TW201437591A - Heat pipe structure - Google Patents
Heat pipe structure Download PDFInfo
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- TW201437591A TW201437591A TW102110680A TW102110680A TW201437591A TW 201437591 A TW201437591 A TW 201437591A TW 102110680 A TW102110680 A TW 102110680A TW 102110680 A TW102110680 A TW 102110680A TW 201437591 A TW201437591 A TW 201437591A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本案是有關一種熱管結構。 This case is about a heat pipe structure.
目前應用於消費性電子產品的熱管通常以銅作為殼體，以水作為工作流體。當熱管的一端置於較高溫處且另一端置於較低溫處時，高溫處之毛細體吸附的工作流體會開始蒸發。蒸發的氣體聚集在管內的空間，並因壓力的因素使氣態的流體往熱管的低溫處流動。當氣態的流體到達低溫處時便開始冷凝成液態的流體，並由低溫處的毛細體吸附。之後，毛細體將液態的流體利用毛細現象使其從低溫處流回了高溫處。工作流體循環不息的以氣、液態之相變化傳熱，即為熱管的傳熱原理。 Heat pipes currently used in consumer electronics typically use copper as the housing and water as the working fluid. When one end of the heat pipe is placed at a higher temperature and the other end is placed at a lower temperature, the capillary-adsorbed working fluid at a high temperature starts to evaporate. The vaporized gas collects in the space inside the tube, and the gaseous fluid flows toward the low temperature of the heat pipe due to the pressure. When the gaseous fluid reaches a low temperature, it begins to condense into a liquid fluid and is adsorbed by the capillary at a low temperature. After that, the capillary fluidizes the fluid from the low temperature to the high temperature by capillary action. The working fluid is continuously circulated and the heat is transferred by the gas and liquid phases, which is the heat transfer principle of the heat pipe.
然而，習知熱管的毛細體是佈滿整個殼體內壁，且熱管的剖面形狀為長方形或橢圓形。由於殼體中能讓氣體流動的空間狹小，氣體流動的阻力大，使傳熱速率難以提升。此外，當系統外殼位於熱管的一側時，由於系統外殼與熱管面對系統外殼之表面間的距離都是相同的，因此距離過近會造成系統外殼溫度過高。 However, the capillary of the conventional heat pipe is covered with the entire inner wall of the casing, and the cross-sectional shape of the heat pipe is rectangular or elliptical. Due to the narrow space in the casing that allows gas to flow, the resistance to gas flow is large, making it difficult to increase the heat transfer rate. In addition, when the system casing is located on one side of the heat pipe, since the distance between the system casing and the surface of the heat pipe facing the system casing is the same, the distance is too close, which may cause the system casing temperature to be too high.
另外，由於讓氣體流動的空間是由佈滿整個殼體內壁的毛細體圍繞，因此強度難以提升，容易受外力而擠壓變形。在製造熱管時，上述保留讓氣體流動的空間大小還會影響熱管的良率，使熱管的良率不易控制，目前製造薄型熱管的良率僅約為60%的良率。再者，習知熱管與散熱片、風扇搭配使用時，完全不具引導氣流的效果。 In addition, since the space in which the gas flows is surrounded by the capillary body which covers the entire inner wall of the casing, the strength is hard to be lifted, and it is easily deformed by external force. When manufacturing the heat pipe, the above-mentioned space for the gas to flow also affects the heat pipe yield, making the heat pipe yield difficult to control, and the yield of the current thin heat pipe is only about 60%. Moreover, when the conventional heat pipe is used in combination with a heat sink and a fan, there is no effect of guiding the air flow at all.
本案揭示一種熱管結構。 This case discloses a heat pipe structure.
本案揭露一種熱管結構，該熱管結構包含殼體與多數個毛細結構。殼體其內具有容置空間，且容置空間具有第一區與第二區。毛細結構附著於第一區的內壁上。第二區的垂直長度大於第一區的垂直長度。 The present invention discloses a heat pipe structure comprising a casing and a plurality of capillary structures. The housing has an accommodating space therein, and the accommodating space has a first area and a second area. The capillary structure is attached to the inner wall of the first zone. The vertical length of the second zone is greater than the vertical length of the first zone.
由於本案之毛細結構位於容置空間中，且僅附著於部分殼體的內壁上，因此容置空間不會被毛細結構圍繞。在製作熱管結構時，可藉由模具施壓於附著毛細結構之部分殼體，使未附著毛細結構之部分殼體相對於附著毛細結構之另一部分殼體呈凸狀。如此一來，呈凸狀之部分殼體內便可具有足夠的空間供氣體流動，使傳熱速率提升。此外，受壓的部分殼體能由毛細結構支撐，使熱管結構的良率易於控制且強度得以提升。當熱管結構受外力時，不易變形而損壞。 Since the capillary structure of the present case is located in the accommodating space and is attached only to the inner wall of the partial casing, the accommodating space is not surrounded by the capillary structure. When the heat pipe structure is fabricated, a part of the casing to which the capillary structure is attached may be pressed by the mold so that the partial casing of the unattached capillary structure is convex with respect to the other part of the casing to which the capillary structure is attached. In this way, a portion of the convex portion of the housing can have sufficient space for the gas to flow, thereby increasing the heat transfer rate. In addition, the partially compressed casing can be supported by the capillary structure, so that the yield of the heat pipe structure can be easily controlled and the strength can be improved. When the heat pipe structure is subjected to an external force, it is not easily deformed and damaged.
當系統板體(例如機殼)位於熱管結構的一側時，由於附著毛細結構之部分殼體距離系統板體較遠，因此提升 了系統板體散熱效果，可讓使用者較為舒適。當熱管結構與風扇搭配使用時，由於未附著毛細結構之部分殼體相對於附著毛細結構之另一部分殼體呈凸狀，因此熱管結構具有引導氣流的功能。 When the system board body (for example, the casing) is located on one side of the heat pipe structure, since part of the casing to which the capillary structure is attached is far from the system plate body, the lifting is performed. The heat dissipation effect of the system board can make the user more comfortable. When the heat pipe structure is used in combination with the fan, since the portion of the casing to which the capillary structure is not attached is convex with respect to the other portion of the casing to which the capillary structure is attached, the heat pipe structure has a function of guiding the airflow.
100‧‧‧熱管結構 100‧‧‧heat pipe structure
100’‧‧‧熱管結構 100’‧‧‧heat pipe structure
100a‧‧‧熱管結構 100a‧‧‧heat pipe structure
100b‧‧‧熱管結構 100b‧‧‧heat pipe structure
100c‧‧‧熱管結構 100c‧‧‧heat pipe structure
100d‧‧‧熱管結構 100d‧‧‧heat pipe structure
100e‧‧‧熱管結構 100e‧‧‧heat pipe structure
100f‧‧‧熱管結構 100f‧‧‧heat pipe structure
110‧‧‧殼體 110‧‧‧shell
110’‧‧‧殼體 110’‧‧‧Shell
111‧‧‧第一區 111‧‧‧First District
112‧‧‧容置空間 112‧‧‧ accommodating space
113‧‧‧第二區 113‧‧‧Second District
114‧‧‧子空間 114‧‧‧subspace
116‧‧‧子空間 116‧‧‧Subspace
117‧‧‧第一表面 117‧‧‧ first surface
119‧‧‧第二表面 119‧‧‧ second surface
120‧‧‧工作流體 120‧‧‧Working fluid
130‧‧‧毛細結構 130‧‧‧Capillary structure
130’‧‧‧毛細結構 130’‧‧‧Capillary structure
130a‧‧‧第一部分 130a‧‧‧Part 1
130b‧‧‧第二部分 130b‧‧‧Part II
136‧‧‧側面 136‧‧‧ side
212‧‧‧熱源 212‧‧‧heat source
214‧‧‧電路板 214‧‧‧ circuit board
216‧‧‧系統板體 216‧‧‧System board
222‧‧‧模具 222‧‧‧Mold
224‧‧‧模具 224‧‧‧Mold
232‧‧‧散熱片 232‧‧ ‧ heat sink
234‧‧‧風扇 234‧‧‧fan
2-2‧‧‧線段 2-2‧‧‧ segments
6-6‧‧‧線段 6-6‧‧‧ segments
D1‧‧‧方向 D1‧‧ Direction
d1‧‧‧間距 D1‧‧‧ spacing
D2‧‧‧方向 D2‧‧ Direction
d2‧‧‧間距 D2‧‧‧ spacing
H‧‧‧垂直長度 H‧‧‧Vertical length
H’‧‧‧垂直長度 H’‧‧‧Vertical length
H1‧‧‧垂直長度 H1‧‧‧Vertical length
H2‧‧‧垂直長度 H2‧‧‧ vertical length
H3‧‧‧垂直長度 H3‧‧‧Vertical length
H4‧‧‧垂直長度 H4‧‧‧Vertical length
H5‧‧‧垂直長度 H5‧‧‧Vertical length
H6‧‧‧垂直長度 H6‧‧‧Vertical length
H7‧‧‧垂直長度 H7‧‧‧Vertical length
H8‧‧‧垂直長度 H8‧‧‧Vertical length
H9‧‧‧垂直長度 H9‧‧‧Vertical length
H10‧‧‧垂直長度 H10‧‧‧Vertical length
H11‧‧‧垂直長度 H11‧‧‧Vertical length
H12‧‧‧垂直長度 H12‧‧‧Vertical length
H13‧‧‧長度之和 H13‧‧‧The sum of length
H14‧‧‧垂直長度 H14‧‧‧Vertical length
H15‧‧‧垂直長度 H15‧‧‧Vertical length
W‧‧‧氣流 W‧‧‧ airflow
第1圖繪示根據本案第一實施方式之熱管結構的立體圖。 Fig. 1 is a perspective view showing the structure of a heat pipe according to a first embodiment of the present invention.
第2A圖繪示第1圖之熱管結構沿線段2-2的剖面圖。 Figure 2A is a cross-sectional view of the heat pipe structure of Figure 1 taken along line 2-2.
第2B圖繪示根據本案第二實施方式之熱管結構的剖面圖。 2B is a cross-sectional view showing the structure of the heat pipe according to the second embodiment of the present invention.
第3圖繪示第1圖之熱管結構搭配系統板體使用時的示意圖。 FIG. 3 is a schematic view showing the heat pipe structure of the first embodiment when used in conjunction with the system plate body.
第4圖繪示第2A圖之熱管結構製造時的示意圖。 Fig. 4 is a schematic view showing the manufacture of the heat pipe structure of Fig. 2A.
第5圖繪示根據本案第三實施方式之熱管結構的立體圖。 Fig. 5 is a perspective view showing the structure of a heat pipe according to a third embodiment of the present invention.
第6圖繪示第5圖之熱管結構沿線段6-6的剖面圖。 Figure 6 is a cross-sectional view of the heat pipe structure of Figure 5 taken along line 6-6.
第7圖繪示第5圖之熱管結構搭配系統板體、散熱片與風扇使用時的示意圖。 FIG. 7 is a schematic view showing the heat pipe structure of FIG. 5 in combination with the system plate body, the heat sink and the fan.
第8圖繪示第7圖之熱管結構、熱源與系統板體從方向D2看的側視圖。 Figure 8 is a side elevational view of the heat pipe structure, heat source and system plate of Figure 7 as seen from direction D2.
第9圖繪示根據本案第四實施方式之熱管結構的剖面圖。 Figure 9 is a cross-sectional view showing the structure of a heat pipe according to a fourth embodiment of the present invention.
第10圖繪示根據本案第五實施方式之熱管結構的剖面圖。 Figure 10 is a cross-sectional view showing the structure of a heat pipe according to a fifth embodiment of the present invention.
第11圖繪示根據本案第六實施方式之熱管結構的剖面圖。 Figure 11 is a cross-sectional view showing the structure of a heat pipe according to a sixth embodiment of the present invention.
第12圖繪示根據本案第七實施方式之熱管結構的剖面圖。 Figure 12 is a cross-sectional view showing the structure of a heat pipe according to a seventh embodiment of the present invention.
以下將以圖式揭露本案之複數個實施方式，為明確說明起見，許多實務上的細節將在以下敘述中一併說明。然而，應瞭解到，這些實務上的細節不應用以限制本案。也就是說，在本案部分實施方式中，這些實務上的細節是非必要的。此外，為簡化圖式起見，一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。 In the following, a plurality of embodiments of the present invention will be disclosed in the drawings, and for the sake of clarity, a number of practical details will be described in the following description. However, it should be understood that these practical details are not applied to limit the case. That is to say, in some implementations of this case, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.
第1圖繪示根據本案第一實施方式之熱管結構100的立體圖。第2A圖繪示第1圖之熱管結構100沿線段2-2的剖面圖。同時參閱第1圖與第2A圖，熱管結構100包含殼體110與毛細結構130。殼體110其內具有封閉的容置空間112。容置空間112中具有工作流體120，且容置空間112具有第一區111與第二區113。毛細結構130位於容置空間112中，且附著於第一區111的內壁上。其中，上述的內壁意指殼體110接觸毛細結構130的表面，例如位於第一區111的第一表面117與第二表面119。此外，未附著毛細結構130之部分殼體110(即第二區113外側之殼體110)的垂 直長度H大於附著毛細結構130之另一部分殼體110(即第一區111外側之殼體110)的垂直長度H’，使得未附著毛細結構130之部分殼體110相對於附著毛細結構130之另一部分殼體110呈凸狀。 1 is a perspective view of a heat pipe structure 100 according to a first embodiment of the present invention. 2A is a cross-sectional view of the heat pipe structure 100 of FIG. 1 taken along line 2-2. Referring also to FIGS. 1 and 2A, the heat pipe structure 100 includes a housing 110 and a capillary structure 130. The housing 110 has a closed receiving space 112 therein. The accommodating space 112 has a working fluid 120 therein, and the accommodating space 112 has a first zone 111 and a second zone 113. The capillary structure 130 is located in the accommodating space 112 and is attached to the inner wall of the first zone 111. Herein, the inner wall means that the housing 110 contacts the surface of the capillary structure 130, for example, the first surface 117 and the second surface 119 of the first region 111. In addition, a portion of the housing 110 (ie, the housing 110 outside the second region 113) of the capillary structure 130 is not attached. The straight length H is greater than the vertical length H' of the other portion of the housing 110 (ie, the housing 110 outside the first region 111) of the attached capillary structure 130 such that a portion of the housing 110 that does not adhere to the capillary structure 130 is opposite to the attached capillary structure 130. The other portion of the housing 110 is convex.
在本實施方式中，毛細結構130接觸於殼體110的第一表面117與第二表面119。毛細結構130可以為金屬燒結物、微溝槽、纖維、金屬網或上述之組合，或任何可用來進行熱傳導的元件，本案並不以此為限制。 In the present embodiment, the capillary structure 130 is in contact with the first surface 117 and the second surface 119 of the housing 110. The capillary structure 130 can be a metal sinter, a micro-groove, a fiber, a metal mesh, or a combination thereof, or any component that can be used for heat conduction, which is not limited in this case.
此外，容置空間112的第二區113分隔成二子空間114、116，子空間114具有垂直長度H1，子空間116具有垂直長度H2。在本實施方式中，子空間114的垂直長度H1與子空間116的垂直長度H2相同。第二區113的垂直長度(即垂直長度H1、H2)大於第一區111的垂直長度H3。在本實施方式中，毛細結構130整體的垂直長度大致等於第一區111的垂直長度H3，因此子空間114、116的垂直長度H1、H2皆大於毛細結構130整體的垂直長度。本文中的『大致』意指製造上的誤差。 Further, the second region 113 of the accommodation space 112 is divided into two sub-spaces 114, 116, the sub-space 114 has a vertical length H1, and the sub-space 116 has a vertical length H2. In the present embodiment, the vertical length H1 of the subspace 114 is the same as the vertical length H2 of the subspace 116. The vertical length of the second zone 113 (i.e., the vertical lengths H1, H2) is greater than the vertical length H3 of the first zone 111. In the present embodiment, the vertical length of the entire capillary structure 130 is substantially equal to the vertical length H3 of the first region 111, and thus the vertical lengths H1, H2 of the sub-spaces 114, 116 are greater than the vertical length of the entire capillary structure 130. As used herein, "substantially" means manufacturing error.
工作流體120可以為水，但並不以水為限。液態的工作流體120(例如液態水)可由毛細結構130吸附傳遞，氣態的工作流體120(例如水蒸氣)可於子空間114、116中流動。此外，殼體110內的容置空間112經抽真空製程，氣壓會小於1大氣壓，因此工作流體120的沸點得以降低。 Working fluid 120 can be water, but is not limited to water. The liquid working fluid 120 (e.g., liquid water) can be adsorbed and transferred by the capillary structure 130, and the gaseous working fluid 120 (e.g., water vapor) can flow in the subspaces 114, 116. In addition, the accommodating space 112 in the casing 110 is subjected to an evacuation process, and the air pressure is less than 1 atmosphere, so that the boiling point of the working fluid 120 is lowered.
由於毛細結構130位於容置空間112的第一區111中，且僅附著於第一區111的內壁上，因此容置空間112 不會被毛細結構130圍繞。未附著毛細結構130之部分殼體110相對於附著毛細結構130之另一部分殼體110呈凸狀。如此一來，呈凸狀之部分殼體110內便可具有足夠的空間(例如子空間114、116)供氣態的工作流體120流動，使傳熱速率提升。此外，呈凹狀之部分殼體110能由毛細結構130支撐，當熱管結構100受外力時，不易變形而損壞。 Since the capillary structure 130 is located in the first region 111 of the accommodating space 112 and is only attached to the inner wall of the first region 111, the accommodating space 112 It is not surrounded by the capillary structure 130. A portion of the housing 110 to which the capillary structure 130 is not attached is convex with respect to the other portion of the housing 110 to which the capillary structure 130 is attached. In this way, the convex portion of the housing 110 can have sufficient space (for example, the sub-spaces 114, 116) for the gaseous working fluid 120 to flow, thereby increasing the heat transfer rate. Further, the concave portion of the casing 110 can be supported by the capillary structure 130, and when the heat pipe structure 100 is subjected to an external force, it is not easily deformed and damaged.
第2B圖繪示根據本案第二實施方式之熱管結構100’的剖面圖。熱管結構100’包含殼體110與毛細結構130。與第2A圖實施方式不同的地方在於：毛細結構130僅接觸第一區111之第一表面117，而未接觸第一區111之第二表面119。也就是說，毛細結構130整體的垂直長度小於第一區111的垂直長度H3。 Fig. 2B is a cross-sectional view showing the heat pipe structure 100' according to the second embodiment of the present invention. The heat pipe structure 100' includes a housing 110 and a capillary structure 130. The difference from the embodiment of FIG. 2A is that the capillary structure 130 only contacts the first surface 117 of the first zone 111 and does not contact the second surface 119 of the first zone 111. That is, the vertical length of the capillary structure 130 as a whole is smaller than the vertical length H3 of the first region 111.
第3圖繪示第1圖之熱管結構100搭配系統板體216使用時的示意圖。如圖所示，電路板214上設有熱源212。熱源212可以為中央處理器(Central Processing Unit；CPU)、影像晶片、音效晶片、網路晶片、散熱片等，但不以上述元件為限。熱管結構100設置於熱源212上，用以排除熱源212產生的熱。當系統板體216(例如機殼)位於熱管結構100的一側時，由於附著毛細結構130之部分殼體110呈凹狀，距離系統板體216較遠(即間距d1)，因此提升系統板體216散熱效果，可讓使用者較為舒適。 FIG. 3 is a schematic view showing the heat pipe structure 100 of FIG. 1 used in conjunction with the system plate body 216. As shown, a heat source 212 is disposed on the circuit board 214. The heat source 212 may be a central processing unit (CPU), an image chip, an audio chip, a network chip, a heat sink, etc., but is not limited to the above components. The heat pipe structure 100 is disposed on the heat source 212 to exclude heat generated by the heat source 212. When the system board 216 (for example, the casing) is located at one side of the heat pipe structure 100, since the part of the housing 110 to which the capillary structure 130 is attached is concave, far from the system board 216 (ie, the distance d1), the system board is raised. The heat dissipation effect of the body 216 can make the user more comfortable.
第4圖繪示第2A圖之熱管結構100製造時的示意圖。同時參閱第2A圖與第4圖，熱管結構100’為熱管結構 100成型前的示意圖。熱管結構100’具有殼體110’與毛細結構130’。在製作熱管結構100時，可藉由模具222、224施壓於附著毛細結構130’之部分殼體110’，使未附著毛細結構130’之部分殼體110’相對於附著毛細結構130’之另一部分殼體110’呈凸狀。 FIG. 4 is a schematic view showing the manufacture of the heat pipe structure 100 of FIG. 2A. Referring also to FIGS. 2A and 4, the heat pipe structure 100' is a heat pipe structure. Schematic diagram of 100 before molding. The heat pipe structure 100' has a housing 110' and a capillary structure 130'. When the heat pipe structure 100 is fabricated, a portion of the casing 110' of the attached capillary structure 130' may be pressed by the molds 222, 224 such that a portion of the casing 110' of the unattached capillary structure 130' is opposed to the attached capillary structure 130'. The other part of the housing 110' is convex.
在本實施方式中，模具222具有二凹部，當模具222以方向D1施壓於熱管結構100’時，模具222可藉由凹部在殼體110’形成第2A圖呈凸狀的部分殼體110(即第二區113外側的殼體110)，且受壓的中央區域殼體110’可形成第2A圖呈凹狀的部分殼體110(即第一區111外側的殼體110)。其中凹狀的部分殼體110可由毛細結構130支撐，能避免殼體110被模具222、224過度壓扁，使熱管結構100的良率易於控制且強度得以提升，因此能提升熱管結構100的良率至80%以上。 In the present embodiment, the mold 222 has two recesses. When the mold 222 is pressed against the heat pipe structure 100' in the direction D1, the mold 222 can form a partial housing 110 having a convex shape in FIG. 2A in the housing 110' by the recess. (ie, the casing 110 outside the second zone 113), and the pressurized central zone casing 110' can form a partial casing 110 (i.e., the casing 110 outside the first zone 111) having a concave shape in FIG. The concave partial housing 110 can be supported by the capillary structure 130, which can prevent the housing 110 from being excessively flattened by the molds 222 and 224, so that the yield of the heat pipe structure 100 can be easily controlled and the strength can be improved, thereby improving the heat pipe structure 100. The rate is over 80%.
第5圖繪示根據本案第三實施方式之熱管結構100b的立體圖。第6圖繪示第5圖之熱管結構100b沿線段6-6的剖面圖。同時參閱第5圖與第6圖，熱管結構100b包含殼體110與毛細結構130。與第1圖、第2A圖實施方式不同的地方在於：毛細結構130除了接觸於殼體110的第一表面117與第二表面119外，還接觸殼體110的側面136，使容置空間112的第二區113不會被毛細結構130分隔成子空間。在本實施方式中，第二區113的垂直長度H4大於第一區111的垂直長度H5，也就是未附著毛細結構130之部分殼體110(即第二區113外側之殼體110)相對於附著 毛細結構130之另一部分殼體110(即第一區111外側之殼體110)呈凸狀。 Fig. 5 is a perspective view showing the heat pipe structure 100b according to the third embodiment of the present invention. Figure 6 is a cross-sectional view of the heat pipe structure 100b of Figure 5 taken along line 6-6. Referring also to FIGS. 5 and 6, the heat pipe structure 100b includes a housing 110 and a capillary structure 130. The difference from the embodiment of FIG. 1 and FIG. 2A is that the capillary structure 130 contacts the side surface 136 of the housing 110 in addition to the first surface 117 and the second surface 119 of the housing 110, so as to accommodate the receiving space 112. The second zone 113 is not separated into subspaces by the capillary structure 130. In the present embodiment, the vertical length H4 of the second zone 113 is greater than the vertical length H5 of the first zone 111, that is, the partial casing 110 to which the capillary structure 130 is not attached (ie, the casing 110 outside the second zone 113) is opposite to Attach The other portion of the housing 110 of the capillary structure 130 (i.e., the housing 110 outside the first region 111) is convex.
第7圖繪示第5圖之熱管結構100b搭配系統板體216、散熱片232與風扇234使用時的示意圖。第8圖繪示第7圖之熱管結構100b、熱源212與系統板體216從方向D2看的側視圖。同時參閱第7圖與第8圖，熱管結構100b的兩端分別設置於熱源212上與散熱片232上，且系統板體216覆蓋於熱管結構100b與風扇234上方。由於未附著毛細結構130(見第6圖)之部分殼體110相對於附著毛細結構130(見第6圖)之另一部分殼體110呈凸狀，因此呈凹狀的部分殼體110可與系統板體216相距間距d2。當風扇234轉動時，呈凸狀的部分殼體110可視為氣流W的擋牆，使氣流W沿熱管結構100b流動。如此一來，熱管結構100b具有引導氣流W的功能，可提升對熱源212與散熱片232的散熱效率。 FIG. 7 is a schematic view showing the heat pipe structure 100b of FIG. 5 in combination with the system plate body 216, the heat sink 232 and the fan 234. Figure 8 is a side elevational view of the heat pipe structure 100b of Figure 7, the heat source 212 and the system plate 216 as seen from direction D2. Referring to FIG. 7 and FIG. 8 , the two ends of the heat pipe structure 100 b are respectively disposed on the heat source 212 and the heat sink 232 , and the system board 216 covers the heat pipe structure 100 b and the fan 234 . Since the partial housing 110 of the unattached capillary structure 130 (see FIG. 6) is convex with respect to the other portion of the housing 110 of the attached capillary structure 130 (see FIG. 6), the concave partial housing 110 can be The system boards 216 are spaced apart by a distance d2. When the fan 234 is rotated, the convex portion of the housing 110 can be regarded as a retaining wall of the airflow W, causing the airflow W to flow along the heat pipe structure 100b. In this way, the heat pipe structure 100b has the function of guiding the airflow W, and can improve the heat dissipation efficiency of the heat source 212 and the heat sink 232.
應瞭解到，在以上敘述中，已敘述過的元件連接關係將不在重複贅述，合先敘明。在以下敘述中，將敘述不同型式的熱管結構。 It should be understood that in the above description, the component connection relationships that have been described will not be repeated, and will be described first. In the following description, different types of heat pipe structures will be described.
第9圖繪示根據本案第四實施方式之熱管結構100c的剖面圖。熱管結構100c包含殼體110與毛細結構130。與第2A圖實施方式不同的地方在於：子空間114的垂直長度H6大於第一區111的垂直長度H7，而子空間116的垂直長度H7大致等於第一區111的垂直長度H7。也就是說，子空間114的垂直長度H6大於子空間116的垂直長 度H7，且第一區111與子空間116外側的殼體110共平面。 Figure 9 is a cross-sectional view showing a heat pipe structure 100c according to a fourth embodiment of the present invention. The heat pipe structure 100c includes a housing 110 and a capillary structure 130. The difference from the embodiment of FIG. 2A is that the vertical length H6 of the subspace 114 is greater than the vertical length H7 of the first zone 111, and the vertical length H7 of the subspace 116 is substantially equal to the vertical length H7 of the first zone 111. That is, the vertical length H6 of the subspace 114 is greater than the vertical length of the subspace 116. Degree H7, and the first zone 111 is coplanar with the housing 110 outside the subspace 116.
第10圖繪示根據本案第五實施方式之熱管結構100d的剖面圖。熱管結構100d包含殼體110與毛細結構130。與第2A圖實施方式不同的地方在於：子空間114的垂直長度H8大於子空間116的垂直長度H9，且子空間114、116的垂直長度H8、H9均大於第一區111的垂直長度H10。在本實施方式中，毛細結構130的垂直長度大致等於第一區111的垂直長度H10。 Figure 10 is a cross-sectional view showing a heat pipe structure 100d according to a fifth embodiment of the present invention. The heat pipe structure 100d includes a housing 110 and a capillary structure 130. The difference from the embodiment of FIG. 2A is that the vertical length H8 of the subspace 114 is greater than the vertical length H9 of the subspace 116, and the vertical lengths H8, H9 of the subspaces 114, 116 are greater than the vertical length H10 of the first region 111. In the present embodiment, the vertical length of the capillary structure 130 is substantially equal to the vertical length H10 of the first zone 111.
在第1圖至第10圖的實施方式中，毛細結構130皆為單一部分。在以下敘述中，將敘述其他型態的毛細結構130。 In the embodiment of Figures 1 through 10, the capillary structures 130 are all single parts. In the following description, other types of capillary structures 130 will be described.
第11圖繪示根據本案第六實施方式之熱管結構100e的剖面圖。熱管結構100e包含殼體110與毛細結構130。與第2A圖實施方式不同的地方在於：毛細結構130區分為第一部分130a與第二部分130b。毛細結構130的第一部分130a接觸於第一表面117，且毛細結構130第二部分130b接觸於第二表面119。此外，第一部分130a連接於第二部分130b。 Figure 11 is a cross-sectional view showing a heat pipe structure 100e according to a sixth embodiment of the present invention. The heat pipe structure 100e includes a housing 110 and a capillary structure 130. The difference from the embodiment of Fig. 2A is that the capillary structure 130 is divided into a first portion 130a and a second portion 130b. The first portion 130a of the capillary structure 130 is in contact with the first surface 117 and the second portion 130b of the capillary structure 130 is in contact with the second surface 119. Further, the first portion 130a is coupled to the second portion 130b.
在本實施方式中，子空間114的垂直長度H11大於毛細結構130之第一、第二部分130a、130b的垂直長度之和H13(即第一區111的垂直長度)，且子空間116的垂直長度H12也大於毛細結構130之第一、第二部分130a、130b的垂直長度之和H13。 In the present embodiment, the vertical length H11 of the subspace 114 is greater than the sum H13 of the vertical lengths of the first and second portions 130a, 130b of the capillary structure 130 (ie, the vertical length of the first region 111), and the vertical of the subspace 116 The length H12 is also greater than the sum H13 of the vertical lengths of the first and second portions 130a, 130b of the capillary structure 130.
第12圖繪示根據本案第七實施方式之熱管結構 100f的剖面圖。熱管結構100f包含殼體110與毛細結構130。與第11圖實施方式不同的地方在於：子空間114的垂直長度H14大於子空間116的垂直長度H15，且子空間116的垂直長度H15大致等於毛細結構130之第一、第二部分130a、130b整體的垂直長度之和(即第一區111的垂直長度)。 Figure 12 is a diagram showing a heat pipe structure according to a seventh embodiment of the present invention. Sectional view of 100f. The heat pipe structure 100f includes a housing 110 and a capillary structure 130. The difference from the embodiment of FIG. 11 is that the vertical length H14 of the subspace 114 is greater than the vertical length H15 of the subspace 116, and the vertical length H15 of the subspace 116 is substantially equal to the first and second portions 130a, 130b of the capillary structure 130. The sum of the overall vertical lengths (i.e., the vertical length of the first zone 111).
本案的熱管結構具有以下優點： The heat pipe structure of this case has the following advantages:
(1)毛細結構位於容置空間中，且僅附著於部分殼體上，因此容置空間不會被毛細結構圍繞。在製作熱管結構時，可藉由模具施壓於附著毛細結構之部分殼體，使未附著毛細結構之部分殼體相對於附著毛細結構之另一部分殼體呈凸狀。如此一來，呈凸狀之部分殼體內便可具有足夠的空間供氣體流動，使傳熱速率提升。此外，受壓的部分殼體能由毛細結構支撐，使熱管結構的良率易於控制且強度得以提升。當熱管結構受外力時，不易變形而損壞。 (1) The capillary structure is located in the accommodating space and is attached only to a part of the casing, so that the accommodating space is not surrounded by the capillary structure. When the heat pipe structure is fabricated, a part of the casing to which the capillary structure is attached may be pressed by the mold so that the partial casing of the unattached capillary structure is convex with respect to the other part of the casing to which the capillary structure is attached. In this way, a portion of the convex portion of the housing has sufficient space for the gas to flow, thereby increasing the heat transfer rate. In addition, the partially compressed casing can be supported by the capillary structure, so that the yield of the heat pipe structure can be easily controlled and the strength can be improved. When the heat pipe structure is subjected to an external force, it is not easily deformed and damaged.
(2)當系統板體(例如機殼)位於熱管結構的一側時，由於附著毛細結構之部分殼體距離系統板體較遠，因此提升系統板體的散熱效率，可讓使用者較為舒適。 (2) When the system board body (for example, the casing) is located on one side of the heat pipe structure, since part of the casing to which the capillary structure is attached is far from the system plate body, the heat dissipation efficiency of the system plate body is improved, and the user is more comfortable. .
(3)當熱管結構與風扇搭配使用時，由於未附著毛細結構之部分殼體相對於附著毛細結構之另一部分殼體呈凸狀，因此熱管結構具有引導氣流的功能。 (3) When the heat pipe structure is used in combination with the fan, since the portion of the casing to which the capillary structure is not attached is convex with respect to the other portion of the casing to which the capillary structure is attached, the heat pipe structure has a function of guiding the airflow.
雖然本案已以實施方式揭露如上，然其並非用以限定本案，任何熟習此技藝者，在不脫離本案之精神和範圍內，當可作各種之更動與潤飾，因此本案之保護範圍當視 後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the case. Anyone skilled in the art can make various changes and refinements without departing from the spirit and scope of the case. Therefore, the scope of protection of this case is considered. The scope defined in the appended patent application shall prevail.
100‧‧‧熱管結構 100‧‧‧heat pipe structure
110‧‧‧殼體 110‧‧‧shell
111‧‧‧第一區 111‧‧‧First District
113‧‧‧第二區 113‧‧‧Second District
114‧‧‧子空間 114‧‧‧subspace
116‧‧‧子空間 116‧‧‧Subspace
117‧‧‧第一表面 117‧‧‧ first surface
119‧‧‧第二表面 119‧‧‧ second surface
120‧‧‧工作流體 120‧‧‧Working fluid
130‧‧‧毛細結構 130‧‧‧Capillary structure
H1‧‧‧垂直長度 H1‧‧‧Vertical length
H2‧‧‧垂直長度 H2‧‧‧ vertical length
H3‧‧‧垂直長度 H3‧‧‧Vertical length
Claims (8)
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| TW102110680A TW201437591A (en) | 2013-03-26 | 2013-03-26 | Heat pipe structure |
| US14/222,676 US20140290914A1 (en) | 2013-03-26 | 2014-03-23 | Heat pipe structure |
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| Application Number | Priority Date | Filing Date | Title |
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| TW102110680A TW201437591A (en) | 2013-03-26 | 2013-03-26 | Heat pipe structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI614477B (en) * | 2017-06-16 | 2018-02-11 | Wu Sen Chan | Star heat pipe structure |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5750188B1 (en) * | 2014-07-15 | 2015-07-15 | 株式会社フジクラ | heat pipe |
| CN105698579A (en) | 2014-11-28 | 2016-06-22 | 台达电子工业股份有限公司 | Heat pipe |
| JP6868476B2 (en) * | 2016-06-14 | 2021-05-12 | 古河電気工業株式会社 | heat pipe |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH063354B2 (en) * | 1987-06-23 | 1994-01-12 | アクトロニクス株式会社 | Loop type thin tube heat pipe |
| EP0409179B1 (en) * | 1989-07-19 | 1995-01-18 | Showa Aluminum Corporation | Heat pipe |
| TW407455B (en) * | 1997-12-09 | 2000-10-01 | Diamond Electric Mfg | Heat pipe and its processing method |
| DE19980801T1 (en) * | 1998-04-13 | 2000-05-31 | Furukawa Electric Co Ltd | Plate-shaped heat sink pipe and cooling device using the same |
| US20040011509A1 (en) * | 2002-05-15 | 2004-01-22 | Wing Ming Siu | Vapor augmented heatsink with multi-wick structure |
| ES2312878T3 (en) * | 2004-05-18 | 2009-03-01 | Soemtron Ag | COOLING DEVICE. |
| US20050274488A1 (en) * | 2004-05-28 | 2005-12-15 | A-Loops Thermal Solution Corporation | Heat-pipe engine structure |
| US20050284614A1 (en) * | 2004-06-22 | 2005-12-29 | Machiroutu Sridhar V | Apparatus for reducing evaporator resistance in a heat pipe |
| KR100631050B1 (en) * | 2005-04-19 | 2006-10-04 | 한국전자통신연구원 | Flat plate type heat pipe |
| CN100437005C (en) * | 2005-07-08 | 2008-11-26 | 富准精密工业(深圳)有限公司 | Flat type heat-pipe |
| CN100480612C (en) * | 2006-04-28 | 2009-04-22 | 富准精密工业(深圳)有限公司 | Heat pipe |
| SG142174A1 (en) * | 2006-10-11 | 2008-05-28 | Iplato Pte Ltd | Method for heat transfer and device therefor |
| US20080142196A1 (en) * | 2006-12-17 | 2008-06-19 | Jian-Dih Jeng | Heat Pipe with Advanced Capillary Structure |
| TWM318115U (en) * | 2007-04-09 | 2007-09-01 | Tai Sol Electronics Co Ltd | Flat heat pipe |
| US20090139696A1 (en) * | 2007-12-03 | 2009-06-04 | Forcecon Technology Co., Ltd. | Flat heat pipe with multi-passage sintered capillary structure |
| JP4399013B2 (en) * | 2008-02-28 | 2010-01-13 | 株式会社東芝 | Electronic equipment and heat pipe |
| JP4352091B2 (en) * | 2008-03-27 | 2009-10-28 | 株式会社東芝 | Electronic equipment, cooling device |
| JP4730624B2 (en) * | 2008-11-17 | 2011-07-20 | 株式会社豊田自動織機 | Boiling cooler |
| CN101765352B (en) * | 2008-12-23 | 2013-04-24 | 富瑞精密组件（昆山）有限公司 | Flat type heat conducting pipe and heat radiating module using same |
| TW201038896A (en) * | 2009-04-16 | 2010-11-01 | Yeh Chiang Technology Corp | Ultra-thin heat pipe |
| TW201100736A (en) * | 2009-06-17 | 2011-01-01 | Yeh Chiang Technology Corp | Superthin heat pipe |
| WO2011010395A1 (en) * | 2009-07-21 | 2011-01-27 | 古河電気工業株式会社 | Flattened heat pipe, and method for manufacturing the heat pipe |
| US20110024085A1 (en) * | 2009-07-28 | 2011-02-03 | Huang Yu-Po | Heat pipe and method for manufacturing the same |
| US20110297355A1 (en) * | 2010-06-07 | 2011-12-08 | Celsia Technologies Taiwan, Inc. | Heat-conducting module and heat-dissipating device having the same |
| TWI443944B (en) * | 2011-02-18 | 2014-07-01 | Asia Vital Components Co Ltd | Thin hot plate structure |
| GB2489401B (en) * | 2011-03-21 | 2014-04-23 | Naked Energy Ltd | Solar energy converter |
| TW201309996A (en) * | 2011-08-17 | 2013-03-01 | Chaun Choung Technology Corp | Method of manufacturing light-weight heat pipe and product of the same |
| TWI530654B (en) * | 2011-12-26 | 2016-04-21 | 鴻準精密工業股份有限公司 | Plate type heat pipe |
| US9476652B2 (en) * | 2012-01-04 | 2016-10-25 | Asia Vital Components Co., Ltd. | Thin heat pipe structure having enlarged condensing section |
| TWI457528B (en) * | 2012-03-22 | 2014-10-21 | Foxconn Tech Co Ltd | Plate type heat pipe |
| US9273909B2 (en) * | 2012-08-23 | 2016-03-01 | Asia Vital Components Co., Ltd. | Heat pipe structure, and thermal module and electronic device using same |
| CN103471634B (en) * | 2013-09-04 | 2015-11-25 | 北京空间机电研究所 | A kind of space optical remote sensor heat abstractor |
-
2013
- 2013-03-26 TW TW102110680A patent/TW201437591A/en unknown
-
2014
- 2014-03-23 US US14/222,676 patent/US20140290914A1/en not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI614477B (en) * | 2017-06-16 | 2018-02-11 | Wu Sen Chan | Star heat pipe structure |
Also Published As
| Publication number | Publication date |
|---|---|
| US20140290914A1 (en) | 2014-10-02 |
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