CN105925243A - Room-temperature cured-type high thermal conductive flexible silica gel - Google Patents

Room-temperature cured-type high thermal conductive flexible silica gel Download PDF

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Publication number
CN105925243A
CN105925243A CN201610342517.8A CN201610342517A CN105925243A CN 105925243 A CN105925243 A CN 105925243A CN 201610342517 A CN201610342517 A CN 201610342517A CN 105925243 A CN105925243 A CN 105925243A
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silica gel
component
room temperature
thermal conductivity
curing type
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瘳玉超
苏冠贤
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Dongguan Corehelm Electronic Material Technology Co Ltd
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Dongguan Corehelm Electronic Material Technology Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Abstract

The invention discloses a room-temperature cured-type high thermal conductive flexible silica gel. The silica gel is composed of a component A and a component B which are mixed to be uniform according to the proportion of 1:1, the component A is prepared from, by weight, 35%-65% of methyl vinyl polysiloxane, 0.1%-2.0% of tackifier, 25%-60% of thermal conductive filler, 2%-5% of inorganic filler and 0.5%-2.0% of anti-sedimentation agent, and 0.08%-0.10% of crosslinking catalyst is additionally added to the component A; the component B is prepared from, by weight, 10%-25% of methyl vinyl polysiloxane, 25%-45% of hydrogen-containing silicone oil, 20%-40% of thermal conductive filler, 5%-10% of inorganic filler and 0.5%-2.0% of anti-sedimentation agent. According to the above-mentioned materiel proportions, the room-temperature cured-type high thermal conductive flexible silica gel has the following advantages that curing can be achieved at room temperature, and the construction performance and energy-saving effects are good; the thermal conductivity coefficient can reach up to 7 W/mK; the properties of high thermal conductivity and sealing are both achieved.

Description

A kind of room temperature curing type height thermal conductivity flexible silica gel
Technical field
The present invention relates to Heat Conduction Material technical field, particularly relate to a kind of room temperature curing type height thermal conductivity flexible silica gel.
Background technology
Heat conductive silica gel is high-end heat conduction compound, the characteristic of insulation is avoided that such as short circuit equivalent risk, good bonding and thermal conduction characteristic can solve the sealing between device and flash heat transfer problem, and therefore it plays irreplaceable effect in the field such as CPU, GPU and radiator.
For the heater members of high-power high-voltage, it is higher to the requirement of Heat Conduction Material.And the heat conductivity of heat conductive silica gel is generally at below 4W/mK, it is difficult to meet above-mentioned requirements.And the solidification of existing heat conductive silica gel solidifies the most at relatively high temperatures, construction and use are made troubles.
Summary of the invention
Present invention aims to the deficiencies in the prior art and a kind of room temperature curing type height thermal conductivity flexible silica gel is provided, this room temperature curing type height thermal conductivity flexible silica gel has the advantage that 1, can mix 60 minutes under the room temperature environment of 20 DEG C-35 DEG C and begin to solidification, 8-12 hour completion of cure, i.e. has good workability and energy-saving effect;2, heat conductivity reaches as high as 7W/mK, good heat conduction effect;3, on the premise of keeping high thermal conductivity coefficient, this room temperature curing type height thermal conductivity flexible silica gel remains flexible, and has certain viscosity, can fit tightly in substrate surfaces such as steel, pottery, plastics, takes into account high heat conduction and seals two kinds of performances.
For reaching above-mentioned purpose, the present invention is achieved through the following technical solutions.
A kind of room temperature curing type height thermal conductivity flexible silica gel, includes the component A according to mass ratio 1:1 mix homogeneously, B component;
Wherein, component A includes the material of following weight portion, particularly as follows:
Methylvinyl-polysiloxane 35%-65%
Viscosifier 0.1%-2.0%
Heat filling 25%-60%
Inorganic filler 2%-5%
Sagging inhibitor 0.5%-2.0%,
Component A is also outer is the crosslinking catalyst of 0.08%-0.10% added with weight portion;
B component includes the material of following weight portion, particularly as follows:
Methylvinyl-polysiloxane 10%-25%
Containing hydrogen silicone oil 25%-45%
Heat filling 20%-40%
Inorganic filler 5%-10%
Sagging inhibitor 0.5%-2.0%。
Wherein, the mixture that described viscosifier are formed with vinyltrimethoxy silane by VTES or vinyltrimethoxy silane or VTES.
Wherein, described heat filling be aluminum nitride powder, the mixture that formed of at least two material in alumina powder, titanium oxide powder, spinel powder, thermal conductive ceramic powder, powdered carbon.
Wherein, the particle size values of described heat filling is 0.05 μm-2.00 μm.
Wherein, the granule microscopic appearance of described aluminum nitride powder is fibrous or spherical.
Wherein, described inorganic filler be silica flour, the mixture that formed of one or two kinds of in Paris white, hydroxide magnesium powder.
Wherein, the particle size values of described inorganic filler is 0.5 μm-5.00 μm.
Wherein, described sagging inhibitor be polyglycol ether, the mixture that formed of a kind of or at least two in polyoxyethylene fatty alcohol sulfate, lithium bentonite, white carbon.
The invention have the benefit that a kind of room temperature curing type height thermal conductivity flexible silica gel of the present invention, it includes the A of mass ratio 1:1 mix homogeneously, B component, component A includes the material of following weight portion: methylvinyl-polysiloxane 35%-65%, viscosifier 0.1%-2.0%, heat filling 25%-60%, inorganic filler 2%-5%, sagging inhibitor 0.5%-2.0%, the crosslinking catalyst of the additional 0.08%-0.10% of component A;B component includes the material of following weight portion: methylvinyl-polysiloxane 10%-25%, containing hydrogen silicone oil 25%-45%, heat filling 20%-40%, inorganic filler 5%-10%, sagging inhibitor 0.5%-2.0%.By above-mentioned material proportion, the room temperature curing type height thermal conductivity flexible silica gel of the present invention has the following advantages, particularly as follows: 1, can mix 60 minutes under the room temperature environment of 20 DEG C-35 DEG C begin to solidification, 8-12 hour completion of cure, i.e. there is good workability and energy-saving effect;2, heat conductivity reaches as high as 7W/mK, good heat conduction effect;3, on the premise of keeping high thermal conductivity coefficient, this room temperature curing type height thermal conductivity flexible silica gel remains flexible, and has certain viscosity, can fit tightly in substrate surfaces such as steel, pottery, plastics, takes into account high heat conduction and seals two kinds of performances.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention will be described.
Embodiment one, a kind of room temperature curing type height thermal conductivity flexible silica gel, include the component A according to mass ratio 1:1 mix homogeneously, B component;
Wherein, component A includes the material of following weight portion, particularly as follows:
Methylvinyl-polysiloxane 55%
Viscosifier 1%
Heat filling 39%
Inorganic filler 3%
Sagging inhibitor 2%,
Component A is also outer is the crosslinking catalyst of 0.09% added with weight portion;
B component includes the material of following weight portion, particularly as follows:
Methylvinyl-polysiloxane 25%
Containing hydrogen silicone oil 40%
Heat filling 25%
Inorganic filler 8%
Sagging inhibitor 2%。
Wherein, the mixture that viscosifier are formed with vinyltrimethoxy silane by VTES or vinyltrimethoxy silane or VTES;The mixture that heat filling is aluminum nitride powder, at least two material in alumina powder, titanium oxide powder, spinel powder, thermal conductive ceramic powder, powdered carbon is formed, and in heat filling containing 25% spherical aluminum nitride powder, the particle size values of heat filling is 0.05 μm-2.00 μm;The mixture that inorganic filler is silica flour, one or two kinds of in Paris white, hydroxide magnesium powder is formed, the particle size values of inorganic filler is 0.5 μm-5.00 μm;The mixture that sagging inhibitor is polyglycol ether, a kind of or at least two in polyoxyethylene fatty alcohol sulfate, lithium bentonite, white carbon is formed.
In the room temperature curing type height thermal conductivity flexible silica gel preparation process of the present embodiment one, first quantitatively weigh methylvinyl-polysiloxane, viscosifier, heat filling, inorganic filler, sagging inhibitor, be mixed and stirred for prepared component A;The most quantitatively weigh methylvinyl-polysiloxane, containing hydrogen silicone oil, heat filling, inorganic filler, sagging inhibitor, be mixed and stirred for prepared B component;Component A and the B component mixing of quality such as finally weigh, stir homogeneous to color, after stirring, compound is poured into levelling in mould, cured at room temperature.
By above-mentioned material proportion, the room temperature curing type height thermal conductivity flexible silica gel of the present embodiment one has the following advantages, particularly as follows: 1, the mixed viscosity of AB component be 6120Cps, solidification within 60 minutes under the room temperature environment of 20 DEG C-35 DEG C, can be begun to, 8 hours completion of cures, i.e. have good workability and energy-saving effect;2, after solidification, the heat conductivity of silica gel is 6.0W/mK, and hardness is 20HA;3, on the premise of keeping high thermal conductivity coefficient, this room temperature curing type height thermal conductivity flexible silica gel remains flexible, and has certain viscosity, can fit tightly in substrate surfaces such as steel, pottery, plastics, takes into account high heat conduction and seals two kinds of performances.
Embodiment two, a kind of room temperature curing type height thermal conductivity flexible silica gel, include the component A according to mass ratio 1:1 mix homogeneously, B component;
Wherein, component A includes the material of following weight portion, particularly as follows:
Methylvinyl-polysiloxane 50%
Viscosifier 0.5%
Heat filling 44%
Inorganic filler 3.5%
Sagging inhibitor 2%,
Component A is also outer is the crosslinking catalyst of 0.08% added with weight portion;
B component includes the material of following weight portion, particularly as follows:
Methylvinyl-polysiloxane 20%
Containing hydrogen silicone oil 30.5%
Heat filling 40%
Inorganic filler 7.5%
Sagging inhibitor 2%。
Wherein, the mixture that viscosifier are formed with vinyltrimethoxy silane by VTES or vinyltrimethoxy silane or VTES;The mixture that heat filling is aluminum nitride powder, at least two material in alumina powder, titanium oxide powder, spinel powder, thermal conductive ceramic powder, powdered carbon is formed, and in heat filling containing 30% spherical aluminum nitride powder, the particle size values of heat filling is 0.05 μm-2.00 μm;The mixture that inorganic filler is silica flour, one or two kinds of in Paris white, hydroxide magnesium powder is formed, the particle size values of inorganic filler is 0.5 μm-5.00 μm;The mixture that sagging inhibitor is polyglycol ether, a kind of or at least two in polyoxyethylene fatty alcohol sulfate, lithium bentonite, white carbon is formed.
In the room temperature curing type height thermal conductivity flexible silica gel preparation process of the present embodiment two, first quantitatively weigh methylvinyl-polysiloxane, viscosifier, heat filling, inorganic filler, sagging inhibitor, be mixed and stirred for prepared component A;The most quantitatively weigh methylvinyl-polysiloxane, containing hydrogen silicone oil, heat filling, inorganic filler, sagging inhibitor, be mixed and stirred for prepared B component;Component A and the B component mixing of quality such as finally weigh, stir homogeneous to color, after stirring, compound is poured into levelling in mould, cured at room temperature.
By above-mentioned material proportion, the room temperature curing type height thermal conductivity flexible silica gel of the present embodiment two has the following advantages, particularly as follows: 1, the mixed viscosity of AB component be 6250Cps, solidification within 60 minutes under the room temperature environment of 20 DEG C-35 DEG C, can be begun to, 8.5 hours completion of cures, i.e. have good workability and energy-saving effect;2, after solidification, the heat conductivity of silica gel is 6.2W/mK, and hardness is 20HA;3, on the premise of keeping high thermal conductivity coefficient, this room temperature curing type height thermal conductivity flexible silica gel remains flexible, and has certain viscosity, can fit tightly in substrate surfaces such as steel, pottery, plastics, takes into account high heat conduction and seals two kinds of performances.
Embodiment three, a kind of room temperature curing type height thermal conductivity flexible silica gel, include the component A according to mass ratio 1:1 mix homogeneously, B component;
Wherein, component A includes the material of following weight portion, particularly as follows:
Methylvinyl-polysiloxane 55%
Viscosifier 1.5%
Heat filling 40%
Inorganic filler 2%
Sagging inhibitor 1.5%,
Component A is also outer is the crosslinking catalyst of 0.09% added with weight portion;
B component includes the material of following weight portion, particularly as follows:
Methylvinyl-polysiloxane 17.5%
Containing hydrogen silicone oil 40%
Heat filling 32%
Inorganic filler 9%
Sagging inhibitor 1.5%。
Wherein, the mixture that viscosifier are formed with vinyltrimethoxy silane by VTES or vinyltrimethoxy silane or VTES;The mixture that heat filling is aluminum nitride powder, at least two material in alumina powder, titanium oxide powder, spinel powder, thermal conductive ceramic powder, powdered carbon is formed, and in heat filling containing 30% fibrous aluminum nitride powder, the particle size values of heat filling is 0.05 μm-2.00 μm;The mixture that inorganic filler is silica flour, one or two kinds of in Paris white, hydroxide magnesium powder is formed, the particle size values of inorganic filler is 0.5 μm-5.00 μm;The mixture that sagging inhibitor is polyglycol ether, a kind of or at least two in polyoxyethylene fatty alcohol sulfate, lithium bentonite, white carbon is formed.
In the room temperature curing type height thermal conductivity flexible silica gel preparation process of the present embodiment three, first quantitatively weigh methylvinyl-polysiloxane, viscosifier, heat filling, inorganic filler, sagging inhibitor, be mixed and stirred for prepared component A;The most quantitatively weigh methylvinyl-polysiloxane, containing hydrogen silicone oil, heat filling, inorganic filler, sagging inhibitor, be mixed and stirred for prepared B component;Component A and the B component mixing of quality such as finally weigh, stir homogeneous to color, after stirring, compound is poured into levelling in mould, cured at room temperature.
By above-mentioned material proportion, the room temperature curing type height thermal conductivity flexible silica gel of the present embodiment three has the following advantages, particularly as follows: 1, the mixed viscosity of AB component be 6320Cps, solidification within 60 minutes under the room temperature environment of 20 DEG C-35 DEG C, can be begun to, 8 hours completion of cures, i.e. have good workability and energy-saving effect;2, after solidification, the heat conductivity of silica gel is 6.7W/mK, and hardness is 25HA;3, on the premise of keeping high thermal conductivity coefficient, this room temperature curing type height thermal conductivity flexible silica gel remains flexible, and has certain viscosity, can fit tightly in substrate surfaces such as steel, pottery, plastics, takes into account high heat conduction and seals two kinds of performances.
Embodiment four, a kind of room temperature curing type height thermal conductivity flexible silica gel, include the component A according to mass ratio 1:1 mix homogeneously, B component;
Wherein, component A includes the material of following weight portion, particularly as follows:
Methylvinyl-polysiloxane 55%
Viscosifier 1.5%
Heat filling 38%
Inorganic filler 4%
Sagging inhibitor 1.5%,
Component A is also outer is the crosslinking catalyst of 0.1% added with weight portion;
B component includes the material of following weight portion, particularly as follows:
Methylvinyl-polysiloxane 20.5%
Containing hydrogen silicone oil 45%
Heat filling 26%
Inorganic filler 7%
Sagging inhibitor 1.5%。
Wherein, the mixture that viscosifier are formed with vinyltrimethoxy silane by VTES or vinyltrimethoxy silane or VTES;The mixture that heat filling is aluminum nitride powder, at least two material in alumina powder, titanium oxide powder, spinel powder, thermal conductive ceramic powder, powdered carbon is formed, and in heat filling containing 25% fibrous aluminum nitride powder, the particle size values of heat filling is 0.05 μm-2.00 μm;The mixture that inorganic filler is silica flour, one or two kinds of in Paris white, hydroxide magnesium powder is formed, the particle size values of inorganic filler is 0.5 μm-5.00 μm;The mixture that sagging inhibitor is polyglycol ether, a kind of or at least two in polyoxyethylene fatty alcohol sulfate, lithium bentonite, white carbon is formed.
In the room temperature curing type height thermal conductivity flexible silica gel preparation process of the present embodiment four, first quantitatively weigh methylvinyl-polysiloxane, viscosifier, heat filling, inorganic filler, sagging inhibitor, be mixed and stirred for prepared component A;The most quantitatively weigh methylvinyl-polysiloxane, containing hydrogen silicone oil, heat filling, inorganic filler, sagging inhibitor, be mixed and stirred for prepared B component;Component A and the B component mixing of quality such as finally weigh, stir homogeneous to color, after stirring, compound is poured into levelling in mould, cured at room temperature.
By above-mentioned material proportion, the room temperature curing type height thermal conductivity flexible silica gel of the present embodiment four has the following advantages, particularly as follows: 1, the mixed viscosity of AB component be 6010Cps, solidification within 60 minutes under the room temperature environment of 20 DEG C-35 DEG C, can be begun to, 9 hours completion of cures, i.e. have good workability and energy-saving effect;2, after solidification, the heat conductivity of silica gel is 6.6W/mK, and hardness is 30HA;3, on the premise of keeping high thermal conductivity coefficient, this room temperature curing type height thermal conductivity flexible silica gel remains flexible, and has certain viscosity, can fit tightly in substrate surfaces such as steel, pottery, plastics, takes into account high heat conduction and seals two kinds of performances.
Embodiment five, a kind of room temperature curing type height thermal conductivity flexible silica gel, include the component A according to mass ratio 1:1 mix homogeneously, B component;
Wherein, component A includes the material of following weight portion, particularly as follows:
Methylvinyl-polysiloxane 55%
Viscosifier 1.5%
Heat filling 38%
Inorganic filler 4%
Sagging inhibitor 1.5%,
Component A is also outer is the crosslinking catalyst of 0.1% added with weight portion;
B component includes the material of following weight portion, particularly as follows:
Methylvinyl-polysiloxane 20.5%
Containing hydrogen silicone oil 45%
Heat filling 26%
Inorganic filler 7%
Sagging inhibitor 1.5%。
Wherein, the mixture that viscosifier are formed with vinyltrimethoxy silane by VTES or vinyltrimethoxy silane or VTES;The mixture that heat filling is aluminum nitride powder, at least two material in alumina powder, titanium oxide powder, spinel powder, thermal conductive ceramic powder, powdered carbon is formed, and in heat filling containing 25% spherical aluminum nitride powder, the particle size values of heat filling is 0.05 μm-2.00 μm;The mixture that inorganic filler is silica flour, one or two kinds of in Paris white, hydroxide magnesium powder is formed, the particle size values of inorganic filler is 0.5 μm-5.00 μm;The mixture that sagging inhibitor is polyglycol ether, a kind of or at least two in polyoxyethylene fatty alcohol sulfate, lithium bentonite, white carbon is formed.
In the room temperature curing type height thermal conductivity flexible silica gel preparation process of the present embodiment five, first quantitatively weigh methylvinyl-polysiloxane, viscosifier, heat filling, inorganic filler, sagging inhibitor, be mixed and stirred for prepared component A;The most quantitatively weigh methylvinyl-polysiloxane, containing hydrogen silicone oil, heat filling, inorganic filler, sagging inhibitor, be mixed and stirred for prepared B component;Component A and the B component mixing of quality such as finally weigh, stir homogeneous to color, after stirring, compound is poured into levelling in mould, cured at room temperature.
By above-mentioned material proportion, the room temperature curing type height thermal conductivity flexible silica gel of the present embodiment five has the following advantages, particularly as follows: 1, the mixed viscosity of AB component be 6420Cps, solidification within 60 minutes under the room temperature environment of 20 DEG C-35 DEG C, can be begun to, 8.5 hours completion of cures, i.e. have good workability and energy-saving effect;2, after solidification, the heat conductivity of silica gel is 5.9W/mK, and hardness is 35HA;3, on the premise of keeping high thermal conductivity coefficient, this room temperature curing type height thermal conductivity flexible silica gel remains flexible, and has certain viscosity, can fit tightly in substrate surfaces such as steel, pottery, plastics, takes into account high heat conduction and seals two kinds of performances.
Embodiment six, a kind of room temperature curing type height thermal conductivity flexible silica gel, include the component A according to mass ratio 1:1 mix homogeneously, B component;
Wherein, component A includes the material of following weight portion, particularly as follows:
Methylvinyl-polysiloxane 44.5%
Viscosifier 0.5%
Heat filling 48%
Inorganic filler 5%
Sagging inhibitor 2%,
Component A is also outer is the crosslinking catalyst of 0.09% added with weight portion;
B component includes the material of following weight portion, particularly as follows:
Methylvinyl-polysiloxane 25%
Containing hydrogen silicone oil 32%
Heat filling 36%
Inorganic filler 6%
Sagging inhibitor 1%。
Wherein, the mixture that viscosifier are formed with vinyltrimethoxy silane by VTES or vinyltrimethoxy silane or VTES;The mixture that heat filling is aluminum nitride powder, at least two material in alumina powder, titanium oxide powder, spinel powder, thermal conductive ceramic powder, powdered carbon is formed, and in heat filling containing 40% spherical aluminum nitride powder, the particle size values of heat filling is 0.05 μm-2.00 μm;The mixture that inorganic filler is silica flour, one or two kinds of in Paris white, hydroxide magnesium powder is formed, the particle size values of inorganic filler is 0.5 μm-5.00 μm;The mixture that sagging inhibitor is polyglycol ether, a kind of or at least two in polyoxyethylene fatty alcohol sulfate, lithium bentonite, white carbon is formed.
In the room temperature curing type height thermal conductivity flexible silica gel preparation process of the present embodiment six, first quantitatively weigh methylvinyl-polysiloxane, viscosifier, heat filling, inorganic filler, sagging inhibitor, be mixed and stirred for prepared component A;The most quantitatively weigh methylvinyl-polysiloxane, containing hydrogen silicone oil, heat filling, inorganic filler, sagging inhibitor, be mixed and stirred for prepared B component;Component A and the B component mixing of quality such as finally weigh, stir homogeneous to color, after stirring, compound is poured into levelling in mould, cured at room temperature.
By above-mentioned material proportion, the room temperature curing type height thermal conductivity flexible silica gel of the present embodiment six has the following advantages, particularly as follows: 1, the mixed viscosity of AB component be 6530Cps, solidification within 60 minutes under the room temperature environment of 20 DEG C-35 DEG C, can be begun to, 10 hours completion of cures, i.e. have good workability and energy-saving effect;2, after solidification, the heat conductivity of silica gel is 7.0W/mK, and hardness is 30HA;3, on the premise of keeping high thermal conductivity coefficient, this room temperature curing type height thermal conductivity flexible silica gel remains flexible, and has certain viscosity, can fit tightly in substrate surfaces such as steel, pottery, plastics, takes into account high heat conduction and seals two kinds of performances.
Embodiment seven, a kind of room temperature curing type height thermal conductivity flexible silica gel, include the component A according to mass ratio 1:1 mix homogeneously, B component;
Wherein, component A includes the material of following weight portion, particularly as follows:
Methylvinyl-polysiloxane 55%
Viscosifier 1%
Heat filling 39%
Inorganic filler 3%
Sagging inhibitor 2%,
Component A is also outer is the crosslinking catalyst of 0.08% added with weight portion;
B component includes the material of following weight portion, particularly as follows:
Methylvinyl-polysiloxane 20%
Containing hydrogen silicone oil 40%
Heat filling 30%
Inorganic filler 8%
Sagging inhibitor 2%。
Wherein, the mixture that viscosifier are formed with vinyltrimethoxy silane by VTES or vinyltrimethoxy silane or VTES;The mixture that heat filling is aluminum nitride powder, at least two material in alumina powder, titanium oxide powder, spinel powder, thermal conductive ceramic powder, powdered carbon is formed, and without aluminum nitride powder in heat filling, the particle size values of heat filling is 0.05 μm-2.00 μm;The mixture that inorganic filler is silica flour, one or two kinds of in Paris white, hydroxide magnesium powder is formed, the particle size values of inorganic filler is 0.5 μm-5.00 μm;The mixture that sagging inhibitor is polyglycol ether, a kind of or at least two in polyoxyethylene fatty alcohol sulfate, lithium bentonite, white carbon is formed.
In the room temperature curing type height thermal conductivity flexible silica gel preparation process of the present embodiment seven, first quantitatively weigh methylvinyl-polysiloxane, viscosifier, heat filling, inorganic filler, sagging inhibitor, be mixed and stirred for prepared component A;The most quantitatively weigh methylvinyl-polysiloxane, containing hydrogen silicone oil, heat filling, inorganic filler, sagging inhibitor, be mixed and stirred for prepared B component;Component A and the B component mixing of quality such as finally weigh, stir homogeneous to color, after stirring, compound is poured into levelling in mould, cured at room temperature.
By above-mentioned material proportion, the room temperature curing type height thermal conductivity flexible silica gel of the present embodiment seven has the following advantages, particularly as follows: 1, the mixed viscosity of AB component be 6010Cps, solidification within 60 minutes under the room temperature environment of 20 DEG C-35 DEG C, can be begun to, 8.5 hours completion of cures, i.e. have good workability and energy-saving effect;2, after solidification, the heat conductivity of silica gel is 3.5W/mK, and hardness is 30HA;3, on the premise of keeping high thermal conductivity coefficient, this room temperature curing type height thermal conductivity flexible silica gel remains flexible, and has certain viscosity, can fit tightly in substrate surfaces such as steel, pottery, plastics, takes into account high heat conduction and seals two kinds of performances.
Above content is only presently preferred embodiments of the present invention, for those of ordinary skill in the art, according to the thought of the present invention, the most all will change, and this specification content should not be construed as limitation of the present invention.

Claims (8)

1. a room temperature curing type height thermal conductivity flexible silica gel, it is characterised in that include the component A according to mass ratio 1:1 mix homogeneously, B component;
Wherein, component A includes the material of following weight portion, particularly as follows:
Methylvinyl-polysiloxane 35%-65%
Viscosifier 0.1%-2.0%
Heat filling 25%-60%
Inorganic filler 2%-5%
Sagging inhibitor 0.5%-2.0%,
Component A is also outer is the crosslinking catalyst of 0.08%-0.10% added with weight portion;
B component includes the material of following weight portion, particularly as follows:
Methylvinyl-polysiloxane 10%-25%
Containing hydrogen silicone oil 25%-45%
Heat filling 20%-40%
Inorganic filler 5%-10%
Sagging inhibitor 0.5%-2.0%。
A kind of room temperature curing type height thermal conductivity flexible silica gel the most according to claim 1, it is characterised in that: the mixture that described viscosifier are formed with vinyltrimethoxy silane by VTES or vinyltrimethoxy silane or VTES.
A kind of room temperature curing type height thermal conductivity flexible silica gel the most according to claim 1, it is characterised in that: the mixture that described heat filling is aluminum nitride powder, at least two material in alumina powder, titanium oxide powder, spinel powder, thermal conductive ceramic powder, powdered carbon is formed.
A kind of room temperature curing type height thermal conductivity flexible silica gel the most according to claim 3, it is characterised in that: the particle size values of described heat filling is 0.05 μm-2.00 μm.
A kind of room temperature curing type height thermal conductivity flexible silica gel the most according to claim 3, it is characterised in that: the granule microscopic appearance of described aluminum nitride powder is fibrous or spherical.
A kind of room temperature curing type height thermal conductivity flexible silica gel the most according to claim 1, it is characterised in that: the mixture that described inorganic filler is silica flour, one or two kinds of in Paris white, hydroxide magnesium powder is formed.
A kind of room temperature curing type height thermal conductivity flexible silica gel the most according to claim 6, it is characterised in that: the particle size values of described inorganic filler is 0.5 μm-5.00 μm.
A kind of room temperature curing type height thermal conductivity flexible silica gel the most according to claim 1, it is characterised in that: the mixture that described sagging inhibitor is polyglycol ether, a kind of or at least two in polyoxyethylene fatty alcohol sulfate, lithium bentonite, white carbon is formed.
CN201610342517.8A 2016-05-23 2016-05-23 Room-temperature cured-type high thermal conductive flexible silica gel Pending CN105925243A (en)

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US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing

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