US20140290914A1 - Heat pipe structure - Google Patents
Heat pipe structure Download PDFInfo
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- US20140290914A1 US20140290914A1 US14/222,676 US201414222676A US2014290914A1 US 20140290914 A1 US20140290914 A1 US 20140290914A1 US 201414222676 A US201414222676 A US 201414222676A US 2014290914 A1 US2014290914 A1 US 2014290914A1
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- Prior art keywords
- heat pipe
- region
- pipe structure
- hollow tube
- tube body
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- This invention relates to a heat pipe structure.
- the body of the heat pipe is usually made of copper, and the working fluid of the heat pipe is usually water.
- the working fluid adsorbed by a capillary structure at higher temperature evaporates.
- the evaporated air is gathered in the pipe, and the fluid flows to the part of the heat pipe in lower temperature because of the pressure.
- the gaseous fluid flows to the part in lower temperature, the gaseous fluid is condensed to the liquid fluid, and it is adsorbed by the capillary structure at the lower temperature part.
- the liquid fluid flows back to the part with higher temperature from the part of the capillary structure with lower temperature by the capillarity.
- the working fluid is changed between the gaseous state and the liquid state circularly to conduct the heat, which is a principle of the heat transfer in the heat pipe.
- the capillary structure of the heat pipe usually enclosed inside the heat pipe.
- the sectional shape of the heat pipe is rectangle or oval. Since the space for the air to flow in the body is narrow and resulting a large resistance of the air flow, the efficiency of the heat transfer is low.
- the outer surface of a conventional heat pipe contacts the casing of an electronic device, and the heat would conduct to the casing via the outer surface of the heat pipe, which resulting a high temperature of the easing of an electronic device.
- the space inside the body of the heat pipe that surrounded by the capillary structure is saved for the air to flow through, therefore, the strength of the body of the heat pipe is difficult to improve, and it easily deforms when an external force applied, in the production of heat pipes, the saved space for the air flow affects the yield of the heat pipe, and the yield of the heat pipe is difficult to control which is just about 60% at present.
- the conventional heat pipe is no function in guiding the airflow when cooperating with a cooling fin and a fan.
- a heat pipe structure is provided.
- the heat pipe structure includes a hollow tube body and a plurality of capillary structures. A first region and a second region are defined.
- the capillary structure is disposed on the inner wall of the first region. The diameter of the second region is larger than that of the first region.
- the capillary structure is disposed in part of the inner wall of the hollow tube body, therefore the hollow tube body is not fulfilled by the capillary structure.
- a mold applies to the heat pipe body via a pressure to form a second region and a first region.
- the inner wall of the second region of the hollow tube body disposes no capillary structure while the inner wall of the first region of the hollow tube body disposes with the capillary structure.
- the second region of the hollow tube body forms a channel for the air to flow through, and the efficiency of dissipating the heat is enhanced.
- the first region of the body is disposed with the capillary structure, thus the strength of the heat pipe structure is improved, and the yield of the heat pipe structure is easy to be managed.
- the first region is not contact the casing of the electronic device, thus the heat would not accumulate on the casing of the electronic device, and the user feels more comfortable.
- the second region of the heat pipe forms a channel to guide the airflow, which enhance heat dissipating efficiency.
- FIG. 1 is a three dimensional schematic diagram showing a heat pipe structure in a first embodiment
- FIG. 2A is a sectional schematic diagram showing the heat pipe structure in FIG. 1 along the line segment 2 - 2 ;
- FIG. 2B is a sectional schematic diagram showing the heat pipe structure in a second embodiment
- FIG. 3 is a schematic diagram showing that the heat pipe structure in FIG. 1 is used cooperating with the casing of the electronic device;
- FIG. 4 is a schematic diagram showing the heat pipe structure in FIG. 2A in manufacturing
- FIG. 5 is a sectional schematic diagram showing the heat pipe structure in a third embodiment
- FIG. 6 is a sectional schematic diagram showing the heat pipe structure in FIG. 5 along the line segment 6 - 6 ;
- FIG. 7 is a schematic diagram showing that the heat pipe structure in FIG. 5 is used with the casing of the electronic device, a heat sink, and a fan;
- FIG. 8 is a side view showing the heat pipe structure, the heat source, and the casing of the electronic device viewed from the direction D 2 ;
- FIG. 9 is a sectional schematic diagram showing the heat pipe structure m a. fourth embodiment.
- FIG. 10 is a sectional schematic diagram showing the heat pipe structure in a filth embodiment
- FIG. 11 is a sectional schematic diagram showing the heat pipe structure in a sixth embodiment
- FIG. 12 is a sectional schematic diagram showing the heat pipe structure in a seventh embodiment.
- FIG. 1 is a three dimensional diagram showing a heat pipe structure 100 .
- FIG. 2A is a sectional schematic diagram showing the heat pipe structure in FIG. 1 along the line segment 2 - 2 .
- the heat pipe structure 100 includes a hollow tube body 110 and a capillary structure 130 .
- the heat pipe structure 100 accommodates a working fluid 120 therein.
- a first region 111 and a second region 113 are defined inside the hollow tube body 110 .
- a capillary structure 130 is disposed on an inner wall of the first region 111 .
- the inner wall is a surface of the hollow tube body 110 contacting the capillary structure 130 . such as a first surface 117 and a second surface 119 of the first region 111 .
- a diameter H of the part of the hollow tube body 110 on where the capillary structure 130 is not disposed is larger than a diameter H′ of the other part of the hollow tube body 110 on where the capillary structure 130 is disposed (that is the hollow tube body 110 outside the first region 111 ).
- the part of the hollow tube body 110 which is not attached with the capillary structure 130 is the second region 111
- the other part of the hollow tube body 110 which is attached with the capillary structure 130 is the first region.
- the capillary structure 130 contacts the first surface 117 and the second surface 119 of the hollow tube body 110 .
- the capillary structure 130 may be one or a combination of metal sinters, micro grooves, fibers, mental nets, or any other heat conduction elements, which is not limited herein.
- the second region 113 of the hollow tube body 110 is divided into two subspaces 114 and 116 , the subspace 114 has a diameter H 1 , and the subspace 116 has a diameter H 2 .
- the diameter H 1 of the subspace 114 is same to the diameter H 2 of the subspace 116 .
- the diameter of the second region 113 (that is the diameter H 1 and H 2 ) is larger than a diameter H 3 of the first region 111 .
- the diameter of the capillary structure 130 is approximately same to the diameter 113 of the first region 111 , and thus the diameter H 1 and H 2 of the subspaces 114 and 116 are all larger than the diameter of the capillary structure 130 , respectively.
- the term “approximately” above means that it allows an error in manufacturing.
- the working fluid 120 may be water, which is not limited herein.
- the liquid working fluid 120 (such as the liquid water) can be absorbed and transmitted by the capillary structure 130 , and the gaseous working fluid 120 (such as the water vapor) can flow in the subspaces 114 and 116 .
- the accommodating space 112 in the hollow tube body 110 is vacuumized, and the pressure is less than 1 standard atmospheric pressure, and thus the boiling point of the working fluid 120 is reduced.
- the capillary structure 130 is in the first region 111 and only disposed on the inner wall of the first region 111 , the hollow tube body 110 is not fulfilled by the capillary structure 130 .
- the second region of the hollow tube body 110 has enough space (such as the subspace 114 and 116 ) for the gaseous working fluid 120 to flow, and the efficiency of conducting heat is enhanced. Furthermore, the second region of the hollow tube body 110 is supported by the capillary structure 130 , and thus the heat pipe structure 100 is not easily deformed and damaged when an external force applied.
- FIG. 2B is a sectional schematic diagram showing the heat pipe structure 100 ′ in a second embodiment.
- the heat pipe structure 100 ′ includes the hollow tube body 110 and the capillary structure 130 .
- the difference between this embodiment and the embodiment in FIG. 2A is that the capillary structure 130 contacts the first surface 117 of the first region 111 but not the second surface 119 of the first region 111 . That is, the diameter of the capillary structure 130 is smaller than the diameter H 3 of the first region 111 .
- FIG. 3 is a schematic, diagram showing that the heat pipe structure 100 is used inside the casing of the electronic device 216 .
- a heat source 212 is disposed on a circuit board 214 .
- the heat source 212 is an electronic component which generates heats while operation, such as a central processing, unit (CPU), a video chip, an audio chip, a network chip or a heat sink, which is not limited herein.
- the heat pipe structure 100 is disposed at the heat source 212 to transfer the heat produced by the heat source 212 .
- the first region of the hollow tube body 110 is not contact the casing of the electronic device 216 (that is a distance d 1 ), and thus the casing of the electronic device 216 receives less heat from heat pipe, and the user feels more comfortable while operating.
- FIG. 4 is a schematic diagram showing the heat pipe structure 100 in FIG. 2A in manufacturing.
- the heat pipe structure 100 is not yet molded.
- the heat pipe structure 100 ′ includes the hollow tube body 110 ′ and the capillary structure 130 ′.
- the part of the hollow tube body 110 ′ which is attached with the capillary structure 130 ′ is pressed by the molds 222 and 224 to form the first region, and the part of the hollow tube body 110 ′ which is not attached with the capillary structure 130 ′ forms the second region.
- the mold 222 includes two concaves.
- the mold 222 presses the heat pipe structure 100 ′ along direction D 1 , the mold 222 can make the hollow tube body 110 ′ form the second region of the body 110 in FIG. 2A , the pressed central region of the hollow tube body 110 ′ forms the first region 111 of the hollow tube body 110 in FIG. 2A .
- Inside the first region 111 of the body 110 is disposed with the capillary structure 130 , and thus the hollow tube body 110 would not be excessively squashed by the molds 222 and 224 . Consequently, the yield of the heat pipe structure 100 is easy to be managed, the strength of the heat pipe structure 100 is enhanced, and the yield of the heat pipe structure 100 is increased to more than 80%.
- FIG. 5 is a sectional schematic diagram showing the heat pipe structure 100 b in a third embodiment.
- FIG. 6 is a sectional schematic diagram showing the heat pipe structure in FIG. 5 along the line segment 6 - 6 .
- the heat pipe structure 100 b includes the hollow tube body 110 and the capillary structure 130 .
- the capillary structure 130 not only contacts the first surface 117 and the second surface 119 of the hollow tube body 110 but also contacts the side 136 of the hollow tube body 110 .
- the diameter H 4 of the second region 113 is larger than the diameter H 5 of the first region 111 .
- FIG. 7 is a schematic diagram showing that the heat pipe structure 100 b in FIG. 5 is used with the casing of the electronic device 216 , a heat sink 232 , and a fan 234 .
- FIG. 8 is a side view showing the heat pipe structure 100 b , the heat source 212 , and the casing of the electronic device looked from the direction D 2 . Referring to FIG. 7 and FIG. 8 , two ends of the heat pipe structure 100 b are disposed at the heat source 212 and the heat sink 232 respectively, and the casing of the electronic device 216 is covering the heat pipe structure 100 b and the fan 234 .
- a distance d 2 is formed between the first region of the hollow tube body 110 and the casing of the electronic device 216 , where the first region of the hollow tube body 110 disposed with capillary structure 130 (as shown in FIG. 6 ), and compare to the first region, is the second region disposed with no capillary structure 130 (as shown in FIG. 6 ).
- the second region of the hollow tube body 110 can be regarded as a baffle of the airflow W to make the airflow W flow along the heat pipe structure 100 b .
- the heat pipe structure 100 b guides the airflow W thus enhancing the heat dissipation efficiency for the heat source 212 and heat sink 231 .
- FIG. 9 is a sectional schematic diagram showing the heat pipe structure 100 c in a fourth embodiment.
- the heat pipe structure 100 c includes the hollow tube body 110 and the capillary structure 130 .
- the difference between this embodiment and that in FIG. 2A the diameter H 6 of the subspace 114 is larger than the diameter 117 of the first region 111 , and the diameter H 7 of the subspace 116 is approximately same to the diameter H 7 of the first region 111 . That is, the diameter H 6 of the subspace 114 is larger than the diameter H 7 of the subspace 116 , and the first region 111 and the hollow tube body 110 outside the subspace 116 are at the same plane.
- FIG. 10 is a sectional schematic diagram showing the heat pipe structure 100 d in a fifth embodiment.
- the heat pipe structure 100 d includes the hollow tube body 110 and the capillary structure 130 .
- the difference between this embodiment and that in FIG. 2A are the diameter H 8 of the subspace 114 is larger than the diameter 119 of the subspace 116 , and the diameter H 8 and H 9 of the subspace 114 and 116 are all larger than the diameter H 10 of the first region 111 .
- the diameter of the capillary structure 130 is approximately same to the diameter H 10 of the first region 111 .
- the capillary structures 130 in the embodiments of FIG. 1 to FIG. 10 are single structures. Various of the capillary structures 130 are illustrated, hereinafter.
- FIG. 11 is a sectional schematic diagram showing the heat pipe structure in a sixth embodiment.
- the heat pipe structure 100 e includes the hollow tube body 110 and the capillary structure 130 .
- the difference between this embodiment and that in FIG. 2A is that the capillary structure 130 is divided into the first part 130 a and the second part 130 b .
- the first part 130 a of the capillary structure 130 contacts the first surface 117
- the second. part 130 b of the capillary structure 130 contacts the second surface 119 .
- the first part 130 a is connected to the second part 130 b.
- the diameter H 11 of the subspace 114 is larger than a sum diameter H 13 (that is the diameter of the first region 111 ) of the first part 130 a and the second part 130 b .
- the diameter H 12 of the subspace 116 is also larger than a sum diameter H 3 of the first part 130 a and the second part 130 b of the capillary structure 130 .
- FIG. 12 is a sectional schematic diagram showing the heat pipe structure in a seventh embodiment.
- the heat pipe structure 100 f includes the hollow tube body 110 and the capillary structure 130 .
- the difference between this embodiment and that in FIG. 11 are: the diameter H 14 of the subspace 114 is larger than the diameter H 15 of the subspace 116 , and the diameter H 15 of the subspace 116 is approximately same to the sum of diameter of the first part 130 a and diameter of the second part 130 b of the capillary structure 110 (that is the diameter of the first region 111 ).
- the heat pipe structure in embodiments includes following advantages.
- the capillary structure is disposed on part of the hollow tube body, and thus the hollow tube body is not fulfilled by the capillary structure.
- the mold presses the part of the hollow tube body which is not attached with the capillary structure to make a second region.
- the second region of the hollow tube body has enough space for the air to flow, and the heat dissipation efficiency is enhanced.
- the first region of the hollow tube body is supported by the capillary structure, the yield of the heat pipe structure is easy to be managed, and the strength of the heat pipe structure is enhanced.
- the heat pipe structure is not easily deformed and damaged.
- the first region of the hollow tube body which is attached with the capillary structure is not contact the casing, of the electronic device, thus the heat would not accumulate on the casing of the electronic device, and it is more comfortable for the user while operating.
- the convex part of the hollow tube body on where the capillary structure 130 (that is the second part) is not disposed forms a channel to guide the airflow, and thus the efficiency of the heat pipe structure is increased.
Abstract
A heat pipe structure includes a hollow tube body and a plurality of capillary structures. A first region and a second region are defined in the hollow tube body. The capillary structure is disposed on the first region. A diameter of the second region is larger than a diameter of the first region.
Description
- This application claims priority to Taiwan Application Serial Number 102110680, filed Mar. 26, 2013, the entirety of which is herein incorporated by reference.
- 1. Field of the Invention
- This invention relates to a heat pipe structure.
- 2. Description of the Related Art
- The body of the heat pipe is usually made of copper, and the working fluid of the heat pipe is usually water. When one end of the heat pipe is in a higher temperature and the other end of the heat pipe is in a lower temperature, the working fluid adsorbed by a capillary structure at higher temperature evaporates. The evaporated air is gathered in the pipe, and the fluid flows to the part of the heat pipe in lower temperature because of the pressure. When the gaseous fluid flows to the part in lower temperature, the gaseous fluid is condensed to the liquid fluid, and it is adsorbed by the capillary structure at the lower temperature part. Then, the liquid fluid flows back to the part with higher temperature from the part of the capillary structure with lower temperature by the capillarity. The working fluid is changed between the gaseous state and the liquid state circularly to conduct the heat, which is a principle of the heat transfer in the heat pipe.
- However, the capillary structure of the heat pipe usually enclosed inside the heat pipe. The sectional shape of the heat pipe is rectangle or oval. Since the space for the air to flow in the body is narrow and resulting a large resistance of the air flow, the efficiency of the heat transfer is low. Furthermore, the outer surface of a conventional heat pipe contacts the casing of an electronic device, and the heat would conduct to the casing via the outer surface of the heat pipe, which resulting a high temperature of the easing of an electronic device.
- Additionally, the space inside the body of the heat pipe that surrounded by the capillary structure is saved for the air to flow through, therefore, the strength of the body of the heat pipe is difficult to improve, and it easily deforms when an external force applied, in the production of heat pipes, the saved space for the air flow affects the yield of the heat pipe, and the yield of the heat pipe is difficult to control which is just about 60% at present. Moreover, the conventional heat pipe is no function in guiding the airflow when cooperating with a cooling fin and a fan.
- A heat pipe structure is provided.
- The heat pipe structure includes a hollow tube body and a plurality of capillary structures. A first region and a second region are defined. The capillary structure is disposed on the inner wall of the first region. The diameter of the second region is larger than that of the first region.
- The capillary structure is disposed in part of the inner wall of the hollow tube body, therefore the hollow tube body is not fulfilled by the capillary structure. To produce the heat pipe structure of the present disclosure, a mold applies to the heat pipe body via a pressure to form a second region and a first region. The inner wall of the second region of the hollow tube body disposes no capillary structure while the inner wall of the first region of the hollow tube body disposes with the capillary structure. Thus, the second region of the hollow tube body forms a channel for the air to flow through, and the efficiency of dissipating the heat is enhanced. Additionally; the first region of the body is disposed with the capillary structure, thus the strength of the heat pipe structure is improved, and the yield of the heat pipe structure is easy to be managed. When the heat pipe structure is pressed by the external force, it is not easily deformed and damaged.
- When the casing of the electronic device contacts part of the heat pipe structure, the first region is not contact the casing of the electronic device, thus the heat would not accumulate on the casing of the electronic device, and the user feels more comfortable. Further, when the heat pipe structure is used cooperating with the fan, the second region of the heat pipe forms a channel to guide the airflow, which enhance heat dissipating efficiency.
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FIG. 1 is a three dimensional schematic diagram showing a heat pipe structure in a first embodiment; -
FIG. 2A is a sectional schematic diagram showing the heat pipe structure inFIG. 1 along the line segment 2-2; -
FIG. 2B is a sectional schematic diagram showing the heat pipe structure in a second embodiment; -
FIG. 3 is a schematic diagram showing that the heat pipe structure inFIG. 1 is used cooperating with the casing of the electronic device; -
FIG. 4 is a schematic diagram showing the heat pipe structure inFIG. 2A in manufacturing; -
FIG. 5 is a sectional schematic diagram showing the heat pipe structure in a third embodiment; -
FIG. 6 is a sectional schematic diagram showing the heat pipe structure inFIG. 5 along the line segment 6-6; -
FIG. 7 is a schematic diagram showing that the heat pipe structure inFIG. 5 is used with the casing of the electronic device, a heat sink, and a fan; -
FIG. 8 is a side view showing the heat pipe structure, the heat source, and the casing of the electronic device viewed from the direction D2; -
FIG. 9 is a sectional schematic diagram showing the heat pipe structure m a. fourth embodiment, -
FIG. 10 is a sectional schematic diagram showing the heat pipe structure in a filth embodiment; -
FIG. 11 is a sectional schematic diagram showing the heat pipe structure in a sixth embodiment; -
FIG. 12 is a sectional schematic diagram showing the heat pipe structure in a seventh embodiment. -
FIG. 1 is a three dimensional diagram showing aheat pipe structure 100.FIG. 2A is a sectional schematic diagram showing the heat pipe structure inFIG. 1 along the line segment 2-2. Referring toFIG. 1 andFIG. 2A , theheat pipe structure 100 includes ahollow tube body 110 and acapillary structure 130. Theheat pipe structure 100 accommodates a workingfluid 120 therein. Afirst region 111 and asecond region 113 are defined inside thehollow tube body 110. Acapillary structure 130 is disposed on an inner wall of thefirst region 111. The inner wall is a surface of thehollow tube body 110 contacting thecapillary structure 130. such as afirst surface 117 and asecond surface 119 of thefirst region 111. Furthermore, a diameter H of the part of thehollow tube body 110 on where thecapillary structure 130 is not disposed (that is thehollow tube body 110 outside the second region 113) is larger than a diameter H′ of the other part of thehollow tube body 110 on where thecapillary structure 130 is disposed (that is thehollow tube body 110 outside the first region 111). And the part of thehollow tube body 110 which is not attached with thecapillary structure 130 is thesecond region 111, and the other part of thehollow tube body 110 which is attached with thecapillary structure 130 is the first region. - In this embodiment, the
capillary structure 130 contacts thefirst surface 117 and thesecond surface 119 of thehollow tube body 110. Thecapillary structure 130 may be one or a combination of metal sinters, micro grooves, fibers, mental nets, or any other heat conduction elements, which is not limited herein. - Furthermore, the
second region 113 of thehollow tube body 110 is divided into twosubspaces subspace 114 has a diameter H1, and thesubspace 116 has a diameter H2. In this embodiment, the diameter H1 of thesubspace 114 is same to the diameter H2 of thesubspace 116. The diameter of the second region 113 (that is the diameter H1 and H2) is larger than a diameter H3 of thefirst region 111. The diameter of thecapillary structure 130 is approximately same to thediameter 113 of thefirst region 111, and thus the diameter H1 and H2 of thesubspaces capillary structure 130, respectively. The term “approximately” above means that it allows an error in manufacturing. - The working
fluid 120 may be water, which is not limited herein. The liquid working fluid 120 (such as the liquid water) can be absorbed and transmitted by thecapillary structure 130, and the gaseous working fluid 120 (such as the water vapor) can flow in thesubspaces hollow tube body 110 is vacuumized, and the pressure is less than 1 standard atmospheric pressure, and thus the boiling point of the workingfluid 120 is reduced. - Since the
capillary structure 130 is in thefirst region 111 and only disposed on the inner wall of thefirst region 111, thehollow tube body 110 is not fulfilled by thecapillary structure 130. The second region of thehollow tube body 110 has enough space (such as thesubspace 114 and 116) for the gaseous workingfluid 120 to flow, and the efficiency of conducting heat is enhanced. Furthermore, the second region of thehollow tube body 110 is supported by thecapillary structure 130, and thus theheat pipe structure 100 is not easily deformed and damaged when an external force applied. -
FIG. 2B is a sectional schematic diagram showing theheat pipe structure 100′ in a second embodiment. Theheat pipe structure 100′ includes thehollow tube body 110 and thecapillary structure 130. The difference between this embodiment and the embodiment inFIG. 2A is that thecapillary structure 130 contacts thefirst surface 117 of thefirst region 111 but not thesecond surface 119 of thefirst region 111. That is, the diameter of thecapillary structure 130 is smaller than the diameter H3 of thefirst region 111. -
FIG. 3 is a schematic, diagram showing that theheat pipe structure 100 is used inside the casing of theelectronic device 216. Aheat source 212 is disposed on acircuit board 214. Theheat source 212 is an electronic component which generates heats while operation, such as a central processing, unit (CPU), a video chip, an audio chip, a network chip or a heat sink, which is not limited herein. Theheat pipe structure 100 is disposed at theheat source 212 to transfer the heat produced by theheat source 212. When the casing of theelectronic device 216 contacts part of theheat pipe structure 100, the first region of thehollow tube body 110 is not contact the casing of the electronic device 216 (that is a distance d1), and thus the casing of theelectronic device 216 receives less heat from heat pipe, and the user feels more comfortable while operating. -
FIG. 4 is a schematic diagram showing theheat pipe structure 100 inFIG. 2A in manufacturing. Referring toFIG. 2A andFIG. 4 , theheat pipe structure 100 is not yet molded. Theheat pipe structure 100′ includes thehollow tube body 110′ and thecapillary structure 130′. In manufacturing theheat pipe structure 100, the part of thehollow tube body 110′ which is attached with thecapillary structure 130′ is pressed by the molds 222 and 224 to form the first region, and the part of thehollow tube body 110′ which is not attached with thecapillary structure 130′ forms the second region. - In this embodiment, the mold 222 includes two concaves. When the mold 222 presses the
heat pipe structure 100′ along direction D1, the mold 222 can make thehollow tube body 110′ form the second region of thebody 110 inFIG. 2A , the pressed central region of thehollow tube body 110′ forms thefirst region 111 of thehollow tube body 110 inFIG. 2A . Inside thefirst region 111 of thebody 110 is disposed with thecapillary structure 130, and thus thehollow tube body 110 would not be excessively squashed by the molds 222 and 224. Consequently, the yield of theheat pipe structure 100 is easy to be managed, the strength of theheat pipe structure 100 is enhanced, and the yield of theheat pipe structure 100 is increased to more than 80%. -
FIG. 5 is a sectional schematic diagram showing theheat pipe structure 100 b in a third embodiment.FIG. 6 is a sectional schematic diagram showing the heat pipe structure inFIG. 5 along the line segment 6-6. Referring toFIG. 5 andFIG. 6 , theheat pipe structure 100 b includes thehollow tube body 110 and thecapillary structure 130. The difference between this embodiment and that inFIG. 1 andFIG. 2A is that: thecapillary structure 130 not only contacts thefirst surface 117 and thesecond surface 119 of thehollow tube body 110 but also contacts theside 136 of thehollow tube body 110. In this embodiment, the diameter H4 of thesecond region 113 is larger than the diameter H5 of thefirst region 111. -
FIG. 7 is a schematic diagram showing that theheat pipe structure 100 b inFIG. 5 is used with the casing of theelectronic device 216, aheat sink 232, and afan 234.FIG. 8 is a side view showing theheat pipe structure 100 b, theheat source 212, and the casing of the electronic device looked from the direction D2. Referring toFIG. 7 andFIG. 8 , two ends of theheat pipe structure 100 b are disposed at theheat source 212 and theheat sink 232 respectively, and the casing of theelectronic device 216 is covering theheat pipe structure 100 b and thefan 234. A distance d2 is formed between the first region of thehollow tube body 110 and the casing of theelectronic device 216, where the first region of thehollow tube body 110 disposed with capillary structure 130 (as shown inFIG. 6 ), and compare to the first region, is the second region disposed with no capillary structure 130 (as shown inFIG. 6 ). When thefan 234 rotates, the second region of thehollow tube body 110 can be regarded as a baffle of the airflow W to make the airflow W flow along theheat pipe structure 100 b. Thus, theheat pipe structure 100 b guides the airflow W thus enhancing the heat dissipation efficiency for theheat source 212 and heat sink 231. -
FIG. 9 is a sectional schematic diagram showing theheat pipe structure 100 c in a fourth embodiment. Theheat pipe structure 100 c includes thehollow tube body 110 and thecapillary structure 130. The difference between this embodiment and that inFIG. 2A the diameter H6 of thesubspace 114 is larger than thediameter 117 of thefirst region 111, and the diameter H7 of thesubspace 116 is approximately same to the diameter H7 of thefirst region 111. That is, the diameter H6 of thesubspace 114 is larger than the diameter H7 of thesubspace 116, and thefirst region 111 and thehollow tube body 110 outside thesubspace 116 are at the same plane. -
FIG. 10 is a sectional schematic diagram showing theheat pipe structure 100 d in a fifth embodiment. Theheat pipe structure 100 d includes thehollow tube body 110 and thecapillary structure 130. The difference between this embodiment and that inFIG. 2A are the diameter H8 of thesubspace 114 is larger than thediameter 119 of thesubspace 116, and the diameter H8 and H9 of thesubspace first region 111. In this embodiment, the diameter of thecapillary structure 130 is approximately same to the diameter H10 of thefirst region 111. - The
capillary structures 130 in the embodiments ofFIG. 1 toFIG. 10 are single structures. Various of thecapillary structures 130 are illustrated, hereinafter. -
FIG. 11 is a sectional schematic diagram showing the heat pipe structure in a sixth embodiment. The heat pipe structure 100 e includes thehollow tube body 110 and thecapillary structure 130. The difference between this embodiment and that inFIG. 2A is that thecapillary structure 130 is divided into thefirst part 130 a and thesecond part 130 b. Where thefirst part 130 a of thecapillary structure 130 contacts thefirst surface 117, and the second.part 130 b of thecapillary structure 130 contacts thesecond surface 119. Furthermore, thefirst part 130 a is connected to thesecond part 130 b. - In this embodiment, the diameter H11 of the
subspace 114 is larger than a sum diameter H13 (that is the diameter of the first region 111) of thefirst part 130 a and thesecond part 130 b. The diameter H12 of thesubspace 116 is also larger than a sum diameter H3 of thefirst part 130 a and thesecond part 130 b of thecapillary structure 130. -
FIG. 12 is a sectional schematic diagram showing the heat pipe structure in a seventh embodiment. The heat pipe structure 100 f includes thehollow tube body 110 and thecapillary structure 130. The difference between this embodiment and that inFIG. 11 are: the diameter H14 of thesubspace 114 is larger than the diameter H15 of thesubspace 116, and the diameter H15 of thesubspace 116 is approximately same to the sum of diameter of thefirst part 130 a and diameter of thesecond part 130 b of the capillary structure 110 (that is the diameter of the first region 111). - The heat pipe structure in embodiments includes following advantages.
- The capillary structure is disposed on part of the hollow tube body, and thus the hollow tube body is not fulfilled by the capillary structure. In manufacturing the heat pipe structure, the mold presses the part of the hollow tube body which is not attached with the capillary structure to make a second region. Thus, the second region of the hollow tube body has enough space for the air to flow, and the heat dissipation efficiency is enhanced. Furthermore, the first region of the hollow tube body is supported by the capillary structure, the yield of the heat pipe structure is easy to be managed, and the strength of the heat pipe structure is enhanced. When an external force is applied on the heat pipe structure, the heat pipe structure is not easily deformed and damaged.
- When the casino of the electronic device contacts part of the heat pipe structure, the first region of the hollow tube body which is attached with the capillary structure is not contact the casing, of the electronic device, thus the heat would not accumulate on the casing of the electronic device, and it is more comfortable for the user while operating.
- When the heat pipe structure is cooperated with the fan, the convex part of the hollow tube body on where the capillary structure 130 (that is the second part) is not disposed forms a channel to guide the airflow, and thus the efficiency of the heat pipe structure is increased.
- Although the disclosure has been described in considerable detail with reference to certain preferred embodiments thereof, the disclosure is not for limiting the scope. Persons having ordinary skill in the art may make various modifications and changes without departing from the scope. Therefore, the scope of the appended claims should not he limited to the description of the preferred embodiments described above.
Claims (8)
1. A heat pipe structure, comprising
a hollow tube body, defining a first region and a second region; and
a plurality of capillary structures disposed on the first region, wherein the diameter of the second region is larger than the diameter of the first region.
2. The heat pipe structure according to claim 1 , wherein the first region includes a first surface and a second surface, and the capillary structure is divided into a first part and a second part.
3. The heat pipe structure according to claim 2 , wherein the first part contacts the first surface.
4. The heat pipe structure according to claim 3 , wherein the first part is connected to the second part.
5. The heat pipe structure according to claim 1 , wherein the second region is divided into at least two subspaces.
6. The heat pipe structure according to claim 5 , wherein the diameter of each of the subspaces is equal or not equal to that of the first region.
7. The heat pipe structure according to claim 5 , wherein the diameters of the subspaces are equal or not equal.
8. The heat pipe structure according to claim 1 , wherein the capillary structure is metal sinters, micro grooves, fibers, mental nets or the combinations thereof.
Applications Claiming Priority (2)
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TW102110680 | 2013-03-26 | ||
TW102110680A TW201437591A (en) | 2013-03-26 | 2013-03-26 | Heat pipe structure |
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US20140290914A1 true US20140290914A1 (en) | 2014-10-02 |
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ID=51619670
Family Applications (1)
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US14/222,676 Abandoned US20140290914A1 (en) | 2013-03-26 | 2014-03-23 | Heat pipe structure |
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TW (1) | TW201437591A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US20160018165A1 (en) * | 2014-07-15 | 2016-01-21 | Fujikura Ltd. | Heat pipe |
US20160153723A1 (en) * | 2014-11-28 | 2016-06-02 | Delta Electronics, Inc. | Heat pipe |
JP2017223435A (en) * | 2016-06-14 | 2017-12-21 | 古河電気工業株式会社 | heat pipe |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI614477B (en) * | 2017-06-16 | 2018-02-11 | Wu Sen Chan | Star heat pipe structure |
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---|---|---|---|---|
US20160018165A1 (en) * | 2014-07-15 | 2016-01-21 | Fujikura Ltd. | Heat pipe |
US10415890B2 (en) * | 2014-07-15 | 2019-09-17 | Fujikura, Ltd. | Heat pipe |
US20160153723A1 (en) * | 2014-11-28 | 2016-06-02 | Delta Electronics, Inc. | Heat pipe |
US11598585B2 (en) | 2014-11-28 | 2023-03-07 | Delta Electronics, Inc. | Heat pipe |
US11796259B2 (en) | 2014-11-28 | 2023-10-24 | Delta Electronics, Inc. | Heat pipe |
JP2017223435A (en) * | 2016-06-14 | 2017-12-21 | 古河電気工業株式会社 | heat pipe |
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