WO2015085569A1

WO2015085569A1 - Heat radiation structure and electronic device having the heat radiation structure

Info

Publication number: WO2015085569A1
Application number: PCT/CN2013/089360
Authority: WO
Inventors: 李华林; 李奋英
Original assignee: 华为终端有限公司
Priority date: 2013-12-13
Filing date: 2013-12-13
Publication date: 2015-06-18
Also published as: CN105378916B; CN105378916A

Abstract

A heat radiation structure (30), which is arranged in an electronic device (100). The electronic device comprises a liquid crystal display module (25). The heat radiation structure (30) comprises a radiator (31), a seal cavity (32) which is arranged in the radiator, and a heat conduction liquid (33) which is sealed in the seal cavity (32), wherein the radiator (31) is arranged in the electronic device (100) and supports the liquid crystal display module (25); and the heat conduction liquid (33) conducts the liquid-gas cyclic exchange and flow in the seal cavity (32), so as to achieve the heat radiation of the electronic device (100). Also provided is an electronic device having the heat radiation structure.

Description

Heat dissipation structure and electronic device having the same

Technical field

The invention relates to a heat dissipation structure and an electronic device having the same. Background technique

With the rapid development of mobile communication technology and the improvement of the performance of the core chip of the hardware system, the existing electronic devices such as mobile phones have a compact structure, a thin and light appearance, and the power consumption of the circuit board and the chip is greatly increased. In order to reduce the temperature of the electronic device, metal sheets or heat pipes are used for heat dissipation during structural design. However, the metal has a limited thermal conductivity and cannot dissipate heat from a chip with a large power consumption. However, the heat pipe is limited by the space and strength of the whole machine, and cannot fully cover the heat-generating area of the whole machine, and cannot achieve better heat dissipation performance. Summary of the invention

A heat dissipation structure with better heat dissipation is provided.

There is also provided an electronic device having the heat dissipation structure.

In a first aspect, a heat dissipation structure is disposed in an electronic device, the electronic device includes a liquid crystal display module, and the heat dissipation structure includes a heat dissipation body, a sealing cavity disposed in the heat dissipation body, and a sealing cavity in the sealing cavity. The heat dissipating body is disposed in the electronic device and supports the liquid crystal display module, and the thermal fluid exchanges and flows in a liquid and a gaseous state in the sealed cavity to dissipate heat from the electronic device.

In a first possible implementation of the first aspect, the inner wall of the sealed chamber is provided with a capillary structure.

In conjunction with the first possible implementation of the first aspect, in a second possible implementation, the sealed chamber includes an evaporation section and a condensation section in communication with the evaporation section, the thermal fluid being heated in the evaporation section Evaporation forms a gaseous thermal fluid, and the pressure difference in the sealed chamber causes the gaseous thermal fluid to flow to the condensation section to dissipate heat. The suction of the capillary structure causes the heat transfer liquid re-condensed into a liquid state to return to the evaporation section after the heat dissipation.

In conjunction with the first possible implementation of the first aspect, in a third possible implementation, the heat sink is a plate made of a metallic material having thermal conductivity.

In a second aspect, an electronic device includes a circuit board, a liquid crystal display module, and a heat dissipation structure, wherein the heat dissipation structure includes a heat dissipation body, a sealing cavity disposed in the heat dissipation body, and heat conduction sealed in the sealing cavity. The heat dissipating body is disposed between the circuit board and the liquid crystal display module and supports the liquid crystal display module, and the heat transfer liquid exchanges liquid and gas in a sealed cavity and flows to realize the circuit board. Cooling.

In a first possible implementation of the second aspect, the inner wall of the sealed chamber is provided with a capillary structure.

In conjunction with the first possible implementation of the second aspect, in a second possible implementation, the sealed chamber includes an evaporation section and a condensation section in communication with the evaporation section, the thermal fluid being heated after the evaporation section Evaporation forms a gaseous thermal fluid, and the pressure difference in the sealed chamber causes the gaseous thermal fluid to flow to the condensation section to dissipate heat. The suction of the capillary structure causes the heat transfer liquid re-condensed into a liquid state to return to the evaporation section after the heat dissipation.

With reference to the second possible implementation of the second aspect, in a third possible implementation manner, the heat dissipating body includes a plate body and a mounting end formed by bending and extending from a periphery of the plate body, the sealing cavity Opened in the board.

In conjunction with the third possible implementation of the second aspect, in a fourth possible implementation manner, a surface of the opposite body opposite to the receiving slot extends with a frame-shaped extension wall, and the extension wall is located at the One side of the evaporation section forms a shielding structure with the plate body.

With the second possible implementation of the second aspect, in a fifth possible implementation manner, the mounting end and the board body form a receiving slot, and the liquid crystal display module is received in the receiving slot Inside.

In conjunction with the fifth possible implementation of the second aspect, in a sixth possible implementation, the electronic device further includes a housing and a battery, and the circuit board is mounted in the housing alongside the battery The circuit board is provided with a central processing unit.

In conjunction with the sixth possible implementation of the second side, in a seventh possible implementation, the heat sink is mounted on the housing through the mounting end and covers the side of the circuit board and the battery. And the circuit board is opposite to the evaporation section of the sealed cavity, and the battery is disposed opposite to the condensation section.

In an eighth possible implementation of the second aspect, the thermal fluid is one of high purity water, decyl alcohol, and propylene alcohol.

The heat dissipating structure of the invention directly uses the bracket of the liquid crystal display module as the heat dissipating body, and the cold heat exchange between the thermal fluid and the heat dissipating body saves the space of the electronic device, and greatly improves the heat transfer capability of the liquid crystal display module bracket. At the same time, the position and shape of the sealing cavity can be adjusted according to different layouts of the heating point, effectively covering the heat source, reducing the internal temperature and surface temperature of the electronic device, and improving the heat dissipation effect of the electronic device. DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings to be used in the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present invention, Those skilled in the art can also obtain other drawings based on these drawings without paying any creative work.

1 is a schematic plan view of an electronic device having a heat dissipation structure according to an embodiment of the present invention. detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.

Referring to FIG. 1, an electronic device 100 according to an embodiment of the present invention is provided with a heat dissipation structure 30. The heat dissipation structure 30 can serve as a support for carrying components of the electronic device 100, and includes a heat sink 31, a sealing cavity 32, and a thermal fluid 33. The heat dissipation of the electronic device 100 is achieved by physical transformation of the thermal fluid 33 into the gasification and liquefaction in the sealed chamber 32. details as follows:

The electronic device 100 further includes a housing 10, a circuit board 15, a liquid crystal display module 25, a battery 35 mounted in the housing 10, and a battery cover 40 disposed on the housing 10. In this embodiment, the housing 10 has two opposite surfaces (not shown). The liquid crystal display module 25 and the battery cover 40 are respectively mounted on the two surfaces. The circuit board 15 is provided with electronic components such as a central processing unit (CPU). The circuit board 15 is mounted side by side with the battery 35 in the housing 10 and is adjacent to the heat dissipation structure 30. In this embodiment, the electronic device component is a liquid crystal display module 25, and the liquid crystal display module 25 is an LCD (Liquid Crystal Display) liquid crystal display module.

In this embodiment, the heat dissipation structure 30 covers the circuit board 15 and the battery 35. The heat sink 31 is made of a metal material having thermal conductivity such as copper, aluminum or stainless steel. In this embodiment, the heat sink 31 is made of copper, and includes a plate body 311 and a mounting end 312. The mounting end 312 is formed by bending and extending from the periphery of the plate body 311 and encloses a receiving groove 313 with the plate body 311. The receiving slot 313 is configured to receive and support the liquid crystal display module 25; the heat sink 31 and the liquid crystal display module 25 constitute the screen assembly. A frame-shaped extension wall 314 is further extended on a surface of the plate body 311 opposite to the receiving groove 313. The extension wall 314 covers the CPU A shielding structure is formed with the plate body 311.

In this embodiment, the sealing cavity 32 is a rectangular cavity which is opened in the opposite body 311 and is in a negative pressure state. The entire inner wall of the sealed chamber 32 is provided with a capillary structure 323 which is composed of a capillary porous material. The capillary structure 323 in this embodiment is fired from copper powder of different forms. The sealed chamber 32 is divided into an evaporation section 321 and a condensation section 322 connected to the evaporation section 321 . The capillary structure 323 can also be formed by other means known in the art, such as fibers, screens, grooves, and the like. It can be understood that the shape of the sealed cavity 32 is not limited to a rectangular shape, and can be set in a curved shape according to the position of the heat source on the circuit board.

The thermal fluid 33 is received and sealed within the sealed chamber 32. The heat transfer liquid 33 may be injected while the heat sink 31 is molded in the mold. The heat transfer liquid 33 in the present embodiment is a liquid having a relatively low boiling point and which is easy to fluorinate and does not corrode the heat radiating body 31, such as high purity water, decyl alcohol, propanol or the like. An appropriate amount of thermal fluid 33 is injected into the sealed chamber 32. When the evaporation section 321 of the heat sink 31 is heated, the thermal fluid 33 evaporates rapidly, and the gaseous thermal fluid 33 flows to the condensation section 322 under a pressure difference in the sealed chamber 32, and After the heat is released from the condensation section, it is recondensed into a liquid heat transfer liquid 33, and the heat transfer liquid 33 is again returned to the evaporation section 321 by the suction force of the capillary structure 323.

Referring to FIG. 1 , in the embodiment, the heat sink 31 is fixed to the housing 10 through the mounting end 312 . The extension wall 314 is disposed on the CPU 20 of the circuit board 15, and the evaporation section 321 of the heat dissipation structure 30 is opposite to the evaporation section 321, and the condensation section 322 is opposite to the battery 35, because the heat of the battery 35 is small. The heat dissipation effect of the condensation section 322 is affected. When the electronic device is in operation, the electronic components on the circuit board 15 , in particular the heat radiated by the CPU 20 , are transferred to the evaporation section 321 of the heat sink 31 , and the thermal fluid 33 in the sealed cavity 32 is heated due to the high temperature. Evaporation becomes a gaseous state, and the gaseous thermal fluid 33 flows to the condensation section 322 under the pressure difference between the evaporation section 321 and the condensation section 322 in the sealed chamber 32, and the heat is transferred to the heat sink 31 in the condensation section 322 and is released; After the release, the temperature is lowered and recondensed into a liquid heat transfer liquid 33, and the heat transfer liquid 33 is again returned to the evaporation section 321 by the suction force of the capillary structure 323; thus, the heat is transferred from the sealed cavity 32 of the heat radiating body 31 to the other end. This cycle is fast, and the heat of the electronic device 100 can be continuously transmitted, which improves the heat dissipation effect on the electronic device.

The heat dissipation structure 30 of the present invention directly uses the bracket of the liquid crystal display module as a heat sink, and performs heat exchange between the heat sink 33 and the heat sink, thereby saving space of the electronic device and greatly improving the transmission of the liquid crystal display module bracket. Thermal capacity; at the same time, it can be adjusted according to different layouts of the board heating The position and shape of the sealing cavity 32 effectively cover the heat source, reduce the internal temperature of the electronic device and the surface temperature, and improve the heat dissipation effect of the electronic device 100.

The above is a preferred embodiment of the present invention, and it should be noted that those skilled in the art can also make several improvements and retouchings without departing from the principles of the present invention. These improvements and retouchings are also considered. It is the scope of protection of the present invention.

Claims

Rights request

A heat dissipation structure is disposed in an electronic device, the electronic device includes a liquid crystal display module, wherein: the heat dissipation structure includes a heat dissipation body, a sealing cavity disposed in the heat dissipation body, and is sealed in the sealing cavity The heat dissipating liquid is disposed in the electronic device and supports the liquid crystal display module, and the thermal fluid exchanges and flows in a liquid and a gaseous state in the sealed cavity to dissipate heat from the electronic device.

2. The heat dissipation structure according to claim 1, wherein the inner wall of the sealing chamber is provided with a capillary structure.

3. The heat dissipation structure according to claim 2, wherein the sealing chamber comprises an evaporation section and a condensation section communicating with the evaporation section, and the thermal fluid is evaporated to form a gaseous thermal fluid after being heated by the evaporation section, The pressure difference in the sealed chamber causes the gaseous heat transfer liquid to flow to the condensation section to release heat, and the suction force of the capillary structure causes the heat transfer liquid which is recondensed into a liquid state after heat dissipation to flow back to the evaporation section.

The heat dissipation structure according to claim 2, wherein the heat sink is a plate body made of a metal material having thermal conductivity.

An electronic device, comprising: a circuit board, a liquid crystal display module, and a heat dissipation structure, wherein the heat dissipation structure comprises a heat dissipation body, a sealing cavity disposed in the heat dissipation body, and a thermal fluid sealed in the sealing cavity The heat dissipating body is installed between the circuit board and the liquid crystal display module and supports the liquid crystal display module, and the heat transfer liquid exchanges liquid and gas in a sealed cavity to perform heat dissipation on the circuit board. .

6. The electronic device according to claim 5, wherein the inner wall of the sealed chamber is provided with a capillary structure.

The electronic device according to claim 6, wherein the sealed chamber comprises an evaporation section and a condensation section communicating with the evaporation section, and the thermal fluid is evaporated to form a gaseous thermal fluid after being heated by the evaporation section, The pressure difference in the sealed chamber causes the gaseous heat transfer liquid to flow to the condensation section to release heat, and the suction force of the capillary structure causes the heat transfer liquid which is recondensed into a liquid state after heat dissipation to flow back to the evaporation section.

The electronic device according to claim 7, wherein the heat dissipating body comprises a plate body and a mounting end formed by bending and extending from a periphery of the plate body, and the sealing cavity is opened in the plate body.

9. The electronic device according to claim 8, wherein the mounting end and the board body The liquid crystal display module is received in the receiving slot.

The electronic device according to claim 9, wherein a surface of the board opposite to the receiving slot extends with a frame-shaped extension wall, and the extension wall is located at one side of the evaporation section Forming a shielding structure with the opposite body.

The electronic device of claim 7, further comprising a housing and a battery, wherein the circuit board is mounted in the housing alongside the battery, and the circuit board is mounted There is a central processing unit.

The electronic device according to claim 11, wherein the heat dissipating body is mounted on the casing through a mounting end and covers a side of the circuit board provided with the central processing unit and the battery, and the central processing unit is The evaporation section of the sealed chamber is opposite, and the battery is disposed opposite to the condensation section.

The electronic device according to claim 5, wherein the thermal conductive liquid is one of high purity water, decyl alcohol and propanol.