TWM494951U - Heat dissipation module with high-low surface for binding with mobile device - Google Patents

Description

Thermal module with high and low surface combined with mobile device

This creation department is related to the heat dissipation technology, in particular, a heat dissipation module having a high and low surface combined with a mobile device that can match the height of the electronic component in the mobile device.

As technology advances, mobile devices (such as mobile phones, tablets, or personal assistants) have become a must-have tool for modern people, and mobile devices can perform calls, Internet connections, web browsing, emailing, and executing applications. (APP) and other functions, therefore, the function and execution speed of recent mobile devices are increasing. The use of a high-speed central processing unit (CPU) and an integrated circuit chip has a problem of heat generation, and when the temperature is too high, the user feels uncomfortable. Therefore, the heat dissipation problem of the mobile device has recently received increasing attention.

China Patent No. M460507 discloses a casing structure of a mobile phone device, which mainly manufactures a temperature equalizing plate into a back shell shape of a mobile phone device, or manufactures a partial back shell of a mobile phone device, and utilizes a uniform temperature. The board's fast thermal conductivity to achieve heat dissipation. However, using the temperature equalizing plate as part or all of the back cover of the mobile phone can only dissipate heat from the heat generating component closer to the back of the mobile phone, which constitutes a large limitation on the installation position of the heat generating component. In addition, since the current temperature equalizing plates are mostly flat, it is necessary to make the temperature equalizing plate into a back cover of the mobile phone or a part thereof, and it is necessary to match the shape to make a curved portion, or to discard the curved portion. Warm plate. In addition, the uniform temperature plate is made into the back cover of the mobile phone, which has the problem of durability. When the mobile phone encounters a collision or falls to the ground, it may cause damage to the temperature equalization plate, so that the heat dissipation effect is lost.

In addition, since the plate surface of the conventional temperature equalizing plate is flat without high and low fluctuations, the electronic components in the mobile device are not necessarily the same height, so only some of the electronic components can contact the temperature equalizing plate. In use, the electronic components that are in contact with the temperature equalization plate can be dissipated by the temperature equalization plate, and the electronic components that are not in contact with the temperature equalization plate cannot be dissipated by the temperature equalization plate. It can be seen that the conventional temperature equalizing plate combined with the mobile device does not allow all electronic components to effectively dissipate heat.

The main purpose of the present invention is to provide a heat dissipation module having a high and low surface combined with a mobile device, which can have two or more different levels of the board surface, and can be in contact with electronic components of different heights inside the mobile device to achieve completeness. heat radiation.

In order to achieve the above object, the present invention provides a heat dissipation module having a high and low surface combined with a mobile device, comprising: a first board attached to the mobile device; and a second board coupled to the first board, Forming a peripherally closed chamber between the second plate and the first plate; a first capillary layer disposed on one of the first plates and located in the chamber; a second capillary layer disposed on the second capillary layer One of the second plates is located in the chamber, the second capillary layer is spaced apart from the first capillary layer by a predetermined distance to form a gas flow path therebetween; and a working fluid is located in the chamber Wherein at least one of the first board or the second board is formed with at least two different heights of contact surfaces with respect to the board surface thereof for respectively contacting electronic components of different heights inside the mobile device .

Thereby, by contacting the electronic components of different heights inside the mobile device with the contact faces of the at least two different heights, the heat dissipation function can be provided for each electronic component that needs to be dissipated, thereby achieving a complete heat dissipation effect.

10‧‧‧ Thermal module with high and low surface combined with mobile device

11‧‧‧ first board

12‧‧‧ chamber

21‧‧‧ second board

24‧‧‧ standing wall

26‧‧‧Contact surface

31‧‧‧First capillary layer

41‧‧‧Second capillary layer

49‧‧‧Wall plate

10'‧‧‧ Thermal module with high and low surface combined with mobile device

11’‧‧‧ first board

18’‧‧‧Depression

19’‧‧‧立立

21’‧‧‧ second board

26’‧‧‧Contact surface

10''‧‧‧ Thermal module with high and low surface combined with mobile device

11’’‧‧‧ first board

16’’‧‧‧Contact surface

21’’‧‧‧ second board

26’’‧‧‧Contact surface

51’’‧‧‧ framework

52’’‧‧‧ Included parts

54’’‧‧·Perforation

91‧‧‧Mobile devices

92‧‧‧ boards

94,95‧‧‧Electronic components

96‧‧‧ bolt

97‧‧‧ front panel

98‧‧‧ Back cover

C‧‧‧ gas flow path

Figure 1 is a perspective view of a first preferred embodiment of the present invention.

Figure 2 is an exploded view of the first preferred embodiment of the present invention.

Fig. 3 is an exploded view showing the assembly of the first preferred embodiment of the present invention, showing a state in which the circuit board of the mobile device has not been joined.

Fig. 4 is a schematic view showing the assembly of the first preferred embodiment of the present invention, showing the state of being combined with the circuit board of the mobile device.

Fig. 5 is a cross-sectional view taken along line 5-5 of Fig. 4.

Figure 6 is an exploded view of the second preferred embodiment of the present invention.

Figure 7 is a schematic cross-sectional view showing the second preferred embodiment of the present invention.

Figure 8 is an exploded view of a third preferred embodiment of the present invention.

Figure 9 is a schematic cross-sectional view showing the third preferred embodiment of the present invention.

In order to explain in detail the technical features of the present invention, the following preferred embodiments are described with reference to the following drawings, wherein: as shown in FIGS. 1 to 5, the first preferred embodiment of the present invention provides A heat dissipation module 10 having a high and low surface combined with a mobile device mainly comprises a first plate 11, a second plate 21, a first capillary layer 31, a second capillary layer 41 and a working fluid (not shown) The first board 11 is disposed in a mobile device 91. In the first embodiment, the mobile device 91 is provided with a plurality of electronic components 94, 95 on a circuit board 92 to simplify display. Without Other components such as a display panel or a casing are shown, and the circuit board 92 is coupled to the first board 11 by a plurality of bolts 96.

The second plate 21 is coupled to the first plate 11, and a cavity 12 is formed between the second plate 21 and the first plate 11 to be closed. In the first embodiment, the periphery of the second plate 21 extends toward the first plate 11 to form a vertical wall 24, and the vertical wall 24 is coupled to the first plate 11. The chamber 12 is located at the vertical wall 24. In the combined area. And the first plate 11 and the second plate 21 are combined by welding or hot pressing.

The first capillary layer 31 is disposed on one of the first plates 11 and located in the chamber 12.

The second capillary layer 41 is disposed on one of the second plates 21 and located in the chamber 12. The second capillary layer 41 is spaced apart from the first capillary layer 31 by a predetermined distance to form a gap therebetween. Gas flow path C.

The working fluid is located in the chamber 12. Since the working fluid is liquid and adsorbed in the first capillary layer 31 and the second capillary layer 41, it is difficult to represent in the drawing, and the working fluid is a person having ordinary knowledge in the technical field. A component that can be understood, so it is not represented in the schema.

Wherein at least one of the first plate 11 or the second plate 21 is formed with contact faces 26 having at least two different heights with respect to the plate surface thereof for respectively contacting different heights inside the mobile device 91 The electronic components 94, 95, wherein in each of the figures, the electronic component 94 is lower and the electronic component 95 is higher. In the first embodiment, the contact faces 26 of the at least two different heights are exemplified by two in number, and are formed on the second plate 21, and one of the contact faces 26 is the second plate. 21 own surface, another contact surface 26 of different height is raised In addition to the second plate 21, the second capillary layer 41 also corresponds in shape to the shape of the back surface of the raised contact surface 26.

The first plate 11, the second plate 21, the first capillary layer 31, the second capillary layer 41 and the working fluid are combined to form a vapor chamber.

The architecture of the first embodiment has been described above, and the state of use of the first embodiment will be described next.

As shown in FIG. 5, after the heat dissipation group of the present invention is coupled to the mobile device 91, the two different heights of the second plate 21 are contacted by the bonding relationship of the first plate 11 to the mobile device 91. The faces 26 respectively contact the electronic components 94, 95 of the two different heights inside the mobile device 91, and provide complete heat conduction and heat dissipation effects for the electronic components 94, 95 of different heights.

Please refer to FIG. 6 and FIG. 7 again. The heat dissipation module 10 ′ having a high and low surface combined with the mobile device provided by the second preferred embodiment of the present invention is mainly similar to the first embodiment. The second plate 21' does not have the vertical wall 24 in the first embodiment, but a recess 18' is formed by the first plate 11' extending in a direction opposite to the position of the second plate 21'. And forming a vertical wall 19' around the recess 18', the second plate 21' completely covers the recess 18', and the chamber is located in the recess 19'.

The contact faces 26' of the at least two different heights are not formed on the second plate 21' as defined in the first embodiment, but are formed on the first plate 11', and are still in the embodiment. Two different height contact faces 26' are exemplified.

Thereby, the two contact faces 26' on the first plate 11' can be used to contact the electronic components 94, 95 of different heights on the mobile device 91 to achieve the heat dissipation effect.

The rest of the structure and the achievable functions of the second embodiment are the same as those in the first embodiment, and will not be described again.

Please refer to FIG. 8 and FIG. 9 again. A heat dissipation module 10" having a high and low surface combined with a mobile device according to the third preferred embodiment of the present invention is mainly similar to the first embodiment. The frame device 51 has a front panel 97 and a rear cover 98. The frame 51′′ is located between the front panel 97 and the rear cover 98. The frame 51′′ has a capacity. Position 52". The frame 51" has a plurality of perforations 54" extending through the back, the first plate 11" also has a plurality of perforations (the figure is blocked by the bolt, so it is not displayed, please refer to the second case of the case Each of the perforations 54" of the frame 51" is respectively aligned, and the first plate 11" is disposed in the frame 51" and is located in the receiving portion 52" by insert molding or assembly. In the present embodiment, the insert molding is taken as an example, and its state is as shown in Fig. 9. The second plate 21" is located in the accommodating portion 52" without being in contact with the frame 51".

The first plate 11" and the second plate 21" are each provided with two contact faces 16", 26" of different heights.

As can be seen from the structure disclosed in the third embodiment, the product of the present combination is coupled to the frame 51" by the first board 11", and is coupled to the front panel 97 of the mobile device 91 by the frame 51". Between the rear covers 98, such a structure can make the first plate 11" easier to assemble with the mobile device 91 by the frame 51". Further, the first plate 11" and the second plate 21" are provided Two different height contact surfaces 16", 26" can enable the electronic components 94, 95 on the surface of the first plate 11" and the surface of the second plate 21" in the mobile device 91 to generate heat dissipation by contact. effect.

The remaining structure of the third embodiment and the achievable functions are the same as those of the first embodiment, and will not be further described.

10‧‧‧ Thermal module with high and low surface combined with mobile device

11‧‧‧ first board

21‧‧‧ second board

24‧‧‧ standing wall

26‧‧‧Contact surface

31‧‧‧First capillary layer

41‧‧‧Second capillary layer

49‧‧‧Wall plate

Claims (13)

A heat dissipation module having a high and low surface combined with a mobile device includes: a first board attached to the mobile device; a second board coupled to the first board, the second board and the first board Forming a peripherally closed chamber; a first capillary layer disposed on one of the first plates and located in the chamber; a second capillary layer disposed on one of the second plates Located in the chamber, the second capillary layer is spaced apart from the first capillary layer by a predetermined distance to form a gas flow path therebetween; and a working fluid is located in the chamber; wherein the first plate or the first plate At least one of the second plates is formed with contact faces having at least two different heights relative to the surface of the plate for respectively contacting electronic components of different heights inside the mobile device. The heat dissipation module having a high and low surface combined with the mobile device according to claim 1, wherein the at least two different height contact surfaces are formed on the second plate. The heat dissipation module having a high and low surface combined with the mobile device according to claim 1, wherein the at least two different height contact surfaces are formed on the first plate. The heat dissipation module having a high and low surface combined with the mobile device according to claim 1, wherein the at least two different height contact surfaces are formed on the first plate and the second plate. The heat dissipation module having a high and low surface combined with the mobile device according to claim 1, wherein: the first plate or the second plate is formed by the contact faces of the at least two different heights formed by the first plate or the second plate, There is a contact surface that is the surface of the first or second plate itself. A heat dissipation module having a high and low surface combined with a mobile device according to claim 1, wherein: the second plate periphery extends toward the first plate to form a vertical wall, and the first wall is coupled to the first wall A plate, the chamber being located in an area enclosed by the upright wall. The heat dissipation module having a high and low surface combined with the mobile device according to claim 1, wherein the first plate extends in a direction opposite to the position of the second plate to form a recess, and the recess A vertical wall is formed around the portion, and the second plate completely covers the recess, and the chamber is located in the recess. A heat dissipation module having a high and low surface combined with a mobile device according to claim 1, further comprising: a frame having a front panel and a rear cover, the frame being located at the front panel The frame has an accommodating portion, and the first plate is disposed in the frame and located in the accommodating portion. A heat dissipating module having a high and low surface combined with a mobile device according to claim 8 , wherein the second plate is located in the receiving portion and is not in contact with the frame. A heat dissipation module having a high and low surface combined with a mobile device according to claim 8 wherein: the frame has a plurality of perforations extending therethrough, the first plate also having a plurality of perforations respectively aligning the frames The perforation. A heat dissipation module having a high and low surface combined with a mobile device according to the invention of claim 8, wherein the first plate is disposed in the frame in an insert molding manner. A heat dissipation module having a high and low surface combined with a mobile device according to claim 8 of the invention, wherein the first plate is coupled to the frame by assembly. The heat dissipation module having a high and low surface combined with the mobile device according to the first aspect of the invention, wherein the first plate and the second plate are combined by welding or hot pressing.