CN210275024U - Heat conduction shielding body - Google Patents
Heat conduction shielding body Download PDFInfo
- Publication number
- CN210275024U CN210275024U CN201921019005.3U CN201921019005U CN210275024U CN 210275024 U CN210275024 U CN 210275024U CN 201921019005 U CN201921019005 U CN 201921019005U CN 210275024 U CN210275024 U CN 210275024U
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- CN
- China
- Prior art keywords
- layer
- cpu
- change material
- phase change
- metal
- Prior art date
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 23
- 239000012782 phase change material Substances 0.000 claims abstract description 16
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims abstract description 3
- 238000000576 coating method Methods 0.000 claims abstract description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 abstract description 3
- 239000011889 copper foil Substances 0.000 abstract description 3
- 239000007791 liquid phase Substances 0.000 abstract description 3
- 239000012071 phase Substances 0.000 abstract description 3
- 239000007790 solid phase Substances 0.000 abstract description 3
- 238000012856 packing Methods 0.000 abstract description 2
- 230000007704 transition Effects 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Images
Abstract
The utility model discloses a heat conduction shielding body, including phase change material layer, metal level, the electrically conductive double-sided tape layer of non-woven fabrics that from top to bottom sets gradually, the coating of phase change material layer is in the upper surface of metal level, the lower surface of metal level pastes the electrically conductive double-sided tape layer upper surface of non-woven fabrics. The utility model discloses use on CPU shielding frame support, under the shield cover trompil condition, when CPU operating temperature is higher than 45 ℃, phase change material becomes the liquid phase by the solid phase, absorb the heat, through the packing between phase transition layer and other metal radiating blocks (for example metal center), get rid of middle air bed and reduce the heat resistance and make the heat on copper foil layer transmit the metal radiating block fast, reach the purpose for CPU rapid cooling, CPU's radiating efficiency has greatly been improved, electronic equipment's work efficiency has been improved. Meanwhile, the non-woven conductive double-sided adhesive tape is well bonded with the shielding case bracket, so that electromagnetic noise can be prevented from being leaked from the side surface.
Description
Technical Field
The utility model relates to a heat conduction technology especially relates to a heat conduction shielding body.
Background
With the continuous improvement of the performance of computers and smart phones, the power consumption required by the computers and smart phones becomes larger and larger, so that the computers and smart phones need to be designed compactly, the volume of a CPU (central processing unit) is smaller and smaller, the integration level is higher and higher, the performance of the CPU becomes more sensitive to the temperature, the working efficiency is reduced if the CPU is not radiated in time, and even the service life is shortened. Therefore, better heat dissipation of the computer is very important in the normal use process, the reliability of the hardware system work of the computer can be well improved, and the continuous high-performance work of the computer or the smart phone is ensured. However, the traditional silica gel heat conduction can not meet the use requirement of high load at all, and a novel heat conduction shielding body which can conduct heat and cool quickly and shield interfering electromagnetic waves needs to be developed.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve lies in: the utility model provides a heat conduction shielding body for on computer or smart mobile phone's CPU, replace traditional heat conduction silica gel/gel and shield cover, the heat conduction that produces CPU is gone out fast, cools down CPU, shields the interference electromagnetic wave that other components and parts produced simultaneously.
In order to solve the technical problem, the utility model provides a heat conduction shielding body, including the phase change material layer, metal level, the electrically conductive double-sided tape layer of non-woven fabrics that from top to bottom set gradually, the coating of phase change material layer is in the upper surface of metal level, the lower surface of metal level pastes the upper surface on the electrically conductive double-sided tape layer of non-woven fabrics.
Preferably, the phase change material layer is a phase change material with a thickness of 100um-150 um.
Preferably, the metal layer is a copper thin layer.
Preferably, the thickness of the non-woven conductive double-sided tape layer is 10um-100 um.
The technical scheme at least has the following beneficial effects: in general, in a very compact electronic device, a gap between a CPU shield and a metal bezel is very small and filled with air, resulting in very large thermal resistance. The utility model discloses use on CPU shielding frame support, under the shield cover trompil condition, when CPU operating temperature is higher than 45 ℃, phase change material becomes the liquid phase by the solid phase, absorb the heat, through the packing between phase transition layer and other metal radiating blocks (for example metal center), get rid of middle air bed and reduce the heat resistance and make the heat on copper foil layer transmit the metal radiating block fast, reach the purpose for CPU rapid cooling, CPU's radiating efficiency has greatly been improved, electronic equipment's work efficiency has been improved. Meanwhile, the non-woven conductive double-sided adhesive tape is well bonded with the shielding case bracket, so that electromagnetic noise can be prevented from being leaked from the side surface.
Drawings
Fig. 1 is a schematic structural diagram of the heat conductive shield of the present invention.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be further described with reference to the accompanying drawings.
As shown in fig. 1, the utility model provides a heat conduction shielding body, including the phase change material layer 1 that from top to bottom sets gradually, metal level 2, the electrically conductive double-sided adhesive tape layer of non-woven fabrics 3, the upper surface at metal level 2 is coated to phase change material layer 1, the upper surface at the electrically conductive double-sided adhesive tape layer of non-woven fabrics 3 is pasted to the lower surface of metal level 2, and preferably, metal level 3 is the copper thin layer, with the electrically conductive double-sided adhesive tape layer thickness design of non-woven fabrics in 10um-100um within range, and is preferred, the electrically conductive double-sided adhesive tape layer thickness design of non-woven.
The phase change material is used on a CPU shielding frame support (under the condition of opening holes of the shielding cover), when the working temperature of the CPU is higher than 45 ℃, the phase change material is changed into a liquid phase from a solid phase, absorbs heat, and meanwhile, through filling between the phase change layer and other metal radiating blocks (such as a metal middle frame), the air layer in the middle is removed, the heat resistance is reduced, so that the heat of the copper foil layer is quickly transmitted to the metal radiating blocks, the purpose of quickly cooling the CPU is achieved, the radiating efficiency of the CPU is greatly improved, and the working efficiency of the electronic equipment is improved. Meanwhile, the non-woven conductive double-sided adhesive tape is well bonded with the shielding case bracket, so that the electromagnetic noise can be prevented from being leaked from the side surface.
The foregoing is a detailed description of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations are also considered as the protection scope of the present invention.
Claims (4)
1. The utility model provides a heat conduction shielding body which characterized in that, includes phase change material layer, metal level, the electrically conductive double-sided tape layer of non-woven fabrics that from top to bottom sets gradually, the coating of phase change material layer is in the upper surface of metal level, the lower surface of metal level pastes the upper surface on the electrically conductive double-sided tape layer of non-woven fabrics.
2. The thermally conductive shield of claim 1, wherein the phase change material layer is a phase change material having a thickness of 100um to 150 um.
3. The thermally conductive shield of claim 1, wherein said metal layer is a thin layer of copper.
4. The thermally conductive shield of claim 1, wherein said non-woven electrically conductive double-sided tape layer has a thickness of 10um to 100 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921019005.3U CN210275024U (en) | 2019-07-02 | 2019-07-02 | Heat conduction shielding body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921019005.3U CN210275024U (en) | 2019-07-02 | 2019-07-02 | Heat conduction shielding body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210275024U true CN210275024U (en) | 2020-04-07 |
Family
ID=70046621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921019005.3U Active CN210275024U (en) | 2019-07-02 | 2019-07-02 | Heat conduction shielding body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210275024U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112175538A (en) * | 2020-10-14 | 2021-01-05 | 深圳市飞荣达科技股份有限公司 | Film and preparation method thereof |
-
2019
- 2019-07-02 CN CN201921019005.3U patent/CN210275024U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112175538A (en) * | 2020-10-14 | 2021-01-05 | 深圳市飞荣达科技股份有限公司 | Film and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 3001, Unit 1, Building 1, Lechuanghui Building, No. 1211 Guihua Community Sightseeing Road, Guanlan Street, Longhua District, Shenzhen City, Guangdong Province, 518110 Patentee after: SHENZHEN JOHAN MATERIAL TECH. Co.,Ltd. Address before: Room 501, Building A11, Silicon Valley Power Intelligent Terminal Industrial Park, No. 20 Dafu Industrial Zone, Dafu Community, Guanlan Street, Longhua District, Shenzhen City, Guangdong Province, 518035 Patentee before: SHENZHEN JOHAN MATERIAL TECH. Co.,Ltd. |