CN206525067U - The composite support radiator structure of portable electronic devices - Google Patents
The composite support radiator structure of portable electronic devices Download PDFInfo
- Publication number
- CN206525067U CN206525067U CN201621144764.9U CN201621144764U CN206525067U CN 206525067 U CN206525067 U CN 206525067U CN 201621144764 U CN201621144764 U CN 201621144764U CN 206525067 U CN206525067 U CN 206525067U
- Authority
- CN
- China
- Prior art keywords
- electronic devices
- portable electronic
- radiator structure
- component
- rear shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 45
- 239000000463 material Substances 0.000 claims abstract description 8
- 238000001816 cooling Methods 0.000 claims abstract description 6
- 238000007493 shaping process Methods 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000004973 liquid crystal related substance Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 239000011469 building brick Substances 0.000 abstract description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910001069 Ti alloy Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910001338 liquidmetal Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 244000062793 Sorghum vulgare Species 0.000 description 1
- 206010053615 Thermal burn Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 235000019713 millet Nutrition 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Details Of Aerials (AREA)
Abstract
A kind of composite support radiator structure of portable electronic devices, including：One is applied to the fore shell and rear shell of portable electronic devices, and fore shell is corresponding with rear shell phase is combined into a component, on fore shell and rear shell on component, at least it is integrally formed provided with a complex being made up of two layers or more different rigidity material, and its complete type body of shaping with frame, the main support body of fore shell and rear shell is made, a composite support radiator structure is formed, so that fore shell is correspondingly formed a cooling system with rear shell phase.Radiated in this composite, portable electronic devices are after a long time use, the heat distributed by electronic building brick thermal source is via composite support radiator structure uniformly dispersing in whole cavity, again heat exchange is carried out with the external world, opposing electronic device DIE Temperature, which has, clearly to be reduced, do not result in body hot or when machine problem, electronic equipment performance can be given full play to relatively, allow consumer to have more preferable man-machine experience.
Description
Technical field
The utility model is the composite support radiator structure about a kind of portable electronic devices, and it is radiated with composite support
Structure is applied to portable electronic devices, makes portable electronic devices solve the problems, such as, because body is hot or works as machine, to fill relatively
Electronic equipment performance is waved in distribution, allows consumer to have more preferable man-machine experience.
Background technology
, after via long-time use, are then locally there is superheating phenomenon, this shows in presently commercially available portable electronic devices
As not only causing the reduction of electronic equipment performance, body is hot or when machine problem.
Secondary person, because the appearance and modeling of current portable electronic devices requires that thickness is excessively thin, space to be preserved is not to biography
Thermal convection current (obtaining convection current using fan) in system heat transfer method, so just only remaining heat transfer and heat radiation two ways can
It is employed, presently commercially available portable electronic devices are to utilize to attach near heating sources mostly, and such as graphite flake, copper foil are contour compound
Material is to reach radiating and cooling purpose, from commercially available Meizu, millet, from the point of view of the brand large-screen mobile phone such as Huawei, has no significantly radiating drop
Temp effect, local temperature still remain high, the phenomenon not only cause electronic equipment performance reduction, body it is hot or when machine problem very
To making consumer's sense of touch temperature too high or even scalding user, consumer in more complaint.Therefore the present inventor is in view of upper
Problem points are taken off, a kind of composite support radiator structure of portable electronic devices, the problem to be solved by the utility model is conceived.
Utility model content
Technical problem underlying to be solved in the utility model is, overcomes the drawbacks described above of prior art presence, and carries
For a kind of composite support radiator structure of portable electronic devices, it is applied to that electronics dress can be carried with composite support radiator structure
Put, make portable electronic devices solve the problems, such as, because body is hot or works as machine, electronic equipment performance can be given full play to relatively, allows and disappears
Fei Zheyou preferably man-machine experience；It is integrated using the complex and housing of high heat conduction and high rigidity is radiated and is supported, and is had
Radiating thin film manner is not attached in market, the maximum area of dissipation under overcoming product structure complicated.
The utility model solves the technical scheme that its technical problem used：
A kind of composite support radiator structure of portable electronic devices, including：One is applied to before portable electronic devices
Shell and rear shell, and the fore shell is corresponding with the rear shell phase is combined into a component, it is characterised in that：Fore shell and rear shell on the component
On, at least it is integrally formed provided with a complex being made up of two layers or more different rigidity material, and its shaping has side
The complete type body of frame, makes the fore shell and the main support body of the rear shell, forms a composite support radiator structure, so that should
Fore shell is correspondingly formed a cooling system with the rear shell phase.
According to feature is before taken off, it is provided with the component on a circuit board, the circuit board at least provided with a chip and radome,
The radome covers the chip, and the cover of the radome contacts the side in the component with the complex.
According to feature is before taken off, a battery is provided with the component, the battery is in the side with the complex.
According to feature is before taken off, the complex is set as two, and sets the fore shell and rear shell for being located at the component respectively and relative
Should be in parallel.
According to before taking off feature, a circuit board is provided with the component, chip and shielding of the circuit board provided with two mirrors
Cover, respectively the radome covers the respectively chip respectively, and respectively the cover of the radome contacts fore shell in the component, rear shell simultaneously respectively
Located at the both sides of the complex.
According to before taking off feature, a battery is provided with the component, the battery contacts fore shell in the component, rear shell and set respectively
In the both sides of the complex.
According to feature is before taken off, the complex is made up of composite, and the composite is by least one layer of high duty metal
And floor height thermally conductive materials institute composite molding, to constitute the composite structure of a high intensity and high heat conduction.
According to feature is before taken off, the high thermal conductive metallic is closed by copper, aluminium, titanium, silver, gold, copper alloy, aluminium alloy, silver alloy, titanium
Golden any of which or its combined type are constituted；The high duty metal is by stainless steel, aluminium, titanium, aluminium alloy, titanium alloy, liquid metal
Any of which or its combined type are constituted.
According to feature, in addition to a liquid crystal screen and contact panel is before taken off, it is sequentially fixed on the assembly.
By technological means is above taken off, the heat that thermal source produced by the utility model solves portable electronic devices is distributed is passed through
By composite support radiator structure, the problem of not resulting in housing hot-spot solves the chip of portable electronic devices in work
When produced main heating source heat pass through housing and scald user, allow consumer to have more preferable man-machine experience.
The beneficial effects of the utility model are that it is applied to portable electronic devices with composite support radiator structure, and making can
Carrying electronic devices solve the problems, such as, because body is hot or works as machine, electronic equipment performance can be given full play to relatively, allows consumer to have
More preferable man-machine experience；It is integrated using the complex and housing of high heat conduction and high rigidity is radiated and is supported, and is different from city
Field attaches radiating thin film manner, the maximum area of dissipation under overcoming product structure complicated.
Brief description of the drawings
The utility model is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is the schematic diagram of the utility model embodiment.
Fig. 2 is the schematic diagram of the another embodiment of the utility model.
Fig. 3 is the schematic diagram of another embodiment of the utility model.
Fig. 4 A are the shaping schematic views of the utility model fore shell and composite.
Fig. 4 B are the shaping schematic views of shell and composite after the utility model.
Label declaration in figure：
10 portable electronic devices
11 components
111 fore shells
Shell after 112
12 circuit boards
121 chips
122 radomes
13 batteries
14 liquid crystal screens
15 contact panels
20 composite support radiator structures
21 complexs
211st, 212 rigid material
30 cooling systems
Embodiment
First, refer to shown in Fig. 1~Fig. 3 and Fig. 4 A, Fig. 4 B, a kind of portable electronic devices of the utility model it is compound
The preferred embodiment of support radiator structure includes：One is applied to the fore shell 111 and rear shell 112 of portable electronic devices 10, and should
Fore shell 111 and the corresponding combination of rear shell 112, form a component 11, it is characterised in that：Fore shell 111 on the component 11 and after
On shell 112, at least it is integrally formed provided with a complex 21 being made up of two layers or more different rigidity material 211,212,
And its complete type body of shaping with frame (plastics or metal), make the main support of the fore shell 111 and the rear shell 112
Body, forms a composite support radiator structure 20, so that the fore shell 111 is corresponding with the rear shell 112 to form a cooling system 30.
Hold, the complex 21 is made up of composite, the composite is by least one layer of high duty metal and one layer
The composite molding of high conductivity material institute, to constitute the composite structure of a high intensity and high heat conduction, and the high thermal conductive metallic
It is made up of copper, aluminium, titanium, silver, gold, copper alloy, aluminium alloy, silver alloy, titanium alloy any of which or its combined type, and this is high-strength
Degree metal is made up of stainless steel, aluminium, titanium, aluminium alloy, titanium alloy, liquid metal any of which or its combined type, the present embodiment
In, as shown in figure 1, its complex 21 is located at the fore shell 111 of the component 11.
Or as shown in Fig. 2 in another possible embodiments, its complex 21 is located at the rear shell 112 of the component 11, such one
Come, the fore shell 111 is two differences and independent individual with the rear shell 112, the composite support radiator structure 20 is may be provided in this
Fore shell 111 or the rear shell 112, but it is not limited to this.
Hold, be provided with the component 11 on a circuit board 12, the circuit board 12 at least provided with a chip 121 and radome
122, the radome 122 covers the chip 121, and the cover of the radome 122 is contacted in the component 11 with the complex 21
Side, and the component 11 in be provided with a battery 13, the battery 13 is in the side with the complex 21, in other words, in the crystalline substance
The top face fore shell of piece 121 (middle plate) 111 and rear shell 112, are radiated and are propped up using the complex 21 of high heat conduction and high rigidity
Support, is different from market and attaches radiating thin film manner, the maximum area of dissipation under overcoming product structure complicated, but is not limited to this.
Again as shown in figure 3, in another possible embodiments, its complex 21 is set as two, and set respectively positioned at this
The fore shell 111 and rear shell 112 of component 11 and corresponding in parallel, consequently, it is possible to the fore shell 111 and the rear shell 112 be two not
Same and independent individual, makes the composite support radiator structure 20 to be respectively provided at the fore shell 111 and the rear shell 112, but do not limit
In this.
Hold, be provided with a circuit board 12 in the component 11, chip 121 and shielding of the circuit board 12 provided with two mirrors
Cover 122, respectively the radome 122 covers the respectively chip 121 respectively, and respectively the cover of the radome 122 contacts the component 11 respectively
Interior fore shell 111, rear shell 112 and the both sides with the complex, and the component are interior provided with a battery, and the battery contacts this respectively
Fore shell, rear shell in component and located at the both sides of the complex, in other words, in the top face fore shell of chip 121 (middle plate) 111
And rear shell 112, radiated and supported using the complex 21 of high heat conduction and high rigidity, be different from market and attach radiating film side
Formula, the maximum area of dissipation under overcoming product structure complicated, but it is not limited to this.In addition, also including a liquid crystal screen and touch-control
Panel, it is sequentially fixed on the assembly.
Based on above-mentioned composition, composite support radiator structure 20 of the present utility model can insert the fore shell 111 and rear shell simultaneously
112, radiated in this complex 21 formation radiator structure, the electronic building brick thermal source (such as chip 121, battery 13) is distributed
Heat via the uniformly dispersing of composite support radiator structure 20 on the fore shell 111 in whole cavity, then by the rear shell 112
Composite support radiator structure 20 and extraneous progress heat exchange, it is relative to make the electronic building brick thermal source (such as chip 121, battery 13)
Temperature have and clearly reduce, it is hot or when machine problem not result in body, and electronic equipment performance can be given full play to relatively, allows and disappears
Fei Zheyou preferably man-machine experience.
It is described above, only it is preferred embodiment of the present utility model, not makees any formal to the utility model
Limitation, it is every according to technical spirit of the present utility model above example is made it is any it is simple modification, equivalent variations with
Modification, in the range of still falling within technical solutions of the utility model.
In summary, the utility model complies fully with industry development in structure design, using in practicality and cost benefit
Required and disclosed structure is also that, with unprecedented innovative structure, with novelty, creativeness, practicality, meeting has
The regulation of utility model patent important document is closed, therefore lifts application in accordance with the law.
Claims (8)
1. a kind of composite support radiator structure of portable electronic devices, including：One is applied to the fore shell of portable electronic devices
And rear shell, and the fore shell is corresponding with the rear shell phase is combined into a component, it is characterised in that：
On fore shell and rear shell on the component, at least it is integrally formed and is made up of provided with one two layers or more different rigidity material
Complex, and its complete type body of shaping with frame makes the fore shell and the main support body of the rear shell, forms one
Composite support radiator structure, so that the fore shell is correspondingly formed a cooling system with the rear shell phase.
2. the composite support radiator structure of portable electronic devices according to claim 1, it is characterised in that the component
A circuit board is inside provided with, at least provided with a chip and radome on the circuit board, the radome covers the chip, and the shielding
The cover of cover contacts the side in the component with the complex.
3. the composite support radiator structure of portable electronic devices according to claim 1, it is characterised in that the component
A battery is inside provided with, the battery is in the side with the complex.
4. the composite support radiator structure of portable electronic devices according to claim 1, it is characterised in that described compound
Body is set as two, and sets fore shell and rear shell and positioned at the component corresponding in parallel respectively.
5. the composite support radiator structure of portable electronic devices according to claim 4, it is characterised in that the component
A circuit board is inside provided with, the circuit board is provided with the chip and radome of two mirrors, respectively the radome covers the respectively crystalline substance respectively
Piece, and respectively the cover of the radome contacts fore shell, rear shell and the both sides for being located at the complex in the component respectively.
6. the composite support radiator structure of portable electronic devices according to claim 4, it is characterised in that the component
A battery is inside provided with, the battery contacts fore shell, rear shell and the both sides for being located at the complex in the component respectively.
7. the composite support radiator structure of portable electronic devices according to any one of claim 1 to 6, its feature exists
In the complex is made up of composite, and the composite is by least one layer of high duty metal and a floor height thermal conductivity material
Institute's composite molding is expected, to constitute the composite structure of a high intensity and high heat conduction.
8. the composite support radiator structure of portable electronic devices according to claim 7, it is characterised in that also including one
Liquid crystal screen and contact panel, it is sequentially fixed on the assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621144764.9U CN206525067U (en) | 2016-10-21 | 2016-10-21 | The composite support radiator structure of portable electronic devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621144764.9U CN206525067U (en) | 2016-10-21 | 2016-10-21 | The composite support radiator structure of portable electronic devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206525067U true CN206525067U (en) | 2017-09-26 |
Family
ID=59888102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621144764.9U Withdrawn - After Issue CN206525067U (en) | 2016-10-21 | 2016-10-21 | The composite support radiator structure of portable electronic devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206525067U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107979943A (en) * | 2016-10-21 | 2018-05-01 | 东莞爵士先进电子应用材料有限公司 | The composite support radiator structure of portable electronic devices |
-
2016
- 2016-10-21 CN CN201621144764.9U patent/CN206525067U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107979943A (en) * | 2016-10-21 | 2018-05-01 | 东莞爵士先进电子应用材料有限公司 | The composite support radiator structure of portable electronic devices |
| CN107979943B (en) * | 2016-10-21 | 2022-04-19 | 深圳市为什新材料科技有限公司 | Composite support heat radiation structure capable of carrying electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210427 Address after: 703, block B, Changxing building, 4002 Huaqiang North Road, Yuanling street, Futian District, Shenzhen, Guangdong 518000 Patentee after: Shenzhen Weishi New Material Technology Co.,Ltd. Address before: Liaobu Town, Guangdong city of Dongguan province 523421 Liu Wu Xiang Village Fulailu No. 51 Patentee before: DONGGUAN JAZZ ADVANCED ELECTRONIC APPLICATION MATERIALS Co.,Ltd. |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20170926 Effective date of abandoning: 20220419 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20170926 Effective date of abandoning: 20220419 |