CN206525067U - Composite supporting heat dissipation structure for portable electronic devices - Google Patents

Abstract

A composite support heat dissipation structure for a portable electronic device, comprising: the front shell and the back shell are combined into a component, at least one complex body formed by two or more layers of different rigid materials is integrally formed on the front shell and the back shell on the component, and the complex body is formed into a complete body with a frame to be a main supporting body of the front shell and the back shell to form a composite supporting and radiating structure, so that the front shell and the back shell correspondingly form a radiating system. The composite material is used for heat dissipation, after the portable electronic device is used for a long time, because the heat dissipated by the heat source of the electronic component is uniformly distributed in the whole cavity through the composite supporting heat dissipation structure and then exchanges heat with the outside, the core temperature of the electronic device is definitely reduced, the problem that a machine body is hot or crashed cannot be caused, the performance of the electronic device can be sufficiently played relatively, and a consumer can have better human-computer experience.

Description

Composite supporting heat dissipation structure for portable electronic devices

technical field

The utility model relates to a composite support heat dissipation structure of a portable electronic device. The composite support heat dissipation structure is applied to a portable electronic device, so that the portable electronic device can solve the problem of hot or crashed body and can relatively fully utilize the electronic device. Equipment performance, so that consumers have a better human-machine experience.

Background technique

The currently commercially available portable electronic devices, after a long period of use, may overheat locally. This phenomenon not only causes the performance of the electronic device to degrade, but also causes the body to become hot or crash.

Secondly, since the appearance of portable electronic devices requires too thin thickness, there is no space reserved for heat convection in traditional heat transfer methods (using fans to obtain convection), so only heat conduction and heat radiation are left. It can be applied. At present, most of the portable electronic devices on the market are attached near the heat source, such as graphite sheet, copper foil and other high-composite materials to achieve the purpose of heat dissipation and cooling. From the commercially available Meizu, Xiaomi, Huawei and other brands of large-screen mobile phones From the point of view, there is no significant heat dissipation and cooling effect, and the local temperature is still high. This phenomenon not only causes the performance of electronic equipment to decrease, the body becomes hot or crashes, and even makes consumers feel that the temperature is too high or even burns the user. Consumers often use it There are complaints. Therefore, in view of the problems disclosed above, the inventor conceived a composite supporting heat dissipation structure for a portable electronic device, which is the problem to be solved by the present invention.

Utility model content

The main technical problem to be solved by the utility model is to overcome the above-mentioned defects in the prior art, and provide a composite supporting heat dissipation structure for portable electronic devices, which is applied to portable electronic devices with a composite supporting heat dissipation structure, so that portable The electronic device solves the problem of overheating or crashing of the body, relatively can give full play to the performance of the electronic device, and allows consumers to have a better human-machine experience; it uses a high thermal conductivity and high rigidity composite body integrated with the shell for heat dissipation and support, Different from the way of attaching heat dissipation film in the market, it overcomes the maximum heat dissipation area under the complex product structure.

The technical scheme that the utility model solves its technical problem adopts is:

A composite supporting heat dissipation structure for a portable electronic device, comprising: a front case and a rear case suitable for a portable electronic device, and the front case and the rear case are combined into a component correspondingly, and the feature is that: the On the front shell and the rear shell, at least one composite body composed of two or more layers of different rigid materials is formed integrally, and it is formed into a complete body with a frame, making it the main body of the front shell and the rear shell. The supporting body forms a composite supporting heat dissipation structure, so that the front shell and the rear shell correspond to form a heat dissipation system.

According to the feature disclosed above, a circuit board is arranged inside the component, and at least one chip and a shield are arranged on the circuit board, the shield covers the chip, and the cover surface of the shield contacts the component with the complex side.

According to the aforementioned features, the module houses a battery on the side with the complex.

According to the feature disclosed above, the composite body is set in two, and the front shell and the rear shell are respectively arranged on the component and are parallel to each other.

According to the features disclosed above, a circuit board is arranged inside the assembly, and two mirrored chips and shielding covers are arranged on the circuit board, each of the shielding covers respectively covers each of the chips, and the cover surfaces of each of the shielding covers are in contact with each other respectively. The front shell and the rear shell in the assembly are arranged on both sides of the complex.

According to the feature disclosed above, a battery is arranged inside the component, and the battery is respectively in contact with the front shell and the rear shell in the component and is arranged on both sides of the complex.

According to the features disclosed above, the composite body is made of composite material, and the composite material is compounded by at least one layer of high-strength metal and one layer of high thermal conductivity material to form a high-strength and high thermal conductivity composite material structure.

According to the characteristics disclosed above, the high thermal conductivity metal is composed of any one of copper, aluminum, titanium, silver, gold, copper alloy, aluminum alloy, silver alloy, titanium alloy or a combination thereof; the high-strength metal is composed of stainless steel, aluminum , titanium, aluminum alloy, titanium alloy, liquid metal, or any combination thereof.

According to the features disclosed above, it also includes a liquid crystal screen and a touch panel, which are sequentially fixed on the component.

With the help of the above technical means, the utility model solves the heat emitted by the heat source generated by the portable electronic device. Through the composite supporting heat dissipation structure, the problem of local overheating of the housing will not be caused, and the problem of the chip generated by the portable electronic device during operation can be solved. The heat from the main heat source passes through the shell and burns the user, allowing consumers to have a better human-machine experience.

The beneficial effect of the utility model is that it is applied to a portable electronic device with a composite supporting heat dissipation structure, so that the portable electronic device can solve the problem of being hot or crashed due to the body, relatively can fully exert the performance of the electronic device, and allow consumers to have a better experience. Human-machine experience; it uses high thermal conductivity and high rigidity composite body and shell integration for heat dissipation and support, which is different from the market method of attaching heat dissipation film, and overcomes the maximum heat dissipation area under complex product structure.

Description of drawings

Below in conjunction with accompanying drawing and embodiment the utility model is further described.

Fig. 1 is the schematic diagram of the utility model embodiment.

Fig. 2 is a schematic diagram of another embodiment of the utility model.

Fig. 3 is a schematic diagram of another embodiment of the utility model.

Fig. 4A is a schematic diagram of forming the front shell and the composite material of the present invention.

Fig. 4B is a schematic diagram of forming the rear shell and the composite material of the present invention.

Explanation of symbols in the figure:

10 Portable Electronic Devices

11 components

111 front shell

112 back shell

12 circuit board

121 chips

122 shielding cover

13 batteries

14LCD screen

15 touch panel

20 Composite support cooling structure

21 complex

211, 212 rigid material

30 cooling system

detailed description

First, please refer to Fig. 1-Fig. 3 and Fig. 4A and Fig. 4B, a preferred embodiment of a composite supporting heat dissipation structure of a portable electronic device of the present invention includes: a front case suitable for the portable electronic device 10 111 and the rear case 112, and the front case 111 and the rear case 112 are combined correspondingly to form a component 11, which is characterized in that: on the front case 111 and the rear case 112 on the component 11, at least one by two Composite body 21 composed of one or more layers of different rigid materials 211, 212, and formed into a complete body with a frame (plastic or metal), making it the main support body of the front shell 111 and the rear shell 112, A composite heat dissipation structure 20 is formed so that the front shell 111 and the rear shell 112 correspond to form a heat dissipation system 30 .

As mentioned above, the composite body 21 is made of composite material, and the composite material is compounded by at least one layer of high-strength metal and one layer of high thermal conductivity material to form a high-strength and high thermal conductivity composite material structure, and the high The thermally conductive metal is composed of any one of copper, aluminum, titanium, silver, gold, copper alloy, aluminum alloy, silver alloy, titanium alloy or a combination thereof, and the high-strength metal is composed of stainless steel, aluminum, titanium, aluminum alloy, Titanium alloy, liquid metal or any combination thereof, in this embodiment, as shown in FIG. 1 , the composite body 21 is located at the front shell 111 of the component 11 .

Or as shown in FIG. 2, in yet another feasible embodiment, the composite body 21 is located at the rear shell 112 of the component 11, so that the front shell 111 and the rear shell 112 are two different and independent entities, The composite supporting heat dissipation structure 20 can be disposed on the front shell 111 or the rear shell 112 , but not limited thereto.

As above, a circuit board 12 is arranged inside the component 11, and at least one chip 121 and a shielding case 122 are arranged on the circuit board 12, the shielding case 122 covers the chip 121, and the cover surface of the shielding case 122 contacts the component 11 has the side of the composite body 21, and the assembly 11 is provided with a battery 13, the battery 13 is on the side with the composite body 21, in other words, the front shell (middle plate) 111 above the wafer 121 top surface And the rear shell 112 uses the composite body 21 with high thermal conductivity and high rigidity for heat dissipation and support, which is different from the way of attaching heat dissipation film in the market, and overcomes the maximum heat dissipation area under the complex structure of the product, but it is not limited to this.

Also as shown in FIG. 3 , in another feasible embodiment, the composite body 21 is provided in two, and the front shell 111 and the rear shell 112 of the component 11 are respectively arranged in parallel, so that, The front shell 111 and the rear shell 112 are two different and independent entities, so that the composite supporting heat dissipation structure 20 can be respectively disposed on the front shell 111 and the rear shell 112 , but not limited thereto.

On the above, a circuit board 12 is provided in the assembly 11, and two mirrored chips 121 and shielding cases 122 are arranged on the circuit board 12, and each of the shielding cases 122 covers each of the chips 121 respectively, and each of the shielding cases The cover surface of 122 respectively contacts the front shell 111 and the rear shell 112 in the assembly 11 and has both sides of the complex, and a battery is provided in the assembly, and the battery contacts the front shell and the rear shell in the assembly respectively and is provided with On both sides of the complex, in other words, the front shell (middle plate) 111 and the rear shell 112 above the top surface of the chip 121, use a high thermal conductivity and high rigidity complex 21 for heat dissipation and support, which is different from the market-attached The heat dissipation film method overcomes the maximum heat dissipation area under the complex structure of the product, but it is not limited to this. In addition, it also includes a liquid crystal screen and a touch panel, which are sequentially fixed on the component.

Based on the above structure, the composite supporting heat dissipation structure 20 of the present invention can be inserted into the front case 111 and the rear case 112 at the same time, and the complex 21 forms a heat dissipation structure to dissipate heat. The dissipated heat is evenly distributed in the entire cavity through the composite supporting heat dissipation structure 20 on the front shell 111, and then the composite supporting heat dissipation structure 20 of the rear shell 112 performs heat exchange with the outside, relatively enabling the heat source of the electronic component (such as a wafer 121. The temperature of the battery 13) is clearly lowered, which will not cause the body to become hot or crash, and can relatively give full play to the performance of electronic equipment, allowing consumers to have a better human-machine experience.

The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the utility model, All still belong to within the scope of the technical solution of the utility model.

In summary, the utility model fully meets the needs of industrial development in terms of structural design, practicability and cost-effectiveness, and the disclosed structure also has an unprecedented innovative structure, novelty, creativity and practicability, and meets the needs of industrial development. According to the regulations on the requirements of utility model patents, the application is filed in accordance with the law.

Claims (8)

1. A composite supporting heat dissipation structure for a portable electronic device, comprising: a front case and a rear case suitable for a portable electronic device, and the front case and the rear case are correspondingly combined into an assembly, characterized in that: On the front shell and the rear shell of the component, at least one composite body composed of two or more layers of different rigid materials is integrally formed, and it is formed into a complete body with a frame, so that it becomes the front shell and the The main supporting body of the rear case forms a composite supporting heat dissipation structure, so that the front case and the rear case correspond to form a heat dissipation system. 2. The composite supporting heat dissipation structure of a portable electronic device according to claim 1, wherein a circuit board is arranged inside the assembly, and at least one chip and a shielding cover are arranged on the circuit board, and the shielding cover covers The wafer, and the mask surface of the shield contact the side of the assembly with the complex. 3 . The composite support and heat dissipation structure of a portable electronic device according to claim 1 , wherein a battery is disposed inside the assembly, and the battery is on the side of the composite body. 4 . 4. The composite supporting heat dissipation structure of the portable electronic device according to claim 1, wherein the composite body is set as two, and the front shell and the rear shell of the component are arranged respectively and are parallel to each other. . 5. The composite supporting heat dissipation structure of the portable electronic device according to claim 4, wherein a circuit board is arranged in the said assembly, and the circuit board is provided with two mirrored wafers and a shielding case, each of which The shield covers each of the wafers respectively, and the cover surface of each shield respectively touches the front shell and the rear shell in the assembly and is arranged on both sides of the composite body. 6. The composite supporting heat dissipation structure of a portable electronic device according to claim 4, wherein a battery is provided in the assembly, and the battery respectively contacts the front case and the rear case in the assembly and is arranged in the composite body on both sides. 7. The composite supporting heat dissipation structure of a portable electronic device according to any one of claims 1 to 6, wherein the composite body is made of a composite material, and the composite material is composed of at least one layer of high-strength metal and A layer of high thermal conductivity material is compounded to form a composite material structure with high strength and high thermal conductivity. 8 . The composite supporting heat dissipation structure of a portable electronic device according to claim 7 , further comprising a liquid crystal screen and a touch panel, which are sequentially fixed on the component. 9 .