TWI617913B - Hand-held device dissipation structure - Google Patents

Abstract

The present invention relates to a heat dissipating structure of a handheld device, comprising a display module, a temperature equalizing plate, a first electronic component set, a frame body and a cover plate disposed between the temperature equalizing plate and the display module, the frame body The first accommodating space is configured to sequentially receive the display module, the first electronic component group and the temperature equalizing plate, and a second accommodating space for accommodating the cover plate, and the temperature receiving plate receives the first The heat of an electronic component group is quickly and uniformly diffused to dissipate heat to effectively prevent heat from accumulating at the heat source of the handheld device.

Description

Handheld device heat dissipation structure

The present invention relates to a hand-held device, and more particularly to a hand-held device heat-dissipating structure having a heat-dissipating heat of a hand-held device that is rapidly and uniformly diffused to effectively prevent heat from being collected at a heat source of the hand-held device.

Conventional handheld devices (such as mobile phones, tablets, personal digital assistants (PDAs), digital cameras), mostly low-power, do not need to use a heat sink, but look into the future, when the temperature of the electronic heating elements inside the handheld device At higher times, it may be necessary to use a heat sink such as a heat sink to assist in heat dissipation.

However, installing a heat sink inside the handheld device inevitably occupies the internal space of the handheld device, resulting in an increase in the volume of the handheld device, which is difficult to meet the requirements of thinning modern electronic products. Secondly, the heat dissipating device disposed inside the handheld device is difficult to quickly derive heat, and the heat is accumulated inside the handheld device, which easily affects the normal operation of the electronic components inside the handheld device.

Therefore, how to solve the above problems and problems in the past, that is, the inventors of this case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.

Accordingly, in order to effectively solve the above problems, the main object of the present invention is to provide a heat dissipating structure of a hand-held device having a rapid and uniform diffusion of heat of the hand-held device to effectively prevent heat from collecting at the heat source of the hand-held device.

Another object of the present invention is to provide a heat sink structure for a hand-held device that allows a user to use the handheld device to achieve a comfortable feel.

To achieve the above objective, the present invention provides a heat dissipating structure for a handheld device, comprising a display module, a temperature equalizing plate, a first electronic component set, a frame body and a cover plate, the display module having an operation a display surface and a bottom surface, the temperature equalization plate has a first side and a second side opposite to the first side, the first side corresponding to the bottom surface of the module, the frame system has a first accommodating space, a second accommodating space and an opening, the first accommodating space is recessed on one side of the frame, and is configured to receive the temperature equalizing plate and the first electronic component set and the display module, The second accommodating space is recessed on the other side of the frame, and the opening penetrates through the center of the bottom of the first and second accommodating spaces, and communicates with the first and second accommodating spaces. The cover is accommodated in the corresponding second accommodating space; the design of the structure of the present invention enables the heat generated by the handheld device to be quickly and uniformly diffused and dissipated, so as to avoid heat accumulation (or accumulation) in the handheld device. The effect of the heat source.

1‧‧‧Handheld device heat dissipation structure

10‧‧‧ display module

101‧‧‧Operation display surface

102‧‧‧ bottom

11‧‧‧Wall plate

111‧‧‧ first side

112‧‧‧ second side

113‧‧‧ chamber

115‧‧‧Working fluid

116‧‧‧Support column

117‧‧‧Capillary structure

13‧‧‧First Electronic Parts Group

131‧‧‧Circuit board

1311‧‧‧ convex

1312‧‧‧through hole

1313‧‧‧Electronic components

132‧‧‧ battery parts

14‧‧‧Second Electronic Parts Group

141‧‧‧ battery parts

15‧‧‧ frame

151‧‧‧First accommodation space

152‧‧‧Second accommodating space

153‧‧‧opening

154‧‧‧Perforation

16‧‧‧ Cover

17‧‧‧Fixed parts

171‧‧‧ hole

18‧‧‧Connected parts

181‧‧‧Combination hole

2‧‧‧ Screw locks

3‧‧‧Locker

Figure 1A is an exploded perspective view of a first preferred embodiment of the present invention.

Figure 1B is another exploded perspective view of the first preferred embodiment of the present invention.

Figure 2 is a perspective view showing the combination of the first preferred embodiment of the present invention.

Figure 3A is a schematic cross-sectional view of a first preferred embodiment of the present invention.

Fig. 3B is a partially enlarged schematic cross-sectional view showing the first preferred embodiment of the present invention.

Figure 3C is another cross-sectional view of the first preferred embodiment of the present invention.

3D is a partially enlarged schematic view showing another cross section of the first preferred embodiment of the present invention.

Figure 4A is an exploded perspective view of a second preferred embodiment of the present invention.

Figure 4B is another exploded perspective view of the second preferred embodiment of the present invention.

Figure 5 is a perspective view showing the combination of the second preferred embodiment of the present invention.

Figure 6A is a schematic cross-sectional view showing a second preferred embodiment of the present invention.

Figure 6B is a partially enlarged schematic cross-sectional view showing a second preferred embodiment of the present invention.

Figure 6C is another cross-sectional view of the first preferred embodiment of the present invention.

Fig. 6D is a partially enlarged plan view showing another cross section of the first preferred embodiment of the present invention.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

The present invention provides a heat dissipating structure for a hand-held device. Please refer to FIGS. 1A, 1B, 2, 3A, and 3B for the decomposition, combination, and cross-sectional views of the first preferred embodiment of the present invention, and supplemented by reference to 3C. 3D illustration; the heat dissipation structure 1 of the handheld device in the preferred embodiment is described by a smart phone, but is not limited thereto. In the specific implementation, it may also be selected as a tablet computer, an IPAD or a handheld navigation device. Wait. The heat dissipation structure 1 of the handheld device includes a display module 10, a temperature equalizing plate 11, a first electronic component set 13, a frame 15 and a cover 16. The display module 10 is in the preferred embodiment. The touch display module 10 is described, but not limited thereto; and the display module 10 is located above the first electronic component group 13 and has an operation display surface 101 and a bottom surface 102. The display surface 101 is flush with the top end of the frame 15 for viewing and performing operations by the user. The temperature equalizing plate 11 has a first side 111, a second side 112 opposite to the first side 111, a vacuum chamber 113, a working fluid 115 filled in the chamber 113, and a capillary structure 117. And the plurality of support columns 116, the first side 111 of the temperature equalizing plate 11 corresponds to the bottom surface 102 of the module 10. The capillary structure 117 is described in the preferred embodiment as a sintered powder body, but is not limited thereto. In a specific implementation, a groove or a metal mesh may be selected, and the capillary structure 117 is formed on the inner wall of the chamber 113, and the support columns 116 are disposed in the chamber 113. The upper and lower ends are respectively abutted against the upper and lower inner walls of the chamber 113, and the support columns 116 are used to support the temperature equalizing plate 11. The working fluid 115 may be pure water, an inorganic compound, an alcohol, a ketone, a liquid metal, a cold coal or an organic compound.

One end of the plurality of fixing members 17 is coupled from the first side 111 corresponding to the supporting column 116 to the supporting columns 116, and has an internally threaded hole 171 for the hole 171 for Corresponding to the multi-phase screw lock 2 phase screw lock. The first electronic component group 13 is disposed between the display module 10 and the temperature equalizing plate 11. One side of the first electronic component group 13 is opposite to the bottom surface 102 of the module 10, and the other side thereof The first electronic component group 13 is disposed on the first side 111 of the temperature equalizing plate 11. The first electronic component group 13 is provided with a circuit board 131 and a battery component 132 (such as a lithium battery). The circuit board 131 is in the preferred embodiment. The printed circuit board (PCB) is described as a printed circuit board (PCB), but is not limited thereto, and the circuit board 131 is provided with a plurality of convex portions 1311 corresponding to the fixing members 17 and a plurality of electronic components 1313, and the like. The component 1313 includes a central processing unit (CPU), a graphics processing unit (GPU), a memory (such as a flash memory), and other components (such as a capacitor, a resistor, a transistor, or an IC chip). element).

The plurality of electronic components 1313 are disposed on one side of the circuit board 131 and are in contact with the corresponding first side 111, that is, the electronic components 1313 are soldered to one side of the circuit board 131. And an end surface thereof is disposed on the first side 111 opposite to the temperature equalizing plate 11, and an end surface of the CPU (or GPU, IC chip) is attached to the first side 111, thereby transmitting the temperature The board 11 rapidly and evenly spreads the heat generated by the received CPU (or GPU) on the temperature equalizing plate 11 having a large heat dissipation area, thereby effectively preventing heat accumulation (or hoarding) in the heat source of the smart phone (such as the CPU). , GPU) effect.

Referring to FIGS. 1A, 1B and 3A-3D, the equal convex portion 1311 is formed to protrude outward from the outer side of the circuit board 131, and has a constant hole 1312 for making one end of the screw lock 2 The through holes 1312 are inserted into the holes 171 to be screwed and fixed, so that the temperature equalizing plate 11 and the circuit board 131 are combined, and the battery member 132 is attached to the first temperature plate 11 On the side 111, and adjacent to the circuit board 131. before The frame body 15 has a first accommodating space 151, a second accommodating space 152, an opening 153 and a plurality of through holes 154. The first accommodating space 151 is recessed and formed on one side of the frame body 15. And the bottom of the first accommodating space 151 is attached to the second side 112 of the temperature equalizing plate 11 , the first The circuit board 131 on the side 111 is received in the first accommodating space 151 together with the battery unit 132 and the display module 10 located above the circuit board 131. The second accommodating space 152 is recessed in the frame. The other side of the body 15 and the opening 153 extend through the center of the bottom of the first and second accommodating spaces 151 and 152 and communicate with the first and second accommodating spaces 151 and 152. The through holes 154 are penetrated from the bottom of the first accommodating space 151 adjacent to the opening 153 to the bottom of the corresponding second accommodating space 152, and communicate with the first and second accommodating spaces 151 and 152, and plural One end of the coupling member 18 is connected from the second side 112 of the temperature equalizing plate 11 corresponding to the supporting column 116 to the supporting columns 116, and has a coupling hole 181 therein, and the coupling holes 181 are Corresponding to the perforations 154, the plurality of fasteners 3 are threaded relative to the perforations 154 and screwed into the coupling holes 181 to join the temperature equalizing plate 11 to the frame 15. The cover plate 16 is received in the corresponding second accommodating space 152. One side of the cover plate 16 is attached to the bottom of the second accommodating space 152, and the other side is flush. The bottom end of the frame 15 and the cover 16 have the function of protection and dust prevention.

Therefore, when the electronic components (such as the CPU, GPU) on the circuit board 131 generate heat, the first side 111 of the temperature equalizing plate 11 rapidly and uniformly diffuses the received heat throughout the temperature equalizing plate having a large heat dissipation area. At the same time, the heat of the battery member 132 is also absorbed by the first side 111 of the temperature equalizing plate 11 and rapidly and uniformly diffused over the entire temperature equalizing plate 11 to dissipate heat, so that heat accumulation (or accumulation) can be effectively avoided in the handheld device. The CPU (or GPU) and the battery member 132 therein, in other words, can improve the effect of local heat accumulation on the handheld device, thereby achieving a thinning effect.

Therefore, the circuit board 131 and the battery unit 132 of the present invention are disposed on the temperature equalizing plate 11 and are integrated with the display module 10 to be integrated with the frame body 15, so that the CPU (or GPU) can be effectively The heat of the battery member 132 is quickly and evenly diffused to dissipate heat over the entire temperature equalizing plate 11, thereby further solving heat accumulation (or accumulation). The effect of the CPU (or GPU) and the battery member 132 in the handheld device can also provide a better comfort effect when the user holds the handheld device (i.e., the heat sink structure of the handheld device of the present invention).

Please refer to FIGS. 4A, 4B, 5, 6A, and 6B for the decomposition, combination, and cross-sectional views of the second preferred embodiment of the present invention, and supplemented with reference to FIGS. 6C and 6D; The structure and the connection relationship of the example and the effect thereof are substantially the same as those of the first preferred embodiment. Therefore, the preferred embodiment is mainly to modify the first electronic component group 13 to include only The circuit board 131, that is, the first side 111 of the temperature equalizing plate 11, is provided with the circuit board 131. The connection relationship between the circuit board 131 and the temperature equalizing board 11 of the preferred embodiment and the first The preferred embodiment is the same and will not be described again here. The heat dissipation structure 1 of the handheld device further includes a second electronic component group 14 . The second electronic component group 14 is provided with a battery component 141 . One side of the battery component 141 is attached to the second side of the temperature equalization plate 11 . A portion of the battery member 141 is located in the opening 153, and another portion of the battery member 141 is protruded into the second accommodating space 152.

In addition, the cover plate 16 of the preferred embodiment is mainly designed such that the cover plate 16 of the first preferred embodiment is modified such that the side of the cover plate 16 is not attached to the bottom of the second accommodating space 152. That is, one side of the cover plate 16 of the preferred embodiment (ie, the side of the cover plate 16 opposite the bottom of the second accommodating space 152) is attached to the other side of the battery, and the cover plate 16 has The cover 16 can be made of a metal material (such as aluminum or copper) to achieve a heat dissipation effect. For example, when the cover 16 is made of aluminum, the cover 16 can be used. The heat absorbed into the battery member 141 can be quickly and uniformly diffused over the entire cover plate 16, so that the cover plate 16 can discharge heat outward through a large heat dissipation area.

Therefore, when the CPU (or GPU) on the circuit board 131 generates heat, the first side 111 of the temperature equalizing plate 11 rapidly and uniformly diffuses the received heat to the temperature equalizing plate 11 having a large heat dissipation area. At the same time, the heat of the battery member 141 on the second side 112 of the temperature equalizing plate 11 is also absorbed by the second side 112 of the temperature equalizing plate 11 to rapidly and uniformly diffuse heat on the entire temperature equalizing plate 11, so that the heat can be effectively avoided. The heat is concentrated (or accumulated) at the CPU (or GPU) and the battery unit 141 within the handheld device.

Therefore, the circuit board 131 and the battery unit 141 of the present invention are respectively disposed on both sides of the temperature equalizing plate 11 and are integrated with the display module 10 to be integrated with the frame body 15 to effectively make the CPU ( The heat of the GPU and the battery member 141 is quickly and evenly diffused to dissipate heat over the entire temperature equalizing plate 11, thereby further solving the effect of heat accumulation (or accumulation) on the CPU (or GPU) and the battery member 141 in the handheld device.

As described above, the present invention has the following advantages over the conventional ones:

1. It has the effect of achieving rapid and even diffusion of heat generated by the handheld device.

2. It has the effect of avoiding heat accumulation (or accumulation) at the heat source of the handheld device.

3. Has the effect of better heat dissipation.

It is to be understood that the above-described methods, shapes, configurations, and devices of the present invention are intended to be included within the scope of the present invention.

Claims (6)

A heat dissipation structure of a handheld device includes: a display module having an operation display surface and a bottom surface; a temperature equalization plate having a first side and a second side opposite the first side, the first The side of the first electronic component set is disposed between the temperature equalizing plate and the display module, and one side of the first electronic component group is opposite to the bottom surface of the module, and the other is One side is disposed on the first side of the temperature equalizing plate; a frame body has a first accommodating space, a second accommodating space and an opening, and the first accommodating space is recessed One side of the frame is configured to receive the temperature equalizing plate and the first electronic component set and the display module, and the second receiving space is recessed on the other side of the frame. And the opening is through the center of the bottom of the first and second accommodating spaces, and communicates with the first and second accommodating spaces; and a cover plate is disposed in the corresponding second accommodating space. The heat dissipation structure of the handheld device according to claim 1, wherein the temperature equalization plate has a vacuum chamber, a working fluid filled in the chamber, and a plurality of support columns, wherein the support columns are disposed in the cavity Indoor, a plurality of ends of the plurality of fixing members are coupled from the first side corresponding to the supporting columns to the supporting columns, and the fixing members have a hole for the corresponding plurality of screw members Phase screw lock. The heat dissipation structure of the handheld device according to claim 2, wherein the first electronic component group is provided with a circuit board and a battery component, and the circuit board is provided with a plurality of convex portions and a plurality of electronic components corresponding to the fixing members. The electronic components are disposed on one side of the circuit board and are disposed on the first side, and the convex portions are outwardly convex from the outer side of the circuit board. And having a uniform hole, such that one end of the screw locks is threadedly fixed to the inner holes of the holes, and the battery member is disposed on the first side of the temperature equalization plate And adjacent to the board. The heat dissipation structure of the handheld device of claim 3, wherein the frame body is provided with a plurality of perforations, and the perforations are penetrated from the bottom of the first accommodating space adjacent to the opening to the corresponding second accommodating The bottom of the space is connected to the first and second accommodating spaces, and one end of the plurality of coupling members is coupled to the second side of the corresponding supporting column and penetrates into the supporting columns, and has a coupling hole therein The pair of bonding holes are correspondingly perforated, so that the plurality of locking members are threaded relative to the perforations and screwed into the coupling holes. The heat dissipation structure of the handheld device of claim 2, further comprising a second electronic component set, wherein the second electronic component set is provided with a battery component, and the battery component is attached to the second side of the temperature equalization plate. The first electronic component group is provided with a circuit board, and the circuit board is provided with a plurality of convex portions corresponding to the fixing members and a plurality of electronic components, and the electronic components are disposed on one side of the circuit board, and the pair The first side should be attached to each other, and the protrusions are formed to protrude outward from the outer side of the circuit board, and have a uniform hole, so that one end of the screw locks is disposed opposite to the through holes The internal phases of the holes are screwed and fixed. The heat dissipation structure of the hand-held device of claim 5, wherein the frame body is provided with a plurality of perforations, and the perforations are penetrated from the bottom of the first accommodating space adjacent to the opening to the corresponding second accommodating The bottom of the space is connected to the first and second accommodating spaces, and one end of the plurality of coupling members is coupled to the second side of the corresponding supporting column and penetrates into the supporting columns, and has a coupling hole therein The pair of bonding holes are correspondingly perforated, so that the plurality of locking members are threaded relative to the perforations and screwed into the coupling holes.