US20130092353A1 - Vapor chamber structure and method of manufacturing same - Google Patents

Vapor chamber structure and method of manufacturing same Download PDF

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Publication number
US20130092353A1
US20130092353A1 US13274360 US201113274360A US2013092353A1 US 20130092353 A1 US20130092353 A1 US 20130092353A1 US 13274360 US13274360 US 13274360 US 201113274360 A US201113274360 A US 201113274360A US 2013092353 A1 US2013092353 A1 US 2013092353A1
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Prior art keywords
plate
structure
chamber
opening
vapor chamber
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US13274360
Inventor
Hsiu-Wei Yang
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Asia Vital Components Co Ltd
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Asia Vital Components Co Ltd
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4935Heat exchanger or boiler making

Abstract

A vapor chamber structure includes a main body formed from a first plate and a second plate, which are correspondingly closed to each other to define at least one open area on the main body and a chamber in the main body. The chamber is internally provided with at least one wick structure, a supporting structure, and a working fluid. The open area correspondingly extends through the first plate, the second plate and the chamber. When the main body is positioned on a substrate to contact with a heat source, the at least one open area allows other electronic elements higher than the heat source to extend therethrough without interfering with the direct contact of the main body with the heat source. A method of manufacturing the above-described vapor chamber structure is also disclosed.

Description

    FIELD OF THE INVENTION
  • The present invention relates to a vapor chamber structure, and more particularly to a vapor chamber structure that allows electronic elements located near and around a heat source on a substrate to extend therethrough without interfering with the direct contact of the vapor chamber structure with the heat source. The present invention also relates to a method of manufacturing the above-described vapor chamber structure.
  • BACKGROUND OF THE INVENTION
  • In response to the market demands for compact and lightweight electronic devices, all electronic elements therefor are also reduced in size. However, the heat generated by the electronic elements in the size-reduced electronic devices during operation thereof forms a major hindrance to the performance improvement of the electronic devices and systems using same. Meanwhile, the semiconductors forming the electronic elements must be constantly upgraded in performance even if their size is constantly reduced.
  • A vapor chamber is suitable for conducting and transferring heat between two relatively large surfaces, and is therefore different from a heat pipe that transfers heat between two points. The vapor chamber can also be advantageously used in a relatively narrow space for heat transfer and dissipation.
  • Since the vapor chamber provides a large contact and heat conducting area, it is very suitable for use with a heat source having a relatively large heat-generating area or a plurality of heat sources that are located close to one another.
  • However, according to most electronic circuit designs, it is impossible or not easy for all the electronic elements that generate heat and need heat dissipation to be arranged within the same zone on a substrate. In addition, not all the electronic elements are the same in height. Thus, the conventional vapor chamber could not always simultaneously contact with different heat sources provided on the same substrate.
  • Furthermore, the electronic elements are different in their power and accordingly, generate different amounts of heat. In the case there is a big difference between the amounts of heat generated by two different electronic elements, it is not suitable to use the same one vapor chamber with these two electronic elements at the same time for the purpose of transferring and dissipating heat.
  • SUMMARY OF THE INVENTION
  • A primary object of the present invention is to provide a vapor chamber structure that allows increased flexibility in use.
  • Another object of the present invention is to provide a method of manufacturing a vapor chamber structure that allows increased flexibility in use.
  • To achieve the above and other objects, the vapor chamber structure according to the present invention includes a main body formed from a first plate and a second plate, which are correspondingly closed to each other to define at least one open area on the main body and a chamber in the main body. The chamber is internally provided with at least one wick structure, a supporting structure, and a working fluid; and the open area correspondingly extends through the first plate, the second plate and the chamber.
  • To achieve the above and other objects, the vapor chamber structure manufacturing method according to the present invention includes the following steps: (a) providing a first plate and a second plate; (b) mechanically processing the first and the second plate, so that the first and the second plate are correspondingly formed at predetermined positions with at least one opening; (c) providing at least one wick structure and a supporting structure on surfaces of the first and second plates that are to be faced toward each other when the first and second plates are correspondingly closed later; and (d) correspondingly closing the first and the second plate to each other to define a chamber therebetween, fixedly connecting and sealing joints between the first and the second plate as well as between the first and the second opening, evacuating the chamber, and filling a working fluid into the chamber.
  • By forming one or more open areas on the main body at positions corresponding to predetermined electronic elements that are higher than the heat source on the same substrate, the selected electronic elements can extend through the open areas without interfering with the direct contact of the main body with the heat source, so that the vapor chamber structure has increased flexibility in use. Further, the open areas also effectively isolate the chamber in the main body from the selected electronic elements to achieve good thermal insulation of the chamber.
  • In brief, the present invention provides the following advantages: (1) ensuring direct contact of the vapor chamber with a heat source without being interfered by other nearby electronic elements that are higher than the heat source on the substrate; (2) providing increased flexibility in use; and (3) enabling good thermal insulation of the chamber defined in the main body of the vapor chamber structure.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
  • FIG. 1 is an exploded perspective view of a vapor chamber structure according to a first embodiment of the present invention;
  • FIG. 2 is an assembled view of FIG. 1;
  • FIG. 3 is a sectional view taken along line A-A of FIG. 2;
  • FIG. 4 is an exploded perspective view of a vapor chamber structure according to a second embodiment of the present invention;
  • FIG. 5 is an assembled view of FIG. 4;
  • FIG. 6 is a sectional view taken along line B-B of FIG. 5;
  • FIG. 7 is an exploded perspective view schematically showing the use of the vapor chamber structure of the present invention;
  • FIG. 8 is an assembled view of FIG. 7; and
  • FIG. 9 is a flowchart showing the steps included in a method of manufacturing vapor chamber structure according to the present invention.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The present invention will now be described with some preferred embodiments thereof and with reference to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.
  • Please refer to FIGS. 1 and 2 that are exploded and assembled perspective views, respectively, of a vapor chamber structure according to a first embodiment of the present invention; and to FIG. 3 that is a sectional view taken along line A-A of FIG. 2. As shown, in the first embodiment, the vapor chamber structure includes a main body 1.
  • The main body 1 is formed from a first plate 11 and a second plate 12, which are correspondingly closed to each other to define at least one open area 13 on the main body 1 and a chamber 14 in the main body 1. In the chamber 14, at least one wick structure 15, a supporting structure 16, and a working fluid 17 are provided. The open area 13 correspondingly extends through the first and second plates 11, 12 and the chamber 14. The chamber 14 is an independent and sealed space spreading between the first and the second plates 11, 12 and the open area 13.
  • The first plate 11 has a first opening 111 formed thereon to extend through the first plate 11 in a thickness direction thereof. The first opening 111 is mechanically processed so that an axially inward perpendicularly bent first extension wall 1111 is formed along a border of the first opening 111. The second plate 12 has a second opening 121 formed thereon to extend through the second plate 12 in a thickness direction thereof. When the first and the second plate 11, 12 are closed to each other, the first extension wall 1111 is extended toward the second plate 12 with a free end of the first extension wall 1111 abutted on a border of the second opening 121, so that the open area 13 is enclosed in the first extension wall 1111 and the border of the second opening 121.
  • The wick structure 15 is selected from the group consisting of a sintered powder structure, a netlike structure, and a plurality of grooves. The illustrated first embodiment is described with the wick structure 15 being a sintered powder structure, but it is understood the present invention is not necessarily limited thereto. The supporting structure 16 may include a plurality of copper posts, sintered powder posts, or round hollow posts. While the illustrated first embodiment is described with the supporting structure being a plurality of copper posts, it is understood the present invention is not necessarily limited thereto.
  • Please refer to FIGS. 4 and 5 that are exploded and assembled perspective views, respectively, of a vapor chamber structure according to a second embodiment of the present invention; and to FIG. 6 that is a sectional view taken along line B-B of FIG. 5. As shown, the second embodiment is generally structurally similar to the first embodiment, except that the second opening 121 is mechanically processed so that an axially inward perpendicularly bent second extension wall 1211 is formed along a border of the second opening 121. Therefore, when the first and the second plate 11, 12 are closed to each other, the first extension wall 1111 is extended toward the second plate 12 and the second extension wall 1211 is extended toward the first plate 11, such that the first extension wall 1111 abuts a free end thereof on a free end of the second extension wall 1211 and the open area 13 is enclosed in the first extension wall 1111 and the second extension wall 1211.
  • FIGS. 7 and 8 are exploded and assembled perspective views, respectively, schematically showing the use of the vapor chamber structure of the present invention. As shown, to use the vapor chamber structure of the present invention, first put the main body 1 on a top of a substrate 2. On the substrate 2, at least one heat source 21 and a plurality of electronic elements 22 are provided. The electronic elements 22 are located near and around the heat source 21 and are different in height. The main body 1 put atop the substrate 2 is in direct contact with the heat source 21 to absorb heat generated by the heat source 21. One or more open areas 13 may be formed on the main body 1 at positions corresponding to predetermined electronic elements 22 that are higher than the heat source 21, so that the higher electronic elements 22 can extend through the open areas 13 without interfering with the direct contact of the main body 1 with the heat source 21. Further, as can be seen from FIGS. 3 and 6, since the chamber 14 is an independent and sealed space in the main body 1, the provision of the open areas 13 may effectively isolate the chamber 14 from other electronic elements 22 to achieve good thermal insulation of the chamber 14.
  • FIG. 9 is a flowchart showing steps S1 to S4 included in a method of manufacturing vapor chamber structure according to the present invention. Please refer to FIG. 9 along with FIGS. 1 to 6.
  • In the step S1, a first plate and a second plate are provided.
  • More specifically, a first plate 11 and a second plate 12 are provided. The first and second plates 11, 12 are preferably made of a material with good heat conducting property, such as a copper material, an aluminum material, a stainless steel material, or a ceramic material. In the illustrated embodiment of the method according to the present invention, the first and second plates 11, 12 are described with a copper material. However, it is understood the present invention is not necessarily limited thereto.
  • In the step S2, the first and the second plate are mechanically processed to correspondingly form at least one opening thereon.
  • More specifically, the first plate 11 and the second plate 12 are mechanically processed so as to correspondingly form at predetermined positions with at least one opening, such as the first opening 111 and the second opening 121 shown in FIG. 3, for defining at least one open area 13 between the first and the second plate 11, 12. The first and second plates 11, 12 may be mechanically processed by way of punching, drawing or cutting to form the openings 111, 121. While the illustrated embodiment of the method of the present invention is described with the openings 111, 121 being formed by punching, it is understood the present invention is not necessarily limited thereto. To form the openings, such as the first opening 111 and the second opening 121 shown in FIG. 3, on the first and the second plate 11, 12, first punch the first plate 11 to form the first opening 111 and then slowly process the first opening to form an axially inward perpendicularly bent extension wall along a border of the first opening 111, such as the first extension wall 1111 shown in FIG. 3. Thereafter, punch the second plate 12 to form the second opening 121 at a position corresponding to the first opening 111 on the first plate 11, as shown in FIG. 3.
  • Alternatively, the openings can be formed on the first and the second plate 11, 12 by punching the first plate 11 at a predetermined position to form the first opening 111 and then slowly processing the first opening to form an axially inward perpendicularly bent extension wall along a border of the first opening 111, such as the first extension wall 1111 shown in FIG. 3. Thereafter, punch the second plate 12 to form the second opening 121 at a position corresponding to the first opening 111 on the first plate 11, as shown in FIG. 6, and then slowly process the second opening 121 to form an axially inward perpendicularly bent extension wall along a border of the second opening 121, such as the second extension wall 1211 shown in FIG. 6.
  • In the step S3, at least one wick structure and a supporting structure are provided on surfaces of the first and the second plate that are to be faced toward each other later.
  • More specifically, at least one wick structure 15 and a supporting structure 16 are provided on surfaces of the first plate 11 and the second plate 12 that are to be faced toward each other when the first and second plates 11, 12 are closed together later. The wick structure 15 may be a sintered powder structure, a netlike structure, or a plurality of grooves provided on the facing surfaces of the first and second plates 11, 12. The illustrated embodiment of the method of the present invention is described with the wick structure 15 being a sintered powder structure formed on the facing surfaces of the first and second plates 11, 12 by way of sintering, but the present invention is not intended to be limited thereto. And, the supporting structure 16 can be a plurality of copper posts, sintered powder posts, or round hollow posts. While the method of the present invention is described with the supporting structure being a plurality of copper posts, it is understood the present invention is not necessarily limited thereto.
  • In the step S4, the first and the second plate are correspondingly closed together to define a chamber therebetween, joints between the first and second plates as well as between the first and second openings are fixedly connected and sealed, the chamber is evacuated, and a working fluid is filled into the chamber.
  • More specifically, the first and the second plate 11, 12 are correspondingly closed together to define a chamber 14 therebetween, and joints between the first and the second plate 11, 12 as well as between the first and the second opening 111, 121 are fixedly connected and sealed by way of soldering, diffusion bonding or ultrasonic welding. In the illustrated embodiment of the method of the present invention, while the connection and sealing of the joints is described as diffusion bonding, it is understood the present invention is not limited thereto. Finally, the chamber 14 is evacuated and filled with a working fluid 17.
  • The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.

Claims (11)

    What is claimed is:
  1. 1. A vapor chamber structure comprising a main body formed from a first plate and a second plate; the first plate and the second plate being correspondingly closed to each other to thereby together define at least one open area on the main body and a chamber in the main body; the chamber being internally provided with at least one wick structure, a support structure, and a working fluid; and the open area correspondingly extending through the first plate, the second plate, and the chamber.
  2. 2. The vapor chamber structure as claimed in claim 1, wherein the chamber is an independent and sealed space spreading between the first plate, the second plate and the at least one open area.
  3. 3. The vapor chamber structure as claimed in claim 1, wherein the first plate has a first opening formed thereon to extend through the first plate in a thickness direction thereof, and the first opening having an axially inward perpendicularly bent first extension wall extended along a border thereof; and wherein the second plate has a second opening formed thereon to extend through the second plate in a thickness direction thereof, and the second opening having an axially inward perpendicularly bent second extension wall extended along a border thereof; whereby when the first and the second plate are correspondingly closed to each other, the first extension wall has a free end abutted on a free end of the second extension wall, so that the open area is enclosed in the first and second extension walls.
  4. 4. The vapor chamber structure as claimed in claim 1, wherein the first plate has a first opening formed thereon to extend through the first plate in a thickness direction thereof, and the first opening having an axially inward perpendicularly bent first extension wall extended along a border thereof; and wherein the second plate has a second opening formed thereon to extend through the second plate in a thickness direction thereof; whereby when the first and the second plate are correspondingly closed to each other, the first extension wall has a free end abutted on a border of the second opening, so that the open area is enclosed in the first extension wall and the border of the second opening.
  5. 5. The vapor chamber structure as claimed in claim 1, wherein the wick structure is provided on inner wall surfaces of the chamber and is selected from the group consisting of a sintered powder structure, a netlike structure, and a plurality of grooves.
  6. 6. The vapor chamber structure as claimed in claim 1, wherein the supporting structure is selected from the group consisting of copper posts, sintered powder posts, and round hollow posts.
  7. 7. A method of manufacturing vapor chamber structure, comprising following steps:
    (a) providing a first plate and a second plate;
    (b) mechanically processing the first and the second plate, so that the first and the second plate are correspondingly formed at predetermined positions with at least one opening;
    (c) providing at least one wick structure and a supporting structure on surfaces of the first and second plates that are to be faced toward each other when the first and second plates are correspondingly closed later; and
    (d) correspondingly closing the first and the second plate to each other to define a chamber therebetween, fixedly connecting and sealing joints between the first and the second plate as well as between the first and the second opening, evacuating the chamber, and filling a working fluid into the chamber.
  8. 8. The vapor chamber structure manufacturing method as claimed in claim 7, wherein in the step (d) the joints between the first and the second plate as well as between the first and second opening are fixedly connected and sealed by a manner selected from the group consisting of soldering, diffusion bonding, and ultrasonic welding.
  9. 9. The vapor chamber structure manufacturing method as claimed in claim 7, wherein in the step (c) the wick structure is selected from the group consisting of a sintered powder structure, a netlike structure, and a plurality of grooves.
  10. 10. The vapor chamber structure manufacturing method as claimed in claim 7, wherein in the step (c) the wick structure is a sintered powder structure being molded on the facing surfaces of the first and second plates by sintering.
  11. 11. The vapor chamber structure manufacturing method as claimed in claim 7, wherein in the step (b) the first and the second plate are mechanically processed in a manner selected from the group consisting of punching, drawing, and cutting.
US13274360 2011-10-17 2011-10-17 Vapor chamber structure and method of manufacturing same Abandoned US20130092353A1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150323262A1 (en) * 2014-05-07 2015-11-12 Samsung Electronics Co., Ltd. Heat dissipating apparatus and electronic device having the same
US20160290734A1 (en) * 2015-03-30 2016-10-06 Infinera Corporation Low-cost nano-heat pipe
US20180100708A1 (en) * 2016-06-16 2018-04-12 Asia Vital Components Co., Ltd. Vapor chamber structure

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5880929A (en) * 1997-12-01 1999-03-09 Intel Corporation Heat exchanger system for cooling a hinged computing device
US6302192B1 (en) * 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6392883B1 (en) * 2000-06-30 2002-05-21 Intel Corporation Heat exchanger having phase change material for a portable computing device
US20020067598A1 (en) * 2000-12-05 2002-06-06 Sathe Ajit V. Electronic assembly having a heat pipe that conducts heat from a semiconductor die
US20030051859A1 (en) * 2001-09-20 2003-03-20 Chesser Jason B. Modular capillary pumped loop cooling system
US6802363B1 (en) * 2003-06-03 2004-10-12 Pei Choa Wang Flat type heat pipe with opening
US20080055563A1 (en) * 2006-08-31 2008-03-06 Seiko Epson Corporation Projector
US20080087405A1 (en) * 2006-10-11 2008-04-17 Foxconn Technology Co., Ltd. Heat spreader with vapor chamber and method of manufacturing the same
US20090260785A1 (en) * 2008-04-17 2009-10-22 Wang Cheng-Tu Heat plate with capillary supporting structure and manufacturing method thereof

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5880929A (en) * 1997-12-01 1999-03-09 Intel Corporation Heat exchanger system for cooling a hinged computing device
US6302192B1 (en) * 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6392883B1 (en) * 2000-06-30 2002-05-21 Intel Corporation Heat exchanger having phase change material for a portable computing device
US20020067598A1 (en) * 2000-12-05 2002-06-06 Sathe Ajit V. Electronic assembly having a heat pipe that conducts heat from a semiconductor die
US20030051859A1 (en) * 2001-09-20 2003-03-20 Chesser Jason B. Modular capillary pumped loop cooling system
US6981543B2 (en) * 2001-09-20 2006-01-03 Intel Corporation Modular capillary pumped loop cooling system
US6802363B1 (en) * 2003-06-03 2004-10-12 Pei Choa Wang Flat type heat pipe with opening
US20080055563A1 (en) * 2006-08-31 2008-03-06 Seiko Epson Corporation Projector
US20080087405A1 (en) * 2006-10-11 2008-04-17 Foxconn Technology Co., Ltd. Heat spreader with vapor chamber and method of manufacturing the same
US20090260785A1 (en) * 2008-04-17 2009-10-22 Wang Cheng-Tu Heat plate with capillary supporting structure and manufacturing method thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150323262A1 (en) * 2014-05-07 2015-11-12 Samsung Electronics Co., Ltd. Heat dissipating apparatus and electronic device having the same
WO2015170828A1 (en) * 2014-05-07 2015-11-12 Samsung Electronics Co., Ltd. Heat dissipating apparatus and electronic device having the same
US9639127B2 (en) * 2014-05-07 2017-05-02 Samsung Electronics Co., Ltd. Heat dissipating apparatus and electronic device having the same
EP3141094A4 (en) * 2014-05-07 2018-01-24 Samsung Electronics Co., Ltd Heat dissipating apparatus and electronic device having the same
US20160290734A1 (en) * 2015-03-30 2016-10-06 Infinera Corporation Low-cost nano-heat pipe
US20180100708A1 (en) * 2016-06-16 2018-04-12 Asia Vital Components Co., Ltd. Vapor chamber structure

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Effective date: 20111017