TWM494951U - Heat dissipation module with high-low surface for binding with mobile device - Google Patents
Heat dissipation module with high-low surface for binding with mobile device Download PDFInfo
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本創作係與散熱技術有關,特別是指可以配合行動裝置中電子元件高度的一種結合於行動裝置之具有高低表面之散熱模組。This creation department is related to the heat dissipation technology, in particular, a heat dissipation module having a high and low surface combined with a mobile device that can match the height of the electronic component in the mobile device.
隨著科技的進步,行動裝置(例如手機、平板電腦或個人助理)已成為現代人所必備的工具,而行動裝置可以執行撥打電話、網路連接、網路瀏覽、收發電子郵件以及執行應用程式(APP)等功能,因此,近來行動裝置的功能及執行速度,即日漸提昇。而使用了高速的中央處理單元(CPU)以及積體電路晶片,會有發熱的問題,溫度太高時會讓使用者產生不適感,因此,近來行動裝置的散熱問題,已逐漸受到重視。As technology advances, mobile devices (such as mobile phones, tablets, or personal assistants) have become a must-have tool for modern people, and mobile devices can perform calls, Internet connections, web browsing, emailing, and executing applications. (APP) and other functions, therefore, the function and execution speed of recent mobile devices are increasing. The use of a high-speed central processing unit (CPU) and an integrated circuit chip has a problem of heat generation, and when the temperature is too high, the user feels uncomfortable. Therefore, the heat dissipation problem of the mobile device has recently received increasing attention.
我國公告第M460507號專利,即揭露了一種手機裝置的殼體結構,其主要是將一個均溫板製造成手機裝置的背殼形狀,或是製造成手機裝置的部分背殼,而利用均溫板的快速導熱特性來達到散熱的效果。然而,將均溫板做為手機背殼的一部分或全部,僅能對手機內部較接近背部的發熱元件進行散熱,此對發熱元件的設置位置構成了較大的限制。此外,由於目前的均溫板大多是平板狀,因此欲將均溫板做成手機背殼或其一部分,勢必要在形狀上配合做出彎曲的部分,或是捨棄掉在彎曲的部分製作均溫板。還有,將均溫板做成手機背殼,會有耐用度的問題,在手機遭遇碰撞或摔落地面時,有可能造成均溫板的損壞,使得散熱效果喪失。China Patent No. M460507 discloses a casing structure of a mobile phone device, which mainly manufactures a temperature equalizing plate into a back shell shape of a mobile phone device, or manufactures a partial back shell of a mobile phone device, and utilizes a uniform temperature. The board's fast thermal conductivity to achieve heat dissipation. However, using the temperature equalizing plate as part or all of the back cover of the mobile phone can only dissipate heat from the heat generating component closer to the back of the mobile phone, which constitutes a large limitation on the installation position of the heat generating component. In addition, since the current temperature equalizing plates are mostly flat, it is necessary to make the temperature equalizing plate into a back cover of the mobile phone or a part thereof, and it is necessary to match the shape to make a curved portion, or to discard the curved portion. Warm plate. In addition, the uniform temperature plate is made into the back cover of the mobile phone, which has the problem of durability. When the mobile phone encounters a collision or falls to the ground, it may cause damage to the temperature equalization plate, so that the heat dissipation effect is lost.
此外,由於習知的均溫板的板面均為平坦狀而沒有高低起伏,但是行動裝置內的電子元件並不一定是相同高度,因此只能有部分的電子元件接觸到均溫板,實際使用時,接觸到均溫板的電子元件才能藉由均溫板散熱,而沒有接觸到均溫板的電子元件則無法藉由均溫板散熱。由此可見,習知的均溫板與行動裝置結合時,並不能讓所有的電子元件都可以有效的散熱。In addition, since the plate surface of the conventional temperature equalizing plate is flat without high and low fluctuations, the electronic components in the mobile device are not necessarily the same height, so only some of the electronic components can contact the temperature equalizing plate. In use, the electronic components that are in contact with the temperature equalization plate can be dissipated by the temperature equalization plate, and the electronic components that are not in contact with the temperature equalization plate cannot be dissipated by the temperature equalization plate. It can be seen that the conventional temperature equalizing plate combined with the mobile device does not allow all electronic components to effectively dissipate heat.
本創作之主要目的在於提供一種結合於行動裝置之具有高低表面之散熱模組,其可具有兩種以上不同高低的板面,而可與行動裝置內部不同高度的電子元件接觸,以達到完整的散熱效果。The main purpose of the present invention is to provide a heat dissipation module having a high and low surface combined with a mobile device, which can have two or more different levels of the board surface, and can be in contact with electronic components of different heights inside the mobile device to achieve completeness. heat radiation.
為了達成上述目的,本創作提供了一種結合於行動裝置之具有高低表面之散熱模組,包含有:一第一板,係設於該行動裝置;一第二板,結合於該第一板,該第二板與該第一板之間係形成周邊封閉的一腔室;一第一毛細層,設於該第一板之一板面且位於該腔室內;一第二毛細層,設於該第二板之一板面且位於該腔室內,該第二毛細層係與該第一毛細層相隔預定距離而於兩者間形成一氣體流道;以及一工作液,係位於該腔室內;其中,該第一板或該第二板的至少其中之一係形成有相對於其板面而有至少二種不同高度的接觸面,分別用以接觸該行動裝置內部的不同高度的電子元件。In order to achieve the above object, the present invention provides a heat dissipation module having a high and low surface combined with a mobile device, comprising: a first board attached to the mobile device; and a second board coupled to the first board, Forming a peripherally closed chamber between the second plate and the first plate; a first capillary layer disposed on one of the first plates and located in the chamber; a second capillary layer disposed on the second capillary layer One of the second plates is located in the chamber, the second capillary layer is spaced apart from the first capillary layer by a predetermined distance to form a gas flow path therebetween; and a working fluid is located in the chamber Wherein at least one of the first board or the second board is formed with at least two different heights of contact surfaces with respect to the board surface thereof for respectively contacting electronic components of different heights inside the mobile device .
藉此,藉由該至少二種不同高度的接觸面來接觸行動裝置內部的不同高度的電子元件,即可對每個需要散熱的電子元件提供散熱的功能,達到完整的散熱效果。Thereby, by contacting the electronic components of different heights inside the mobile device with the contact faces of the at least two different heights, the heat dissipation function can be provided for each electronic component that needs to be dissipated, thereby achieving a complete heat dissipation effect.
10‧‧‧結合於行動裝置之具有高低表面之散熱模組10‧‧‧ Thermal module with high and low surface combined with mobile device
11‧‧‧第一板11‧‧‧ first board
12‧‧‧腔室12‧‧‧ chamber
21‧‧‧第二板21‧‧‧ second board
24‧‧‧立壁24‧‧‧ standing wall
26‧‧‧接觸面26‧‧‧Contact surface
31‧‧‧第一毛細層31‧‧‧First capillary layer
41‧‧‧第二毛細層41‧‧‧Second capillary layer
49‧‧‧均溫板49‧‧‧Wall plate
10’‧‧‧結合於行動裝置之具有高低表面之散熱模組10'‧‧‧ Thermal module with high and low surface combined with mobile device
11’‧‧‧第一板11’‧‧‧ first board
18’‧‧‧凹陷部18’‧‧‧Depression
19’‧‧‧立壁19’‧‧‧立立
21’‧‧‧第二板21’‧‧‧ second board
26’‧‧‧接觸面26’‧‧‧Contact surface
10’’‧‧‧結合於行動裝置之具有高低表面之散熱模組10''‧‧‧ Thermal module with high and low surface combined with mobile device
11’’‧‧‧第一板11’’‧‧‧ first board
16’’‧‧‧接觸面16’’‧‧‧Contact surface
21’’‧‧‧第二板21’’‧‧‧ second board
26’’‧‧‧接觸面26’’‧‧‧Contact surface
51’’‧‧‧框架51’’‧‧‧ framework
52’’‧‧‧容置部位52’’‧‧‧ Included parts
54’’‧‧‧穿孔54’’‧‧·Perforation
91‧‧‧行動裝置91‧‧‧Mobile devices
92‧‧‧電路板92‧‧‧ boards
94,95‧‧‧電子元件94,95‧‧‧Electronic components
96‧‧‧螺栓96‧‧‧ bolt
97‧‧‧前面板97‧‧‧ front panel
98‧‧‧後蓋98‧‧‧ Back cover
C‧‧‧氣體流道C‧‧‧ gas flow path
第1圖係本創作第一較佳實施例之立體圖。Figure 1 is a perspective view of a first preferred embodiment of the present invention.
第2圖係本創作第一較佳實施例之爆炸圖。Figure 2 is an exploded view of the first preferred embodiment of the present invention.
第3圖係本創作第一較佳實施例之裝配分解圖,顯示行動裝置之電路板尚未結合的狀態。Fig. 3 is an exploded view showing the assembly of the first preferred embodiment of the present invention, showing a state in which the circuit board of the mobile device has not been joined.
第4圖係本創作第一較佳實施例之裝配示意圖,顯示與行動裝置之電路板結合的狀態。Fig. 4 is a schematic view showing the assembly of the first preferred embodiment of the present invention, showing the state of being combined with the circuit board of the mobile device.
第5圖係第4圖中5-5剖線之剖視圖。Fig. 5 is a cross-sectional view taken along line 5-5 of Fig. 4.
第6圖係本創作第二較佳實施例之爆炸圖。Figure 6 is an exploded view of the second preferred embodiment of the present invention.
第7圖係本創作第二較佳實施例之組合剖視示意圖。Figure 7 is a schematic cross-sectional view showing the second preferred embodiment of the present invention.
第8圖係本創作第三較佳實施例之爆炸圖。Figure 8 is an exploded view of a third preferred embodiment of the present invention.
第9圖係本創作第三較佳實施例之組合剖視示意圖。Figure 9 is a schematic cross-sectional view showing the third preferred embodiment of the present invention.
為了詳細說明本創作之技術特點所在,茲舉以下之較佳實施例並配合圖式說明如後,其中:如第1圖至第5圖所示,本創作第一較佳實施例所提供之一種結合於行動裝置之具有高低表面之散熱模組10,主要由一第一板11、一第二板21、一第一毛細層31、一第二毛細層41以及一工作液(圖中未示)所組成,其中:該第一板11,係設於一行動裝置91,該行動裝置91於本第一實施例中係以一電路板92上設置多個電子元件94,95來簡化顯示,而不 顯示面板或機殼等其他構件,並以該電路板92藉由複數螺栓96與該第一板11結合。In order to explain in detail the technical features of the present invention, the following preferred embodiments are described with reference to the following drawings, wherein: as shown in FIGS. 1 to 5, the first preferred embodiment of the present invention provides A heat dissipation module 10 having a high and low surface combined with a mobile device mainly comprises a first plate 11, a second plate 21, a first capillary layer 31, a second capillary layer 41 and a working fluid (not shown) The first board 11 is disposed in a mobile device 91. In the first embodiment, the mobile device 91 is provided with a plurality of electronic components 94, 95 on a circuit board 92 to simplify display. Without Other components such as a display panel or a casing are shown, and the circuit board 92 is coupled to the first board 11 by a plurality of bolts 96.
該第二板21,結合於該第一板11,該第二板21與該第一板11之間係形成周邊封閉的一腔室12。於本第一實施例中,該第二板21周緣係向該第一板11延伸形成一立壁24,並以該立壁24結合於該第一板11,該腔室12係位於該立壁24圍合的區域中。且該第一板11與該第二板21係藉由焊接或熱壓的方式結合。The second plate 21 is coupled to the first plate 11, and a cavity 12 is formed between the second plate 21 and the first plate 11 to be closed. In the first embodiment, the periphery of the second plate 21 extends toward the first plate 11 to form a vertical wall 24, and the vertical wall 24 is coupled to the first plate 11. The chamber 12 is located at the vertical wall 24. In the combined area. And the first plate 11 and the second plate 21 are combined by welding or hot pressing.
該第一毛細層31,設於該第一板11之一板面且位於該腔室12內。The first capillary layer 31 is disposed on one of the first plates 11 and located in the chamber 12.
該第二毛細層41,設於該第二板21之一板面且位於該腔室12內,該第二毛細層41係與該第一毛細層31相隔預定距離而於兩者間形成一氣體流道C。The second capillary layer 41 is disposed on one of the second plates 21 and located in the chamber 12. The second capillary layer 41 is spaced apart from the first capillary layer 31 by a predetermined distance to form a gap therebetween. Gas flow path C.
該工作液,係位於該腔室12內。由於該工作液係為液體而吸附於該第一毛細層31及該第二毛細層41內,在圖式中表示有所困難,再加上工作液乃是所屬技術領域中具有通常知識者所能理解之元件,因此不在圖式中表示。The working fluid is located in the chamber 12. Since the working fluid is liquid and adsorbed in the first capillary layer 31 and the second capillary layer 41, it is difficult to represent in the drawing, and the working fluid is a person having ordinary knowledge in the technical field. A component that can be understood, so it is not represented in the schema.
其中,該第一板11或該第二板21的至少其中之一係形成有相對於其板面而有至少二種不同高度的接觸面26,分別用來接觸該行動裝置91內部的不同高度的電子元件94,95,其中在各圖式中係以電子元件94較低而電子元件95較高為例。於本第一實施例中,該至少二種不同高度的接觸面26在數量上以二個為例,而係形成於該第二板21,且其中有一個接觸面26係為該第二板21本身的板面,另一個不同高度的接觸面26則凸起 於該第二板21,此外,該第二毛細層41也在形狀上對應於該凸起的接觸面26的背面形狀。Wherein at least one of the first plate 11 or the second plate 21 is formed with contact faces 26 having at least two different heights with respect to the plate surface thereof for respectively contacting different heights inside the mobile device 91 The electronic components 94, 95, wherein in each of the figures, the electronic component 94 is lower and the electronic component 95 is higher. In the first embodiment, the contact faces 26 of the at least two different heights are exemplified by two in number, and are formed on the second plate 21, and one of the contact faces 26 is the second plate. 21 own surface, another contact surface 26 of different height is raised In addition to the second plate 21, the second capillary layer 41 also corresponds in shape to the shape of the back surface of the raised contact surface 26.
該第一板11、第二板21、第一毛細層31、第二毛細層41及工作液係聯合組成一個均溫板49(vapor chamber)。The first plate 11, the second plate 21, the first capillary layer 31, the second capillary layer 41 and the working fluid are combined to form a vapor chamber.
以上說明了本第一實施例的架構,接下來說明本第一實施例的使用狀態。The architecture of the first embodiment has been described above, and the state of use of the first embodiment will be described next.
如第5圖所示,在本創作之散熱組結合於該行動裝置91後,藉由該第一板11設於該行動裝置91的結合關係,該第二板21的兩個不同高度的接觸面26即分別接觸該行動裝置91內部兩種不同高度的電子元件94,95,而可對不同高度的電子元件94,95提供完整的導熱及散熱效果。As shown in FIG. 5, after the heat dissipation group of the present invention is coupled to the mobile device 91, the two different heights of the second plate 21 are contacted by the bonding relationship of the first plate 11 to the mobile device 91. The faces 26 respectively contact the electronic components 94, 95 of the two different heights inside the mobile device 91, and provide complete heat conduction and heat dissipation effects for the electronic components 94, 95 of different heights.
請再參閱第6圖及第7圖,本創作第二較佳實施例所提供之一種結合於行動裝置之具有高低表面之散熱模組10’,主要概同於前揭第一實施例,不同之處在於:該第二板21’並不具有第一實施例中的立壁24,而是由該第一板11’向相反於該第二板21’位置的方向延伸形成一凹陷部18’,並於該凹陷部18’周圍形成一立壁19’,該第二板21’係完全蓋住該凹陷部18’,而該腔室即位於該凹陷部19’中。Please refer to FIG. 6 and FIG. 7 again. The heat dissipation module 10 ′ having a high and low surface combined with the mobile device provided by the second preferred embodiment of the present invention is mainly similar to the first embodiment. The second plate 21' does not have the vertical wall 24 in the first embodiment, but a recess 18' is formed by the first plate 11' extending in a direction opposite to the position of the second plate 21'. And forming a vertical wall 19' around the recess 18', the second plate 21' completely covers the recess 18', and the chamber is located in the recess 19'.
該至少二種不同高度的接觸面26’,並非如同第一實施例中所定義的形成於該第二板21’,而是形成於該第一板11’,且於本實施例中仍以二種不同高度的接觸面26’為例。The contact faces 26' of the at least two different heights are not formed on the second plate 21' as defined in the first embodiment, but are formed on the first plate 11', and are still in the embodiment. Two different height contact faces 26' are exemplified.
藉此,該第一板11’上的該二接觸面26’即可用來與行動裝置91上的不同高度的電子元件94,95接觸,以達到散熱的效果。Thereby, the two contact faces 26' on the first plate 11' can be used to contact the electronic components 94, 95 of different heights on the mobile device 91 to achieve the heat dissipation effect.
本第二實施例其餘之結構及所能達成的功效均概同於前揭第一實施例,容不再予贅述。The rest of the structure and the achievable functions of the second embodiment are the same as those in the first embodiment, and will not be described again.
請再參閱第8圖及第9圖,本創作第三較佳實施例所提供之一種結合於行動裝置之具有高低表面之散熱模組10”,主要概同於前揭第一實施例,不同之處在於:更包含有一框架51”,該行動裝置91具有一前面板97以及一後蓋98,該框架51”位於該前面板97與該後蓋98之間,該框架51”具有一容置部位52”。該框架51”具有由前往後貫穿之複數穿孔54”,該第一板11”亦具有複數穿孔(圖中係因被螺栓擋住,因此不予顯示出來,可參考本案第2圖)分別對齊該框架51”之各該穿孔54”,且該第一板11”係以嵌入成形(insert molding)或組裝的方式設置於該框架51”且位於該容置部位52”內,於本實施例中係以嵌入成形為例,其狀態如第9圖所示。該第二板21”係位於該容置部位52”內而不與該框架51”接觸。Please refer to FIG. 8 and FIG. 9 again. A heat dissipation module 10" having a high and low surface combined with a mobile device according to the third preferred embodiment of the present invention is mainly similar to the first embodiment. The frame device 51 has a front panel 97 and a rear cover 98. The frame 51′′ is located between the front panel 97 and the rear cover 98. The frame 51′′ has a capacity. Position 52". The frame 51" has a plurality of perforations 54" extending through the back, the first plate 11" also has a plurality of perforations (the figure is blocked by the bolt, so it is not displayed, please refer to the second case of the case Each of the perforations 54" of the frame 51" is respectively aligned, and the first plate 11" is disposed in the frame 51" and is located in the receiving portion 52" by insert molding or assembly. In the present embodiment, the insert molding is taken as an example, and its state is as shown in Fig. 9. The second plate 21" is located in the accommodating portion 52" without being in contact with the frame 51".
該第一板11”及該第二板21”均設有二個不同高度的接觸面16”,26”。The first plate 11" and the second plate 21" are each provided with two contact faces 16", 26" of different heights.
藉由本第三實施例所揭露之結構可知,本創作組合後的產品係藉由該第一板11”結合於該框架51”,並以該框架51”結合於行動裝置91的前面板97與後蓋98之間,這樣的結構可使得該第一板11”藉由該框架51”而更容易與行動裝置91組裝。此外,該第一板11”及該第二板21”均設有二不同高度的接觸面16”,26”,可以使得該行動裝置91內位於該第一板11”表面及該第二板21”表面的電子元件94,95均能藉由接觸而產生散熱的效果。As can be seen from the structure disclosed in the third embodiment, the product of the present combination is coupled to the frame 51" by the first board 11", and is coupled to the front panel 97 of the mobile device 91 by the frame 51". Between the rear covers 98, such a structure can make the first plate 11" easier to assemble with the mobile device 91 by the frame 51". Further, the first plate 11" and the second plate 21" are provided Two different height contact surfaces 16", 26" can enable the electronic components 94, 95 on the surface of the first plate 11" and the surface of the second plate 21" in the mobile device 91 to generate heat dissipation by contact. effect.
本第三實施例之其餘結構及所能達成的功效係概同於前揭第一實施例,容不再予贅述。The remaining structure of the third embodiment and the achievable functions are the same as those of the first embodiment, and will not be further described.
10‧‧‧結合於行動裝置之具有高低表面之散熱模組10‧‧‧ Thermal module with high and low surface combined with mobile device
11‧‧‧第一板11‧‧‧ first board
21‧‧‧第二板21‧‧‧ second board
24‧‧‧立壁24‧‧‧ standing wall
26‧‧‧接觸面26‧‧‧Contact surface
31‧‧‧第一毛細層31‧‧‧First capillary layer
41‧‧‧第二毛細層41‧‧‧Second capillary layer
49‧‧‧均溫板49‧‧‧Wall plate
Claims (13)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103211284U TWM494951U (en) | 2014-06-25 | 2014-06-25 | Heat dissipation module with high-low surface for binding with mobile device |
JP2015001194U JP3197757U (en) | 2014-06-25 | 2015-03-16 | A heat dissipation module combined with a mobile device and having an undulating surface |
CN201520164341.2U CN204539691U (en) | 2014-06-25 | 2015-03-23 | Heat radiation module with high and low surface combined with mobile device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103211284U TWM494951U (en) | 2014-06-25 | 2014-06-25 | Heat dissipation module with high-low surface for binding with mobile device |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM494951U true TWM494951U (en) | 2015-02-01 |
Family
ID=53017261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103211284U TWM494951U (en) | 2014-06-25 | 2014-06-25 | Heat dissipation module with high-low surface for binding with mobile device |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3197757U (en) |
CN (1) | CN204539691U (en) |
TW (1) | TWM494951U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI720865B (en) * | 2020-04-07 | 2021-03-01 | 奇鋐科技股份有限公司 | Heat dissipation connection structure of handheld device |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106455410B (en) * | 2015-08-11 | 2019-03-12 | 奇鋐科技股份有限公司 | Have the middle frame structure and electronic equipment of insulation |
CN106455422B (en) * | 2016-09-21 | 2019-08-30 | 奇鋐科技股份有限公司 | Hand-held device radiator structure |
CN107889422A (en) * | 2016-09-29 | 2018-04-06 | 台达电子工业股份有限公司 | Heat pipe structure |
US10619941B2 (en) | 2016-09-29 | 2020-04-14 | Delta Electronics, Inc. | Heat pipe structure |
CN107846102B (en) * | 2017-10-26 | 2021-12-07 | 珠海格力节能环保制冷技术研究中心有限公司 | Multipurpose casing and motor |
US20210352827A1 (en) * | 2020-05-06 | 2021-11-11 | Asia Vital Components Co., Ltd. | Heat dissipation connection structure of handheld device |
-
2014
- 2014-06-25 TW TW103211284U patent/TWM494951U/en not_active IP Right Cessation
-
2015
- 2015-03-16 JP JP2015001194U patent/JP3197757U/en not_active Expired - Fee Related
- 2015-03-23 CN CN201520164341.2U patent/CN204539691U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI720865B (en) * | 2020-04-07 | 2021-03-01 | 奇鋐科技股份有限公司 | Heat dissipation connection structure of handheld device |
Also Published As
Publication number | Publication date |
---|---|
CN204539691U (en) | 2015-08-05 |
JP3197757U (en) | 2015-06-04 |
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Legal Events
Date | Code | Title | Description |
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MM4K | Annulment or lapse of a utility model due to non-payment of fees |