CN210274979U - Heat conduction shielding wave absorber - Google Patents
Heat conduction shielding wave absorber Download PDFInfo
- Publication number
- CN210274979U CN210274979U CN201921019022.7U CN201921019022U CN210274979U CN 210274979 U CN210274979 U CN 210274979U CN 201921019022 U CN201921019022 U CN 201921019022U CN 210274979 U CN210274979 U CN 210274979U
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- China
- Prior art keywords
- material layer
- layer
- phase
- wave
- absorbing material
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000006096 absorbing agent Substances 0.000 title claims description 6
- 239000002184 metal Substances 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000012782 phase change material Substances 0.000 claims abstract description 15
- 239000011358 absorbing material Substances 0.000 claims abstract description 13
- 239000002390 adhesive tape Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000035699 permeability Effects 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 abstract description 9
- 239000007791 liquid phase Substances 0.000 abstract description 8
- 239000007790 solid phase Substances 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 230000002452 interceptive effect Effects 0.000 abstract 2
- 239000000463 material Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 238000005034 decoration Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Images
Abstract
The utility model discloses a heat conduction shielding wave absorption body, including phase change material layer, metal level, the high magnetic conductivity wave-absorbing material layer that from top to bottom sets gradually, high magnetic conductivity wave-absorbing material layer upper and lower surface is provided with first sticky tape layer and second sticky tape layer respectively, and the coating is at the upper surface of metal level when the liquid phase on phase change material layer, and the upper surface on high magnetic conductivity wave-absorbing material layer is pasted through first sticky tape layer to the lower surface of metal level. When the CPU works, the phase-change material layer is changed from a solid phase to a liquid phase to absorb and conduct heat so as to cool the CPU, and meanwhile, the high-permeability wave-absorbing material layer absorbs interfering electromagnetic waves and converts the interfering electromagnetic waves into heat which is conducted out by the phase-change material layer, so that the working efficiency of the electronic equipment is improved.
Description
Technical Field
The utility model relates to a heat conduction technology especially relates to a heat conduction shielding wave absorber.
Background
With the continuous improvement of the performance of computers and smart phones, the power consumption required by the computers and smart phones becomes larger and larger, so that the computers and smart phones need to be designed compactly, the volume of a CPU (central processing unit) is smaller and smaller, the integration level is higher and higher, the performance of the CPU becomes more sensitive to the temperature, the working efficiency is reduced if the CPU is not radiated in time, and even the service life is shortened. Therefore, better heat dissipation of the computer is very important in the normal use process, the reliability of the hardware system work of the computer can be well improved, and the continuous high-performance work of the computer or the smart phone is ensured. However, the traditional silica gel heat conduction can not meet the use requirement of high load at all, so that improvement is needed.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve lies in: the heat conduction shielding wave absorber is used for a CPU (central processing unit) of a computer or a smart phone, replaces the traditional heat conduction silica gel and a shielding case, quickly conducts heat generated by the heat conduction silica gel and the shielding case, cools the CPU, and absorbs interference electromagnetic waves generated by internal components.
In order to solve the technical problem, the utility model provides a heat conduction shielding wave absorption body, including phase change material layer, metal level, the high magnetic conductivity wave absorption material layer that from top to bottom sets gradually, high magnetic conductivity wave absorption material layer upper and lower surface is provided with first adhesive tape layer and second adhesive tape layer respectively, phase change material coats when the liquid phase the upper surface of metal level, the lower surface of metal level is pasted through first adhesive tape layer the upper surface of high magnetic conductivity wave absorption material layer.
Preferably, the metal layer is a copper thin layer.
Preferably, the high-permeability wave-absorbing material layer is an ultrathin layer, and the thickness of the ultrathin layer is less than 25 um.
Preferably, the first adhesive tape layer and the second adhesive tape layer are ultrathin adhesive tapes, and the thickness of the ultrathin adhesive tapes is less than 5 um.
The technical scheme at least has the following beneficial effects: the utility model discloses use on CPU, when CPU operating temperature is higher than 45 ℃, phase change material becomes the liquid phase by the solid phase, absorbs the heat, reaches for CPU rapid cooling's purpose, has greatly improved CPU's radiating efficiency to adopt high magnetic conductivity wave-absorbing material, effectively reduced the influence of interference wave to CPU, improved electronic equipment's work efficiency.
Drawings
Fig. 1 is a schematic structural view of the heat-conducting wave-absorbing shielding body of the present invention.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be further described with reference to the accompanying drawings.
As shown in fig. 1, the utility model discloses heat conduction shielding wave absorption body, including phase change material layer 1, metal level 2, the high magnetic conductivity wave absorption material layer 4 that from top to bottom sets gradually, be provided with first adhesive tape layer 3 and second adhesive tape layer 5 respectively on the high magnetic conductivity wave absorption material layer 4 lower surface, with phase change material layer 1 coating at the upper surface of metal level 2 when the liquid phase, paste the upper surface at high magnetic conductivity wave absorption material layer 4 through first adhesive tape layer 3 with the lower surface of metal level 2. When the temperature of the phase-change material layer 1 is higher than 45 ℃, the phase-change material layer changes from a solid phase to a liquid phase; when the temperature is lower than 45 ℃, the liquid phase is changed into the solid phase. Preferably, the metal layer 2 is designed as a thin copper layer. The high-permeability wave-absorbing material layer 4 is of an ultrathin layer structure, and the thickness of the high-permeability wave-absorbing material layer is smaller than 25 um. First sticky tape layer 3 and second sticky tape layer 5 are ultra-thin sticky tape, and thickness is less than 5 um.
When the CPU works, the phase-change material layer 1 is changed from a solid phase to a liquid phase, absorbs and conducts heat to cool the CPU, and meanwhile, the high-permeability wave-absorbing material layer 4 absorbs interference electromagnetic waves and converts the interference electromagnetic waves into heat which is conducted out by the phase-change material layer 1, so that the working efficiency of the electronic equipment is improved.
The foregoing is a detailed description of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations are also considered as the protection scope of the present invention.
Claims (4)
1. The heat conduction shielding wave absorbing body is characterized by comprising a phase change material layer, a metal layer and a high-permeability wave absorbing material layer which are sequentially arranged from top to bottom, wherein a first adhesive tape layer and a second adhesive tape layer are respectively arranged on the upper surface and the lower surface of the high-permeability wave absorbing material layer, the phase change material layer is coated on the upper surface of the metal layer, and the lower surface of the metal layer is adhered to the upper surface of the high-permeability wave absorbing material layer through the first adhesive tape layer.
2. The thermally conductive wave absorber of claim 1, wherein the metal layer is a thin layer of copper.
3. The thermally conductive wave absorbing body of claim 1, wherein the layer of high permeability wave absorbing material is less than 25 μm thick.
4. The thermally conductive wave absorber of claim 1, wherein the first tape layer and the second tape layer are each less than 5um thick.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921019022.7U CN210274979U (en) | 2019-07-02 | 2019-07-02 | Heat conduction shielding wave absorber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921019022.7U CN210274979U (en) | 2019-07-02 | 2019-07-02 | Heat conduction shielding wave absorber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210274979U true CN210274979U (en) | 2020-04-07 |
Family
ID=70046623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921019022.7U Active CN210274979U (en) | 2019-07-02 | 2019-07-02 | Heat conduction shielding wave absorber |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210274979U (en) |
-
2019
- 2019-07-02 CN CN201921019022.7U patent/CN210274979U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: 3001, Unit 1, Building 1, Lechuanghui Building, No. 1211 Guihua Community Sightseeing Road, Guanlan Street, Longhua District, Shenzhen City, Guangdong Province, 518110 Patentee after: SHENZHEN JOHAN MATERIAL TECH. Co.,Ltd. Address before: Room 501, Building A11, Silicon Valley Power Intelligent Terminal Industrial Park, No. 20 Dafu Industrial Zone, Dafu Community, Guanlan Street, Longhua District, Shenzhen City, Guangdong Province, 518035 Patentee before: SHENZHEN JOHAN MATERIAL TECH. Co.,Ltd. |
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| CP02 | Change in the address of a patent holder |