CN216873651U - Radiating fin and thermosiphon radiator - Google Patents

Abstract

The utility model discloses a heat radiating fin and a thermosiphon radiator, wherein the heat radiating fin comprises a plate body and solid fins, the plate body is provided with a first end and a second end, the second end is positioned on one side of the first end, a condensation cavity and a backflow channel are formed in the plate body, the condensation cavity is arranged close to the first end and is provided with a fluid inlet, one end of the backflow channel is communicated with the condensation cavity, the other end of the backflow channel extends in the direction far away from the first end and is provided with a fluid outlet, the fluid outlet is positioned on the second end, the condensation cavity, the backflow channel and the second end are enclosed to form a solid heat radiating area, the solid fins are arranged in the solid heat radiating area, and one side of each solid fin close to the backflow channel is not connected with the plate body. The thermosiphon radiator in the embodiment greatly improves the radiating effect of the thermosiphon radiator through the combined action of two modes, namely phase change heat exchange of the plate body and the working medium in the accommodating cavity and direct heat conduction of the solid fins.

Description

Radiating fin and thermosiphon radiator

Technical Field

The utility model relates to the technical field of heat dissipation, in particular to a radiating fin and a thermosiphon radiator.

Background

In recent decades, with the rapid development of communication devices, super computing, data mining, electronic commerce, artificial intelligence and other fields, the total heat dissipation demand has increased dramatically. Miniaturization of the devices further increases the power density and also exacerbates the need for efficient cooling solutions.

The heat siphon radiator in the related art absorbs heat through the phase change working medium and evaporates into gas to radiate the heat of the electronic equipment, but the fins of the existing heat siphon radiator are directly connected with the substrate, and the heat can be transferred from the substrate to the fins through the phase change and the flow of the internal work; on the other hand, the heat of the substrate is also transferred to the fins by heat conduction through the solid portions of the fins. The heat of the solid fins can influence the temperature distribution of the internal working medium, so that the circulation of the internal working medium is possibly blocked, and the heat source cannot be quickly radiated.

SUMMERY OF THE UTILITY MODEL

In view of the above, it is necessary to provide a heat dissipation fin and a thermosiphon heat sink with better heat dissipation effect.

According to a first aspect of the present invention, a heat dissipation fin is provided, where the heat dissipation fin includes a plate body and a solid fin, the plate body has a first end and a second end, the second end is located on one side of the first end, a condensation cavity and a backflow channel are formed in the plate body, the condensation cavity is disposed near the first end and has a fluid inlet, one end of the backflow channel is communicated with the condensation cavity, the other end of the backflow channel extends in a direction away from the first end and has a fluid outlet, the fluid outlet is located on the second end, the condensation cavity, the backflow channel and the second end enclose a solid heat dissipation area, the solid fin is disposed in the solid heat dissipation area, and one side of the solid fin near the backflow channel is not connected to the plate body.

As an embodiment of the present invention, the plate body has at least one heat insulation hole penetrating through the solid heat dissipation area, and the solid fin is connected to at least a hole wall of the heat insulation hole on a side close to the second end.

As an embodiment of the present invention, one side of the solid fin is connected to the wall of the heat insulation hole near the second end, and the other opposite side extends in the direction near the return channel and protrudes from the surface of the plate body.

As an embodiment of the present invention, the solid fins are formed by separating a portion of the plate body within the solid heat dissipation area from the plate body.

In one embodiment of the present invention, the solid fins are provided in plurality, and the plurality of solid fins are arranged at intervals in the solid heat dissipation region.

As an embodiment of the present invention, the return passage extends in a parabolic shape from an end communicating with the condensation chamber to the fluid outlet.

As an embodiment of the present invention, the plate body further has a third end opposite to the first end, a direction from the third end to the first end is a first direction, the plurality of backflow channels have a plurality of corresponding fluid outlets, and the plurality of fluid outlets are sequentially disposed at intervals along the first direction at the second end.

As an embodiment of the present invention, the heat dissipation fin further includes a plurality of groups of first supporting components spaced from each other and disposed in the condensation chamber, the first supporting components include a plurality of first supporting members spaced from each other, and the first supporting members extend from one inner sidewall of the condensation chamber to the other opposite inner sidewall.

According to a second aspect of the present invention, there is provided a thermosiphon heat sink, comprising a base plate having a receiving cavity and a heat dissipating fin as described in any of the above embodiments, the base plate having a first surface and a second surface opposite to the first surface, the first surface having a plurality of areas for mounting a heat source thereon, the second end of the plate body being fixed to the second surface, the fluid inlet and the fluid outlet both communicating with the receiving cavity.

As an embodiment of the present invention, the substrate includes a main board and a cover plate covering the main board, a groove is formed in a surface of one side of the main board facing the cover plate or a groove is formed in a surface of one side of the cover plate facing the main board, and the cover plate covers the groove on the main board or the main board covers the groove of the cover plate to form the receiving cavity.

As an embodiment of the present invention, a plurality of groups of second supporting components are formed in the accommodating cavity, and the second supporting components include a plurality of second supporting members spaced from each other.

As an embodiment of the present invention, the second supporting member is integrally formed with the main plate; or, the second supporting component and the cover plate are integrally formed; or, part of the second supporting component and the main plate are integrally formed, and part of the second supporting component and the cover plate are integrally formed.

As an embodiment of the present invention, the substrate is formed with a first communication hole communicating the fluid inlet with the housing chamber, and a second communication hole communicating the fluid outlet with the housing chamber, and the first communication hole and the second communication hole are formed on the substrate plate surface between two adjacent sets of the second support members.

As an embodiment of the present invention, the heat dissipation fin has a plurality of solid fins, the plurality of solid fins are arranged in parallel and at intervals and are perpendicular to the base plate; or

The plurality of plate bodies are arranged at intervals and are connected with the substrate in an acute angle or an obtuse angle, and among the two adjacent plate bodies, the surface of at least one plate body facing to the other plate body is a curved surface.

The embodiment of the utility model has the following beneficial effects:

the heat source is arranged on the substrate, and heat is transferred to the phase change working medium in the receiving cavity based on heat conduction, so that the liquid phase change working medium absorbs heat and is evaporated into a gaseous phase change working medium, the gaseous phase change working medium is diffused into the condensation cavity through the fluid inlet, and the gaseous phase change working medium exchanges heat in the condensation cavity and is condensed into the liquid phase change working medium; in the process, the phase change working medium in the backflow channel further exchanges heat with the outside to reduce the temperature, the phase change working medium in the backflow channel has lower temperature and higher density relative to the phase change working medium in the accommodation cavity, and the phase change working medium in the accommodation cavity has higher temperature and lower density relative to the phase change working medium in the backflow channel; therefore, the phase change working medium in the backflow channel flows to the containing cavity and drives the phase change working medium in the containing cavity to move upwards, and natural convection is formed to strengthen the cooling effect on the heat source. In addition, the solid fins are also fixed on the base plate, part of heat on the base plate can be directly conducted out through the solid fins, the solid fins are arranged in the solid heat dissipation area, one side, close to the backflow channel, of each solid fin is not connected with the plate body, backflow influence of solid heat conduction on internal working media is reduced, the structure of each heat dissipation fin is reasonable, the thermosiphon heat radiator in the embodiment has the advantages that the heat dissipation effect of the thermosiphon heat radiator is greatly improved through the combined action of the two modes, namely phase change heat exchange of the working media in the accommodating cavity and direct heat conduction of the solid fins.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Wherein:

fig. 1 is a schematic view illustrating an overall structure of a thermosiphon heat sink according to the present invention;

FIG. 2 is an exploded view of FIG. 1;

FIG. 3 is an enlarged view of a portion of FIG. 2 at A;

description of the main element symbols:

10. a heat source; 100. a substrate; 101. an accommodating cavity; 102. a first communication hole; 103. a second communication hole; 104. a liquid injection hole; 110. a main board; 112. a groove; 120. a cover plate; 130. a second support assembly; 131. a second support member; 200. a heat dissipating fin; 201. a solid heat dissipation area; 210. a plate body; 2101. a first end; 2102. a second end; 2103. a third end; 211. a condensation chamber; 212. a return channel; 2121. a fluid outlet; 2122. a communication port; 213. a heat insulation hole; 220. a solid fin; 230. a first support assembly; 231. a first support member.

Detailed Description

To facilitate an understanding of the utility model, the utility model will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. The utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 to 3, in the embodiment of the present invention, a thermosiphon heat sink is provided, which can dissipate heat from a heat source 10, such as a central processing unit, a chip, or the like, of a power electronic device, so as to ensure that the power electronic device stably operates within a rated temperature range. The thermosiphon heat sink in this embodiment includes a base plate 100 having an accommodation chamber 101 and a heat dissipation fin 200 fixed on the base plate 100 and communicated with the accommodation chamber 101, a phase change working medium is accommodated in the accommodation chamber 101, a liquid phase change working medium is absorbed by a heat source 10 and evaporated to form a gaseous phase change working medium and flows into the heat dissipation fin 200, the gaseous phase change working medium is condensed in the heat dissipation fin 200 to form a liquid phase change working medium and flows back to the accommodation chamber 101, thereby completing a heat dissipation cycle. Specifically, the working medium in the heat dissipation fin 200 has a low temperature, the density of the working medium is high, the temperature of the working medium in the containing cavity 101 connected to the heat dissipation fin 200 is higher, and the density of the working medium is lower, so that the density of the working medium in the heat dissipation fin 200 and the density of the working medium in the substrate 100 are different, and the working medium in the containing cavity 101 can flow to the heat dissipation fin 200, so that the heat source 10 can be installed at any position of the thermosiphon heat sink in the embodiment, and no matter the heat source is installed above the substrate 100 or below the substrate 100, a good heat dissipation effect can be achieved, and the heat exchange efficiency between the heat dissipation fin 200 and the environment is ensured.

In order to prevent the heat source 10 from affecting the heat dissipation of the heat dissipation fins 200, it is preferable that the heat source 10 and the heat dissipation fins 200 be mounted on opposite sides of the base plate 100.

Specifically, in order to improve the heat dissipation efficiency of the thermosiphon heat sink to quickly dissipate heat from the heat source 10, an embodiment of the present invention further provides a heat dissipation fin 200, in this embodiment, the heat dissipation fin 200 includes a plate body 210 and a solid fin 220, the plate body 210 has a first end 2101 and a second end 2102, the second end 2102 is located on the first end 2101 side, specifically, the second end 2102 may be located adjacent to the first end 2101 and directly connected to the first end 2101, of course, the second end 2102 may also be indirectly connected to the first end 2101 through another end surface, as long as the second end 2102 is located on the first end 2101 side, for example, the second end 2102 is located on the left side of the first end 2101 as shown in fig. 1; a condensation cavity 211 and a return channel 212 are formed in the plate body 210, the condensation cavity 211 is disposed near the first end 2101 and has a fluid inlet, one end of the return channel 212 is communicated with the condensation cavity 211, the other end of the return channel extends in a direction away from the first end 2101 and has a fluid outlet 2121, the fluid outlet 2121 is located at the second end 2102, the condensation cavity 211, the return channel 212 and the second end 2102 enclose a solid heat dissipation area 201, the solid fins 220 are disposed in the solid heat dissipation area 201, and one side of the solid fins 220 near the return channel 212 is not connected to the plate body 210. The fluid inlet and the fluid outlet 2121 are both connected to the receiving cavity 101, so that the receiving cavity 101 and the heat dissipating fins 200 form a circulating loop.

In this embodiment, the heat source 10 is mounted on the substrate 100, and transfers heat to the phase change working medium in the receiving cavity 101 based on heat conduction, so that the liquid phase change working medium absorbs heat and evaporates into a gaseous phase change working medium, and is diffused into the condensation cavity 211 through the fluid inlet, and the gaseous phase change working medium exchanges heat in the condensation cavity 211 and is condensed into the liquid phase change working medium; in the process, the phase-change working medium in the backflow channel 212 further exchanges heat with the outside to reduce the temperature, the phase-change working medium in the backflow channel 212 has lower temperature and higher density relative to the phase-change working medium in the accommodation cavity 101, and the phase-change working medium in the accommodation cavity 101 has higher temperature and lower density relative to the phase-change working medium in the backflow channel 212; therefore, the phase-change working medium in the return channel 212 flows to the accommodating cavity 101 and drives the phase-change working medium in the accommodating cavity 101 to move upwards, so as to form natural convection to enhance the cooling effect on the heat source 10. In addition, the solid fins 220 are also fixed on the substrate 100, a part of heat on the substrate 100 can be directly conducted out through the solid fins 220, the solid fins 220 are arranged in the solid heat dissipation area 201, one side, close to the backflow channel 212, of the solid fins 220 is not connected with the plate body 210, backflow influence of solid heat conduction on internal working media is reduced, and the structure of the heat dissipation fins 200 is rationalized.

It should be noted that the manner of mounting the solid fins 220 is not limited too much. In addition, the specific shape of the solid fin 220 is not limited.

It should be noted that, for the heat sources 10 at different height positions and different horizontal positions, the same accommodating chamber 101 may be used to cool the heat sources 10 at different horizontal positions and different height positions without dividing the height of the substrate 100, so that the versatility of the thermosiphon heat sink is improved, and the thermosiphon heat sink can be adapted to the heat sources 10 with different structures. The phase change working medium in the accommodating cavity 101 is preferably ensured to cover the heat source 10 with the largest height position, so that the heat source 10 at each position can be closer to the working medium, and a good heat dissipation effect is achieved.

In order to avoid that more heat on the substrate 100 is directly conducted to the working medium in the return channel 212, which affects the temperature of the working medium flowing from the return channel 212 to the accommodating cavity 101, thereby reducing the heat dissipation effect of the working medium, in an embodiment, at least one heat insulation hole 213 is formed through the plate body 210 in the solid heat dissipation area 201, and the solid fin 220 is connected to at least a hole wall of the heat insulation hole 213 near the second end 2102. The heat on the substrate 100 can not be conducted to the return channel 212 from the position of the heat insulation hole 213 through the heat insulation hole 213, so that the working medium in the return channel 212 can be kept at a sufficiently low temperature, and the heat dissipation effect of the thermosiphon heat sink is increased.

The shape and size of the heat insulation hole 213 are not particularly limited.

Since the thermosiphon heat sink has both the plate body 210 and the solid fin 220, in order to make the structure more reasonable, i.e., to reduce the overall volume of the thermosiphon heat sink and to influence the heat dissipation performance to a smaller extent, in a specific embodiment, one side of the solid fin 220 is connected to the wall of the insulating hole 213 near the second end 2102, and the other opposite side extends in a direction near the return channel 212 and protrudes from the surface of the plate body 210. In this embodiment, since the space in which the heat insulating hole 213 is located is not fully utilized, the solid fin 220 is disposed in the heat insulating hole 213, so that the space can be fully utilized, and thus more plate bodies 210 and solid fins 220 can be mounted on the substrate 100 without changing the substrate 100, thereby greatly improving the heat dissipation performance of the thermosiphon heat sink.

Further, the solid fins 220 are formed by separating a portion of the plate body 210 within the solid heat dissipation area 201 from the body of the plate body 210. Note that the solid fins 220 may be provided separately from the plate body 210.

It should also be noted that in some embodiments, there are a plurality of solid fins 220, and a plurality of solid fins 220 are spaced apart in the solid heat dissipation area 201. The plurality of solid fins 220 can increase the contact area with air, thereby improving heat dissipation efficiency.

Since the flowing speed of the working fluid also affects the heat dissipation performance of the thermosiphon heat sink, in order to increase the flowing speed of the working fluid in the thermosiphon heat sink, in one embodiment, the return channel 212 extends in a parabolic shape from an end communicating with the condensation chamber 211 to the fluid outlet 2121. That is, the backflow channel 212 extends in a parabolic shape from one end of the backflow channel communicating with the condensation cavity 211 to the other end of the backflow channel communicating with the receiving cavity 101, and as can be seen from the fast descending method, an object can reach a low point from a high point through a parabolic path at the fastest speed between two points with different heights, because the backflow channel 212 extends in a parabolic shape from one end of the backflow channel communicating with the condensation cavity 211 to the fluid outlet 2121, water in the condensation cavity 211 can flow back into the receiving cavity 101 in the shortest time, and therefore, by increasing the flow rate of the working medium, the heat dissipation effect of the thermosiphon heat sink is improved.

It should be noted that in some other embodiments, the return channel 212 may also be continuously curved from one end to the other in order to make full use of the effective area of the plate body 210, and of course, may have other shapes.

It should be noted that the number of the return channels 212 is also not limited, and may be one or more.

In a specific embodiment, the plate body 210 further has a third end 2103 opposite the first end 2101, and the direction from the third end 2103 toward the first end 2101 is a first direction, wherein the first direction is the Z direction shown in the figure. In this embodiment, the first end 2101, the second end 2102 and the third end 2103 are sequentially connected, the fluid inlet penetrates through the second end 2102 and is communicated with the condensation chamber 211, the plurality of return channels 212 are correspondingly provided with a plurality of fluid outlets 2121, and the plurality of fluid outlets 2121 are sequentially arranged at the second end 2102 at intervals along the first direction. Through setting up many return channels 212, can make the internal diameter of circulation back passageway littleer, the work medium flux in each return channel 212 is littleer, has increased return channel 212's heat transfer area moreover to change the heat effluvium, and then improve this thermosiphon radiator's radiating effect.

In addition, since the plurality of return channels 212 are provided, the plurality of fluid outlets 2121 are provided, and the plurality of fluid outlets 2121 are sequentially arranged at the second end 2102 at intervals along the first direction, so that after the working medium in the accommodating chamber 101 is heated to generate bubbles, the bubbles can flow to the condensation chamber 211 from each fluid outlet 2121 in time, and further the bubbles are not accumulated at the fluid inlet, thereby preventing the poor circulation of the working medium caused by the accumulation of too many bubbles at the fluid inlet, and further preventing the influence of the generated bubbles on the heat dissipation effect of the thermosiphon heat sink.

Specifically, the plate body 210 further has a fourth end opposite to the second end 2102, and the direction of the fourth end toward the second end 2102 is a second direction, wherein the second direction is the X direction shown in the figure. The second direction is perpendicular to the substrate 100, and thus more board bodies 210 can be mounted on the substrate 100.

In a more specific embodiment, the plurality of return channels 212 have a plurality of communication ports 2122 in communication with the condensation chamber 211, and each return channel 212 has one communication port 2122 and one fluid outlet 2121. Of course, the plurality of return channels 212 may share one communication port 2122 communicating with the condensation chamber 211.

Referring to fig. 2, in an embodiment, the heat dissipation fin 200 further includes a first supporting structure disposed in the condensation cavity 211, so as to prevent the heat dissipation fin 200 from collapsing or bulging due to the vacuum or high pressure set in the working environment of the condensation cavity 211, and ensure the communication effect between the condensation cavity 211 and the accommodating cavity 101.

In one embodiment, the first support structure includes a plurality of sets of first support members 230 spaced apart from one another.

Specifically, a plurality of groups of first supporting components 230 and second direction parallel arrangement have realized on the one hand that first supporting structure is to the balanced stable support of radiating fin 200, and on the other hand for gaseous phase change working medium that the formation of being heated can be along the clearance between adjacent two sets of first supporting components 230 in condensation chamber 211 diffusion, reduces first supporting structure to gaseous phase change working medium's resistance, guarantees the mobility and the diffusion rate of phase change working medium.

Further, the first supporting component 230 includes a plurality of first supporting members 231 spaced apart from each other, and the first supporting members 231 extend from one inner sidewall of the condensation chamber 211 to the other opposite inner sidewall.

Specifically, a plurality of first support members 231 and first direction parallel arrangement, first support structure is the matrix structure and arranges promptly, further improves first support structure support radiating fin 200's balanced stability on the one hand, and on the other hand increases the flow diffusion path of gaseous phase change working medium in condensation chamber 211, further reduces first support structure to gaseous phase change working medium's resistance, also further improves the mobility and the diffusion rate of phase change working medium.

In an embodiment, a backflow cavity communicated with the fluid outlet 2121 is formed in the plate body 210 near the third end 2103 to buffer the liquid phase change working medium flowing back to the receiving cavity 101 from the backflow channel 212, so as to ensure a natural convection heat exchange effect; while facilitating the machining of the return channel 212.

In one embodiment, the base plate 100 has a first surface and a second surface opposite to the first surface, the first surface is provided with a plurality of areas for mounting the heat source 10, the second end 2102 of the plate body 210 is fixed on the second surface, and the fluid inlet and the fluid outlet 2121 are both communicated with the receiving cavity 101.

Further, the substrate 100 includes a main board 110 and a cover plate 120 covering the main board 110, a groove 112 is formed in a side surface of the main board 110 facing the cover plate 120 or a side surface of the cover plate 120 facing the main board 110 is recessed to form the groove 112, and the cover plate 120 covers the groove 112 on the main board 110 or the main board 110 covers the groove 112 of the cover plate 120 to form the receiving cavity 101. The substrate 100 in this embodiment has a reasonable structure, which is beneficial to the processing of the accommodating cavity 101 of the substrate 100 and is also convenient to clean the accommodating cavity 101.

Referring to fig. 2, in an embodiment, a second supporting structure is formed in the receiving cavity 101. The second support structure prevents the substrate 100 from collapsing or bulging due to the vacuum or high pressure condition of the receiving cavity 101.

In one embodiment, the second support structure includes a plurality of sets of spaced apart second support members 130.

Specifically, the second support assembly 130 is arranged in parallel with the first direction, so that the support of the second support structure to the substrate 100 is ensured, and the gaseous phase change working medium formed by heating can diffuse towards the condensation cavity 211 along the gap between the two adjacent sets of second support assemblies 130, thereby reducing the influence on the flow speed of the gaseous phase change working medium due to the resistance of the second support structure to the gaseous phase change working medium.

In one embodiment, the second supporting assembly 130 includes a plurality of second supporting members 131 spaced apart from each other.

Further, the second supporting member 130 is integrally formed with the main plate 110; alternatively, the second supporting member 130 is integrally formed with the cover plate 120; alternatively, a portion of the second supporting member 130 is integrally formed with the main plate 110, and a portion of the second supporting member 130 is integrally formed with the cover plate 120. Thereby reducing the difficulty in manufacturing the substrate 100 in this embodiment.

Furthermore, the plurality of second supporting members 131 are arranged at intervals along the first direction, and the second supporting members 131 further improve the balance stability of the second supporting structure supporting the substrate 100 on one hand, and increase the fluidity of the liquid phase-change working medium in the accommodating cavity 101 on the other hand, so that the natural convection heat exchange effect is improved; and increasing the speed of the gaseous phase change working medium flowing to the condensation chamber 211.

In one embodiment, the substrate 100 is further formed with a first communicating hole 102 communicating the fluid inlet with the receiving chamber 101, and a second communicating hole 103 communicating the fluid outlet 2121 with the receiving chamber 101, and the first communicating hole 102 and the second communicating hole 103 are formed on the substrate 100 plate surface between two adjacent sets of the second supporting assemblies 130, so as to ensure that the second supporting structure does not block the first communicating hole 102 and the second communicating hole 103 to ensure the receiving chamber 101 to communicate with the condensation chamber 211 and the return channel 212 while ensuring the stable operation of the substrate 100; on the other hand, the strength of the substrate 100 is reduced by forming the first and second communication holes 102 and 103, and the strength of the substrate 100 is improved by forming the first and second communication holes 102 and 103 on the surface of the substrate 100 between two adjacent sets of the second support members 130.

In one embodiment, the substrate 100 is further provided with a liquid injection hole 104 communicated with the receiving cavity 101; the liquid injection hole 104 may be disposed at the top end of the substrate 100.

In one embodiment, the heat dissipation fin 200 has a plurality of plate bodies 210 disposed in parallel and spaced apart from each other and perpendicular to the base plate 100, and a plurality of solid fins 220 disposed in parallel and spaced apart from each other and perpendicular to the base plate 100.

In order to further improve the heat dissipation effect, in another embodiment, the plurality of plate bodies 210 are disposed at intervals and connected to the substrate 100 at acute angles or obtuse angles, a surface of at least one plate body 210 facing to another plate body 210 in two adjacent plate bodies 210 is a curved surface, the plurality of solid fins 220 are disposed at intervals and connected to the substrate 100 at acute angles or obtuse angles, and a surface of at least one solid fin 220 facing to another solid fin 220 in two adjacent solid fins 220 is a curved surface. In this embodiment, because between two adjacent plate bodies 210, the surface of at least one plate body 210 facing another plate body 210 is a curved surface, and then airflow between the two adjacent plate bodies 210 is disturbed, and then heat dissipation performance is improved.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (14)

1. The utility model provides a radiating fin, its characterized in that, radiating fin includes plate body and solid fin, the plate body has first end and second end, the second end is located first end one side, be formed with condensation chamber and return flow channel in the plate body, the condensation chamber is close to first end sets up and has fluid inlet, return flow channel's one end with condensation chamber intercommunication, the other end is to keeping away from the direction of first end extends and has the fluid outlet, the fluid outlet is located the second is held, condensation chamber, return flow channel and the second end encloses to close and forms a solid heat dissipation region, solid fin locates in the solid heat dissipation region, just solid fin is close to return flow channel's one side with the plate body is disconnected.

2. The fin as claimed in claim 1, wherein the plate body has at least one thermal insulation hole formed therethrough in the solid heat dissipation area, and the solid fin is connected to at least a wall of the thermal insulation hole on a side thereof adjacent to the second end.

3. The fin according to claim 2, wherein one side of the solid fin is connected to the wall of the insulating hole near the second end, and the other opposite side extends in a direction near the return channel and protrudes from the surface of the plate body.

4. The fin according to claim 1, wherein the solid fins are formed by separating portions of the plate body within the solid heat dissipation area from the plate body.

5. The fin according to any one of claims 1 to 4, wherein the solid fins are provided in plurality, and a plurality of the solid fins are provided at intervals in the solid heat dissipation region.

6. The fin according to claim 1, wherein the return channel extends in a parabolic shape from an end communicating with the condensation chamber to the fluid outlet.

7. The fin according to claim 1, wherein the plate body further has a third end opposite to the first end, a direction from the third end to the first end is a first direction, the plurality of backflow channels have a plurality of corresponding fluid outlets, and the plurality of fluid outlets are sequentially disposed at intervals along the first direction at the second end.

8. The fin according to claim 1, further comprising a plurality of sets of spaced first support members disposed in the condensation chamber, wherein the first support members include a plurality of spaced first support members, and the first support members extend from one inner sidewall of the condensation chamber to the other inner sidewall.

9. A thermosiphon heat sink, comprising a base plate having a receiving cavity and a fin according to any one of claims 1 to 8, the base plate having first and second opposing surfaces, the first surface having a plurality of areas for receiving a heat source disposed thereon, the second end of the plate body being secured to the second surface, the fluid inlet and the fluid outlet both communicating with the receiving cavity.

10. The thermosiphon heat sink as claimed in claim 9, wherein the base plate comprises a main plate and a cover plate covering the main plate, wherein a side surface of the main plate facing the cover plate is recessed to form a groove or a side surface of the cover plate facing the main plate is recessed to form a groove, and the cover plate covers the groove on the main plate or the main plate covers the groove of the cover plate to form the receiving cavity.

11. The thermosiphon heat sink as recited in claim 10, wherein a plurality of sets of second support members are formed in the receiving chamber, the sets of second support members being spaced apart from each other, and the second support members include a plurality of second support members spaced apart from each other.

12. The thermosiphon heat sink of claim 11, wherein the second support assembly is integrally formed with the main plate; or the second supporting component and the cover plate are integrally formed; or, part of the second supporting component and the main plate are integrally formed, and part of the second supporting component and the cover plate are integrally formed.

13. The thermosiphon heat sink according to claim 11, wherein the base plate is formed with a first communication hole communicating the fluid inlet with the receiving chamber, and a second communication hole communicating the fluid outlet with the receiving chamber, the first communication hole and the second communication hole being formed on the surface of the base plate between two adjacent sets of the second support members.

14. The thermosiphon heat sink of claim 9, wherein the fins are a plurality of fins, the plurality of plates are disposed in parallel and spaced apart relation and are oriented perpendicular to the base plate, and the plurality of solid fins are disposed in parallel and spaced apart relation and are oriented perpendicular to the base plate; or

The plurality of plate bodies are arranged at intervals and are connected with the substrate in an acute angle or an obtuse angle, and among the two adjacent plate bodies, the surface of at least one plate body facing to the other plate body is a curved surface.

Images