CN203573969U - Energy storage radiating fin - Google Patents
Energy storage radiating fin Download PDFInfo
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- CN203573969U CN203573969U CN201320619081.4U CN201320619081U CN203573969U CN 203573969 U CN203573969 U CN 203573969U CN 201320619081 U CN201320619081 U CN 201320619081U CN 203573969 U CN203573969 U CN 203573969U
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- energy storage
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- radiating fin
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Abstract
The utility model discloses an energy storage radiating fin. The energy storage radiating fin comprises a metal layer, one side surface of the metal layer is coated with a thermally conductive silica gel layer, and the other side surface of the metal layer is coated with a phase-change material layer. According to the energy storage radiating fin, excellence thermal conductivity of metal, excellence flexibility and compressibility of thermally conductive silica gel, and phase-change energy storage characteristic of phase-change materials are combined, contact by utilization of interfaces can be effectively performed, and excellence heat conduction and heat dissipation performance can be obtained; and when a component operates at a high speed, a lot of generated heat can be first stored, and chip operation cannot be influenced.
Description
Technical field
The utility model relates to a kind of fin, is specifically related to a kind of energy storage fin.
Background technology
Along with developing rapidly of microelectronics integrated technology and high density PCB packaging technology, packaging density improves rapidly, and electronic component, thousands of times of ground of logical circuit volume dwindle, and electronic instrument and equipment are day by day towards light, thin, short, little future development.Under high-frequency work frequency, semiconductor working heat environment moves rapidly to high temperature direction, now, heat run-up, increase that electronic devices and components produce, at environment for use temperature, electronic devices and components still can normally be worked on high reliability ground, and heat-sinking capability becomes the critical limitation in its useful life factor that affects in time.For ensureing components and parts operational reliability, need to use the material of the excellent combination properties such as high reliability, high thermal conductivity, the heat in time heater element being gathered rapidly, passes to heat dissipation equipment, ensure that electronic equipment normally moves, in prior art, mostly adopt metal fin and graphite heat radiation fin, although the conductive coefficient of metal fin own is high, but interfacial property is very poor, while contacting with thermal source, there is very large contact heat resistance, can not well heat be delivered to metal from thermal source, thus impact heat radiation.And graphite heat radiation fin is very low at longitudinal conductive coefficient, and its interfacial property is also poor, can not well heat be transmitted out from thermal source.
Utility model content
For the deficiencies in the prior art, the purpose of this utility model is to be to provide a kind of energy storage fin, this energy storage fin is in conjunction with the phase-change accumulation energy characteristic of the excellent pliability of the excellent heat conductivity of metal, heat conductive silica gel and compressibility, phase-change material, make it can effectively use interface contact, obtain excellent heat conduction, heat dispersion, when high-speed component turns round, the large calorimetric producing first can be stored simultaneously, be unlikely to affect the work of chip.
Realizing the purpose of this utility model can be by taking following technical scheme to reach:
A kind of energy storage fin, is characterized in that, comprises metal level, on a side of metal level, is coated with thermal conductive silicon glue-line, on another side of metal level, is coated with phase-change material layers.
Realizing a kind of execution mode of the present utility model is: described metal level is Copper Foil or aluminium foil, and its thickness is 0.01-0.05mm.
Realizing a kind of execution mode of the present utility model is: the thickness of described thermal conductive silicon glue-line is 0.01-0.1mm.
Realizing a kind of execution mode of the present utility model is: the thickness of described phase-change material layers is 0.01-0.1mm.
Realizing a kind of execution mode of the present utility model is: the gross thickness of described metal level, thermal conductive silicon glue-line and phase-change material layers is less than 0.3mm.Restriction gross thickness is mainly to keep heat energy than circulation more smoothly, avoids thickness too thick, occurs that thermal impedance is excessive in process
The beneficial effects of the utility model are:
1, energy storage fin described in the utility model has excellent thermal diffusivity: because metal level is metal copper foil or aluminium foil, all have comprehensive heat conductivility.The conductive coefficient of copper reaches 380w/mk, and the conductive coefficient of aluminium also reaches 270 w/mk, has powerful heat sinking function.This point has kept the high thermal conductivity of metal, has good thermal diffusivity.
2, energy storage fin described in the utility model has excellent thermal diffusivity and compressibility: because layer on surface of metal is attached with thermal conductive silicon glue-line, thermal conductive silicon glue-line is elastomer, has good pliability and compressibility; When material is contacted with thermal source interface, greatly reduced the contact heat resistance of material and thermal source, heat well can be delivered to metal surface from heat source side.
3, energy storage fin described in the utility model has energy storage: the phase-change material layers that layer on surface of metal adheres to has the phase transition process from solid phase to liquid phase, in phase transition process, by producing, absorb a large amount of latent heat, can solve preferably in short-term, the powerful device of periodic duty or be subject to good density of heat flow rate periodically to affect the temperature control problem of equipment.
In sum, the utility model is in conjunction with the phase-change accumulation energy characteristic of the excellent pliability of the excellent heat conductivity of metal, heat conductive silica gel and compressibility, phase-change material, make it can effectively use interface contact, obtain excellent heat conduction, heat dispersion, simultaneously when high-speed component turns round, the large calorimetric producing first can be stored, be unlikely to affect the work of chip.It can be widely used in dispelling the heat between the chip of smart mobile phone, panel computer etc. and shell radiator, also can apply to the heat radiation between mobile phone back shell and metallic hand set case.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Wherein, 1, metal level; 2, thermal conductive silicon glue-line; 3, phase-change material layers.
Embodiment
Below, by reference to the accompanying drawings and embodiment, the utility model is described further:
Specific embodiment:
With reference to Fig. 1, a kind of energy storage fin, comprises metal level 1, on a side of metal level 1, is coated with thermal conductive silicon glue-line 2, on another side of metal level 1, is coated with phase-change material layers 3.
Described metal level is Copper Foil or aluminium foil, and its thickness is 0.01-0.05mm.The conductive coefficient of described thermal conductive silicon glue-line is 2-3w/mk, and the thickness of thermal conductive silicon glue-line is 0.01-0.1mm.The conductive coefficient of described phase-change material layers is 1.5-2.0w/mk, and phase transition temperature is 45-60 ℃, and the thickness of phase-change material layers is 0.01-0.1mm.
The preparation method of the energy storage fin described in the present embodiment, it comprises following processing step successively:
1) prepare raw material: a, get a Copper Foil or aluminium foil; B, get heat conductive silica gel base-material (HFC company, product type: H300); C, get phase-change material base-material (chomerics company, product type: T725);
2) the heat conductive silica gel base-material in step 1) is evenly coated on the outer surface of a side of metal level, is positioned in continuous tunnel furnace and vulcanizes, after having vulcanized, form thermal conductive silicon glue-line;
3) the even heat of phase-change material base-material in step 1) is coated on the outer surface of opposite side of metal level, the temperature of controlling heat coating is 60-80 ℃, forms phase-change material layers; Thereby finally obtain energy storage fin.
For a person skilled in the art, can be according to technical scheme described above and design, make other various corresponding changes and distortion, and these all changes and distortion all should belong to the protection range of the utility model claim within.
Claims (5)
1. an energy storage fin, is characterized in that, comprises metal level, on a side of metal level, is coated with thermal conductive silicon glue-line, on another side of metal level, is coated with phase-change material layers.
2. energy storage fin according to claim 1, is characterized in that: described metal level is Copper Foil or aluminium foil, and its thickness is 0.01-0.05mm.
3. energy storage fin according to claim 1, is characterized in that: the thickness of described thermal conductive silicon glue-line is 0.01-0.1mm.
4. energy storage fin according to claim 1, is characterized in that: the thickness of described phase-change material layers is 0.01-0.1mm.
5. energy storage fin according to claim 1, is characterized in that: the gross thickness of described metal level, thermal conductive silicon glue-line and phase-change material layers is less than 0.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320619081.4U CN203573969U (en) | 2013-09-30 | 2013-09-30 | Energy storage radiating fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320619081.4U CN203573969U (en) | 2013-09-30 | 2013-09-30 | Energy storage radiating fin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203573969U true CN203573969U (en) | 2014-04-30 |
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ID=50541683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320619081.4U Expired - Lifetime CN203573969U (en) | 2013-09-30 | 2013-09-30 | Energy storage radiating fin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203573969U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105472941A (en) * | 2014-09-30 | 2016-04-06 | 联发科技（新加坡）私人有限公司 | Mobile phone and manufacturing method thereof |
| CN111087820A (en) * | 2018-10-23 | 2020-05-01 | 成都戎创航空科技有限公司 | Heat dissipation silica gel pad and processing method of silica gel used in same |
-
2013
- 2013-09-30 CN CN201320619081.4U patent/CN203573969U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105472941A (en) * | 2014-09-30 | 2016-04-06 | 联发科技（新加坡）私人有限公司 | Mobile phone and manufacturing method thereof |
| CN111087820A (en) * | 2018-10-23 | 2020-05-01 | 成都戎创航空科技有限公司 | Heat dissipation silica gel pad and processing method of silica gel used in same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 518103 floor 1, 2 and 3, building C, No. 7, Fuyong East Avenue, Fenghuang community, Fuyong street, Bao'an District, Shenzhen, Guangdong Province Patentee after: Shenzhen hongfucheng New Material Co.,Ltd. Address before: 518103 building C, Fenghuang third industrial zone, Fuyong Town, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HFC SHIELDING PRODUCTS Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140430 |