TWM547236U - Multi-support heat dissipation structure of portable electronic device - Google Patents
Multi-support heat dissipation structure of portable electronic device Download PDFInfo
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- TWM547236U TWM547236U TW105215614U TW105215614U TWM547236U TW M547236 U TWM547236 U TW M547236U TW 105215614 U TW105215614 U TW 105215614U TW 105215614 U TW105215614 U TW 105215614U TW M547236 U TWM547236 U TW M547236U
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- electronic device
- portable electronic
- dissipation structure
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- 230000017525 heat dissipation Effects 0.000 title claims description 34
- 239000002131 composite material Substances 0.000 claims description 65
- 235000012431 wafers Nutrition 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 238000001816 cooling Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 206010053615 Thermal burn Diseases 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
本創作係有關一種可攜帶電子裝置之複合支撐散熱結構，其以複合支撐散熱結構應用於可攜帶電子裝置，使可攜帶電子裝置解決因機體發燙或當機問題，相對可以充分發揮電子設備性能，讓消費者有更好的人機體驗。 The present invention relates to a composite supporting heat dissipation structure for a portable electronic device, which is applied to a portable electronic device by a composite supporting heat dissipation structure, so that the portable electronic device can solve the problem of hot or crashing of the body, and the performance of the electronic device can be fully utilized. To give consumers a better human-machine experience.
按，目前市售的可攜帶電子裝置，當經由長時間使用後，則在局部出現過熱現象，該現象不僅造成電子設備性能降低，機體發燙或當機問題。 According to the currently available portable electronic device, when it is used for a long time, the phenomenon of overheating occurs locally, which not only causes the performance of the electronic device to be degraded, but also causes the body to become hot or crash.
次按，由於目前可攜帶電子裝置之外觀造型要求厚度過薄，並沒有空間預留給傳統熱傳遞方法中的熱對流(利用風扇獲得對流)，所以就只剩下熱傳導和熱輻射兩種方式可被應用，目前市售的可攜帶電子裝置多是利用在熱源附近貼附，例如石墨片、銅箔等高複合材料以達到散熱降溫目的，從市售魅族，小米，華為等品牌大屏手機來看，並無顯著散熱降溫效果，局部溫度仍居高不下，該現象不僅造成該現象不僅造成電子設備性能降低，機體發燙或當機問題甚至讓消費者觸感溫度過高甚至燙傷用戶，消費者使用中多有抱怨。是以，本創作人有鑑於上揭問題點，乃構思一種可攜帶電子裝置之複合支撐散熱結構，為本創作所欲解決的課題。 Sub-press, because the current shape of the portable electronic device requires too thin thickness, and there is no space reserved for the heat convection in the traditional heat transfer method (convection is obtained by the fan), only the heat conduction and the heat radiation are left. Can be applied, most of the currently available portable electronic devices are attached to the vicinity of the heat source, such as graphite sheets, copper foil and other high-composite materials to achieve the purpose of cooling and cooling, from the market for Meizu, Xiaomi, Huawei and other brands of large-screen mobile phones In view of this, there is no significant cooling and cooling effect, and the local temperature is still high. This phenomenon not only causes the phenomenon not only to degrade the performance of the electronic equipment, but also causes the user to feel hot or even burn the user if the body is hot or crashed. There are many complaints from consumers. Therefore, in view of the above problems, the present creator conceived a composite supporting heat dissipation structure of a portable electronic device, which is a problem to be solved by the author.
緣是，本創作之主要目的，係在提供一種可攜帶電子裝置之複合支撐散熱結構，其以複合支撐散熱結構應用於可攜帶電子裝置，使可 攜帶電子裝置解決因機體發燙或當機問題，相對可以充分發揮電子設備性能，讓消費者有更好的人機體驗。 The main purpose of this creation is to provide a composite support heat dissipation structure for a portable electronic device, which is applied to a portable electronic device with a composite support heat dissipation structure. Carrying electronic devices to solve the problem of hot or downtime of the body, can relatively fully exert the performance of electronic devices, so that consumers have a better human-machine experience.
本創作之另一目的，係在提供一種可攜帶電子裝置之複合支撐散熱結構，其使用高導熱及高剛性的複合體和殼體整合進行散熱及支撐，有別於市場貼附散熱薄膜方式，克服產品結構複雜下的最大散熱面積。 Another object of the present invention is to provide a composite supporting heat dissipating structure for a portable electronic device, which uses a high thermal conductivity and high rigidity composite body and a casing to integrate heat dissipation and support, which is different from the way of attaching a heat dissipating film to the market. Overcome the maximum heat dissipation area under the complicated product structure.
為達上述目的，本創作所採用之技術手段包含：一適用於可攜帶電子裝置之前殼及後殼，且該前殼與該後殼係相對應結合成一組件，其特徵在於：該組件上之前殼及後殼上，至少一體成型設有一由二層或二層以上不同剛性材所構成的複合體，且其成型具有邊框之完整型體，使之成為該前殼及該後殼的主要支撐體，形成一複合支撐散熱結構，據以使該前殼與該後殼相對應形成一散熱系統。 For the above purposes, the technical means adopted by the present invention include: one for the front and rear shells of the portable electronic device, and the front shell and the rear shell are combined to form an assembly, characterized in that: before the assembly The shell and the rear shell are integrally formed with at least one composite body composed of two or more layers of different rigid materials, and the formed body has a complete shape of the frame, so that it becomes the main support of the front shell and the rear shell. The body forms a composite support heat dissipation structure, so that the front case and the rear case form a heat dissipation system.
依據前揭特徵，該組件內係設有一電路板，該電路板上係至少設有一個晶片及屏蔽罩，該屏蔽罩係罩住該晶片，且該屏蔽罩之罩面係接觸該組件內具有該複合體之一側。 According to the foregoing feature, the circuit board is provided with a circuit board, and the circuit board is provided with at least one chip and a shielding cover, the shielding cover covers the wafer, and the cover surface of the shielding cover contacts the component. One side of the composite.
依據前揭特徵，該組件內係設有一電池，該電池在具有該複合體之一側。 According to a predecessor feature, the assembly is provided with a battery having one side of the composite.
依據前揭特徵，該複合體包括設成二個，並分別設置位於該組件之前殼及後殼且相對應呈平行。 According to the foregoing feature, the composite body is provided in two, and is respectively disposed on the front shell and the rear shell of the assembly and is correspondingly parallel.
依據前揭特徵，該組件內係設有一電路板，該電路板上係設有二個鏡射之晶片及屏蔽罩，各該屏蔽罩係分別罩住各該晶片，且各該屏蔽罩之罩面係分別接觸該組件內之前殼、後殼並具有該複合體之兩側。 According to the foregoing feature, the circuit board is provided with a circuit board on which two mirrored wafers and a shield cover are disposed, and each of the shield covers each of the wafers, and each of the shield covers The facing contacts the front and rear shells of the assembly and have sides of the composite.
依據前揭特徵，該組件內係設有一電池，該電池係分別接觸該組件內之前殼、後殼並具有該複合體之兩側。 According to the foregoing feature, a battery is disposed in the assembly, and the battery contacts the front and rear shells of the assembly and has two sides of the composite.
依據前揭特徵，該複合體係由複合材料所構成，該複合材料包括至少一層高強度金屬及一層高導熱性材料所複合成型，據以構成一高強度且高導熱之複合材料結構。 According to the foregoing features, the composite system is composed of a composite material comprising at least one layer of high-strength metal and a layer of high thermal conductivity material to form a composite structure of high strength and high thermal conductivity.
依據前揭特徵，該高導熱性金屬係選自包括：銅、鋁、鈦、銀、金、銅合金、鋁合金、銀合金、鈦合金其中任一或其組合式所構成；該高強度金屬為不銹鋼、鋁、鈦、鋁合金、鈦合金、液態金屬其中任一或其組合式所構成。 According to the foregoing feature, the high thermal conductivity metal is selected from the group consisting of copper, aluminum, titanium, silver, gold, copper alloy, aluminum alloy, silver alloy, titanium alloy, or a combination thereof; the high strength metal It is composed of stainless steel, aluminum, titanium, aluminum alloy, titanium alloy, liquid metal or a combination thereof.
依據前揭特徵，更包括一液晶螢幕及觸控面板，其依序固定在該組件上。 According to the foregoing features, a liquid crystal screen and a touch panel are further included, which are sequentially fixed on the component.
藉助上揭技術手段，本創作解決可攜帶電子裝置所產生熱源散發的熱量，經由複合支撐散熱結構，不會造成殼體局部過熱之問題，解決可攜帶電子裝置的晶片在工作時所產生之主要熱源的熱穿越殼體燙傷用戶，讓消費者有更好的人機體驗。 By means of the above-mentioned technical means, the present invention solves the heat dissipated by the heat source generated by the portable electronic device, and the composite support heat dissipating structure does not cause the local overheating of the casing, and solves the main problem that the wafer of the portable electronic device is generated at work. The heat of the heat source scalds the user through the shell, giving the consumer a better human-machine experience.
10‧‧‧可攜帶電子裝置 10‧‧‧Portable electronic devices
11‧‧‧組件 11‧‧‧ components
111‧‧‧前殼 111‧‧‧ front shell
112‧‧‧後殼 112‧‧‧back shell
12‧‧‧電路板 12‧‧‧ boards
121‧‧‧晶片 121‧‧‧ wafer
122‧‧‧屏蔽罩 122‧‧‧Shield
13‧‧‧電池 13‧‧‧Battery
14‧‧‧液晶螢幕 14‧‧‧ LCD screen
15‧‧‧觸控面板 15‧‧‧Touch panel
20‧‧‧複合支撐散熱結構 20‧‧‧Composite support heat dissipation structure
21‧‧‧複合體 21‧‧‧Compound
211、212‧‧‧剛性材 211, 212‧‧‧Rigid material
30‧‧‧散熱系統 30‧‧‧heating system
圖1係本創作實施例之示意圖。 Figure 1 is a schematic diagram of an embodiment of the present invention.
圖2係本創作又一實施例之示意圖。 2 is a schematic diagram of still another embodiment of the present creation.
圖3係本創作另一實施例之示意圖。 Figure 3 is a schematic illustration of another embodiment of the present invention.
圖4A係本創作前殼與複合材料之成型示意圖。 Fig. 4A is a schematic view showing the molding of the front shell and the composite material.
圖4B係本創作後殼與複合材料之成型示意圖。 Fig. 4B is a schematic view showing the forming of the back shell and the composite material.
首先，請參閱圖1~圖3及圖4A、圖4B所示，本創作一種可攜帶電子裝置之複合支撐散熱結構之較佳實施例包含：一適用於可攜帶電子 裝置10之前殼111及後殼112，且該前殼111與該後殼112係相對應結合，形成一組件11，其特徵在於：該組件11上之前殼111及後殼112上，至少一體成型設有一由二層或二層以上不同剛性材211、212所構成的複合體21，且其成型具有邊框(塑膠或金屬)之完整型體，使之成為該前殼111及該後殼112的主要支撐體，形成一複合支撐散熱結構20，據以使該前殼111與該後殼112相對應形成一散熱系統30。 First, referring to FIG. 1 to FIG. 3 and FIG. 4A and FIG. 4B, a preferred embodiment of a composite supporting heat dissipation structure for a portable electronic device includes: one suitable for portable electronic The device 10 has a front shell 111 and a rear shell 112, and the front shell 111 and the rear shell 112 are coupled to each other to form an assembly 11 characterized in that the front shell 111 and the rear shell 112 of the assembly 11 are at least integrally formed. A composite body 21 composed of two or more layers of different rigid materials 211, 212 is provided, and is formed into a complete body having a frame (plastic or metal) so as to be the front case 111 and the rear case 112. The main support body forms a composite support heat dissipation structure 20, so that the front case 111 and the rear case 112 correspond to form a heat dissipation system 30.
承上，該複合體21係由複合材料所構成，該複合材料包括至少一層高強度金屬及一層高導熱性材料所複合成型，據以構成一高強度且高導熱之複合材料結構，而該高導熱性金屬係選自包括：銅、鋁、鈦、銀、金、銅合金、鋁合金、銀合金、鈦合金其中任一或其組合式所構成，及該高強度金屬為不銹鋼、鋁、鈦、鋁合金、鈦合金、液態金屬其中任一或其組合式所構成，本實施例中，如圖1所示，其該複合體21係位於該組件11之前殼111。 The composite body 21 is composed of a composite material comprising at least one layer of high-strength metal and a layer of high thermal conductivity material, thereby forming a high-strength and high-heat-conducting composite structure, and the composite material is high. The thermally conductive metal is selected from the group consisting of copper, aluminum, titanium, silver, gold, copper alloy, aluminum alloy, silver alloy, titanium alloy, or a combination thereof, and the high-strength metal is stainless steel, aluminum, titanium The aluminum alloy, the titanium alloy, and the liquid metal are composed of any one or a combination thereof. In the present embodiment, as shown in FIG. 1, the composite body 21 is located in the front shell 111 of the assembly 11.
或如圖2所示，又一可行實施例中，其該複合體21係位於該組件11之後殼112，如此一來，該前殼111與該後殼112乃為兩個不同且獨立的個體，使該複合支撐散熱結構20可設在該前殼111或該後殼112，但不限定於此。 Or, as shown in FIG. 2, in another possible embodiment, the composite body 21 is located behind the casing 11 of the assembly 11, such that the front casing 111 and the rear casing 112 are two different and independent individuals. The composite support heat dissipation structure 20 may be provided in the front case 111 or the rear case 112, but is not limited thereto.
承上，該組件11內係設有一電路板12，該電路板12上係至少設有一個晶片121及屏蔽罩122，該屏蔽罩122係罩住該晶片121，且該屏蔽罩122之罩面係接觸該組件11內具有該複合體21之一側，及該組件11內係設有一電池13，該電池13在具有該複合體21之一側，換言之，在該晶片121頂面上方前殼(中板)111及後殼112，使用高導熱及高剛性的複合體21進行散熱及支撐，有別於市場貼附散熱薄膜方式，克服產品結構複雜下的最大散熱面積，但不限定於此。 The circuit board 12 is provided with a circuit board 12, and the circuit board 12 is provided with at least one chip 121 and a shield cover 122. The shield cover 122 covers the wafer 121, and the cover of the shield cover 122 The component 11 is in contact with one side of the composite body 21, and a battery 13 is disposed in the component 11. The battery 13 has a side of the composite body 21, in other words, a front shell above the top surface of the wafer 121. The (middle plate) 111 and the rear case 112 are heat-dissipated and supported by the composite body 21 having high heat conductivity and high rigidity, which is different from the way of attaching a heat-dissipating film to the market, and overcomes the maximum heat dissipation area under complicated product structure, but is not limited thereto. .
又如圖3所示，在另一可行實施例中，其該複合體21包括設成二個，並分別設置位於該組件11之前殼111及後殼112且相對應呈平行，如此一來，該前殼111與該後殼112乃為兩個不同且獨立的個體，使該複合支撐散熱結構20可分別設在該前殼111與該後殼112，但不限定於此。 As shown in FIG. 3, in another possible embodiment, the composite body 21 is provided in two, and is respectively disposed in front of the casing 11 and the rear casing 112 of the assembly 11 and is correspondingly parallel. The front case 111 and the rear case 112 are two different and independent individuals, so that the composite support heat dissipation structure 20 can be respectively disposed on the front case 111 and the rear case 112, but is not limited thereto.
承上，該組件11內係設有一電路板12，該電路板12上係設有二個鏡射之晶片121及屏蔽罩122，各該屏蔽罩122係分別罩住各該晶片121，且各該屏蔽罩122之罩面係分別接觸該組件11內之前殼111、後殼112並具有該複合體之兩側，及該組件內係設有一電池，該電池係分別接觸該組件內之前殼、後殼並具有該複合體之兩側，換言之，在該晶片121頂面上方前殼(中板)111及後殼112，使用高導熱及高剛性的複合體21進行散熱及支撐，有別於市場貼附散熱薄膜方式，克服產品結構複雜下的最大散熱面積，但不限定於此。此外，更包括一液晶螢幕及觸控面板，其依序固定在該組件上。 The circuit board 12 is provided with a circuit board 12, and the circuit board 12 is provided with two mirrored wafers 121 and a shield cover 122. Each of the shield covers 122 covers each of the wafers 121, and each of them The cover of the shield cover 122 respectively contacts the front shell 111 and the rear shell 112 of the assembly 11 and has two sides of the composite body, and a battery is disposed in the assembly, and the battery system respectively contacts the front shell of the assembly, The rear case has two sides of the composite body, in other words, the front case (middle plate) 111 and the rear case 112 above the top surface of the wafer 121 are cooled and supported by the composite body 21 with high thermal conductivity and high rigidity, which is different from The market attaches a heat-dissipating film method to overcome the maximum heat-dissipating area under complicated product structure, but is not limited thereto. In addition, a liquid crystal screen and a touch panel are sequentially mounted on the component.
基於如此之構成，本創作之複合支撐散熱結構20可同時置入該前殼111及後殼112，在此複合體21形成散熱結構進行散熱，將該電子組件熱源(例如晶片121、電池13)散發的熱量經由該前殼111上的複合支撐散熱結構20均勻散佈在整個腔體內，再由該後殼112的複合支撐散熱結構20和外界進行熱交換，相對能使該電子組件熱源(例如晶片121、電池13)的溫度有明確降低，不會造成機體發燙或當機問題，相對可以充分發揮電子設備性能，讓消費者有更好的人機體驗。 Based on such a configuration, the composite support heat dissipation structure 20 of the present invention can be simultaneously inserted into the front case 111 and the rear case 112. The composite body 21 forms a heat dissipation structure for heat dissipation, and the electronic component heat source (for example, the wafer 121 and the battery 13) The heat dissipated is evenly distributed throughout the cavity via the composite support heat dissipation structure 20 on the front case 111, and the composite support heat dissipation structure 20 of the rear case 112 exchanges heat with the outside, so that the heat source of the electronic component (for example, the wafer) can be relatively 121, the temperature of the battery 13) is clearly reduced, will not cause the body to become hot or crash problems, relatively can fully play the performance of electronic equipment, so that consumers have a better human-machine experience.
綜上所述，本創作所揭示之技術手段，確具「新穎性」、「進步性」及「可供產業利用」等新型專利要件，祈請 鈞局惠賜專利，以勵創作，無任德感。 In summary, the technical means disclosed in this creation are indeed new types of patents such as "novelty", "progressiveness" and "available for industrial use", and pray for the patents of the bureau to encourage creation. German sense.
惟，上述所揭露之圖式、說明，僅為本創作之較佳實施例，大凡熟悉此項技藝人士，依本案精神範疇所作之修飾或等效變化，仍應包括在本案申請專利範圍內。 However, the drawings and descriptions disclosed above are only preferred embodiments of the present invention, and modifications or equivalent changes made by those skilled in the art in accordance with the spirit of the present invention should still be included in the scope of the patent application.
10‧‧‧可攜帶電子裝置 10‧‧‧Portable electronic devices
11‧‧‧組件 11‧‧‧ components
111‧‧‧前殼 111‧‧‧ front shell
112‧‧‧後殼 112‧‧‧back shell
12‧‧‧電路板 12‧‧‧ boards
121‧‧‧晶片 121‧‧‧ wafer
122‧‧‧屏蔽罩 122‧‧‧Shield
13‧‧‧電池 13‧‧‧Battery
14‧‧‧液晶螢幕 14‧‧‧ LCD screen
15‧‧‧觸控面板 15‧‧‧Touch panel
20‧‧‧複合支撐散熱結構 20‧‧‧Composite support heat dissipation structure
21‧‧‧複合體 21‧‧‧Compound
211、212‧‧‧剛性材 211, 212‧‧‧Rigid material
30‧‧‧散熱系統 30‧‧‧heating system
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105215614U TWM547236U (en) | 2016-10-14 | 2016-10-14 | Multi-support heat dissipation structure of portable electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105215614U TWM547236U (en) | 2016-10-14 | 2016-10-14 | Multi-support heat dissipation structure of portable electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM547236U true TWM547236U (en) | 2017-08-11 |
Family
ID=60188832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105215614U TWM547236U (en) | 2016-10-14 | 2016-10-14 | Multi-support heat dissipation structure of portable electronic device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM547236U (en) |
-
2016
- 2016-10-14 TW TW105215614U patent/TWM547236U/en not_active IP Right Cessation
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