CN107820359A - A kind of main PCB A plates - Google Patents

A kind of main PCB A plates Download PDF

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Publication number
CN107820359A
CN107820359A CN201610826719.XA CN201610826719A CN107820359A CN 107820359 A CN107820359 A CN 107820359A CN 201610826719 A CN201610826719 A CN 201610826719A CN 107820359 A CN107820359 A CN 107820359A
Authority
CN
China
Prior art keywords
chip
plates
main pcb
radome
fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610826719.XA
Other languages
Chinese (zh)
Inventor
黄文丰
符大富
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inlife Handnet Co Ltd
Original Assignee
Inlife Handnet Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inlife Handnet Co Ltd filed Critical Inlife Handnet Co Ltd
Priority to CN201610826719.XA priority Critical patent/CN107820359A/en
Priority to PCT/CN2017/073981 priority patent/WO2018049788A1/en
Publication of CN107820359A publication Critical patent/CN107820359A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB

Abstract

The present invention provides a kind of main PCB A plates, including substrate, the front of the substrate is provided with chip, radome and the absorber including phase-change material, the radome covers the chip, the absorber is filled between the chip and the radome, the absorber covers the chip, and the back side of the substrate is provided with fin.The main PCB A plates of the present invention, chip is main heat generating components, and absorber and fin are arranged around chip, absorbs and remove most of heat that chip is sent, solve the problems, such as the part of chip circumference generated heat by chip caused by temperature rise temperature, improve life-spans of main PCB A plates.

Description

A kind of main PCB A plates
Technical field
The present invention relates to electronic technology field, more specifically to a kind of main PCB A plates.
Background technology
Be disposed with all kinds of electronic components on main PCB A plates, its chips generate heat the problem of be particularly acute, chip circumference cloth Very more electronic component or miscellaneous part are equipped with, and the interval being distributed is general very small, the heat that chip is sent can cause These device temperatures raise, and this can not only influence the normal work of main PCB A plates, also reduce the life-span of whole main PCB A plates.
The content of the invention
The present invention proposes a kind of main PCB A plates, can solve chip circumference part generated heat by chip caused by temperature rise temperature The problem of spending.
Therefore, the present invention proposes following technical scheme：
A kind of main PCB A plates, including substrate, the front of the substrate are provided with chip, radome and including phase-change material Absorber, the radome cover the chip, and the absorber, the heat absorption are filled between the chip and the radome Body covers the chip, and the back side of the substrate is provided with fin.
Wherein, the top of the radome is disposed with heat shield, battery bracket and battery, the battery from low to high Support fixes the battery.
Wherein, the top of the fin is disposed with LCD screen support and LCD screen, the LCD screen support from low to high The fixed LCD screen.
Wherein, the thickness of the absorber is 1.5mm or 2mm.
Wherein, the heat shield is rectangular shape, the lower surface size of heat shield and the size phase of radome upper surface Together, the surface size of heat shield is 60mm*30mm, and thickness is 200 μm or 500 μm.
Wherein, the back side of the substrate attaches 2 fin, and 2 fin are overlapping, and the thickness of every fin is 25μm。
Wherein, the distance between the upper surface of the chip and the upper surface of the radome are 1.3mm.
Wherein, the distance between the upper surface of the radome and the lower surface of the battery bracket are 1.9mm.
Wherein, the distance between the upper surface of the fin and the lower surface of the LCD screen support are 1.75mm.
The present invention provides a kind of main PCB A plates, including substrate, the front of the substrate be provided with chip, radome and including The absorber of phase-change material, the radome cover the chip, the heat absorption are filled between the chip and the radome Body, the absorber cover the chip, and the back side of the substrate is provided with fin.The main PCB A plates of the present invention, chip are Main heat generating components, absorber and fin are arranged around chip, absorbs and remove most of heat that chip is sent, Solve the problems, such as the part of chip circumference generated heat by chip caused by temperature rise temperature, improve life-spans of main PCB A plates.
Brief description of the drawings
Fig. 1 is a kind of structural representation of main PCB A plates of the present invention.
Fig. 2 is a kind of positive structural representation of main PCB A plates of the present invention.
Fig. 3 is a kind of structural representation of main PCB A backs of the present invention.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only to explain the present invention, not For limiting the present invention.
As shown in figure 1, a kind of main PCB A plates, including substrate 1, the front of the substrate 1 are provided with chip 2, the and of radome 3 Absorber 4 comprising phase-change material, the radome 3 cover the chip 2, filled between the chip 2 and the radome 3 The absorber 4, the absorber 4 cover the chip 2, and the back side of the substrate 1 is provided with fin 5.
Wherein, A represents the front of substrate 1, and B represents the back side of substrate 1.In addition, what is referred in text is arranged on the front of substrate 1 All parts the side of part upward when substrate 1 is just putting (face-up) that refers to of upper surface, lower surface is part court Under the side；Similarly, it is arranged on portion when substrate 1 that the upper surfaces of all parts at the back side of substrate 1 refers to is counter to put (back side is upward) The side of part upward, lower surface are the part sides directed downwardly.
Radome 3 can make chip 2 work when from other emissivity devices interference, or shielding chip 2 to other devices The interference of work.
Absorber 4 is mainly process by phase-change material, can absorb the heat that chip is sent.
In the front of substrate 1, absorber 4 is filled between chip 2 and radome 3, the chip 2 is covered with absorber 4, can To sponge most of heat that chip 2 distributes upwards so that the device above radome 3 is not influenceed by the heating of chip 2 And cause temperature to raise, fin 5 is arranged in the another side (back side) of substrate 1, enables to the heat at the back side of substrate 1 to be distributed It is even, rather than heat concentrates on corresponding to chip 2 place and forms focus, causes place distribution corresponding to the chip 2 at the back side of substrate 1 Device temperature it is too high.
As Figure 2-3, the top of the radome 3 is disposed with heat shield 6, battery bracket 7 and electricity from low to high Pond 8, the battery bracket 7 fix the battery 8；The top of the fin 5 is disposed with LCD screen support 9 from low to high With LCD screen 10, the LCD screen support 9 fixes the LCD screen 10.
Absorber 4 absorbs most of heat that chip 2 is sent, and the setting of heat shield 6 causes unnecessary heat to be isolated In the lower section of battery bracket 7, battery 8 is avoided to be influenceed to cause temperature to raise by the heat.
LCD (Liquid Crystal Display) shields, i.e. LCDs, is arranged on the back side of substrate 1, and substrate 1 is carried on the back The heat that the fin 5 in face distributes chip 2 is evenly dispersed, and is avoided the local temperature of LCD screen 10 too high and is damaged.
Wherein, the thickness of the absorber 4 is 1.5mm or 2mm.
Wherein, the heat shield 6 is rectangular shape, the lower surface size of heat shield 6 and the size of the upper surface of radome 3 Identical, the surface size of heat shield 6 is 60mm*30mm, and thickness is 200 μm or 500 μm.
Wherein, the back side of the substrate 1 overlapping, the thickness of every fin 5 that attaches 2 described 5,2 fin of fin Spend for 25 μm.
Wherein, the distance between the upper surface of the chip 2 and the upper surface of the radome 3 are 1.3mm.
Wherein, the distance between the upper surface of the radome 3 and the lower surface of the battery bracket 7 are 1.9mm.
Wherein, the distance between the upper surface of the fin 5 and the lower surface of the LCD screen support 9 are 1.75mm.
Main PCB A plates provided in an embodiment of the present invention, chip are main heat generating components, and heat absorption is arranged around chip Body and fin, most of heat that chip is sent is absorbed and removes, the part for solving chip circumference is caused by chip heating Temperature rise temperature the problem of, improve life-spans of main PCB A plates.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto, Any one skilled in the art the invention discloses technical scope in, the change or replacement that can readily occur in, It should all be included within the scope of the present invention.Therefore, protection scope of the present invention should be with scope of the claims It is defined.

Claims (9)

  1. A kind of 1. main PCB A plates, it is characterised in that including substrate, the front of the substrate be provided with chip, radome and including The absorber of phase-change material, the radome cover the chip, the heat absorption are filled between the chip and the radome Body, the absorber cover the chip, and the back side of the substrate is provided with fin.
  2. 2. main PCB A plates as claimed in claim 1, it is characterised in that the top of the radome is disposed with from low to high Heat shield, battery bracket and battery, the battery bracket fix the battery.
  3. 3. main PCB A plates as claimed in claim 1, it is characterised in that the top of the fin is disposed with from low to high LCD screen support and LCD screen, the LCD screen support fix the LCD screen.
  4. 4. main PCB A plates as claimed in claim 1, it is characterised in that the thickness of the absorber is 1.5mm or 2mm.
  5. 5. main PCB A plates as claimed in claim 2, it is characterised in that the heat shield is rectangular shape, under heat shield Surface size is identical with the size of radome upper surface, and the lower surface size of heat shield is 60mm*30mm, thickness be 200 μm or 500μm。
  6. 6. main PCB A plates as claimed in claim 1, it is characterised in that the back side of the substrate attaches 2 fin, and 2 Piece fin is overlapping, and the thickness of every fin is 25 μm.
  7. 7. main PCB A plates as claimed in claim 1, it is characterised in that the upper surface of the chip and the upper table of the radome The distance between face is 1.3mm.
  8. 8. main PCB A plates as claimed in claim 2, it is characterised in that the upper surface of the radome and the battery bracket The distance between lower surface is 1.9mm.
  9. 9. main PCB A plates as claimed in claim 3, it is characterised in that the upper surface of the fin and the LCD screen support The distance between lower surface be 1.75mm.
CN201610826719.XA 2016-09-14 2016-09-14 A kind of main PCB A plates Pending CN107820359A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201610826719.XA CN107820359A (en) 2016-09-14 2016-09-14 A kind of main PCB A plates
PCT/CN2017/073981 WO2018049788A1 (en) 2016-09-14 2017-02-17 Main pcba plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610826719.XA CN107820359A (en) 2016-09-14 2016-09-14 A kind of main PCB A plates

Publications (1)

Publication Number Publication Date
CN107820359A true CN107820359A (en) 2018-03-20

Family

ID=61600363

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610826719.XA Pending CN107820359A (en) 2016-09-14 2016-09-14 A kind of main PCB A plates

Country Status (2)

Country Link
CN (1) CN107820359A (en)
WO (1) WO2018049788A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112672560A (en) * 2020-12-18 2021-04-16 北京无线电计量测试研究所 Temperature control device

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WO2015085569A1 (en) * 2013-12-13 2015-06-18 华为终端有限公司 Heat radiation structure and electronic device having the heat radiation structure
CN205071082U (en) * 2015-11-05 2016-03-02 深圳禾苗通信科技有限公司 High heat dissipation cell -phone structure with blocking function
CN205160997U (en) * 2015-08-28 2016-04-13 清华大学 Handheld electronic equipment with novel heat radiation structure
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Publication number Priority date Publication date Assignee Title
CN202026562U (en) * 2011-03-11 2011-11-02 深圳瑞谷电子有限公司 Shielding hood with radiation function
CN104350814A (en) * 2012-06-15 2015-02-11 株式会社钟化 Heat dissipation structure
WO2015085569A1 (en) * 2013-12-13 2015-06-18 华为终端有限公司 Heat radiation structure and electronic device having the heat radiation structure
CN203883867U (en) * 2014-05-26 2014-10-15 北京高科中天技术股份有限公司 4g wireless router
CN105658020A (en) * 2014-11-10 2016-06-08 奇鋐科技股份有限公司 Wearable host device with heat radiation structure
CN205160997U (en) * 2015-08-28 2016-04-13 清华大学 Handheld electronic equipment with novel heat radiation structure
CN205071082U (en) * 2015-11-05 2016-03-02 深圳禾苗通信科技有限公司 High heat dissipation cell -phone structure with blocking function
CN105916351A (en) * 2016-04-29 2016-08-31 广东欧珀移动通信有限公司 Shielding case and mobile terminal

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112672560A (en) * 2020-12-18 2021-04-16 北京无线电计量测试研究所 Temperature control device

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Application publication date: 20180320