TWM469730U - Heat dissipation structure and heat dissipation structure having the same - Google Patents

Description

Heat dissipation structure and handheld electronic device having the same

The present invention relates to a heat dissipation structure and a handheld electronic device having the same, particularly a heat dissipation structure for improving heat dissipation performance in a handheld electronic device.

With the rapid development of the electronics industry, the operating speed of electronic components in handheld mobile devices continues to increase, generating a large amount of heat during operation, which increases the temperature of itself and the system, which in turn affects the stability of the system. In order to ensure the normal operation of the electronic components, a heat sink is usually installed thereon to discharge the heat generated by the heat sink.
Mean temperature plates and temperature equalizers are popular materials used in the antipyretic of electronic products. For example, smart phones, tablets, lighting and automotive LED lamps have begun to use this passive heat dissipation technology and materials. Mobile phones, tablets and LED lamps will choose the Vapor Chamber and Heat Spreader. The main considerations are: both are passive heat dissipation, no energy consumption; secondly, their heat conduction mode It is two-dimensional and is not affected by gravity and belongs to the conduction of the surface. The third is limited by the light, thin, and closed design of electronic products, and the space designed by the mechanism has a good heat dissipation effect.
The working principle of the temperature equalizing plate is almost the same as that of the heat pipe, including four main steps of conduction, evaporation, convection and solidification. The temperature equalizing plate is a two-phase fluid device which is filled with pure water and filled with a microstructured container. The heat enters the plate from the external high temperature zone via heat conduction, and the water around the point heat source rapidly absorbs heat and vaporizes into vapor, taking away a large amount of heat energy. Reusing the latent heat of water vapor, when the steam in the plate diffuses from the high pressure zone to the low pressure zone (ie, the low temperature zone), when the vapor contacts the inner wall of the lower temperature, the water vapor rapidly condenses into a liquid and emits heat energy. The condensed water flows back to the heat source point by the capillary action of the microstructure to complete a heat transfer cycle to form a two-phase circulation system in which water and water vapor coexist. The gasification of the water in the uniform temperature plate continues, and the pressure in the chamber will maintain equilibrium as the temperature changes. When the water is operated at low temperature, its heat transfer coefficient is low, but the viscosity of the water changes with temperature, so the temperature plate can also operate at 5 ° C or 10 ° C. Since the liquid reflux is caused by the capillary force, the temperature equalization plate is less affected by the gravity, and the application system design space can be used at any angle. The temperature equalization board requires no power supply and no moving parts. It is a completely sealed passive device.
Since the outer casing of the temperature equalizing plate needs to be anodized to avoid oxidation caused by contact with air, the anode treatment adds a layer of thermal impedance, which affects the heat dissipation efficiency. Therefore, the soft ceramic heat-dissipating paint is applied to the outer layer of the uniform temperature plate, especially if the white soft ceramic heat-dissipating paint is used, the thermal resistance is as low as zero, and the outer casing can be protected from oxidation, and the cooling effect is very remarkable.
In addition, graphite heat-dissipating film or graphite temperature spreader (Graphite Heat Spreader) is used as a component for uniform temperature heat dissipation. Graphite heat-dissipating film is a kind of nano composite material, which is suitable for uniform heat conduction on any surface and has EMI electromagnetic shielding effect. It has a unique grain orientation and is uniformly thermally conductive in both directions, and the lamellar structure is well adapted to any surface.
The chemical composition of the graphite heat-dissipating film is mainly a single carbon (C) element, which is a natural element mineral. The graphitized film can be obtained by chemical method under high temperature and high pressure, because the carbon element is a non-metallic element, but the metal material is conductive and thermally conductive. Performance, also has the same plasticity as organic plastics, and also has special thermal properties, chemical stability, lubrication and coating on solid surfaces, etc. Some good process properties, graphite heat sink film in-plane (horizontal heat conduction) has Ultra high thermal conductivity in the 150-1500 W/mK range. In addition, the vertical thermal conductivity of graphite is only 5-20 W/mK, which almost plays a role of heat insulation. Also, the graphite heat-dissipating film has a heat transfer coefficient that is difficult to achieve in other directions in the horizontal direction, and has a low heat transfer coefficient in the vertical direction.
In addition, the main characteristics of graphite heat-dissipating film: ultra-high thermal conductivity, easy operation, low thermal resistance and light weight. Using the plasticity of graphite, the graphite material can be made into a sheet like a sticker that is attached to the circuit board inside the phone. It can not only block the contact between the components, but also play a certain role in earthquake resistance. Because the graphite heat-dissipating film has a high horizontal thermal conductivity, it can conduct heat in a fast horizontal direction, so that the heat distribution of the entire surface in the horizontal direction is uniform, eliminating local hot spots. So accurately speaking, the graphite heat-dissipating film actually plays the role of heat conduction and evenly distributes heat, which indirectly means heat dissipation.
However, no matter how light the weight of the graphite heat-dissipating film is, how thin the thickness is applied inside the mobile device, it still occupies a space. Therefore, in order to realize the concept of the thinness of the internal space of the mobile device, how to use different in the existing space Thinking changes the nature of components in the existing mobile phone architecture to effectively solve the heat dissipation problem, which is the starting point of the creation.

In view of the above problems, the main purpose of the present invention is to provide a heat dissipation structure that does not increase the thickness of the handheld electronic device and has a higher heat transfer value than conventional techniques.
Another object of the present invention is to provide an electronic component in a heat-sensitive frame contact contact handheld electronic device that does not require an additional heat-dissipating component to dissipate heat from the electronic component.
Another object of the present invention is to provide a heat conducting frame body having a groove on its surface, and corresponding electronic components in the handheld electronic device are correspondingly mounted on the surface at the groove to provide heat dissipation.
Another object of the present invention is to provide a thermally conductive rack system that can contact the back of a display screen to dissipate the display screen.
In order to achieve the above object, the present invention provides a heat dissipating structure, wherein the handheld electronic device has a casing having a plurality of electronic components therein, the heat dissipating structure comprising: a heat conducting frame body having opposite first sides and a second a chamber having a capillary structure and a working fluid between the first side and the second side, wherein the first side and the second side of the first side and the second side contact the handheld electronic device A plurality of electronic components.
The present invention further provides a hand-held electronic device with a heat dissipation structure, comprising: a casing consisting of an upper cover and a lower cover, a space between the upper cover and the lower cover; and a heat conducting frame disposed in the space Having an opposite first side and a second side, the first side and the second side having a chamber having a capillary structure and a working fluid; a plurality of electronic components located in the space And disposed and contacted on either or both sides of the first side and the second side.
At least one groove is disposed on either or both sides of the first side and the second side to contact the corresponding electronic component. The electronic component is directly mounted on either or both sides of the first side and the second side, and the first side and the second side of the first side and the second side are in contact with the housing of the hand electronic device. The heat conducting frame body is a uniform temperature plate or a thin heat pipe.

10‧‧‧heating frame
11‧‧‧Upper body
111‧‧‧ first side
12‧‧‧ Lower plate
121‧‧‧ second side
13‧‧‧ chamber
14‧‧‧Capillary structure
15‧‧‧Working fluid
16a, 16b‧‧‧ grooves
17‧‧‧ battery slot
20‧‧‧Handheld electronic devices
21‧‧‧ housing
211‧‧‧Upper cover
2111‧‧‧through hole
212‧‧‧Under the cover
213‧‧‧ Space
22, 23‧‧‧ Electronic components
221‧‧‧Electronic components
24‧‧‧ Display screen
241‧‧‧ display surface
242‧‧‧Back
25‧‧‧Battery

The following figures are intended to make the present invention easier to understand, and the drawings are described in detail herein and form part of the specific embodiments. Through the specific embodiments herein and with reference to the corresponding drawings, the specific embodiments of the present invention are explained in detail, and the function principle of the creation is explained.
Figure 1A is an exploded view of the heat dissipation structure of the creation;
1B is a schematic view of one side of the heat-conducting frame body after combining the heat-dissipating structures;
Figure 1C is a schematic view of the other side of the heat-conducting frame body;
1D is a schematic cross-sectional view of the heat-conducting frame of the present invention;
2A is an exploded perspective view of a front view of a handheld electronic device having a heat conducting frame;
2B is an exploded perspective view of the back side of the handheld electronic device having a heat conducting frame;
2C is a schematic view showing the assembly of the heat-conducting frame body and the electronic component;
Figure 3 is a schematic diagram showing the front view angle of the handheld electronic device after assembly;
Fig. 4 is a schematic view showing the AA cross section of Fig. 3.

The preferred embodiment of the present invention will be described with reference to the related drawings, in which the same elements will be described with the same element symbols.
1A is a schematic exploded view of the heat dissipation structure of the present invention; FIG. 1B is a schematic view of one side of the heat-conducting frame after the combination of the heat-dissipating structure; the 1C figure is a combination of the heat-dissipating structure of the heat-dissipating structure; Schematic diagram of one side; Figure 1D is a schematic cross-sectional view of the heat conducting frame of the present invention. As shown in FIGS. 1A to 1D, the heat conducting frame body 10 is a temperature equalizing plate or a thin heat pipe. In the preferred embodiment, a temperature equalizing plate is used as an illustration, and the upper plate body 11 and the lower plate body 12 are butted together. The first side 111 and the second side 112 are opposite to the first side 111, and a sealed chamber 13 is defined between the first side 111 and the second side 112. The chamber 13 has a chamber The above capillary structure 14 and a working fluid 15, wherein the upper plate body 11 and the lower plate body 12 are made of a metal having good thermal conductivity such as copper or aluminum, and the capillary structure 14 is formed on the inner surface of the chamber 13. The type of the capillary structure 14 includes a groove or a metal mesh or a sintered metal powder, and the working fluid 15 is, for example, pure water. Further, although not shown in the preferred embodiment, a plurality of supports may be provided in the chamber 13.
At least one recess 16a, 16b is respectively disposed on the first side 111 and/or the second side 112 of the heat conducting frame body 10, which is specifically formed by metal stamping or milling or grinding on the upper plate body 11. The predetermined positions of the surface of the surface and the lower plate 12 form recesses 16a, 16b of a desired shape and size. In the preferred embodiment, the recesses 16a, 16b are located on the first side 111 for contacting a handheld electronic device. Corresponding electronic components within the device cause phase changes in the heat source generated by the electronic components via the working fluid 15 within the thermally conductive shelf 10 to transfer heat to the second side 112 for heat dissipation. One of the first side 111 and the second side 112 of the heat conducting frame 10 corresponds to and contacts a housing of a handheld electronic device. In the preferred embodiment, the second side 112 contacts the housing, and thus is transmitted to The heat of the second side 112 will dissipate heat to the outside through the housing. Furthermore, since the heat conducting frame 10 is suitable for use in a handheld electronic device, a battery slot 17 can be formed in the second side 112 to accommodate a battery in the handheld electronic device.
The following is a detailed description of the implementation of the heat-conducting frame 10 in a handheld electronic device. The handheld electronic device referred to in this creation includes a mobile phone (including a smart phone), a tablet computer, a PDA, a display, and a smart watch. The pattern will be exemplified by a smart phone.
2A is an exploded perspective view from the front view of the handheld electronic device having a heat-conducting frame; FIG. 2B is an exploded view from the back view of the handheld electronic device having a heat-conducting frame; FIG. 2C is a heat-conducting frame and an electron FIG. 3 is a schematic view showing the front view angle of the hand-held electronic device after assembly; FIG. 4 is a schematic view showing the AA cross-section of FIG.
As shown in FIGS. 2A to 2C, 3 and 4, the handheld electronic device 20 includes a housing 21 which is composed of an upper cover 211 and a lower cover 212. A space 213 is defined between the upper cover 211 and the lower cover 212. 211 defines a through hole 2111 communicating with the space 213. A plurality of electronic components 22, 23 and a display screen 24, a battery 25, and the aforementioned heat conducting frame 10 are received in the space 213. The display screen 24 has a display surface 241 and a back surface 242. The display screen 24 is a device Close to the upper cover 211, and the display surface 241 is corresponding to the through hole 2111 of the upper cover 211. The heat conducting frame 10 is disposed on the back surface 242 of the display screen 24, and the first side 111 of the heat conducting frame 10 is in contact with the display screen. The back surface 242, the electronic components 22, 23 are disposed on the grooves 16a, 16b of the first side 111, wherein the electronic component 22 is shown in the drawing as a circuit board on which a plurality of electronic components 221 (including a chip) are disposed. The resistors, the capacitors, and the like, one side of the electronic components 221 are in contact with the heat conducting frame body 10.
The second side 112 of the heat conducting frame body 10 corresponds to the lower cover 212. When the lower cover 212 is combined with the upper cover 211, the lower cover 212 contacts the second side 112 of the heat conducting frame body 10. The battery 25 is received in the battery slot 17 of the heat conducting frame body 10. Therefore, if the lower cover 212 is opened, the second side 112 of the heat conducting frame 10 and the battery 25 are first seen, and the electronic components 22, 23 disposed on the first side 111 of the heat conducting frame 10 are not seen. Therefore, the heat conductor frame 10 can be regarded as a cover for the electronic components 22, 23.
The heat generated by the electronic components 22, 23 and the display screen 24 is transmitted through the phase change of the working fluid 15 in the chamber 13 of the heat-conducting frame body 10, and is transferred from the first side 111 to the second side 112, and then from the second side 112. The back cover 212 transmits heat to the outside.
In summary, the heat-conducting frame 10 can be applied to various handheld electronic devices, such as mobile phones, tablet computers, PDAs, and digital displays, without additional heat-dissipating components, and without adding handheld electronic devices. The thickness is used to quickly transfer the heat inside the handheld electronic device to other places, so that no heat inside the handheld electronic device can quickly guide the heat to the outside.
In addition, compared with the prior art, the thickness of the temperature plate or the temperature isolator is attached to the heating element, and the thickness of the plastic holder is added. The present invention changes the original plastic holder into a temperature equalizing plate or The heat-conducting frame formed by the thin heat pipe does not increase the thickness of the hand-held electronic device, and therefore is thinner than the prior art and has high heat transfer efficiency.
Although the present invention is disclosed in the above embodiments, it is not intended to limit the present invention, and any person skilled in the art can make various changes and refinements without departing from the spirit and scope of the present invention. The scope of the patent application is subject to the provisions of the attached patent application.

10‧‧‧heating frame

111‧‧‧ first side

16a, 16b‧‧‧ grooves

20‧‧‧Handheld electronic devices

21‧‧‧ housing

211‧‧‧Upper cover

2111‧‧‧through hole

212‧‧‧Under the cover

213‧‧‧ Space

22, 23‧‧‧ Electronic components

24‧‧‧ Display screen

241‧‧‧ display surface

25‧‧‧Battery

Claims (10)

A heat dissipation structure is applied to a handheld electronic device. The handheld electronic device has a housing having a plurality of electronic components therein. The heat dissipation structure includes:
a heat conducting frame having an opposite first side and a second side, wherein the first side and the second side have a capillary structure and a working fluid in a chamber, wherein the first side and the first side Either side or both sides of the two sides are in contact with the plurality of electronic components of the handheld electronic device. The heat dissipation structure of claim 1, wherein at least one groove of the first side and the second side is provided with the corresponding electronic component. The heat dissipation structure of claim 2, wherein the electronic component is disposed on either or both sides of the first side and the second side. The heat dissipation structure of claim 1, wherein any one of the first side and the second side contacts a housing of the handheld electronic device. The heat dissipation structure according to claim 1, wherein the heat conduction frame is a temperature equalization plate or a thin heat pipe. A handheld electronic device with a heat dissipation structure, comprising:
a casing is composed of an upper cover and a lower cover, and a space is located between the upper cover and the lower cover;
a heat conducting frame disposed in the space, having a first side and a second side opposite to each other, wherein the first side and the second side have a capillary structure and a working fluid in a chamber;
A plurality of electronic components are located in the space and are disposed and contact on either or both sides of the first side and the second side. The hand-held electronic device with a heat dissipation structure according to claim 6, wherein at least one groove of the first side and the second side is provided with the corresponding electronic component. The handheld electronic device of claim 6, wherein the first side and the second side are in contact with the housing of the handheld electronic device. The handheld electronic device with a heat dissipation structure according to claim 6, wherein the heat conducting frame body is a temperature equalizing plate or a thin heat pipe. The handheld electronic device of claim 6, further comprising a display screen housed in the space, the display screen having a display surface and a back surface, wherein the back surface contacts the heat conducting frame.