CN216700807U - Base station heat dissipation device - Google Patents

Abstract

The application discloses base station heat abstractor, this base station heat abstractor includes base station heat absorption portion and two at least radiators, all be formed with the chamber and the condensation backward flow chamber that hold that are linked together in every radiator, base station heat absorption portion locates on the base station for absorb the heating element's of base station heat, and base station heat absorption portion and each radiator separation set up, and be formed with the chamber of acceping that is used for holding phase transition working medium in the base station heat absorption portion, it communicates respectively with the chamber that holds in each radiator to accept the chamber through the pipeline. The base station heat dissipation device comprises a base station heat absorption portion and at least two radiators, and the accommodating cavity in the base station heat absorption portion is communicated with the accommodating cavity in each radiator through a pipeline, namely, heat is dissipated to a base station through the radiators (when the power of the base station is too large, the single radiator is limited by the requirements of size and weight and cannot meet the heat dissipation requirement of the base station), so that the heat dissipation requirement of a high-power base station is met, and the normal work and the service life of the base station are further guaranteed.

Description

Base station heat dissipation device

Technical Field

The application relates to the technical field of electronic heat dissipation, in particular to a base station heat dissipation device.

Background

With the continuous development of electronic technology and communication technology, the requirement for the heat dissipation efficiency of the heat sink is also continuously improved. Particularly, the radiator applied to the communication base station is required to have the characteristics of small volume, light weight, high radiating efficiency and the like. In the era of 5G rapid development at present, the heat dissipation performance of the heat radiator is difficult to meet the heat dissipation requirements of the novel base station, especially for the heat dissipation of the base station with excessive power, and further the normal work and the service life of the base station are affected.

SUMMERY OF THE UTILITY MODEL

In order to overcome the problems in the prior art, the present application provides a base station heat dissipation device that satisfies the heat dissipation requirement of a high power base station.

In order to achieve the above purpose, the following technical solutions are specifically adopted in the present application:

the application provides a base station heat abstractor, this base station heat abstractor includes:

the heat radiator comprises at least two heat radiators, wherein an accommodating cavity and a condensation reflux cavity which are communicated are formed in each heat radiator;

the base station heat absorption part is arranged on the base station and used for absorbing heat of a heating element of the base station, the base station heat absorption part and the radiators are arranged in a separated mode, accommodating cavities for accommodating phase change working media are formed in the base station heat absorption part, and the accommodating cavities are communicated with the accommodating cavities in the radiators through pipelines respectively.

In a specific implementation manner, the pipeline includes an air pipe and a liquid return pipe, the accommodating cavity is communicated with the accommodating cavity in each of the radiators through the air pipe, and the accommodating cavity is communicated with the accommodating cavity in each of the radiators through the liquid return pipe.

In a specific implementation mode, the base station heat dissipation device further comprises a first parallel connection joint, wherein the gas pipes comprise a first section of gas pipe and a second section of gas pipe, and the number of the second section of gas pipe corresponds to the number of the radiators;

one end of each second section of gas pipe is communicated with the containing cavity of each radiator, the other end of each second section of gas pipe is connected with one end of the first section of gas pipe through the first parallel connector, and the other end of the first section of gas pipe is communicated with the containing cavity of the heat absorption part of the base station.

In a specific embodiment, the base station heat dissipation device further comprises a second parallel connection joint, the liquid return pipe comprises a first section of liquid return pipe and a second section of liquid return pipe, and the number of the second section of liquid return pipe is corresponding to the number of the heat radiators;

one end of each second section of liquid return pipe is respectively communicated with the containing cavity of each radiator, the other end of each second section of liquid return pipe is respectively connected with one end of the first section of liquid return pipe through the second parallel connector, and the other end of the first section of liquid return pipe is communicated with the containing cavity of the heat absorption part of the base station.

In a specific embodiment, the accommodating cavity is provided with an exhaust hole and a liquid return hole, the accommodating cavity is provided with an air inlet and a liquid return port, the exhaust hole is connected to the air inlet through the air conveying pipe, and the liquid return hole is connected to the liquid return port through the liquid return pipe;

in a first direction, the exhaust hole is located above the liquid return hole, and the air inlet is located above the liquid return port, wherein the first direction is a height extending direction of the base station heat dissipation device.

In a specific embodiment, the pipeline comprises a gas-liquid pipe, and the accommodating cavity is communicated with the accommodating cavity in each radiator through the gas-liquid pipe;

the base station heat dissipation device further comprises a third parallel connection joint, the gas-liquid pipe comprises a first gas-liquid pipe section and a plurality of second gas-liquid pipe sections, the number of the second gas-liquid pipe sections corresponds to the number of the radiators, one end of each second gas-liquid pipe section is communicated with the containing cavity of each radiator, the other end of each second gas-liquid pipe section is connected to one end of the first gas-liquid pipe section through the third parallel connection joint, and the other end of the first gas-liquid pipe section is communicated with the containing cavity of the base station heat absorption part.

In a specific embodiment, the heat spreader is at least partially positioned above the base station heat sink portion in a first direction.

Correspondingly, this application still provides a base station heat abstractor, and this base station heat abstractor includes:

the radiator is internally provided with an accommodating cavity and a condensation reflux cavity which are communicated;

the base station heat absorption device comprises at least two base station heat absorption parts arranged on a base station and used for absorbing heat of a heating element of the base station, wherein each base station heat absorption part is separated from the radiator, accommodating cavities for accommodating phase change working media are formed in each base station heat absorption part, and the accommodating cavities in each base station heat absorption part are respectively communicated with the accommodating cavities in the radiator through pipelines.

In a specific implementation manner, the pipeline includes a gas pipe and a liquid return pipe, the accommodating cavity in each base station heat absorption portion is respectively communicated with the accommodating cavity in the radiator through the gas pipe, and the accommodating cavity in each base station heat absorption portion is respectively communicated with the accommodating cavity in the radiator through the liquid return pipe.

In a specific implementation manner, the heat dissipation device of the base station further comprises a first parallel connection joint, wherein the gas pipes comprise a first section of gas pipe and a second section of gas pipe, and the number of the first section of gas pipe corresponds to the number of the heat absorption parts of the base station;

one end of each first section of gas pipe is communicated with the containing cavity of each base station heat absorption part, the other end of each first section of gas pipe is connected to one end of the second section of gas pipe through the first parallel connector, and the other end of the second section of gas pipe is communicated with the containing cavity of the radiator.

In a specific embodiment, the base station heat dissipation device further comprises a second parallel connection joint, the liquid return pipe comprises a first section of liquid return pipe and a second section of liquid return pipe, and the number of the first section of liquid return pipe corresponds to the number of the base station heat absorption parts;

one end of each first section of liquid return pipe is respectively communicated with the containing cavity of each base station heat absorption part, the other end of each first section of liquid return pipe is respectively connected with one end of the second section of liquid return pipe through the second parallel connector, and the other end of the second section of liquid return pipe is communicated with the containing cavity of the radiator.

In a specific embodiment, the pipeline comprises a gas-liquid pipe, and the accommodating cavity in each base station heat absorption part is communicated with the accommodating cavity in the radiator through the gas-liquid pipe;

the base station heat dissipation device further comprises a third parallel connection joint, the gas-liquid pipe comprises a plurality of first gas-liquid pipe sections and a plurality of second gas-liquid pipe sections, the number of the first gas-liquid pipe sections corresponds to the number of the heat absorption parts of the base station, one end of each first gas-liquid pipe section is communicated with the containing cavity of each heat absorption part of the base station, the other end of each first gas-liquid pipe section is connected to one end of each second gas-liquid pipe section through the third parallel connection joint, and the other end of each second gas-liquid pipe section is communicated with the containing cavity of the radiator.

Compared with the prior art, the base station heat dissipation device comprises a base station heat absorption part and at least two radiators, wherein accommodating cavities in the base station heat absorption part are communicated with accommodating cavities in the radiators through pipelines, namely, one base station is subjected to heat dissipation through the radiators (the power of the base station is overlarge, and the single radiator is limited by the size and the weight and cannot meet the heat dissipation requirement of the base station), so that the heat dissipation requirement of a high-power base station is met, and the normal work and the service life of the base station are further guaranteed.

Drawings

Fig. 1 is a perspective view of a base station heat dissipation device according to an embodiment of the present application.

Fig. 2 is another perspective view of the base station heat sink of fig. 1.

Fig. 3 is an exploded perspective view of the base station of fig. 1.

Fig. 4 is an exploded perspective view of the base station substrate in fig. 3.

Fig. 5 is an exploded perspective view of the heat sink of fig. 1.

Fig. 6 is an exploded perspective view of the heat sink of fig. 1 from another perspective.

Fig. 7 is a perspective view of a base station heat sink device according to another embodiment of the present application.

Fig. 8 is a perspective view of a base station heat sink according to another embodiment of the present application.

Fig. 9 is another perspective view of the base station heat sink of fig. 8.

Fig. 10 is a perspective view of a base station heat dissipation device according to yet another embodiment of the present application.

The attached drawings are as follows:

1. a base station heat absorption part; 11. a base station substrate; 111. a base station base; 112. a base station cover plate; 112a, an exhaust hole; 112b and a liquid return hole; 112c, a first gas-liquid hole; 113. a first support column; 2. a heat sink; 21. a heat sink substrate; 211. a substrate; 211a, an air inlet; 211b and a liquid return port; 211c, a second gas-liquid hole; 212. a cover plate; 212a, a communication hole; 213. a second support column; 22. a heat sink fin; 221. a plate body; 222. a fin cover plate; 223. a third support column; 3. a gas delivery pipe; 31. a first section of gas delivery pipe; 32. a second section of gas transmission pipe; 4. a liquid return pipe; 41. a first section of liquid return pipe; 42. a second section of liquid return pipe; 5. a first parallel coupling head; 6. a second parallel-connection head; 7. a base station; 71. a circuit board; 72. a high power chip; 73. an antenna cover; 8. a gas-liquid tube; 81. a first gas-liquid pipe section; 82. a second gas-liquid pipe section; 9. and a third parallel-connection head.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

In the description of the present application, unless explicitly stated or limited otherwise, the terms "first", "second", and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more unless specified or indicated otherwise; the terms "connected," "fixed," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, integrally connected, or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the description of the present application, it should be understood that the terms "upper" and "lower" used in the description of the embodiments of the present application are used in a descriptive sense only and not for purposes of limitation. In addition, in this context, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on "or" under "the other element or be indirectly on" or "under" the other element via an intermediate element.

The radiator of common die-casting aluminium form has good reliability, workable, advantages such as low cost, but simultaneously because weight is big, the radiating efficiency is low, is difficult to satisfy the heat dissipation demand of novel high power basic station. The novel thermosiphon radiator has high heat exchange efficiency to a certain degree, but is also limited by the limitation of the volume and the weight of a base station, and the processing complexity of the contact surface of the novel thermosiphon radiator and a chip is considered, so that the processing cost of the thermosiphon radiator is greatly improved. In addition, the development of the heat dissipation technology and the development of the communication technology are often asynchronous, and the service lives of the heat dissipation technology and the communication technology are also asynchronous, but in the prior art, the heat sink and the base station are integrated, and once one of the heat sink and the base station is replaced, the heat sink and the base station are completely replaced, so that unnecessary waste is caused.

Referring to fig. 1 and fig. 2, fig. 1 is a perspective view of a base station heat sink according to an embodiment of the present disclosure, and fig. 2 is another perspective view of the base station heat sink in fig. 1. The base station heat dissipation device comprises a base station heat absorption part 1 and at least two radiators 2, wherein an accommodating cavity and a condensation reflux cavity which are communicated are formed in each radiator 2. The base station heat absorption part 1 is arranged on the base station and used for absorbing heat of a heating element of the base station, the base station heat absorption part 1 and each radiator 2 are arranged in a separated mode, an accommodating cavity used for accommodating a phase change working medium is formed in the base station heat absorption part 1, and the accommodating cavity is communicated with the accommodating cavity in each radiator 2 through a pipeline. Wherein, the pipeline includes gas-supply pipe 3 and liquid return pipe 4.

When the base station heat absorption part works, a phase change working medium is injected into the containing cavity of the base station heat absorption part 1, the liquid phase change working medium in the containing cavity receives heat emitted by a heating component of the base station and is converted into a gaseous phase change working medium, the gaseous phase change working medium is transmitted to the condensation reflux cavity through the pipeline and the containing cavity in sequence, the gaseous phase change working medium is converted into the liquid phase change working medium through heat dissipation of the radiator fins of the radiator 2 in the condensation reflux cavity, and the liquid phase change working medium flows back to the containing cavity of the base station heat absorption part 1 through the containing cavity and the pipeline in sequence, so that heat dissipation of the high-power heating component in the base station is realized. This application makes heating devices such as the antenna of radiator and basic station, high power chip separately set up through the thermosiphon principle to the restriction to partial volume of radiator, weight has been liberated, so that the radiator has bigger space to dispel the heat, and then can satisfy the heat dissipation requirement of high power basic station.

In addition, the radiator and the base station are arranged separately, so that the service lives of the radiator and the base station can be different, and when parts need to be replaced or maintained, the continuous use of other parts is not influenced.

Further, in the first direction, each heat radiator 2 is at least partially located above the heat absorbing portion 1 of the base station, and in this embodiment, in the first direction, each heat radiator 2 is respectively located above the heat absorbing portion 1 of the base station, so that the gaseous phase-change working medium in the containing cavity flows into the containing cavity, and the liquid phase-change working medium in the containing cavity flows into the containing cavity. When the phase-change working medium is injected into the accommodating cavity, the height of the phase-change working medium completely sinks through the accommodating cavity, so that the heat radiator 2 is ensured to be higher than the top of the highest heat source (high-power heating component) on the circuit board when in work, all the heat sources can be sunk by the phase-change working medium, the phase-change heat exchange is ensured, and the dry burning is avoided. Meanwhile, the height of the phase change working medium in the accommodating cavity is lower than the bottom of the radiator 2, so that excessive liquid phase change working medium is prevented from entering the gas conveying pipe, the gas transmission resistance is increased, and the heat exchange effect is influenced. The first direction is a height extending direction of the base station heat dissipation device.

Specifically, the housing chamber of the base station heat absorption part 1 has an exhaust hole 112a and a liquid return hole 112b, and the housing chamber of the heat sink 2 has an intake port 211a and a liquid return port 211 b. This heat abstractor in basic station still includes first joint 5 and second joint 6 in parallel, and gas-supply pipe 3 includes first section gas-supply pipe 31 and second section gas-supply pipe 32, and liquid return pipe 4 includes first section liquid return pipe 41 and second section liquid return pipe 42, and wherein, the quantity of second section gas-supply pipe 32 corresponds the setting with the quantity of radiator 2, and the quantity of second section liquid return pipe 42 corresponds the setting with the quantity of radiator 2. When assembling, one end of each second section of air pipe 32 is connected to the air inlet 211a of each radiator 2, the other end of each second section of air pipe 32 is connected to one end of the first section of air pipe 31 through the first parallel joint 5, and the other end of the first section of air pipe 31 is connected to the air outlet 112a of the heat absorption part 1 of the base station. One end of each second section of liquid return pipe 42 is connected to the liquid return port 211b of each radiator 2, the other end of each second section of liquid return pipe 42 is connected to one end of the first section of liquid return pipe 41 through the second parallel connector 6, the other end of the first section of liquid return pipe 41 is connected to the liquid return hole 112b of the heat absorption part 1 of the base station, so that the gaseous phase change working medium generated in the accommodating cavity can flow into the accommodating cavity of each radiator through the exhaust hole 112a, the gas pipe 3 and the gas inlet 211a, and the liquid phase change working medium in the accommodating cavity of each radiator 2 can flow back to the accommodating cavity of the base station 1 through the liquid return port 211b, the liquid return pipe 4 and the liquid return hole 112 b.

Further, in the first direction, first joint 5 in parallel is located the top of the phase change working medium liquid level when the basic station is worked to prevent that liquid from flowing back under the gravity condition, lead to having liquid to get into in the gas-supply pipe 3, form the liquid stopper and influence holistic heat transfer effect. Meanwhile, in the first direction, the discharge hole 112a is located above the liquid return hole 112 b. Specifically, the exhaust hole 112a is opened at the upper part (the position as far as possible) of the base station cover plate 112, for example, the exhaust hole 112a may be opened above the back of the base station cover plate 112, may be opened at the top of the base station cover plate 112, or may be opened above the side of the base station cover plate 112, which may be specifically set according to actual installation and field requirements. The liquid return hole 112b is formed in the lower portion (the position as far as possible below) of the base station cover plate 112, for example, the liquid return hole 112b may be formed below the back portion of the base station cover plate 112, may be formed at the bottom of the base station cover plate 112, or may be formed below the side surface of the base station cover plate 112, which may be specifically set according to actual installation and field requirements.

In the present application, the exhaust holes 112a are provided at positions as close to the base station cover plate 112 as possible, so that steam generated in the accommodating chamber can be completely exhausted without being accumulated at a position higher than the exhaust holes 112 a. The liquid return hole 112b is arranged below the exhaust hole 112a to better complete gas-liquid separation, so that steam generated by the accommodating cavity cannot enter the liquid return pipe 4 through the liquid return hole 112b, and an air plug is formed inside to influence the liquid return capacity. Since the gas is gradually generated from the bottom and moves upward in the housing chamber, it is preferable that the liquid return hole 112b is located as far below the base station cover plate 112 as possible, thereby further reducing the influence of the generation of bubbles on the liquid return.

Further, in the first direction, the air inlet 211a is located above the liquid return port 211b, so that backflow liquid is prevented from entering the air pipe 3 through the air inlet 211a, and a liquid plug is formed to affect the heat dissipation effect. Specifically, the liquid return port 211b is located at a position lower than the base 211 and as lower as possible to reduce the height of liquid convergence and increase the phase-changeable heat exchange area.

Referring to fig. 3 and 4, fig. 3 is an exploded perspective view of the base station of fig. 1, and fig. 4 is an exploded perspective view of the base station substrate of fig. 3. The base station 7 comprises a circuit board 71, a high-power chip 72 and an antenna housing 73, the high-power chip 72 is connected to the circuit board 71, the antenna housing 73 is arranged on one side of the circuit board 71, the base station heat absorption portion 1 comprises a base station substrate 11, a containing cavity is formed in the base station substrate 11, and the base station substrate 11 is arranged on one side, not provided with the antenna housing 73, of the circuit board 71.

Specifically, the base station substrate 11 includes a base station base 111, a base station cover plate 112 and a plurality of first support pillars 113, the base station base 111 is recessed to form a first groove, the base station cover plate 112 covers the base station base 111 by a snap-fit manner to cover the first groove to form an accommodating cavity, and the plurality of first support pillars 113 are disposed in the accommodating cavity at intervals. In the present embodiment, the plurality of first support pillars 113 are formed on the base station substrate 111, and it is understood that in other embodiments, the plurality of first support pillars 113 may also be formed on the base station cover plate 112, or a part of the plurality of first support pillars 113 is formed on the base station substrate 111, and a part of the plurality of first support pillars 113 is formed on the base station cover plate 112.

In this embodiment, the base station base 111 is recessed to form a first groove, and the base station base 111 and the base station cover 112 cover each other to cover the first groove to form an accommodating cavity.

Referring to fig. 5 and 6, fig. 5 is an exploded perspective view of the heat sink in fig. 1, and fig. 6 is an exploded perspective view of the heat sink in fig. 1 from another perspective. The radiator 2 comprises a radiator base plate 21 and a plurality of radiator fins 22, an accommodating cavity is formed in the radiator base plate 21, the radiator fins 22 are connected to the radiator base plate 21, and a condensation reflux cavity is formed in the radiator fins 22.

Specifically, the heat sink base plate 21 includes a base 211, a cover plate 212, and a plurality of second support pillars 213, wherein a second groove is formed on the base 211 in a recessed manner, the cover plate 212 is mutually covered with the base 211 in a snap-fit manner to cover the second groove to form an accommodating chamber, the cover plate 212 is formed with a plurality of communication holes 212a, each communication hole 212a is arranged along a width extending direction of the cover plate 212, and each communication hole 212a extends along a height extending direction of the cover plate 212, so that the communication holes 212a are in a long-strip hole shape. The plurality of second supporting pillars 213 are disposed in the accommodating cavity at intervals, in this embodiment, the plurality of second supporting pillars 213 are formed on the substrate 211, it is understood that in other embodiments, the plurality of second supporting pillars 213 may also be formed on the cover plate 212, or a part of the plurality of second supporting pillars 213 is formed on the substrate 211, and a part of the plurality of second supporting pillars 213 is formed on the cover plate 212.

In this embodiment, the base 211 is recessed to form a second recess, and the base 211 and the cover 212 cover each other to cover the second recess to form the receiving cavity.

With continued reference to fig. 6, a plurality of radiator fins 22 are arranged along the width extension direction of the radiator base plate 21, and each radiator fin 22 has a condensate-reflux chamber, each of which communicates with the housing chamber via the communication hole 212 a. Specifically, the length of each radiator fin 22 extends in the height extending direction of the radiator base plate 21, the width of each radiator base plate 21 extends in the thickness extending direction of the radiator base plate 21, so that the length of the condensed reflux cavity in each radiator fin 22 extends in the height extending direction of the radiator base plate 21, the width of the condensed reflux cavity in each radiator fin 22 extends in the thickness extending direction of the radiator base plate 21, and the condensed reflux cavity in each radiator fin 22 communicates with the accommodating cavity via one communication hole 212 a.

Further, each radiator fin 22 comprises a plate body 221, a fin cover plate 222 and a plurality of third support columns 223, a third groove is formed on the plate body 221 in a recessed manner, and the plate body 221 and the fin cover plate 222 cover the third groove to form a condensate return cavity. A plurality of third support pillars 223 are disposed in the condensing and returning cavity at intervals, in this embodiment, the plurality of third support pillars 223 are formed on the plate body 221, it is understood that in other embodiments, the plurality of third support pillars 223 may also be formed on the fin cover plate 222, or a part of the plurality of third support pillars 223 is formed on the plate body 221, and a part of the plurality of third support pillars 223 is formed on the fin cover plate 222.

In the present embodiment, a third groove is formed on the plate body 221 in a recessed manner, and the plate body 221 and the fin cover plate 222 cover each other to cover the third groove to form the condensation reflux cavity.

When the heat source is transferred to the accommodating cavity through the base station substrate 11, the phase change working medium in the accommodating cavity is heated and changed from a liquid state to a gaseous state, and the generated gaseous phase change working medium moves upwards under the action of buoyancy and is transferred to the accommodating cavity of each radiator 2 through the gas transmission pipe 3; in the containing cavity of each radiator 2, gaseous phase-change working medium is diffused to different condensation backflow cavities through the communication holes 212a, in the condensation backflow cavities, the gaseous phase-change working medium is condensed on the inner surfaces of the radiator fins 22 to release heat, liquid formed by condensation flows downwards under the action of gravity and is gathered at the bottom of the radiator base plate, and then flows back to the containing cavity again through the liquid return port 211b, the liquid return pipe 4 and the liquid return hole 112b to complete the whole circulation.

The phase change and the steam diffusion of the internal working medium are fully utilized to transfer heat, so that the radiator has higher heat exchange efficiency, the heat dissipation problem of a high-power heat source is solved, and meanwhile, the contradiction that the base station is small in size and light in weight and the radiator requires a larger heat dissipation space is solved by separating the base station heat source and the radiator 2. Meanwhile, the connection common heat dissipation between the radiators with different numbers and the base station is realized, the number of the radiators matched with the base station can be adjusted according to needs, the requirement for non-standard customization is reduced, and the waste caused by different updating periods of different components can be solved through the sub-component heat dissipation.

The radiator fin 22 can be manufactured by machining welding, by blowing, or by stamping welding, and the specific form can be various. The phase-change working medium can be selected from various R134a R22R 1233zd fluorinated liquid and the like.

Based on the above embodiment, the embodiment of the present application further discloses another implementation manner, the gas pipe and the liquid return pipe are combined into a pipe, as shown in fig. 7, the receiving cavity has a first gas-liquid hole 112c, the receiving cavity has a second gas-liquid hole 211c, in the first direction, the second gas-liquid hole 211c is located above the first gas-liquid hole 112c, and the first gas-liquid hole 112c is communicated with the second gas-liquid hole 211c through the gas-liquid pipe 8, which may weaken the performance of the heat dissipation part to some extent, but is not high in the requirement for partial heat dissipation, and is more applicable to the case where the pipe and the reliability are highly limited.

Specifically, the base station heat dissipation device further includes a third parallel connection head 9, the gas-liquid pipe 8 includes a first gas-liquid pipe section 81 and a plurality of second gas-liquid pipe sections 82, the number of the second gas-liquid pipe sections 82 corresponds to the number of the radiators 2, one end of each second gas-liquid pipe section 82 is respectively communicated with the accommodating cavity of each radiator 2, the other end of each second gas-liquid pipe section 82 is respectively connected to one end of the first gas-liquid pipe section 81 through the third parallel connection head 9, and the other end of the first gas-liquid pipe section 81 is communicated with the accommodating cavity of the base station heat absorption part 1.

Further, the first gas-liquid hole 112c is disposed above the base station substrate 11, and the second gas-liquid hole 211c is disposed below the heat sink substrate 21, for example, the first gas-liquid hole 112c may be disposed on the top of the base station substrate 11, and the second gas-liquid hole 211c may be disposed at the bottom or near the bottom of the heat sink substrate 21.

Based on the above embodiment, another implementation mode is disclosed in the embodiment of the present application, and as shown in fig. 8 and fig. 9, the present embodiment is different from the above embodiment in that in the present embodiment, a plurality of base station heat absorption portions 1 are provided, and the plurality of base station heat absorption portions 1 correspond to one heat sink 2. Further, one end of each first section of air pipe 31 is connected to the exhaust hole 112a of each base station heat absorption part 1, the other end of each first section of air pipe 31 is connected to one end of the second section of air pipe 32 through the first parallel joint 5, and the other end of the second section of air pipe 32 is connected to the air inlet 211a of the radiator 2. One end of each first section of liquid return pipe 41 is connected to the liquid return hole 112b of each base station heat absorption part 1, the other end of each first section of liquid return pipe 41 is connected to one end of the second section of liquid return pipe 42 through the second parallel connector 6, the other end of the second section of liquid return pipe 42 is connected to the liquid return port 211b of the radiator 2, so that gaseous phase change working media generated in the accommodating cavity of the base station heat absorption part 1 can flow into the accommodating cavity of the radiator 2 through the exhaust hole 112a, the gas pipe 3 and the gas inlet 211a, and liquid phase change working media in the accommodating cavity of the radiator 2 can flow back to the accommodating cavity of the base station heat absorption part 1 through the liquid return port 211b, the liquid return pipe 4 and the liquid return hole 112 b.

Further, in the first direction, the second parallel connection head 6 is located below the liquid level of the phase change working medium when the heat absorption portions 1 of the base stations work, that is, the position of the second parallel connection head 6 is lower than the liquid level of the liquid phase change working medium in the containing cavity, so that the liquid phase change working medium in the heat absorption portions of the two base stations can be communicated with each other through the second parallel connection head, and under the action of liquid level pressure, the liquid phase change working medium in the heat absorption portions of the two base stations is uniformly distributed through the communicating device principle, that is, the liquid levels of the heat absorption portions 1 of the base stations can keep the same height.

In the embodiment, one radiator is used for radiating heat corresponding to a plurality of base stations (for the base stations, the power is low, and a single radiator has enough volume and radiating area), so that the cost is reduced and the occupied space is reduced.

Based on the above embodiment, the present application further discloses another specific implementation manner, in which the gas pipe and the liquid return pipe are combined into a pipe, as shown in fig. 10, the receiving cavity has a first gas-liquid hole 112c, the receiving cavity has a second gas-liquid hole 211c, in the first direction, the second gas-liquid hole 211c is located above the first gas-liquid hole 112c, and the first gas-liquid hole 112c is communicated with the second gas-liquid hole 211c through the gas-liquid pipe 8, which may weaken the performance of the heat dissipation part to some extent, but is not high in the requirement for partial heat dissipation, and is more suitable for the case where the pipe and the reliability are highly limited.

Specifically, the base station heat dissipation device further includes a third parallel-connection head 9, the gas-liquid pipe 8 includes a first gas-liquid pipe section 81 and a plurality of second gas-liquid pipe sections 82, the number of the first gas-liquid pipe sections 81 corresponds to the number of the heat absorption portions 1 of the base station, one end of each first gas-liquid pipe section 81 is communicated with the accommodating cavity of each heat absorption portion 1 of the base station, the other end of each first gas-liquid pipe section 81 is connected to one end of each second gas-liquid pipe section 82 through the third parallel-connection head 9, and the other end of each second gas-liquid pipe section 82 is communicated with the accommodating cavity of the heat sink 2.

Further, the first gas-liquid hole 112c is disposed above the base station substrate 11, and the second gas-liquid hole 211c is disposed below the heat sink substrate 21, for example, the first gas-liquid hole 112c may be disposed on the top of the base station substrate 11, and the second gas-liquid hole 211c may be disposed at the bottom or near the bottom of the heat sink substrate 21.

The above description is only for the preferred embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (12)

1. A base station heat sink, comprising:

the heat radiator comprises at least two radiators, wherein an accommodating cavity and a condensation reflux cavity which are communicated are formed in each radiator;

the base station heat absorption part is arranged on the base station and used for absorbing heat of heating elements of the base station, the base station heat absorption part is separately arranged from each radiator, an accommodating cavity for accommodating a phase change working medium is formed in the base station heat absorption part, and the accommodating cavity is respectively communicated with the accommodating cavity in each radiator through a pipeline.

2. The base station heat sink according to claim 1, wherein the pipeline includes an air pipe and a liquid return pipe, the accommodating cavity is communicated with the accommodating cavity in each of the radiators through the air pipe, and the accommodating cavity is communicated with the accommodating cavity in each of the radiators through the liquid return pipe.

3. The base station heat sink according to claim 2, further comprising a first parallel connection joint, wherein the gas pipes comprise a first section of gas pipe and a second section of gas pipe, and the number of the second section of gas pipe is corresponding to the number of the heat radiators;

one end of each second section of gas pipe is communicated with the containing cavity of each radiator, the other end of each second section of gas pipe is connected with one end of the first section of gas pipe through the first parallel connector, and the other end of the first section of gas pipe is communicated with the containing cavity of the heat absorption part of the base station.

4. The base station heat sink according to claim 2, further comprising a second parallel connector, wherein the liquid return pipe comprises a first section of liquid return pipe and a second section of liquid return pipe, and the number of the second section of liquid return pipe corresponds to the number of the radiators;

one end of each second section of liquid return pipe is respectively communicated with the containing cavity of each radiator, the other end of each second section of liquid return pipe is respectively connected with one end of the first section of liquid return pipe through the second parallel connector, and the other end of the first section of liquid return pipe is communicated with the containing cavity of the heat absorption part of the base station.

5. The base station heat dissipation device of claim 2, wherein the accommodating cavity has an exhaust hole and a liquid return hole, the accommodating cavity has an air inlet and a liquid return port, the exhaust hole is connected to the air inlet through the air pipe, and the liquid return hole is connected to the liquid return port through the liquid return pipe;

in a first direction, the exhaust hole is located above the liquid return hole, and the air inlet is located above the liquid return port, wherein the first direction is a height extending direction of the base station heat dissipation device.

6. The base station heat sink device according to claim 1, wherein the pipeline includes a gas-liquid pipe, and the receiving cavity is communicated with the receiving cavity in each of the heat sinks through the gas-liquid pipe;

the base station heat dissipation device further comprises a third parallel connection joint, the gas-liquid pipe comprises a first gas-liquid pipe section and a plurality of second gas-liquid pipe sections, the number of the second gas-liquid pipe sections corresponds to the number of the radiators, one end of each second gas-liquid pipe section is communicated with the containing cavity of each radiator, the other end of each second gas-liquid pipe section is connected to one end of the first gas-liquid pipe section through the third parallel connection joint, and the other end of the first gas-liquid pipe section is communicated with the containing cavity of the base station heat absorption part.

7. The base station heat sink of any of claims 1-6, wherein the heat spreader is at least partially positioned above the base station heat sink portion in a first direction.

8. A base station heat sink, comprising:

the radiator is internally provided with an accommodating cavity and a condensation reflux cavity which are communicated;

the base station heat absorption device comprises at least two base station heat absorption parts arranged on a base station and used for absorbing heat of a heating element of the base station, wherein each base station heat absorption part is separated from the radiator, accommodating cavities for accommodating phase change working media are formed in each base station heat absorption part, and the accommodating cavities in each base station heat absorption part are respectively communicated with the accommodating cavities in the radiator through pipelines.

9. The base station heat sink according to claim 8, wherein the pipeline includes an air pipe and a liquid return pipe, the receiving cavity in each base station heat absorption portion is respectively communicated with the receiving cavity in the heat sink through the air pipe, and the receiving cavity in each base station heat absorption portion is respectively communicated with the receiving cavity in the heat sink through the liquid return pipe.

10. The base station heat sink according to claim 9, further comprising a first parallel connection joint, wherein the air pipes comprise a first section of air pipe and a second section of air pipe, and the number of the first section of air pipe is corresponding to the number of the heat absorption part of the base station;

one end of each first section of gas pipe is communicated with the containing cavity of the heat absorption part of the base station, the other end of each first section of gas pipe is connected to one end of the second section of gas pipe through the first parallel connector, and the other end of the second section of gas pipe is communicated with the containing cavity of the radiator.

11. The base station heat sink device as claimed in claim 9, further comprising a second parallel connector, wherein the liquid return pipes comprise a first section of liquid return pipe and a second section of liquid return pipe, and the number of the first section of liquid return pipe is corresponding to the number of the heat absorbing parts of the base station;

one end of each first section of liquid return pipe is respectively communicated with the containing cavity of each base station heat absorption part, the other end of each first section of liquid return pipe is respectively connected with one end of the second section of liquid return pipe through the second parallel connector, and the other end of the second section of liquid return pipe is communicated with the containing cavity of the radiator.

12. The base station heat sink device according to claim 8, wherein the pipeline comprises a gas-liquid pipe, and the receiving cavity in each base station heat absorption part is communicated with the receiving cavity in the heat sink through the gas-liquid pipe;

the base station heat dissipation device further comprises a third parallel connection joint, the gas-liquid pipe comprises a plurality of first gas-liquid pipe sections and a plurality of second gas-liquid pipe sections, the number of the first gas-liquid pipe sections corresponds to the number of the heat absorption parts of the base station, one end of each first gas-liquid pipe section is communicated with the containing cavity of each heat absorption part of the base station, the other end of each first gas-liquid pipe section is connected to one end of each second gas-liquid pipe section through the third parallel connection joint, and the other end of each second gas-liquid pipe section is communicated with the containing cavity of the radiator.

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