JP3197757U - A heat dissipation module combined with a mobile device and having an undulating surface - Google Patents

Abstract

Disclosed is a heat dissipation module coupled to a mobile device and having an undulating surface. A heat radiation module coupled to a mobile device and having an undulating surface includes a first plate-like portion, a second plate-like portion, a first layered capillary tube, a second layered capillary tube, and a working fluid. . The first plate-like portion 11 is disposed on the mobile device. The second plate-like portion 21 covers the first plate-like portion to form a sealed chamber between the second plate-like portion 21 and the first plate-like portion. The first layered capillary tube 31 is disposed on the surface of the first plate-like portion and in the chamber. The second layered capillary 41 is disposed on the surface of the second plate-like portion and in the chamber. A gas flow path is formed with a predetermined distance between the second layered capillary and the first layered capillary. The working fluid is disposed in the chamber. The first plate portion and the second plate portion or one of them has at least two contact surfaces 26 on the surface. The contact surface 26 is different in height and contacts electronic components having different heights in the mobile device. [Selection] Figure 2

Description

  The present invention relates to a heat dissipation technique, and more particularly to a heat dissipation module that is coupled to a mobile device and has an undulating surface corresponding to the height of an electronic component in the mobile device.

  With the development of science and technology, mobile devices (for example, smartphones, tablets or PDAs) are becoming a necessity for modern people. In addition to the call function, the mobile device has a function of searching and sending / receiving mails by connecting to the Internet and executing application software (APP), so that the function and the processing speed are improved day by day. However, if the high-speed central processing unit (CPU) and the integrated circuit chip are operated, a heat dissipation phenomenon occurs. If the temperature is too high, it will cause discomfort to the user, so the heat dissipation problem of the mobile device must be considered.

On the other hand, the cellular phone casing structure disclosed in Patent Document 1 processes the vapor chamber, molds the back shell of the cellular phone casing or a part of the back shell, and rapidly advances the heat conduction by the vapor chamber, This produces a heat dissipation effect.
However, when the vapor chamber is used as the back shell of the mobile phone casing or a part of the back shell, the heat dissipating effect can be exerted only on the heat generating parts close to the back shell inside the mobile phone. Limit greatly. On the other hand, many of the current vapor chambers are flat plates. When manufacturing the back shell or a part of the back shell of the mobile phone housing in the vapor chamber, it is necessary to bend the vapor chamber or avoid placing the vapor chamber in a portion where the vapor chamber needs to be curved. In addition, if the back shell of the mobile phone casing is manufactured from a vapor chamber, there is a problem in durability. If the mobile phone collides with an object or falls to the ground, the vapor chamber may be damaged and the heat dissipation effect may be lost.

Since the conventional vapor chamber is a flat plate, there is no undulation on the surface. Since the electronic parts in the mobile device do not necessarily have the same height, the electronic parts that can contact the vapor chamber are limited. In other words, the heat dissipation effect is effective only for electronic components that can contact the vapor chamber. Electronic components that cannot contact the vapor chamber cannot dissipate heat.
As described above, even when a conventional vapor chamber is used in a mobile device, it cannot effectively dissipate heat from all electronic components.

Taiwan Utility Model M460507

  The present invention mainly provides a heat dissipation module that can be combined with a mobile device to dissipate the entire heat by bringing two or more different relief surfaces into contact with electronic components of different heights inside the mobile device. With a purpose.

  In order to achieve the above-mentioned object, a heat dissipation module coupled with a mobile device according to the present invention and having an undulating surface includes a first plate-like portion, a second plate-like portion, a first layer-like capillary, a second layer-like capillary, and an operation. Provide liquid. The first plate-like portion is disposed on the mobile device. The second plate-like portion is covered with the first plate-like portion to form a sealed chamber between the second plate-like portion and the first plate-like portion. The first layered capillary is disposed on the surface of the first plate portion and in the chamber. The second layered capillary is disposed on the surface of the second plate-like portion and in the chamber. A gas flow path is formed with a predetermined distance between the second layered capillary and the first layered capillary. The working fluid is disposed in the chamber. The first plate portion and the second plate portion or one of them has at least two contact surfaces on the surface. The contact surfaces are different in height and contact electronic components having different heights in the mobile device.

  As described above, the present invention produces a heat dissipation effect on all electronic components that require heat dissipation by bringing at least two contact surfaces having different heights into contact with electronic components having different heights in the mobile device. Dissipates the entire heat.

1 is a perspective view showing a first embodiment of the present invention. 1 is an exploded perspective view showing a first embodiment of the present invention. It is a perspective view which shows the state before 1st Embodiment of this invention is applied to the circuit board of a mobile device. It is a perspective view which shows the state after 1st Embodiment of this invention is applied to the circuit board of a mobile device. FIG. 5 is a cross-sectional view taken along line 5-5 in FIG. It is a disassembled perspective view which shows 2nd Embodiment of this invention. It is sectional drawing which shows the state after 2nd Embodiment of this invention is applied to the circuit board of a mobile device. It is a disassembled perspective view which shows 3rd Embodiment of this invention. It is sectional drawing which shows the state after 3rd Embodiment of this invention is applied to a mobile device.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
As shown in FIG. 1 to FIG. 5, in the first embodiment of the present invention, the heat dissipation module 10 coupled with a mobile device and having an undulating surface includes a first plate-like portion 11, a second plate-like portion 21, a first plate-like portion 21, and a first plate-like portion 21. It consists of a layered capillary 31, a second layered capillary 41, and a working fluid (not shown in the figure).

  The first plate-like portion 11 is disposed on the mobile device 91. In the first embodiment, the mobile device 91 is displayed on the circuit board 92 and the plurality of electronic components 94 and 95 arranged on the circuit board 92, and another accessory such as a panel or a casing is omitted. The circuit board 92 is fastened to the first plate-like portion 11 by a plurality of bolts 96.

  The second plate-shaped portion 21 covers the first plate-shaped portion 11 to form a sealed chamber 12 between the second plate-shaped portion 11 and the first plate-shaped portion 11. In the first embodiment, the second plate-like portion 21 has a three-dimensional wall surface 24 formed to extend from the peripheral portion toward the first plate-like portion 11. The three-dimensional wall surface 24 is connected to the first plate-like portion 11. The chamber 12 is positioned at a part surrounded by the three-dimensional wall surface 14. The 1st plate-shaped part 11 and the 2nd plate-shaped part 21 are put together by soldering or a hot embossing process.

  The first layered capillary tube 31 is disposed on the surface of the first plate-like portion 11 and in the chamber 12.

  The second layered capillary 41 is disposed on the surface of the second plate-like portion 21 and in the chamber 12. A gas channel C is formed with a predetermined distance between the second layered capillary 41 and the first layered capillary 31.

  The hydraulic fluid is a liquid that is disposed in the chamber 12 and adsorbs in the first layered capillary tube 31 and the second layered capillary tube 41. Since the hydraulic fluid is familiar to those who have common sense in the related area, drawing display and detailed description are omitted.

The first plate-like portion 11 and the second plate-like portion 21 or one of them has at least two contact surfaces 26 on the surface. The contact surface 26 is different in height and contacts the electronic components 94 and 95 having different heights in the mobile device 91. In the drawing, the electronic component 94 is lower than the electronic component 95.
In 1st Embodiment, the contact surface 26 from which height differs is formed in the 2nd plate-shaped part 21, and the number is two. The one contact surface 26 is formed by the surface of the second plate-shaped portion 21, and another contact surface 26 having a different height protrudes from the second plate-shaped portion 21. On the other hand, the shape of the second layered capillary 41 corresponds to the back surface of the protruding contact surface 26.

  The first plate-like portion 11, the second plate-like portion 21, the first layered capillary tube 31, the second layered capillary tube 41, and the working fluid constitute a vapor chamber 49.

  The above is the description of the structure of the first embodiment. Next, description will be made on the usage method of the first embodiment.

  As shown in FIG. 5, after the heat dissipation module according to the present invention and the mobile device 91 are coupled, the first plate-like portion 11 is connected to the mobile device 91, and the second plate-like portion 21 has two different contact heights. Since the surface 26 is brought into contact with two electronic components 94 and 95 having different heights in the mobile device 91, the entire electronic components 94 and 95 having different heights have heat conduction and heat dissipation effects.

(Second Embodiment)
As shown in FIGS. 6 and 7, the heat dissipating module 10 ′ combined with the mobile device according to the second embodiment of the present invention and having an undulating surface has the same main structure as that of the first embodiment. Differences from the first embodiment are as follows.

  In the second embodiment, the first plate-like portion 11 ′ is formed in the opposite direction to the second plate-like portion 21 ′ without forming the solid wall surface 24 as in the first embodiment on the second plate-like portion 21 ′. Stretched to form a concave portion 18 ′, a solid wall 19 ′ is formed around the concave portion 18 ′, a second plate-like portion 21 ′ is covered with the concave portion 18 ′, and a chamber is formed inside the concave portion 18 ′. To do.

  In contrast to the first embodiment in which at least two contact surfaces 26 having different heights are arranged on the second plate-shaped portion 21, the second embodiment has at least two contact surfaces 26 'having different heights disposed on the first plate-shaped portion 11. Place in '. In the second embodiment, the number of contact surfaces 26 'having different heights is two.

  With the above-described structure, the two contact surfaces 26 ′ of the first plate-like portion 11 ′ can be brought into contact with the electronic components 94 and 95 having different heights of the mobile device 91, thereby generating a heat dissipation effect.

  Since other structures and achieved effects of the second embodiment are the same as those of the first embodiment, detailed description thereof is omitted.

(Third embodiment)
As shown in FIGS. 8 and 9, the heat dissipating module 10 ″ combined with the mobile device according to the third embodiment of the present invention and having an undulating surface has the same main structure as that of the first embodiment. The difference from the form is as follows.

The third embodiment further includes a frame 51 ". The mobile device 91 has a front shell 97 and a back shell 98. The frame 51" is located between the front shell 97 and the back shell 98, and the storage portion 52 ". And a plurality of perforations 54 "penetrating the front and back surfaces. The first plate portion 11 ″ has a plurality of perforations (portions into which bolts are inserted or FIG. 2) corresponding to the plurality of perforations 54 ″ of the frame 51 ″.
As shown in FIG. 9, the first plate-like portion 11 ″ is positioned at the storage portion 52 ″ of the frame 51 ″ by an insert molding process or an assembling method. In this embodiment, the insert molding process is taken as an example. The second plate-like portion 21 ″ does not contact the frame 51 ″ but is positioned in the storage part 52 ″.

  The first plate-like part 11 ″ has two contact surfaces 16 ″ having different heights. The second plate-like part 21 "has two contact surfaces 26" having different heights.

  What is clarified by the structure of the third embodiment described above is as follows. The product combining the parts of the present invention and the frame 51 "are coupled by the first plate-like portion 11". Since the frame 51 ″ is connected between the front shell 97 and the back shell 98 of the mobile device 91, the frame 51 ″ makes it easy to combine the first plate-like portion 11 ″ and the mobile device 91. The two different contact surfaces 16 ″ of the first plate-like part 11 ″ and the two different contact surfaces 26 ″ of the second plate-like part 21 ″ are the first plate-like part in the mobile device 91. The electronic components 94 and 95 located on the surface of 11 ″ and the surface of the second plate-shaped portion 21 ″ can be brought into contact with each other to produce a heat dissipation effect.

  Since other structures and achieved effects of the third embodiment are the same as those of the first embodiment, detailed description thereof is omitted.

DESCRIPTION OF SYMBOLS 10 Radiation module which couple | bonds with mobile apparatus and has undulating surface 11 1st plate-shaped part 12 Chamber 21 2nd plate-shaped part 24 Solid wall 26 Contact surface 31 1st layered capillary 41 2nd layered capillary 49 Vapor chamber 10 'Mobile apparatus Module 11 'first plate-like portion 18' concave portion 19 'solid wall 21' second plate-like portion 26 'contact surface 10 "heat-dissipating module 11" First plate-like portion 16 "Contact surface 21" Second plate-like portion 26 "Contact surface 51" Frame 52 "Storage part 54" Perforation 91 Mobile device 92 Circuit board 94, 95 Electronic component 96 Bolt 97 Front shell 98 Back shell C Gas flow path

Claims (13)

A first plate-like portion, a second plate-like portion, a first layered capillary, a second layered capillary and a working fluid,
The first plate-like portion is disposed in a mobile device,
The second plate-like portion forms a sealed chamber with the first plate-like portion by covering the first plate-like portion,
The first layered capillary is disposed on the surface of the first plate-like portion and in the chamber,
The second layered capillary is disposed on the surface of the second plate-like portion and in the chamber,
Forming a gas flow path with a predetermined distance between the second layered capillary and the first layered capillary;
The hydraulic fluid is disposed in the chamber;
The first plate-like portion and the second plate-like portion or one of them has at least two contact surfaces on the surface, the contact surfaces have different heights, and electronic components having different heights in the mobile device In contact with,
A heat dissipation module combined with a mobile device and having an undulating surface.   The heat dissipating module as claimed in claim 1, wherein at least two of the contact surfaces having different heights are formed on the second plate-shaped portion.   The heat dissipating module as claimed in claim 1, wherein at least two contact surfaces having different heights are formed on the first plate-like portion.   2. The mobile device according to claim 1, wherein at least two contact surfaces having different heights are formed on the first plate-like portion and the second plate-like portion. Heat dissipation module.   At least two contact surfaces having different heights formed on the first plate-like portion or the second plate-like portion, one contact surface is a surface of the first plate-like portion or the second plate-like portion. A heat dissipation module coupled to the mobile device according to claim 1 and having an undulating surface.   The second plate-like portion has a three-dimensional wall surface formed extending from a peripheral portion toward the first plate-like portion, the three-dimensional wall surface is connected to the first plate-like portion, and the chamber is the three-dimensional wall. The heat dissipating module coupled with the mobile device according to claim 1, wherein the heat dissipating module has an undulating surface.   The first plate-like portion further includes a concave portion formed extending in the opposite direction to the second plate-like portion, and a three-dimensional wall surface formed around the concave portion, and the second plate-like portion is the concave shape. 2. The heat dissipation module according to claim 1, wherein the heat dissipation module is connected to a mobile device and has an undulating surface.   The mobile device further includes a front shell and a back shell, the frame is located between the front shell and the back shell, has a storage portion, and the first plate portion is The heat dissipating module coupled to the mobile device according to claim 1, wherein the heat dissipating module is disposed on the frame and positioned at the storage portion.   The heat dissipation module having an undulating surface coupled to the mobile device according to claim 8, wherein the second plate-like portion is positioned at the storage portion without contacting the frame.   9. The frame according to claim 8, wherein the frame has a plurality of perforations penetrating a plurality of front and rear surfaces, and the first plate-shaped portion has a plurality of perforations corresponding to the plurality of the perforations of the frame. A heat dissipation module combined with a mobile device and having an undulating surface.   The heat dissipating module of claim 8, wherein the first plate-like portion is disposed on the frame by an insert molding process and has a undulating surface.   The heat radiating module as claimed in claim 8, wherein the first plate-like part is connected to the frame by an assembling method and has a undulating surface.   The heat dissipation module having the undulating surface according to claim 1, wherein the first plate-like portion and the second plate-like portion are combined by a soldering or hot embossing process.

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