CN107509381B - A kind of production method of screening cover, screening cover and mobile terminal - Google Patents
A kind of production method of screening cover, screening cover and mobile terminal Download PDFInfo
- Publication number
- CN107509381B CN107509381B CN201710833814.7A CN201710833814A CN107509381B CN 107509381 B CN107509381 B CN 107509381B CN 201710833814 A CN201710833814 A CN 201710833814A CN 107509381 B CN107509381 B CN 107509381B
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- China
- Prior art keywords
- coverboard
- framework
- screening cover
- accommodating chamber
- heat absorption
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The present invention provides a kind of production method of screening cover, screening cover and mobile terminal, by making upper coverboard and lower coverboard respectively, again by upper coverboard and the contraposition of lower coverboard at box, and the injection heat absorption phase-change material in the accommodating chamber that upper coverboard and lower coverboard surround, to form screening cover, not only there is preferable heat dissipation performance, and since the heat absorption phase-change material in screening cover can be absorbed in phase transformation or discharge a large amount of heat, so as to so that the temperature rising of the outer surface of screening cover is slower, mobile terminal local temperature can be greatly avoided to rise too fast and form hot spot, the final temperature of mobile terminal can be reduced.
Description
Technical field
The present invention relates to electronic technology field more particularly to a kind of production methods of screening cover, screening cover and mobile terminal.
Background technique
It improves with the development of science and technology, electronic technology is developed rapidly and significant progress, and electronic product is popularized
Also a unprecedented height, especially mobile terminal have been increased into indispensable a part in for people's lives.
More and more complete with functions various in mobile terminal, the precision of electronic component is increasingly in mobile terminal
Height, number of electronic components is more and more, in order to preferably protect various precision electronic elements, and guarantees electronic component not by it
Metallic shield lid can be arranged in the interference of his electronic component on electronic component mostly, on the one hand, can play good shielding and make
With, on the other hand can also play certain heat spreading function, but existing screening cover, be mostly one layer of metal plate of setting or
There are the security risks such as damage electronic component in phenomena such as metal mesh etc., heat dissipation effect is poor, easily overheats.
Summary of the invention
The embodiment of the present invention provides production method, screening cover and the mobile terminal of a kind of screening cover, to solve existing shielding
Phenomena such as lid heat dissipation effect is poor, easily overheats there are problems that damaging the security risks such as electronic component.
The embodiment of the invention provides a kind of production method of screening cover, the screening cover is applied to the electronics of mobile terminal
Device, which comprises
The upper coverboard and lower coverboard of screening cover are made respectively；
By the upper coverboard and the lower coverboard contraposition at box, so as to surround one between the upper coverboard and the lower coverboard
Accommodating chamber；
The injection heat absorption phase-change material into the accommodating chamber.
The embodiment of the present invention also provides a kind of screening cover, and the screening cover includes upper coverboard, lower coverboard, the first framework, side
Wall and heat absorption phase-change material, the upper coverboard is oppositely arranged with the lower coverboard, first framework be sandwiched in the upper coverboard and
Between the lower coverboard, the side wall is located at side of the lower coverboard far from the upper coverboard, and the heat absorption phase-change material is filled out
It fills in the accommodating chamber that the upper coverboard, the lower coverboard and first framework surround jointly.
The embodiment of the present invention also provides a kind of mobile terminal, and the mobile terminal includes screening cover, and the screening cover includes
Upper coverboard, lower coverboard, the first framework, side wall and heat absorption phase-change material, the upper coverboard is oppositely arranged with the lower coverboard, described
First framework is sandwiched between the upper coverboard and the lower coverboard, and the side wall is located at the lower coverboard far from the upper coverboard
Side, the heat absorption phase-change material are filled in the receiving that the upper coverboard, the lower coverboard and first framework surround jointly
In chamber.
Production method, screening cover and the mobile terminal of screening cover provided in an embodiment of the present invention make screening cover respectively
Upper coverboard and lower coverboard；By the upper coverboard and lower coverboard contraposition at box so that the upper coverboard and the lower coverboard it
Between surround an accommodating chamber；The injection heat absorption phase-change material into the accommodating chamber.In this way, by making upper coverboard and lower casing respectively
Plate, then by upper coverboard and the contraposition of lower coverboard at box, and the injection heat absorption phase transformation material in the accommodating chamber that upper coverboard and lower coverboard surround
Material not only has preferable heat dissipation performance, but also since the heat absorption phase-change material in screening cover is in phase transformation to form screening cover
When can be absorbed or discharge a large amount of heat, so as to can greatly avoid so that the temperature of the outer surface of screening cover rises slower
Mobile terminal local temperature rises too fast and forms hot spot, can reduce the final temperature of mobile terminal.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, needed in being described below to the embodiment of the present invention
Attached drawing to be used is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention,
For those of ordinary skill in the art, without any creative labor, it can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the perspective view for the mobile terminal that a preferred embodiment of the present invention provides；
Fig. 2 is the top view of the circuit board in mobile terminal shown in Fig. 1；
Fig. 3 is the sectional view in Fig. 2 shown in III-III；
Fig. 4 is the sectional view for the screening cover that another embodiment of the present invention provides；
Fig. 5 is the sectional view for the screening cover that a further embodiment of this invention provides；
Fig. 6 is the flow chart of the production method of screening cover shown in Fig. 3；
Fig. 6 to Figure 12 is the fragmentary cross-sectional view in the manufacturing process of screening cover shown in Fig. 3.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
Referring to Fig. 1, Fig. 1 is the perspective view for the mobile terminal that a preferred embodiment of the present invention provides, Fig. 2 is institute in Fig. 1
Show the top view of the circuit board in mobile terminal.As shown in Figures 1 and 2, the mobile terminal 100 includes display screen 110, shell
120 and circuit board 130, the display screen 110 setting nested with the shell 120, and the shell 120 is described aobvious for carrying
Display screen 110, the shell 120 surround an accommodating chamber with the display screen 110 jointly, and the circuit board 130 is contained in described
In the accommodating chamber that shell 120 and the display screen 110 surround, wherein the circuit board 130 is mainly used for carrying described mobile whole
The electronic components such as various circuit modules, cabling and the battery at end 100.The mobile terminal 100 further includes a viewing area 101 and encloses
Around the peripheral region 102 of the viewing area 101, the viewing area 101 primarily can be used for realizing the display of the mobile terminal 100
Output function, the peripheral region 102 be mainly used for providing space to setting button, receiver, sounding device, camera module,
Infrared sensor and its circuit trace etc..
The mobile terminal 100 further includes the conventional structures such as flash lamp, volume adjustment key and power key, is not gone to live in the household of one's in-laws on getting married one by one herein
It states.
In the embodiment of the present invention, above-mentioned mobile terminal can it is any for example: mobile phone, tablet computer (Tablet Personal
Computer), laptop computer (Laptop Computer), personal digital assistant (personal digital
Assistant, abbreviation PDA), mobile Internet access device (Mobile Internet Device, MID) or wearable device
The mobile terminal of (Wearable Device) etc..In addition, although above-mentioned illustrate to mobile terminal, only as an example
Explanation, it is not limited to above-mentioned electronic equipment, it is all that screening cover can be used on the electronic components such as circuit module or circuit board
Electronic equipment, may be embodied in the protection scope of the mobile terminal.
The circuit board 130 can be a part of the mainboard of the mobile terminal 100, be also possible to the electricity being separately provided
Road plate, (figure is not for the processor (not shown) that the mobile terminal 100 can be set on the circuit board 130, various circuits
Show) and the various functional module groups 140 (shown in Fig. 3) etc. for realizing different function.
It is the sectional view in Fig. 2 shown in III-III please refer to Fig. 3, Fig. 3.As shown in figure 3, the mobile terminal
100 further include screening cover 150, and the screening cover 150 is located in the functional module group 140, and covers on the functional module group 140
On.The screening cover 150 includes upper coverboard 151, lower coverboard 152, the first framework 153, side wall 154 and heat absorption phase-change material 155,
The upper coverboard 151 is oppositely arranged with the lower coverboard 152, first framework 153 be sandwiched in the upper coverboard 151 and it is described under
Between coverboard 152, and it is vertical with the bottom plate of the upper coverboard 151 and the lower coverboard 152 respectively connect, the upper coverboard 151,
The lower coverboard 152 and first framework 153 surround an accommodating chamber jointly, and the heat absorption phase-change material 155 is filled in described
In the accommodating chamber that upper coverboard 151, the lower coverboard 152 and first framework 153 surround jointly.
In addition, the heat dissipation such as heat-conducting glue and graphite flake can also be arranged between the screening cover 150 and the functional module group 140
Body.
In present embodiment, the heat absorption phase-change material 155 is the heat absorption phase-change material with high enthalpy.Preferably, institute
The enthalpy for stating heat absorption phase-change material 155 is greater than 100J/g.
The side wall 154 is located at side of the lower coverboard 152 far from the upper coverboard 151, and with the lower coverboard 152
A box-like that do not cover is surrounded, the side wall 154 is used for after the screening cover 150 covers on the functional module group 140, by institute
Screening cover 150 is stated to be fixed on the circuit board 130.
Wherein, first framework 153, which can be, vertically connects and is fixed on the bottom plate of the upper coverboard 151, and by
The edge of the bottom plate of the upper coverboard 151 extends towards the lower coverboard 152, is also possible to vertically connect and be fixed on institute
On the bottom plate for stating lower coverboard 152, and extended by the edge of the bottom plate of the lower coverboard 152 towards the upper coverboard 151, also
The edge that can be the bottom plate of the upper coverboard 151 has extended to form the first sub- framework, the lower casing towards the lower coverboard 152
The edge of the bottom plate of plate 152 has extended to form the second sub- framework towards the upper coverboard 151, the first sub- framework and described the
Two sub- frameworks collectively constitute first framework 153.
In this way, not only having preferable by injecting heat absorption phase-change material in the accommodating chamber that upper coverboard and lower coverboard surround
Heat dissipation performance, and since the heat absorption phase-change material in screening cover can be absorbed in phase transformation or discharge a large amount of heat, thus
Increase the temperature of the outer surface of screening cover slower, mobile terminal local temperature can greatly be avoided to rise too fast and formed
Hot spot can reduce the final temperature of mobile terminal.
Please refer to Fig. 4, Fig. 4 is the sectional view for the screening cover that another embodiment of the present invention provides.As shown in Figure 4
Screening cover 450, the difference is that, the screening cover 450 of embodiment of the present invention also wraps with screening cover 150 shown in Fig. 3
Include upper cover plate 456, lower cover plate 457, the first capillary structure 458 and the second capillary structure 459, the upper cover plate 456 and upper coverboard
451 are oppositely arranged, and the upper cover plate 456 and upper coverboard 451, and are sandwiched in the upper cover plate 456 and the upper coverboard 451
Between side wall surround the first accommodating cavity jointly, first capillary structure 458 is placed in first accommodating cavity, and in institute
It states and is additionally provided with liquid radiating medium in the first accommodating cavity, to form the first conductive structure.
In present embodiment, the liquid radiating medium is the heat eliminating mediums such as water or methanol.
The lower cover plate 457 is oppositely arranged with lower coverboard 452, and the lower cover plate 457 and the lower coverboard 452, with
And the side wall being sandwiched between the lower cover plate 457 and lower coverboard 452 surrounds the second accommodating cavity, second capillary structure jointly
459 are placed in second accommodating cavity, and are additionally provided with liquid radiating medium in second accommodating cavity, to form the
Two conductive structures.
In present embodiment, first conductive structure and second conductive structure are vacuum structure, and described first
The heat-conducting effect of conductive structure and second conductive structure can reach 10000W/mK.
In present embodiment, the upper cover plate 456 is to be located at side of the upper coverboard 451 far from the lower coverboard 452,
However, it is not limited to this, and in other embodiments, the upper cover plate 456 can also be positioned at the upper coverboard 451 close to institute
State the side of lower coverboard 452.
In present embodiment, the lower cover plate 457 is to be located at side of the lower coverboard 452 far from the upper coverboard 451,
However, it is not limited to this, and in other embodiments, the lower cover plate 457 can also be positioned at the lower coverboard 452 close to institute
State the side of coverboard 451.
It is to be respectively arranged with the first conductive structure and in upper coverboard side and the lower coverboard side in present embodiment
Two conductive structures, however, it is not limited to this, in other embodiments, the first thermally conductive knot only can also be arranged in upper coverboard side
Structure, or the second conductive structure only is set in lower coverboard side, it is not limited with secondary.
In this way, by setting upper cover plate and lower cover plate on screening cover, in upper coverboard side and lower coverboard side difference
The first conductive structure and the second conductive structure are formed, the conduction of temperature can be accelerated, to accelerate to radiate.
Please refer to Fig. 5, Fig. 5 is the sectional view for the screening cover that a further embodiment of this invention provides.As shown in Figure 5
Screening cover 550, with screening cover 150 shown in Fig. 3 the difference is that, embodiment of the present invention provide screening cover 550
Including second framework 5510 and third capillary structure 5511, the second framework 5510 be sandwiched in coverboard 551 and lower coverboard 552 it
Between, and it is vertical with the bottom plate of the upper coverboard 551 and the lower coverboard 552 respectively connect, the second framework 5510 and first
Framework 553 is arranged concentrically, the upper coverboard 551, the lower coverboard 552, first framework 553 and the second framework 5510
Surround an accommodating chamber jointly, the third capillary structure 5511 be located at first framework 553 and the second framework 5510 it
Between, and be contained in the accommodating chamber, and be additionally provided with liquid radiating medium in second accommodating cavity, to form third
Conductive structure.
Wherein, the accommodating chamber by the second framework interval is arranged around the accommodating chamber and with the accommodating chamber.
In present embodiment, the third conductive structure is vacuum structure, and the heat-conducting effect of the third conductive structure can
Reach 10000W/mK.
Wherein, the second framework 5510, which can be, vertically connects and is fixed on the bottom plate of the upper coverboard 551, and by
The edge of the bottom plate of the upper coverboard 551 extends towards the lower coverboard 552, is also possible to vertically connect and be fixed on institute
On the bottom plate for stating lower coverboard 552, and extended by the edge of the bottom plate of the lower coverboard 552 towards the upper coverboard 551, also
The edge that can be the bottom plate of the upper coverboard 551 has extended to form the sub- framework of third, the lower casing towards the lower coverboard 552
The edge of the bottom plate of plate 552 has extended to form the 4th sub- framework towards the upper coverboard 551, the sub- framework of third and described the
Four sub- frameworks collectively constitute the second framework 5510.
In this way, on screening cover by setting second framework, between upper coverboard and lower coverboard and accommodating chamber four
Week forms third conductive structure, can accelerate the conduction of temperature, to accelerate to radiate.
Fig. 6 to Figure 12 is please referred to, Fig. 6 is the flow chart of the production method of screening cover shown in Fig. 3, and Fig. 6 to Figure 12 is
Fragmentary cross-sectional view in the manufacturing process of screening cover shown in Fig. 3.As shown in Figure 6, which comprises
Step 601, the upper coverboard and lower coverboard for making screening cover respectively.
In the step, upper coverboard 751 and lower coverboard 752 are made respectively first.
Specifically, can be using a metal material, the upper coverboard 751 of formation is directly processed by panel cutting machine, is made
It with a metal material, can machine to form a bottom plate by punching press, and formation is connected vertically with the bottom plate on bottom plate
First framework 753 and side wall 754, to form lower coverboard 752, wherein first framework 753 and the side wall 754 divide
Not Wei Yu the lower coverboard 752 bottom plate two sides, and it is vertical with the bottom plate of the lower coverboard 752 respectively connect, in Fig. 7
It is shown.
It is to form first framework 753 on the bottom plate of the lower coverboard 752, but do not limit in present embodiment
In this, in other embodiments, it is also possible to form first framework 753 on the bottom plate of the upper coverboard 751, or
It can also be and extended to form the sub- framework of third at the edge of the bottom plate of the upper coverboard 751, the bottom plate of the lower coverboard 752
Edge has extended to form the 4th sub- framework, and the first sub- framework and the described second sub- framework collectively constitute first framework
753。
In present embodiment, the material of the upper coverboard 751 and the lower coverboard 752 is the metal with thermal conductivity, excellent
Choosing, the material of the upper coverboard 751 and the lower coverboard 752 is foreign white copper.
Step 602 aligns the upper coverboard 751 and the lower coverboard 752 at box, so that the upper coverboard 751 and institute
It states and surrounds an accommodating chamber between lower coverboard 752.
In the step, after production forms the upper coverboard 751 and the lower coverboard 752, it can by the upper casing
Plate 751 and the lower coverboard 752 contraposition are at box, so as to surround a receiving between the upper coverboard 751 and the lower coverboard 752
Chamber.
Specifically, can be using welding technique or dispensing bonding technology, first framework 753 is welded and fixed or
Person is bonded and fixed on the upper coverboard 751, to the upper coverboard 751 and the lower coverboard 752 are welded and fixed, so that institute
It states coverboard 751 to be oppositely arranged with the lower coverboard 752, first framework 73 is sandwiched in the upper coverboard 751 and the lower casing
Between plate 752, and it is vertical with the bottom plate of the upper coverboard 751 and the lower coverboard 752 respectively and be fixedly connected, the upper coverboard
751, the lower coverboard 752 and first framework 753 surround an accommodating chamber jointly.
Injection heat absorption phase-change material in step 603, Xiang Suoshu accommodating chamber.
In the step, the receiving that is surrounded jointly to the upper coverboard 751, the lower coverboard 752 and first framework 753
Injection heat absorption phase-change material 755 in chamber, to form the screening cover 750 with excellent heat dispersion performance, as shown in Figure 8.
Wherein, the heat absorption phase-change material 755 is the heat absorption phase-change material with high enthalpy.Preferably, the heat absorption phase
The enthalpy for becoming material 155 is greater than 100J/g.
Optionally, after step 203, which comprises
Detect whether the screening cover has the heat absorption phase-change material to ooze out；If there is no the heat absorption phase in the screening cover
Become material exudation, determines that the screening cover is qualified.
It, can be to the screen after injection heat absorption phase-change material 755 forms screening cover 750 in the step
It covers lid 750 to be detected, detects whether the screening cover 750 has the heat absorption phase-change material 755 to ooze out, to detect the shielding
Whether lid 750 is qualified, if not having the heat absorption phase-change material 755 to stretch out in the screening cover 750, so that it may determine the screen
It is qualified to cover lid 750, is qualified products.
Specifically, detecting whether the screening cover 750 has the heat absorption phase-change material 755 to ooze out, can be the screen
It covers lid 750 to be placed in the environment that temperature is 55 degrees Celsius to 65 degrees Celsius, continues 25 minutes to 35 minutes, to determine whether
The heat absorption phase-change material 755 oozes out.
Preferably, the temperature for detecting environment is 60 degrees Celsius, and the duration is 30 minutes.
Optionally, after step 601, which comprises
The first capillary structure 758 is formed on the one side of the upper coverboard 751；A upper cover plate 756 is made, and will be described
Upper cover plate 756 and the upper coverboard 751 contraposition at box so that first capillary structure 758 be placed in the upper coverboard 751 with
In the first accommodating cavity surrounded between the upper cover plate 756；Liquid radiating medium is injected into first accommodating cavity.
In the step, after forming upper coverboard 751, first can be formed on the one side of the upper coverboard 751
Capillary structure 758, then make and to form a upper cover plate 756, then the upper cover plate 756 and the upper coverboard 751 are aligned into box,
So that the upper cover plate 756 surrounds the one one accommodating cavity with the upper coverboard 751 jointly, and make first capillary structure
758 are placed in the first accommodating cavity that the upper cover plate 756 is surrounded with the upper coverboard 751, then to first accommodating cavity
Middle injection liquid radiating medium, so that the first conductive structure is formed, as shown in Figure 9, thus passing through step 602 and step
After 603, it can make to form screening cover as shown in Figure 4.
Specifically, while forming upper cover plate 756, it can be by being stamped and formed out in the upper cover plate 756
When forming side plate on bottom plate, and making the upper cover plate 756 with the upper contraposition of coverboard 751 at box, the bottom of the upper cover plate 756
Plate, the upper coverboard 751 and the side plate on the bottom plate of the upper cover plate 756 surround first accommodating cavity jointly.
In present embodiment, the side plate is formed on the bottom plate of the upper cover plate 756, and however, it is not limited to this, In
In other embodiments, the side plate, which can also be, to be formed on the upper coverboard 751.
It is to form first capillary structure 758 on the upper coverboard 751, but be not limited in present embodiment
This can also be in other embodiments and form first capillary structure 758 on the upper cover plate 756.
Wherein, the liquid radiating medium is the heat eliminating mediums such as water or methanol.
In present embodiment, first conductive structure is vacuum structure, and the heat-conducting effect of first conductive structure can
Reach 10000W/mK.
In this way, by setting upper cover plate and lower cover plate on screening cover, to form the first thermally conductive knot in the side of upper coverboard
Structure, can accelerate the conduction of temperature, to accelerate to radiate.
Optionally, after step 601, which comprises
A lower cover plate is made, and forms the second capillary structure on the one side of the lower cover plate；By the lower cover plate with
The lower coverboard contraposition is at box, so that second capillary structure is placed in and surrounds between the lower cover plate and the lower coverboard
In second accommodating cavity；Liquid radiating medium is injected into second accommodating cavity.
In the step, after forming lower coverboard 752, second can be formed on the one side of the lower coverboard 752
Capillary structure 759, then make and to form lower cover plate 757, then by the lower cover plate 757 and the lower contraposition of coverboard 752 at box, with
So that the lower cover plate 757 is surrounded the one one accommodating cavity jointly with the lower coverboard 752, and makes second capillary structure 759
It is placed in the second accommodating cavity that the lower cover plate 757 is surrounded with the lower coverboard 752, is then infused into second accommodating cavity
Enter liquid radiating medium, to form the second conductive structure, as shown in Figure 10, thus by step 602 and step 603 it
Afterwards, it can make to form screening cover as shown in Figure 4.
Specifically, while forming upper cover plate 756, can directly be processed by panel cutting machine formed it is described under
Cover board 757, and when making the upper cover plate 756 with the upper contraposition of coverboard 751 at box, it is the bottom plate of the lower cover plate 757, described
Lower coverboard 752 surrounds second accommodating cavity with the side wall 754 on the bottom plate for being located at the lower coverboard 752 jointly.
It is to be enclosed jointly with the bottom plate of the lower cover plate 757, the lower coverboard 752 with the side wall 754 in present embodiment
At what is be illustrated for second accommodating cavity, however, it is not limited to this, in other embodiments, under can also be described
The bottom plate of cover board 757, the lower coverboard 752 surround second accommodating cavity with first framework 753 jointly.
It is second capillary structure 759 to be formed on the lower cover plate 757, but be not limited in present embodiment
This can also be in other embodiments and form second capillary structure 759 on the lower coverboard 752.
Wherein, the liquid radiating medium is the heat eliminating mediums such as water or methanol.
In present embodiment, second conductive structure is vacuum structure, and the heat-conducting effect of second conductive structure can
Reach 10000W/mK.
In this way, by setting upper cover plate and lower cover plate on screening cover, to form the second thermally conductive knot in the side of lower coverboard
Structure, can accelerate the conduction of temperature, to accelerate to radiate.
Optionally, in the specific steps for forming the lower coverboard, can also include:
It is formed on a bottom plate and bottom plate second framework connected vertically, first framework and the second framework
It is arranged concentrically；Third capillary structure is formed between first framework and the second framework.
In the step, formation and the bottom plate the first framework 753 connected vertically and side wall 754 on a bottom plate, from
And while forming lower coverboard 752, second framework 7510 can also be formed on the bottom plate of the lower coverboard 752, and make institute
It states second framework 7510 to be arranged concentrically with first framework 753, then in first framework 753 and the second framework
Third capillary structure 7511 is formed between 7510, it as shown in Figure 11, can be with thus after by step 602 and step 603
Production forms screening cover as shown in Figure 5.
It in this implementation, is illustrated for forming the second framework 7510 on the lower coverboard 752, but not office
It is limited to this, in other embodiments, is also possible to form the second framework 7510 on the upper coverboard 751, it can be with
It is to form the sub- framework of third in the upper coverboard 751, forms the 4th sub- framework, the sub- frame of third on the lower coverboard 752
Body and the 4th sub- framework collectively constitute the second framework 7510.
Further, step 602 includes:
By the upper coverboard 751 and the lower coverboard 752 contraposition at box, so that the upper coverboard 751, the lower coverboard
752, accommodating chamber and accommodating chamber are surrounded between first framework 753 and the second framework 7510, the accommodating chamber surrounds institute
It states accommodating chamber and is spaced with the accommodating chamber by the second framework 7510 and is arranged, wherein the third capillary structure 7511
In the accommodating chamber.
In the step, after production forms the upper coverboard 751 and lower coverboard 752, by the upper coverboard 751 and
The contraposition of lower coverboard 752 is at box, so that the upper coverboard 751 and the lower coverboard 752 are oppositely arranged, first framework
753 and the second framework 7510 be sandwiched between the upper coverboard 751 and the lower coverboard 752, it is the upper coverboard 751, described
Lower coverboard 752 and the second framework 7510 surround accommodating chamber, the upper coverboard 751, the lower coverboard 752, described jointly
One framework 753 and the second framework 7510 surround accommodating chamber jointly, and the accommodating chamber surrounds the accommodating chamber, and with it is described
Accommodating chamber is spaced by the second framework 7510 to be arranged, and the third capillary structure 7511 is located in the accommodating chamber, such as schemes
Shown in 12.
Further, step 603 includes:
Heat absorption phase-change material is injected into the accommodating chamber from the opening being arranged in the second framework；From the upper coverboard
And/or the opening being arranged on the lower coverboard injects liquid radiating medium into the accommodating chamber.
In the step, after by the upper coverboard 751 and the lower coverboard 752 contraposition at box, it can to each cavity
The corresponding substance of middle injection is infused in Xiang Suoshu accommodating chamber specifically, can be the opening being arranged from the second framework 7510
Enter to absorb heat phase-change material 755, the opening in the second framework 7510 is then carried out sealing treatment, then from the upper coverboard
751 and/or the lower coverboard 752 on the opening that is arranged liquid radiating medium is injected into the accommodating chamber, then will be described on
Opening on coverboard 751 and/or the lower coverboard 752 carries out sealing treatment, to form screening cover as shown in Figure 5.
In this way, on screening cover by setting second framework, between upper coverboard and lower coverboard and accommodating chamber four
Week forms third conductive structure, can accelerate the conduction of temperature, to accelerate to radiate.
Production method, screening cover and the mobile terminal of screening cover provided in an embodiment of the present invention make screening cover respectively
Upper coverboard and lower coverboard；By the upper coverboard and lower coverboard contraposition at box so that the upper coverboard and the lower coverboard it
Between surround an accommodating chamber；The injection heat absorption phase-change material into the accommodating chamber.In this way, by making upper coverboard and lower casing respectively
Plate, then by upper coverboard and the contraposition of lower coverboard at box, and the injection heat absorption phase transformation material in the accommodating chamber that upper coverboard and lower coverboard surround
Material not only has preferable heat dissipation performance, but also since the heat absorption phase-change material in screening cover is in phase transformation to form screening cover
When can be absorbed or discharge a large amount of heat, so as to can greatly avoid so that the temperature of the outer surface of screening cover rises slower
Mobile terminal local temperature rises too fast and forms hot spot, can reduce the final temperature of mobile terminal.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be subject to the protection scope in claims.
Claims (7)
1. a kind of production method of screening cover, which is characterized in that the screening cover is applied to the electronic device of mobile terminal, described
Method includes:
The upper coverboard and lower coverboard of screening cover are made respectively；
By the upper coverboard and the lower coverboard contraposition at box, so as to surround a receiving between the upper coverboard and the lower coverboard
Chamber；
The injection heat absorption phase-change material into the accommodating chamber；
Form the specific steps of the upper coverboard and/or the lower coverboard are as follows:
It is formed on a bottom plate and the bottom plate the first framework connected vertically and second framework, first framework and described the
Two frameworks are arranged concentrically；
Third capillary structure is formed between first framework and the second framework；
It is described by the upper coverboard and lower coverboard contraposition is at box, so as to surround one between the upper coverboard and the lower coverboard
The step of accommodating chamber, comprising:
By the upper coverboard and lower coverboard contraposition at box so that the upper coverboard, the lower coverboard, first framework and
Accommodating chamber and accommodating chamber are surrounded between the second framework, the accommodating chamber passes through around the accommodating chamber and with the accommodating chamber
The second framework interval setting, wherein the third capillary structure is located in the accommodating chamber；
Described the step of heat absorption phase-change material is injected into the accommodating chamber, comprising:
Heat absorption phase-change material is injected into the accommodating chamber from the opening being arranged in the second framework；
The opening being arranged from the upper coverboard and/or the lower coverboard injects liquid radiating medium into the accommodating chamber.
2. the method as described in claim 1, which is characterized in that in the injection heat absorption phase-change material into the accommodating chamber
After step, which comprises
Detect whether the screening cover has the heat absorption phase-change material to ooze out；
If there is no the heat absorption phase-change material to ooze out in the screening cover, determine that the screening cover is qualified.
3. method according to claim 2, which is characterized in that whether the detection screening cover has the heat absorption phase transformation material
The step of material exudation, comprising:
The screening cover is placed in the environment that temperature is 55 degrees Celsius to 65 degrees Celsius 25 minutes to 35 minutes, it is determined whether
There are phase change material exudations.
4. the method as described in claim 1, which is characterized in that in the upper coverboard and lower coverboard for making screening cover respectively
After step, which comprises
The first capillary structure is formed on the one side of the upper coverboard；
A upper cover plate is made, and by the upper cover plate and the upper coverboard contraposition at box, so that first capillary structure accommodates
In the first accommodating cavity surrounded between the upper coverboard and the upper cover plate；
Liquid radiating medium is injected into first accommodating cavity.
5. the method as described in claim 1, which is characterized in that in the upper coverboard and lower coverboard for making screening cover respectively
After step, which comprises
A lower cover plate is made, and forms the second capillary structure on the one side of the lower cover plate；
By the lower cover plate and the lower coverboard contraposition at box, so that second capillary structure is placed in the lower cover plate and institute
It states in the second accommodating cavity surrounded between lower coverboard；
Liquid radiating medium is injected into second accommodating cavity.
6. a kind of screening cover, which is characterized in that the screening cover includes upper coverboard, lower coverboard, the first framework, side wall and heat absorption phase
Become material, the upper coverboard is oppositely arranged with the lower coverboard, and first framework is sandwiched in the upper coverboard and the lower coverboard
Between, the side wall is located at side of the lower coverboard far from the upper coverboard, and the heat absorption phase-change material is filled on described
In the accommodating chamber that coverboard, the lower coverboard and first framework surround jointly；The screening cover further includes second framework and
Three capillary structures, the second framework are sandwiched between the upper coverboard and the lower coverboard, and respectively with the upper coverboard and institute
The bottom plate for stating lower coverboard vertically connects, and the second framework is arranged concentrically with first framework, the upper coverboard, the lower casing
Plate, first framework and the second framework surround an accommodating chamber jointly, and the third capillary structure is located at first frame
Between body and the second framework, and it is contained in the accommodating chamber；Liquid radiating medium is additionally provided in the accommodating chamber.
7. a kind of mobile terminal, which is characterized in that the mobile terminal includes screening cover as claimed in claim 6.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710833814.7A CN107509381B (en) | 2017-09-15 | 2017-09-15 | A kind of production method of screening cover, screening cover and mobile terminal |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710833814.7A CN107509381B (en) | 2017-09-15 | 2017-09-15 | A kind of production method of screening cover, screening cover and mobile terminal |
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| CN107509381B true CN107509381B (en) | 2019-11-15 |
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| CN108429825B (en) * | 2018-02-14 | 2020-07-07 | Oppo广东移动通信有限公司 | Electronic component and electronic device |
| CN109274881B (en) * | 2018-11-29 | 2021-01-08 | 维沃移动通信有限公司 | Lens support, camera module and terminal |
| CN110278700A (en) * | 2019-07-27 | 2019-09-24 | Oppo（重庆）智能科技有限公司 | Electronic equipment and its assemble method |
| CN110586428A (en) * | 2019-09-18 | 2019-12-20 | 深圳嘉信源科技实业有限公司 | Processing technology of insulation shielding case |
| CN117561801A (en) * | 2021-10-27 | 2024-02-13 | 华为技术有限公司 | Radiator, manufacturing method thereof, semiconductor device and electronic equipment |
| CN115023099B (en) * | 2021-11-10 | 2023-11-21 | 荣耀终端有限公司 | Electronic equipment |
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