CN111087820A - Heat dissipation silica gel pad and processing method of silica gel used in same - Google Patents

Heat dissipation silica gel pad and processing method of silica gel used in same Download PDF

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Publication number
CN111087820A
CN111087820A CN201811237840.4A CN201811237840A CN111087820A CN 111087820 A CN111087820 A CN 111087820A CN 201811237840 A CN201811237840 A CN 201811237840A CN 111087820 A CN111087820 A CN 111087820A
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CN
China
Prior art keywords
parts
silica gel
weight
heat
conducting layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811237840.4A
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Chinese (zh)
Inventor
谭里程
陈佳
宋奎
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Chengdu Rongchuang Aviation Technology Co ltd
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Chengdu Rongchuang Aviation Technology Co ltd
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Priority to CN201811237840.4A priority Critical patent/CN111087820A/en
Publication of CN111087820A publication Critical patent/CN111087820A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/02—Layer formed of wires, e.g. mesh
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/22—Layered products comprising a layer of synthetic resin characterised by the use of special additives using plasticisers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/02—Organic and inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/582—Tearability
    • B32B2307/5825—Tear resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc

Abstract

The invention discloses a heat dissipation silica gel pad, which is characterized in that: the heat-conducting layer comprises a silica gel heat-conducting layer and a reinforcing layer, wherein the silica gel used for the silica gel heat-conducting layer comprises 10-35 parts by weight of a silane coupling agent, 120-150 parts by weight of silver powder, 50-75 parts by weight of silicon dioxide, 50-75 parts by weight of dicumyl peroxide, 7-10 parts by weight of vinyl silicone oil, 20-40 parts by weight of a reinforcing agent, 20-45 parts by weight of a plasticizer, 50-80 parts by weight of zinc oxide and 4-18 parts by weight of aluminum oxide. The silica gel in the application has high heat dissipation efficiency, high strength and simple processing method, wherein the heat conductivity coefficient of the used silica gel detected according to the ASTM D5470 standard can reach more than 4.2; the tear strength can reach more than 0.60 according to ASTM D412 standard.

Description

Heat dissipation silica gel pad and processing method of silica gel used in same
Technical Field
The invention relates to the field of communication equipment maintenance, in particular to a heat dissipation silica gel pad and a processing method of silica gel used in the heat dissipation silica gel pad.
Background
In the communication equipment maintenance process, in order to improve the heat dissipation effect, the heat dissipation silica gel pad is frequently required to be used, and the heat dissipation effect and the strength of the heat dissipation silica gel pad have great influence on the working state of the equipment and the failure rate of the equipment, so that the heat dissipation silica gel pad with good heat dissipation effect and high strength and the importance thereof are realized.
Disclosure of Invention
The invention aims to provide a heat-dissipation silica gel pad and a processing method of silica gel used in the heat-dissipation silica gel pad, and solves the problem that the strength of the silica gel pad in the prior art is poor.
In order to solve the technical problems, the invention adopts the following technical scheme:
a heat dissipation silica gel pad comprises a silica gel heat conduction layer and a reinforcing layer, wherein the silica gel used by the silica gel heat conduction layer comprises, by weight, 10-35 parts of a silane coupling agent, 120-150 parts of silver powder, 50-75 parts of silicon dioxide, 50-75 parts of dicumyl peroxide, 7-10 parts of vinyl silicone oil, 20-40 parts of a reinforcing agent, 20-45 parts of a plasticizer, 50-80 parts of zinc oxide and 4-18 parts of aluminum oxide.
Preferably, the silica gel heat conduction layer and the reinforcing layer are both more than two layers and arranged at intervals.
Preferably, the reinforcing layers are all metal meshes.
Preferably, the silica gel used for the silica gel heat conduction layer comprises 13-30 parts by weight of a silane coupling agent, 125-145 parts by weight of silver powder, 55-70 parts by weight of silicon dioxide, 55-70 parts by weight of dicumyl peroxide, 8-10 parts by weight of vinyl silicone oil, 23-40 parts by weight of a reinforcing agent, 25-45 parts by weight of a plasticizer, 58-80 parts by weight of zinc oxide and 7-18 parts by weight of aluminum oxide.
Preferably, the silica gel used for the silica gel heat conduction layer comprises, by weight, 10-28 parts of a silane coupling agent, 120-130 parts of silver powder, 60-75 parts of silicon dioxide, 60-75 parts of dicumyl peroxide, 7-9 parts of vinyl silicone oil, 20-30 parts of a reinforcing agent, 20-38 parts of a plasticizer, 50-68 parts of zinc oxide and 4-15 parts of aluminum oxide.
Preferably, the silica gel used for the silica gel heat conduction layer comprises, by weight, 15-28 parts of a silane coupling agent, 128-130 parts of silver powder, 68-70 parts of silicon dioxide, 68-70 parts of dicumyl peroxide, 8 parts of vinyl silicone oil, 25-26 parts of a reinforcing agent, 25-26 parts of a plasticizer, 58-61 parts of zinc oxide and 11-13 parts of aluminum oxide.
A processing method of silica gel used for the silica gel heat conduction layer is characterized in that a silane coupling agent, silver powder, silicon dioxide, dicumyl peroxide, vinyl silicone oil, a reinforcing agent, a plasticizer, zinc oxide and aluminum oxide are mixed in proportion to obtain the heat dissipation silica gel.
Preferably, the silane coupling agent, the silver powder, the silicon dioxide, the dicumyl peroxide, the vinyl silicone oil, the zinc oxide and the aluminum oxide are mixed in proportion to obtain a mixture A, and then the mixture A, the reinforcing agent and the plasticizer are added and uniformly mixed to obtain the heat-dissipating silica gel.
Compared with the prior art, the invention has the beneficial effects that: the silica gel in the application has high heat dissipation efficiency, high strength and simple processing method, wherein the heat conductivity coefficient of the used silica gel detected according to the ASTM D5470 standard can reach more than 4.2; the tear strength can reach more than 0.60 according to ASTM D412 standard.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example 1:
the embodiment provides a heat dissipation silica gel pad, including silica gel heat-conducting layer and enhancement layer, the used silica gel of silica gel heat-conducting layer includes silane coupling agent 10 parts, silver powder 120 parts, silica 50 parts, dicumyl peroxide 50 parts, vinyl silicone oil 7 parts, reinforcing agent 20 parts, plasticizer 20 parts, zinc oxide 50 parts, aluminium oxide 4 parts by weight.
Example 2:
the embodiment provides a heat dissipation silica gel pad, including silica gel heat-conducting layer and enhancement layer, the used silica gel of silica gel heat-conducting layer includes silane coupling agent 35 parts, silver powder 150 parts, silica 75 parts, dicumyl peroxide 75 parts, vinyl silicone oil 10 parts, reinforcing agent 40 parts, plasticizer 45 parts, zinc oxide 80 parts, 18 parts of aluminium oxide by weight.
Example 3:
the embodiment provides a heat dissipation silica gel pad, including silica gel heat-conducting layer and enhancement layer, the used silica gel of silica gel heat-conducting layer includes 13 parts of silane coupling agent, 125 parts of silver powder, 55 parts of silicon dioxide, 55 parts of dicumyl peroxide, 8 parts of vinyl silicone oil, 23 parts of reinforcing agent, 25 parts of plasticizer, 58-80 parts of zinc oxide, 7 parts of alumina by weight.
Example 4:
the embodiment provides a heat dissipation silica gel pad, including silica gel heat-conducting layer and enhancement layer, the used silica gel of silica gel heat-conducting layer includes silane coupling agent 30 parts, silver powder 145 parts, silica 70 parts, dicumyl peroxide 70 parts, vinyl silicone oil 10 parts, reinforcing agent 40 parts, plasticizer 45 parts, zinc oxide 80 parts, aluminium oxide 18 parts by weight.
Example 5:
the embodiment provides a heat dissipation silica gel pad, including silica gel heat-conducting layer and enhancement layer, the used silica gel of silica gel heat-conducting layer includes silane coupling agent 10 parts, silver powder 120 parts, silica 60 parts, dicumyl peroxide 60 parts, vinyl silicone oil 7 parts, reinforcing agent 20 parts, plasticizer 20 parts, zinc oxide 50 ~ 68 parts, aluminium oxide 4 parts by weight.
Example 6:
the embodiment provides a heat dissipation silica gel pad, including silica gel heat-conducting layer and enhancement layer, the used silica gel of silica gel heat-conducting layer includes silane coupling agent 15 parts, silver powder 128 parts, silicon dioxide 68 parts, dicumyl peroxide 68 parts, vinyl silicone oil 8 parts, reinforcing agent 25 parts, plasticizer 25 parts, zinc oxide 58 parts, 11 parts of aluminium oxide by weight.
Example 7:
the embodiment provides a heat dissipation silica gel pad, including silica gel heat-conducting layer and enhancement layer, the used silica gel of silica gel heat-conducting layer includes silane coupling agent 28 parts, silver powder 130 parts, silica 70 parts, dicumyl peroxide 70 parts, vinyl silicone oil 8 parts, reinforcing agent 26 parts, plasticizer 26 parts, zinc oxide 61 parts, aluminium oxide 13 parts by weight.
Example 8:
this example further defines, on the basis of example 7: silica gel heat-conducting layer and enhancement layer all have more than two-layer, and the two interval sets up.
Example 9:
this example further defines, on the basis of example 7: the reinforcing layers are all metal nets.
Example 10:
this example provides a method for processing the silica gel described in example 7, which includes mixing a silane coupling agent, silver powder, silica, dicumyl peroxide, vinyl silicone oil, a reinforcing agent, a plasticizer, zinc oxide, and alumina in a certain proportion to obtain the heat-dissipating silica gel.
Example 9:
in this embodiment, on the basis of embodiment 10, a processing method of the silica gel is further defined to mix a silane coupling agent, silver powder, silica, dicumyl peroxide, vinyl silicone oil, zinc oxide, and alumina in a proportion to obtain a mixture a, and then add, reinforce, and plasticizer to the mixture a to uniformly mix to obtain the heat-dissipating silica gel.
Although the invention has been described herein with reference to a number of illustrative embodiments thereof, it should be understood that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the spirit and scope of the principles of this disclosure. More specifically, various variations and modifications are possible in the component parts and/or arrangements of the subject combination arrangement within the scope of the disclosure and claims of this application. In addition to variations and modifications in the component parts and/or arrangements, other uses will also be apparent to those skilled in the art.

Claims (8)

1. The utility model provides a heat dissipation silica gel pad which characterized in that: the heat-conducting layer comprises a silica gel heat-conducting layer and a reinforcing layer, wherein the silica gel used for the silica gel heat-conducting layer comprises 10-35 parts by weight of a silane coupling agent, 120-150 parts by weight of silver powder, 50-75 parts by weight of silicon dioxide, 50-75 parts by weight of dicumyl peroxide, 7-10 parts by weight of vinyl silicone oil, 20-40 parts by weight of a reinforcing agent, 20-45 parts by weight of a plasticizer, 50-80 parts by weight of zinc oxide and 4-18 parts by weight of aluminum oxide.
2. The heat dissipation silica gel pad of claim 1, wherein: silica gel heat-conducting layer and enhancement layer all have more than two-layer, and the two interval sets up.
3. The heat dissipation silica gel pad of claim 1, wherein: the reinforcing layers are all metal nets.
4. The heat dissipation silica gel pad of claim 1, wherein: the silica gel heat conducting layer comprises 13-30 parts of silane coupling agent, 125-145 parts of silver powder, 55-70 parts of silicon dioxide, 55-70 parts of dicumyl peroxide, 8-10 parts of vinyl silicone oil, 23-40 parts of reinforcing agent, 25-45 parts of plasticizer, 58-80 parts of zinc oxide and 7-18 parts of aluminum oxide.
5. The heat dissipation silica gel pad of claim 1, wherein: the silica gel heat conducting layer comprises, by weight, 10-28 parts of a silane coupling agent, 120-130 parts of silver powder, 60-75 parts of silicon dioxide, 60-75 parts of dicumyl peroxide, 7-9 parts of vinyl silicone oil, 20-30 parts of a reinforcing agent, 20-38 parts of a plasticizer, 50-68 parts of zinc oxide and 4-15 parts of aluminum oxide.
6. The heat dissipation silica gel pad of claim 1, wherein: the silica gel heat conduction layer is made of 15-28 parts of silane coupling agent, 128-130 parts of silver powder, 68-70 parts of silicon dioxide, 68-70 parts of dicumyl peroxide, 8 parts of vinyl silicone oil, 25-26 parts of reinforcing agent, 25-26 parts of plasticizer, 58-61 parts of zinc oxide and 11-13 parts of aluminum oxide.
7. A method for processing the silica gel used for the heat-conducting layer of the silica gel of any one of claims 1 to 6, which is characterized in that: and mixing a silane coupling agent, silver powder, silicon dioxide, dicumyl peroxide, vinyl silicone oil, a reinforcing agent, a plasticizer, zinc oxide and aluminum oxide in proportion to obtain the heat-dissipating silica gel.
8. A method for processing silica gel used for the heat-conducting layer of silica gel as claimed in claim 7, wherein: mixing a silane coupling agent, silver powder, silicon dioxide, dicumyl peroxide, vinyl silicone oil, zinc oxide and aluminum oxide in proportion to obtain a mixture A, then adding a reinforcing agent and a plasticizer into the mixture A, and uniformly mixing to obtain the heat-dissipating silica gel.
CN201811237840.4A 2018-10-23 2018-10-23 Heat dissipation silica gel pad and processing method of silica gel used in same Pending CN111087820A (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103545273A (en) * 2013-09-30 2014-01-29 深圳市鸿富诚屏蔽材料有限公司 Energy-storage radiating sheet and production method thereof
CN203573969U (en) * 2013-09-30 2014-04-30 深圳市鸿富诚屏蔽材料有限公司 Energy storage radiating fin
CN104151837A (en) * 2014-07-31 2014-11-19 王佰全 Heat radiation silica gel
CN203968556U (en) * 2014-06-09 2014-11-26 易脉天成新材料科技（苏州）有限公司 Glass is strengthened heat conductive silica gel pad
CN106221236A (en) * 2016-07-26 2016-12-14 深圳市金无曼工业新材料有限公司 Can the double-component heat-conducting silicone grease prepared of room temperature or gelation of heating and preparation method thereof
CN106366660A (en) * 2016-08-26 2017-02-01 强新正品（苏州）环保材料科技有限公司 Electric-conductive silica gel heat dissipating piece
CN106893563A (en) * 2015-12-21 2017-06-27 比亚迪股份有限公司 Heat conductive silica gel composition and heat conductive silica gel material and heat-conducting silica gel sheet and preparation method thereof
CN107383879A (en) * 2017-06-20 2017-11-24 安徽燕青科技集团有限公司 A kind of LED wall wash lamp packaging silicon rubber

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103545273A (en) * 2013-09-30 2014-01-29 深圳市鸿富诚屏蔽材料有限公司 Energy-storage radiating sheet and production method thereof
CN203573969U (en) * 2013-09-30 2014-04-30 深圳市鸿富诚屏蔽材料有限公司 Energy storage radiating fin
CN203968556U (en) * 2014-06-09 2014-11-26 易脉天成新材料科技（苏州）有限公司 Glass is strengthened heat conductive silica gel pad
CN104151837A (en) * 2014-07-31 2014-11-19 王佰全 Heat radiation silica gel
CN106893563A (en) * 2015-12-21 2017-06-27 比亚迪股份有限公司 Heat conductive silica gel composition and heat conductive silica gel material and heat-conducting silica gel sheet and preparation method thereof
CN106221236A (en) * 2016-07-26 2016-12-14 深圳市金无曼工业新材料有限公司 Can the double-component heat-conducting silicone grease prepared of room temperature or gelation of heating and preparation method thereof
CN106366660A (en) * 2016-08-26 2017-02-01 强新正品（苏州）环保材料科技有限公司 Electric-conductive silica gel heat dissipating piece
CN107383879A (en) * 2017-06-20 2017-11-24 安徽燕青科技集团有限公司 A kind of LED wall wash lamp packaging silicon rubber

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
刘路 等: "改性纳米氧化锌/硅橡胶导热复合材料的性能", 《胶体与聚合物》 *
周利庄 等: "单组分加成型导热有机硅橡胶的制备", 《特种橡胶制品》 *
周文英 等著: "《聚合物基导热复合材料》", 30 June 2017, 国防工业出版社 *

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Application publication date: 20200501