intake vent (figure does not show) respectively, and the side direction of fan frame 12 forms an air outlet 122.
This radiator 20 is piled up by some radiating fins and forms.Radiator 20 is rectangle, and it is positioned at air outlet 122 places of this centrifugal fan 10.
Please consult Fig. 4 simultaneously, heat pipe 30 is plate shape, and it comprises a hollow housing 37, be arranged on the capillary structure 39 in this housing 37 and inject hydraulic fluid in the housing 37.This housing 37 comprises a top board 32, a base plate 36 relative with top board 32, and biside plate 34.This side plate 34 is connected between top board 32 and base plate 36 and with the periphery of this top board 32 and base plate 36.This top board 32, base plate 36 and side plate 34 surround and make this housing 37 form a hollow sealing chamber, thereby make this housing 37 inner steam cavitys that form.In the present embodiment, this housing 37 closes lid by two housings up and down and forms.Certainly, this housing 37 also can be flattened by a hollow circular tube and form.
This heat pipe 30 roughly is " Z " shape, comprises a L shaped evaporation section 31 and a linear condensation segment 33 along its bearing of trend, and this condensation segment 33 is corresponding with radiator 20 connections and shape.
The base plate 36 of the evaporation section 31 of this heat pipe 30 is recessed to form four inner fovea parts 360 towards the steam cavity, be used for being installed with a plurality of heat-generating electronic elements, these four inner fovea parts 360 can be arranged to the different degree of depth according to the height of different heat electronic component, so that the different heat electronic component is carried out heat conduction simultaneously.In the present embodiment only a wherein inner fovea part 360 situations of combining with a heat-generating electronic elements 90 and heat pipe 30 be example.These inner fovea parts 360 roughly are square or rectangle.Each inner fovea part 360 comprises a diapire 361 and four sidewalls 362.This diapire 361 is parallel to base plate 36 and base plate 36 is towards steam cavity depression certain distance relatively, and this diapire 361 and top board 32 are separately.These four sidewalls 362 are connected around the periphery of this diapire 361 and with the base plate 36 of inner fovea part 360 peripheries.This heat-generating electronic elements 90 has an end face 92, and this end face 92 fits with the outer surface of the diapire 361 of this inner fovea part 360, and the sidewall 362 of the side of heat-generating electronic elements 90 and inner fovea part 360 separately.
In other embodiments, these inner fovea parts 360 can also be other shapes, and such as circular, trapezoidal etc., its concrete shape should be corresponding with the shape of heat-generating electronic elements 90 and be slightly larger than the size of heat-generating electronic elements 90.In addition, the degree of these inner fovea part 360 depressions depends on the height that heat-generating electronic elements 90 relative circuit boards 80 protrude, inner fovea part 360 depressions of highly bigger heat-generating electronic elements 90 correspondences are darker, and the depression of the inner fovea part 360 of highly less heat-generating electronic elements 90 correspondences is more shallow.
This capillary structure 39 extends to condensation segment 33 along the bearing of trend of heat pipe 30 from evaporation section 31, and this hydraulic fluid contains in this capillary structure 39.The bottom part ring of this capillary structure 39 is around the periphery of the whole inwall of this inner fovea part 360.The middle body of these capillary structure 39 bottoms contacts with the inner surface of the diapire 361 of inner fovea part 360, the periphery of these capillary structure 39 bottoms is around the inwall of the sidewall 362 of this inner fovea part 360 and extend downward with the inwall of base plate 36 and contact, and the top of this capillary structure 39 extends upwardly to from the bottom with the inwall of top board 32 and contacts.The side plate 34 of this capillary structure 39 and housing 37 is separately to form the steam channel 35 that can supply steam to pass through, this capillary structure 39 contacts with the inner surface of the diapire 361 of inner fovea part 360 and has guaranteed that there is hydraulic fluid at this inner surface place guaranteeing heat pipe 30 operate as normal, and the bottom of this capillary structure 39 contacts with the inwall of base plate 36 and can absorb to capillary structure 39 inside confluxing because of action of gravity to the hydraulic fluid of this base plate 36 inwalls.In addition, this capillary structure 39 contacts with the top board 32 of this housing 37 and the inwall of base plate 36, plays the effect of supporting this housing 37, avoids top board 32 to influence the performance of heat pipe 30 with base plate 36 distortion.
The evaporation section 31 of this heat pipe 30 is provided with four through holes 38 that run through this heat pipe 30 up and down, and the periphery of these through holes 38 forms wall portion sealing the housing 37 of these through hole 38 peripheries, thereby does not influence the sealing of housing 37.These through holes 38 can supply fixture (figure does not show) to pass so that this heat pipe 30 is fixed on the circuit board 80.
During assembling, this radiator 20 is located at air outlet 122 places of this centrifugal fan 10, the condensation segment 33 of this heat pipe 30 is attached at radiator 20 tops, the inner fovea part 360 of the evaporation section 31 of this heat pipe 30 is contained in heat-generating electronic elements 90 wherein, and the end face 92 of heat-generating electronic elements 90 and the diapire 361 of inner fovea part 360 are fitted, for reducing thermal resistance, can be coated with heat-conducting cream (figure does not show) between the outer surface of the end face 92 of this heat-generating electronic elements 90 and this diapire 361, the through hole 38 that utilizes fixture to pass heat pipe 30 at last is fixed in heat pipe 30 on the circuit board 80.
During the work of heat radiation module, the diapire 361 of the inner fovea part 360 of this heat pipe 30 is from heat-generating electronic elements 90 absorption heats and with the inside of heat transferred to housing 37, make hydraulic fluid vaporization contained in the capillary structure 39 that is surrounded on these inner fovea part 360 inwall peripheries, be with heat to move to condensation segment 33 via steam channel 35, condensation segment 33 is passed to heat in the radiator 20 that is positioned at its below, the impeller 14 of centrifugal fan 10 sucks air-flow and blows to radiator 20 from air intake vent 110, heat on the fin is distributed, thereby reduce the temperature of condensation segment 33, steam liquefaction in the condensation segment 33 is condensed, and under the effect of capillary structure 39, be back to evaporation section 31, continuing carburation by evaporation and liquefaction condenses, make working media in the motion of heat pipe 30 inner loop, the heat that heat-generating electronic elements 90 is produced distributes endlessly.
Because the inner fovea part 360 of this heat pipe 30 can be contained in the heat-generating electronic elements 90 that is convexly set in circuit board 80 wherein, compare traditional platypelloid type heat pipe 70 shown in Figure 1, thereby platypelloid type heat pipe 30 of the present invention has made full use of the volume of the space expansion steam cavity around the heat-generating electronic elements 90, under identical installing space, the volume of the steam cavity of platypelloid type heat pipe 30 of the present invention is greater than the volume of the steam cavity 75 of traditional platypelloid type heat pipe 70, in narrow space, still can guarantee bigger steam cavity, especially under the narrow and small situation of inner installing spaces such as notebook computer, more can increase the efficiency of thermal transfer of this platypelloid type heat pipe 30, and then promote the dispel the heat radiating efficiency of module of the present invention.
Figure 5 shows that the platypelloid type heat pipe 50 of second embodiment of the invention, the difference of the heat pipe 30 of this heat pipe 50 and first execution mode is: the capillary structure 59 of this heat pipe 50 is attached at the top board 52 of this housing 57 and the whole inwall of side plate 54.The part that this capillary structure 59 is located at these top board 52 inwalls contacts with the inner surface of the diapire 561 of this inner fovea part 560, thereby there is hydraulic fluid at the inner surface place that guarantees this diapire 561 guaranteeing the heat transfer property of heat pipe 50, thereby and capillary structure 59 is attached at the part of these side plate 54 inwalls and reserves steam channel 55 separately with the sidewall 562 of inner fovea part 560 and pass through for steams.Thereby the part that this capillary structure 59 is located at side plate 54 inwalls extends downward to contact with the inwall of base plate 56 along the inwall of side plate 54 and can absorb the hydraulic fluid of these base plate 56 inwalls.
Claims (10)
1. platypelloid type heat pipe, be used to conduct the heat that heat-generating electronic elements produces, this platypelloid type heat pipe comprises the housing of an inner formation steam cavity and is contained in the interior capillary structure of this housing, it is characterized in that: be recessed to form at least one inner fovea part towards this steam cavity on this housing and the surface that heat-generating electronic elements combines, this inner fovea part is used to accommodate this heat-generating electronic elements.
2. platypelloid type heat pipe as claimed in claim 1 is characterized in that: this inner fovea part is square, rectangle or circle.
3. platypelloid type heat pipe as claimed in claim 1 is characterized in that: this inner fovea part is provided with a plurality of, is used to be installed with a plurality of heat-generating electronic elements, and the degree of depth of each inner fovea part depends on the height of corresponding heat-generating electronic elements.
4. platypelloid type heat pipe as claimed in claim 1 is characterized in that: this inner fovea part comprises that a diapire reaches the sidewall around this diapire periphery, and the outer surface of the diapire of this heat-generating electronic elements and this inner fovea part fits.
5. platypelloid type heat pipe as claimed in claim 4, it is characterized in that: this housing comprises a top board, a base plate relative with top board, and biside plate, this side plate is connected between top board and base plate and with the periphery of this top board and base plate, and this top board, base plate and side plate surround and form a hollow sealing chamber.
6. platypelloid type heat pipe as claimed in claim 5 is characterized in that: the inner surface of the inwall of this capillary structure and this top board and the diapire of inner fovea part contacts.
7. platypelloid type heat pipe as claimed in claim 6, it is characterized in that: the bottom part ring of this capillary structure is around the periphery of the whole inwall of this inner fovea part, the middle body of this capillary structure bottom contacts with the inner surface of the diapire of inner fovea part, the periphery of this capillary structure bottom is around the inwall of the sidewall of this inner fovea part and extend downward with the inwall of base plate and contact, the top of this capillary structure extends to from the bottom with the inwall of top board and contacts, and this capillary structure and this side plate are separately to form the steam channel that can supply steam to pass through.
8. platypelloid type heat pipe as claimed in claim 6, it is characterized in that: this capillary structure is attached at the top board of this housing and the whole inwall of side plate, the part that this capillary structure is located at the top board inwall contacts with the inner surface of the diapire of this inner fovea part, the part that this capillary structure is located at the side plate inwall extends downward with this plate inner wall and contacts, and with the sidewall of inner fovea part separately to form the steam channel that can pass through for steam.
One kind the heat radiation module, be used for dispelling the heat to heat-generating electronic elements, comprise a platypelloid type heat pipe and a radiator, this platypelloid type heat pipe comprises an evaporation section and a condensation segment, this evaporation section is used for contacting with heat-generating electronic elements, this condensation segment is connected with this radiator, it is characterized in that: this platypelloid type heat pipe is any described platypelloid type heat pipe in the claim 1 to 8.
10. heat radiation module as claimed in claim 9 is characterized in that: this heat radiation module also comprises a centrifugal fan, forms an air outlet on this centrifugal fan, and this radiator is located at the air outlet place of this centrifugal fan.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008103064885A CN101765352B (en) | 2008-12-23 | 2008-12-23 | Flat type heat conducting pipe and heat radiating module using same |
| US12/485,942 US20100155030A1 (en) | 2008-12-23 | 2009-06-17 | Thermal module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008103064885A CN101765352B (en) | 2008-12-23 | 2008-12-23 | Flat type heat conducting pipe and heat radiating module using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101765352A true CN101765352A (en) | 2010-06-30 |
| CN101765352B CN101765352B (en) | 2013-04-24 |
Family
ID=42264371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008103064885A Expired - Fee Related CN101765352B (en) | 2008-12-23 | 2008-12-23 | Flat type heat conducting pipe and heat radiating module using same |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20100155030A1 (en) |
| CN (1) | CN101765352B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102573408A (en) * | 2010-12-28 | 2012-07-11 | 富士通株式会社 | Cooling apparatus and electronic apparatus |
| WO2015179089A1 (en) * | 2014-05-22 | 2015-11-26 | Commscope Technologies Llc | Vapor chamber amplifier module |
| CN108617083A (en) * | 2018-06-11 | 2018-10-02 | Oppo广东移动通信有限公司 | A kind of electronic device |
| CN115568160A (en) * | 2022-04-02 | 2023-01-03 | 荣耀终端有限公司 | Heat radiation structure and electronic equipment |
| TWI809691B (en) * | 2022-01-27 | 2023-07-21 | 魏均倚 | Shaped tube cooling and cooling system |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110232877A1 (en) * | 2010-03-23 | 2011-09-29 | Celsia Technologies Taiwan, Inc. | Compact vapor chamber and heat-dissipating module having the same |
| CN103717032A (en) * | 2012-09-29 | 2014-04-09 | 英业达科技有限公司 | Heat radiating device |
| US9121645B2 (en) * | 2013-02-11 | 2015-09-01 | Google Inc. | Variable thickness heat pipe |
| TW201437591A (en) * | 2013-03-26 | 2014-10-01 | Asustek Comp Inc | Heat pipe structure |
| KR102173141B1 (en) * | 2014-02-04 | 2020-11-02 | 삼성전자주식회사 | Handheld device for including heat pipe |
| JP2016004839A (en) * | 2014-06-13 | 2016-01-12 | 日本電産株式会社 | Heat module |
| US10423200B1 (en) * | 2018-10-11 | 2019-09-24 | Dell Products L.P. | Vapor chamber with integrated rotating impeller and methods for cooling information handling systems using the same |
| CN111863746B (en) * | 2019-04-25 | 2023-10-13 | 华为技术有限公司 | Heat abstractor, circuit board and electronic equipment |
| AT522831B1 (en) * | 2019-08-08 | 2023-05-15 | Dau Gmbh & Co Kg | Air heat exchanger and method for its production and electronic structure equipped therewith |
| JP7132958B2 (en) * | 2020-01-31 | 2022-09-07 | 古河電気工業株式会社 | vapor chamber |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1489787A (en) * | 2000-12-05 | 2004-04-14 | ض� | Electronic assembly having heat pipe that conducts heat from semicanductor substrate |
| CN101090621A (en) * | 2006-06-16 | 2007-12-19 | 鸿富锦精密工业（深圳）有限公司 | Loop heat sink module |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4546409A (en) * | 1982-04-02 | 1985-10-08 | Mitsubishi Denki Kabushiki Kaisha | Device for cooling semiconductor elements |
| JP3426101B2 (en) * | 1997-02-25 | 2003-07-14 | 三菱電機株式会社 | Rectifier |
| JP2000341953A (en) * | 1999-05-27 | 2000-12-08 | Mitsubishi Electric Corp | Rectifier for vehicle ac generator |
| TW468820U (en) * | 2000-03-15 | 2001-12-11 | Foxconn Prec Components Co Ltd | Cooler device |
| US6679318B2 (en) * | 2002-01-19 | 2004-01-20 | Allan P Bakke | Light weight rigid flat heat pipe utilizing copper foil container laminated to heat treated aluminum plates for structural stability |
| TWI235906B (en) * | 2003-02-27 | 2005-07-11 | Shwin-Chung Wong | Microchannel heat pipe spreaders and microchannel loop heat pipes housed in a metal case and embodiments of the same |
| US7032652B2 (en) * | 2004-07-06 | 2006-04-25 | Augux Co., Ltd. | Structure of heat conductive plate |
| JP4745206B2 (en) * | 2006-11-30 | 2011-08-10 | 株式会社東芝 | Electronics |
| CN101426357A (en) * | 2007-10-31 | 2009-05-06 | 鸿富锦精密工业（深圳）有限公司 | Heat radiation device |
| JP4399013B2 (en) * | 2008-02-28 | 2010-01-13 | 株式会社東芝 | Electronic equipment and heat pipe |
| JP4352091B2 (en) * | 2008-03-27 | 2009-10-28 | 株式会社東芝 | Electronic equipment, cooling device |
| JP4473925B1 (en) * | 2008-12-16 | 2010-06-02 | 株式会社東芝 | Loop heat pipe and electronic equipment |
-
2008
- 2008-12-23 CN CN2008103064885A patent/CN101765352B/en not_active Expired - Fee Related
-
2009
- 2009-06-17 US US12/485,942 patent/US20100155030A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1489787A (en) * | 2000-12-05 | 2004-04-14 | ض� | Electronic assembly having heat pipe that conducts heat from semicanductor substrate |
| CN101090621A (en) * | 2006-06-16 | 2007-12-19 | 鸿富锦精密工业（深圳）有限公司 | Loop heat sink module |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102573408A (en) * | 2010-12-28 | 2012-07-11 | 富士通株式会社 | Cooling apparatus and electronic apparatus |
| WO2015179089A1 (en) * | 2014-05-22 | 2015-11-26 | Commscope Technologies Llc | Vapor chamber amplifier module |
| US10103692B2 (en) | 2014-05-22 | 2018-10-16 | Commscope Technologies Llc | Vapor chamber amplifier module |
| CN108617083A (en) * | 2018-06-11 | 2018-10-02 | Oppo广东移动通信有限公司 | A kind of electronic device |
| CN108617083B (en) * | 2018-06-11 | 2020-01-17 | Oppo广东移动通信有限公司 | Electronic device |
| TWI809691B (en) * | 2022-01-27 | 2023-07-21 | 魏均倚 | Shaped tube cooling and cooling system |
| CN115568160A (en) * | 2022-04-02 | 2023-01-03 | 荣耀终端有限公司 | Heat radiation structure and electronic equipment |
| CN115568160B (en) * | 2022-04-02 | 2023-08-18 | 荣耀终端有限公司 | Heat radiation structure and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101765352B (en) | 2013-04-24 |
| US20100155030A1 (en) | 2010-06-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101765352B (en) | Flat type heat conducting pipe and heat radiating module using same | |
| US7407000B2 (en) | Liquid cooling device | |
| CN101754655B (en) | Radiating die set | |
| CN100470773C (en) | Heat pipe radiating device | |
| CN100499979C (en) | Heat radiating device | |
| CN101375650B (en) | Liquid-cooled heat radiation device | |
| JP2009188377A (en) | Heat dissipation module and supporting element thereof | |
| WO2020118629A1 (en) | Electronic device | |
| CN101166408A (en) | Heat radiation module | |
| CN101853823A (en) | Heat sink and manufacturing method thereof | |
| CN101990389A (en) | Radiating module | |
| CN101866887A (en) | Heat radiator | |
| JP2006024756A (en) | Cooling module | |
| JP2006279004A (en) | Heat sink with heat pipe | |
| CN201518567U (en) | Radiating die set | |
| EP3518072B1 (en) | Heat transferring module | |
| CN214592558U (en) | Integrated cooling module and electronic device with same | |
| CN100531540C (en) | Heat radiation module | |
| CN101472442A (en) | Temperature equalization board | |
| CN216700807U (en) | Base station heat dissipation device | |
| TWI458928B (en) | Heat dissipation module | |
| CN116483178A (en) | Computing equipment and cold plate thereof | |
| TWM628952U (en) | Liquid-cooling type heat dissipation module | |
| CN100421238C (en) | Radiating device | |
| CN101539792B (en) | Heat dissipating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130424 Termination date: 20141223 |
|
| EXPY | Termination of patent right or utility model |