CN211047669U - Heat dissipation structure for electronic equipment and electronic equipment - Google Patents
Heat dissipation structure for electronic equipment and electronic equipment Download PDFInfo
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- CN211047669U CN211047669U CN201921697931.6U CN201921697931U CN211047669U CN 211047669 U CN211047669 U CN 211047669U CN 201921697931 U CN201921697931 U CN 201921697931U CN 211047669 U CN211047669 U CN 211047669U
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- printed circuit
- heat dissipation
- change material
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Abstract
The embodiment of the disclosure discloses a heat dissipation structure for an electronic device and the electronic device. One embodiment of the heat dissipation structure for an electronic device includes: the shielding cover is fixedly connected with the printed circuit board and surrounds the electric component; and a phase change material disposed in a space formed by the printed circuit board, the electrical component, and the shield cover. The phase change material is arranged in a space formed by the printed circuit board, the electronic components arranged on the printed circuit board and the shielding cover, so that heat generated by the electronic components can be absorbed by the phase change material in time, normal operation of the electronic components is guaranteed, and the electronic equipment has better performance.
Description
Technical Field
The present disclosure relates to the field of electronic device heat dissipation technologies, and in particular, to a heat dissipation structure for an electronic device and an electronic device.
Background
We can use electronic devices to take pictures, perform data processing, obtain external information, etc. The above functions are performed by the electrical components provided on the electronic device according to the corresponding instructions.
The electrical components generate heat during operation. If the heat generated when the electrical component is operated is not timely processed, the performance of the electrical component will be affected.
SUMMERY OF THE UTILITY MODEL
This disclosure is provided to introduce concepts in a simplified form that are further described below in the detailed description. This disclosure is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.
The embodiment of the disclosure provides a heat dissipation structure for electronic equipment, a manufacturing method of the heat dissipation structure and the electronic equipment, so that heat generated by operation of electronic components in the electronic equipment can be absorbed in time, and better performance of electronic products is guaranteed.
In a first aspect, an embodiment of the present disclosure provides a heat dissipation structure for an electronic device, including: the shielding cover is fixedly connected with the printed circuit board and covers the electric component; and a phase change material disposed in a space formed by the printed circuit board, the electrical component, and the shield cover.
In a second aspect, an embodiment of the present disclosure provides an electronic device, including: the heat dissipation structure comprises a display screen, a rear packaging shell and the heat dissipation structure which is arranged between the display screen and the rear packaging shell and used for the electronic equipment.
According to the heat dissipation structure for the electronic equipment and the electronic equipment, the phase change material is arranged in the space formed by the printed circuit board, the electronic components arranged on the printed circuit board and the shielding cover, so that heat generated by the electronic components can be timely absorbed by the phase change material, normal operation of each electronic component is guaranteed, and the electronic equipment has better performance.
Drawings
The above and other features, advantages and aspects of various embodiments of the present disclosure will become more apparent by referring to the following detailed description when taken in conjunction with the accompanying drawings. Throughout the drawings, the same or similar reference numbers refer to the same or similar elements. It should be understood that the drawings are schematic and that elements and features are not necessarily drawn to scale.
FIG. 1 is a cross-sectional structural schematic view of one embodiment of a heat dissipation structure for an electronic device according to the present disclosure;
fig. 2 is a cross-sectional structural schematic view of another embodiment of a heat dissipation structure for an electronic device according to the present disclosure;
fig. 3 is a schematic diagram of an electronic device provided in accordance with an embodiment of the present disclosure.
Detailed Description
Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While certain embodiments of the present disclosure are shown in the drawings, it is to be understood that the present disclosure may be embodied in various forms and should not be construed as limited to the embodiments set forth herein, but rather are provided for a more thorough and complete understanding of the present disclosure. It should be understood that the drawings and embodiments of the disclosure are for illustration purposes only and are not intended to limit the scope of the disclosure.
It should be understood that the various steps recited in the method embodiments of the present disclosure may be performed in a different order, and/or performed in parallel. Moreover, method embodiments may include additional steps and/or omit performing the illustrated steps. The scope of the present disclosure is not limited in this respect.
The term "include" and variations thereof as used herein are open-ended, i.e., "including but not limited to". The term "based on" is "based, at least in part, on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". Relevant definitions for other terms will be given in the following description.
It should be noted that the terms "first", "second", and the like in the present disclosure are only used for distinguishing different devices, modules or units, and are not used for limiting the order or interdependence relationship of the functions performed by the devices, modules or units.
It is noted that references to "a", "an", and "the" modifications in this disclosure are intended to be illustrative rather than limiting, and that those skilled in the art will recognize that "one or more" may be used unless the context clearly dictates otherwise.
Referring to fig. 1, a schematic structural diagram of an embodiment of a heat dissipation structure for an electronic device according to the present disclosure is shown.
As shown in fig. 1, the heat dissipation structure 100 for an electronic device includes: a printed circuit board 101, an electrical component 102 disposed on one side of the printed circuit board 101, and a shield cover 103 fixedly connected to the printed circuit board 101 and surrounding the electrical component 102; and a phase change material 104 provided in a space formed by the printed circuit board 101, the electric component 102, and the shield cover 103.
For electronic devices, the electrical components may be disposed on a Printed Circuit Board (PCB). The printed circuit board provided with the electric components may be provided in an electronic apparatus. The size of the printed circuit board may be determined according to the size of the electronic device and the requirement of heat dissipation performance.
The electrical component 102 is a core component that realizes functions of the electronic device. The electrical components 102 may include a processor (e.g., CPU, GPU), memory, capacitors, resistors, inductors, and so forth. When the electronic device is powered on, the electrical components can cooperate with each other to achieve corresponding functions.
In order to protect the electrical components 102 on the printed circuit board 101 from external signals, a shielding cover is usually disposed above the electrical components 102. The shield cover 103 is typically made of metal. The shield cover 103 may be fixed on the printed circuit board 101.
The shield cover 103 may be bonded, soldered, or screwed to the printed circuit board 101, so as to fixedly connect the shield cover to the printed circuit board. The shielding cover fixed to the printed circuit board may surround the electrical components disposed on the printed circuit board. The area of the printed circuit board may be larger than the area covered by the shield cover.
The electrical component 102 generates heat during the energization operation. In order to dissipate heat, a heat dissipation structure is provided on the shield cover 103 in the related art. For example, a heat dissipation member is provided on a surface of the shield cover 103 remote from the electrical component 102. However, providing the heat dissipation member on the surface of the shield cover away from the electrical component increases the thickness of the electronic device.
In this embodiment, the phase change material 104 is disposed in a space formed by the printed circuit board 101, the electrical component 102, and the shield cover 103.
Phase Change Material (PCM) refers to a substance that changes its state and provides latent heat at a constant temperature. The process of changing physical properties is called a phase change process, and in this case, the phase change material absorbs or releases a large amount of latent heat. The phase change material can absorb or emit heat when the phase change occurs, and the temperature of the substance is not changed or is not changed greatly. Typically phase change materials start to soften and flow at temperatures of 40-45 c. And solid at room temperature. The heat conducting material can be used independently without reinforcing materials, and the influence of the reinforcing materials on the heat conducting performance is avoided. Therefore, if the phase-change material is changed by external temperature, the internal temperature of the product can be freely adjusted within a certain temperature range. Namely, when the temperature of the external environment rises, the heat can be stored, and the product is ensured to rise less temperature; when the outside temperature drops, the energy can be released, and the product is ensured to be cooled less.
In some alternative implementations, the phase change material may be an organic phase change material or an inorganic phase change material.
The melting point temperature of the phase change material can be more than or equal to 40 ℃ and less than or equal to 50 ℃.
The phase change material may be injected using a glue-filled needle. Specifically, when the phase-change material is filled, the needle head of the glue filling needle tube can be placed at any position in a space enclosed by the side cover of the shielding cover, and the phase-change material is injected into the space formed by the printed circuit board, the electric component and the side cover of the shielding cover at a constant speed. In some application scenarios, the phase change material may also be accelerated towards the surroundings by rotating the printed circuit board.
In the heat dissipation structure for electronic equipment provided by this embodiment, the phase change material 104 is disposed in the space formed by the printed circuit board 101, the electrical component 102 and the shielding cover 103, and if the surface temperature of the electrical component is too high due to large heat dissipation of the electrical component, at this time, the phase change material absorbs heat and takes away the heat dissipated by the electrical component, so that the electrical component is maintained at a stable temperature. Therefore, the purposes of maintaining the better performance of the electronic equipment and protecting the electronic equipment are achieved.
Continuing to refer to fig. 2, a schematic cross-sectional structure diagram of an embodiment of a heat dissipation structure for an electronic device according to the present disclosure is shown.
The heat dissipation structure 200 for electronic equipment shown in fig. 2 includes the same printed circuit board 201 as that shown in fig. 1, an electrical component 202 disposed on one side of the printed circuit board 201, and a shield cover 203 fixedly connected to the printed circuit board 201 and surrounding the electrical component 202; a phase change material 204 is disposed in a space formed by the printed circuit board 201, the electrical component 202 and the shielding cover 203, which is not described herein in detail.
Unlike fig. 1, in the heat dissipation structure 200 for an electronic device shown in fig. 2, at least two through holes (e.g., a through hole 205 and a through hole 206) are provided on the shield cover 203. Further, the heat dissipation structure 200 for an electronic apparatus further includes a covering member 207 for covering the through hole.
The surface of the shield cover 203 that is fixed to the printed circuit board 201 and contacts the printed circuit board 201 may be referred to as a side surface of the shield cover 203, and the surface of the shield cover 203 that is parallel to the printed circuit board 201 may be referred to as an upper surface of the shield cover 203.
The through hole 206 may be provided in the upper surface of the shield cover 203. To facilitate the phase change material injection, through holes may be respectively disposed on the upper surface of the shielding cover 203 and near the side surfaces of the shielding cover 203.
When injecting the phase-change material, the phase-change material can be injected from the through hole by using a glue injection needle tube. Specifically, the needle head of the glue-pouring needle tube can be placed in the through hole, and the phase-change material is injected into a space formed by the printed circuit board, the electric component and the shielding cover at a constant speed. In some application scenarios, the phase change material may also be accelerated towards the surroundings by rotating the printed circuit board.
In some embodiments, the covering member 207 may be a metal sheet, such as a copper sheet, an aluminum sheet, or the like, which has good heat dissipation performance. The metal sheet is arranged on one side of the shielding cover, which is parallel to the printed circuit board and is far away from the printed circuit board.
In the heat dissipation structure for electronic devices provided by this embodiment, the through hole is disposed on the shielding cover, so as to facilitate injecting the phase change material into the space formed by the printed circuit board 201, the electrical component 202, and the shielding cover 203, and in addition, the covering member made of metal sheet is used to cover the filling hole and the vent hole, so that on one hand, the phase change material can be prevented from diffusing outwards in a liquid state, and on the other hand, the heat dissipation structure can also play a role in further heat dissipation.
Referring to fig. 3, fig. 3 is a schematic diagram illustrating an electronic device according to an embodiment of the disclosure.
In this embodiment, the electronic device may include a display screen, a rear package housing, and a heat dissipation structure disposed between the display screen and the rear package housing as shown in fig. 1, or the heat dissipation structure for an electronic device provided in the embodiment shown in fig. 2.
As shown in fig. 3, the electronic device 300 may be a cell phone. In addition, the electronic device 300 may include, but is not limited to, a mobile terminal such as a digital broadcast receiver, a PDA (personal digital assistant), a PAD (tablet computer), a PMP (portable multimedia player), a car terminal (e.g., car navigation terminal), etc., and a fixed terminal such as a digital TV, a laptop portable computer, etc.
The electronic device shown in fig. 3 is only an example, and should not bring any limitation to the functions and the scope of use of the embodiments of the present disclosure.
The foregoing description is only exemplary of the preferred embodiments of the disclosure and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the disclosure herein is not limited to the particular combination of features described above, but also encompasses other embodiments in which any combination of the features described above or their equivalents does not depart from the spirit of the disclosure. For example, the above features and (but not limited to) the features disclosed in this disclosure having similar functions are replaced with each other to form the technical solution.
Further, while operations are depicted in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order. Under certain circumstances, multitasking and parallel processing may be advantageous. Likewise, while several specific implementation details are included in the above discussion, these should not be construed as limitations on the scope of the disclosure. Certain features that are described in the context of separate embodiments can also be implemented in combination in a single embodiment. Conversely, various features that are described in the context of a single embodiment can also be implemented in multiple embodiments separately or in any suitable subcombination.
Although the subject matter has been described in language specific to structural features and/or methodological acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as example forms of implementing the claims.
Claims (6)
1. A heat dissipation structure for an electronic device, comprising: the shielding cover is fixedly connected with the printed circuit board and surrounds the electric component; and
a phase change material disposed within a space formed by the printed circuit board, the electrical component, and the shield cover.
2. The heat dissipating structure of claim 1, wherein at least two through holes are provided on the shield cover, and
the heat dissipation structure for an electronic device further includes a covering member for covering the at least two through holes.
3. The heat dissipation structure as set forth in claim 2, wherein the covering member is a metal sheet; the metal sheet is arranged on one side of the shielding cover, which is parallel to the printed circuit board and is far away from the printed circuit board.
4. The heat dissipation structure of claim 1, wherein the phase change material is an organic phase change material or an inorganic phase change material.
5. The heat dissipating structure of any one of claims 1 to 4, wherein the phase change material has a melting point of 40 ℃ or higher and 50 ℃ or lower.
6. An electronic device, comprising: a display screen, a rear package housing, and the heat dissipation structure for an electronic device as recited in any one of claims 1 to 5 disposed between the display screen and the rear package housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921697931.6U CN211047669U (en) | 2019-10-11 | 2019-10-11 | Heat dissipation structure for electronic equipment and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921697931.6U CN211047669U (en) | 2019-10-11 | 2019-10-11 | Heat dissipation structure for electronic equipment and electronic equipment |
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| CN211047669U true CN211047669U (en) | 2020-07-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602932A (en) * | 2019-10-11 | 2019-12-20 | 北京字节跳动网络技术有限公司 | Heat dissipation structure for electronic equipment, manufacturing method and electronic equipment |
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- 2019-10-11 CN CN201921697931.6U patent/CN211047669U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602932A (en) * | 2019-10-11 | 2019-12-20 | 北京字节跳动网络技术有限公司 | Heat dissipation structure for electronic equipment, manufacturing method and electronic equipment |
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