CN103107147A - Radiator with surface covered with graphene film - Google Patents
Radiator with surface covered with graphene film Download PDFInfo
- Publication number
- CN103107147A CN103107147A CN2012100997497A CN201210099749A CN103107147A CN 103107147 A CN103107147 A CN 103107147A CN 2012100997497 A CN2012100997497 A CN 2012100997497A CN 201210099749 A CN201210099749 A CN 201210099749A CN 103107147 A CN103107147 A CN 103107147A
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- Prior art keywords
- radiator
- graphene film
- covered
- heat
- graphene
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention discloses a radiator with a surface covered with a graphene film. The surface of the radiator is covered with the graphene film. According to the radiator with the surface covered with the graphene film, extremely high thermal conductity of grapgene is utilized, heat spreading of the heat is rapidly carried out on the surface of the radiator, and heat balance is achieved in the radiator. Therefore, temperature gradients on a heat conduction path are reduced or eliminated, temperature of heat components is reduced, uneven temperature hot point regions inside the radiator are eliminated, and whole reliability and working capacity for a long time of the components and the radiator are improved. With the excellent heat conductivity of the graphene utilized, the face spreading of the heat is carried out rapidly along the graphene film, so that the heat conduction path inside the radiator is reduced, the radiating speed of the radiator is improved, and the time needed for transferring the heat to the radiator by heat conduction interface materials or the heat components is shortened. Therefore, the radiator with the surface covered with the graphene film has high heat conduction speed, excellent heat radiation performance, and a practical value of batch application.
Description
Technical field
The present invention relates to radiator, refer to that especially a kind of surface is covered with the radiator of graphene film.
Background technology
As everyone knows, the effect of radiator is that the heat that circuit and electronic component produce is in the course of the work dispersed in air.In the prior art, circuit and electronic component dispel the heat according to shown in Figure 1 as heater members.At first the transmission of loss power is to be spread out of by heater members 101, arrives radiator 103 through heat-conducting interface material 102.Dispersion in radiator 103 internal heat is completed through the heat conduction, and the heat transmission from radiator 103 to air needs to complete by radiation and convection current.But because heater members 101 is limited with the contact area of radiator 103, heat is limited by the thermal conductivity of radiator body material in radiator 103 inside, and heat conduction velocity is slower.Therefore, form heat accumulation and the distribution of higher temperature gradient on thermally conductive pathways, cause the heater members temperature drift, the radiating efficiency performance of radiator 103 is limited.
Along with constantly diminishing of device, the continuous increase of power density causes the rising of loss power, and good heat radiation is absolutely necessary.Therefore propose, require the higher radiator of efficient, this radiator can carry out rapidly heat propagation on the surface, and reaches heat balance in radiator.Thereby, reduce or eliminate temperature gradient on heat conduction path, make the temperature step-down of heater members, the global reliability of device and equipment and the ability that works long hours are improved in the uneven focus of the temperature zone of abatement apparatus inside.
Summary of the invention
In view of this, the object of the invention is to propose the radiator that a kind of surface is covered with graphene film, solve the existing drawback that the radiator heat-dissipation ability is lower, radiating rate is slow.
Be covered with the radiator of graphene film based on above-mentioned purpose surface provided by the invention, the surface of described radiator is covered with graphene film.
Preferably, the described surface that is covered with graphene film is the contact site of the corresponding heat-conducting interface material of heater members and radiator.
Better, the described surface that is covered with graphene film is the whole contact-making surface at the place, contact site of the corresponding heat-conducting interface material of heater members and radiator.
Optionally, the surface of described radiator all is covered with graphene film.
Optionally, described graphene film selects the chemical vapour deposition technique Direct precipitation to make in spreader surface.
Better, described radiator is selected any one method in chemical vapour deposition technique, tape stripping method, chemical stripping method, independently makes graphene film or contains the carrier of graphene film, with gum or other physics fixing meanss, make graphene film be covered in the surface of radiator.
Better, the bulk material of described radiator is any one in metal, metal alloy, nonmetallic materials.
Preferably, described metal material is any one in aluminium, copper; Described metal alloy compositions is any one in aluminium alloy, copper alloy; Described nonmetallic materials are any one in polymethyl methacrylate, structural plastic.
Preferably, described radiator be computer chip with fin-shaped band fan radiator, with fin-shaped not with serving as the hardware of radiator, any one in nonmetal structure spare in fan radiator, power electronics devices die cast metal heat radiation chamber or casing, mobile electronic device.
As can be seen from above, surface provided by the invention is covered with the radiator of graphene film, utilize the high thermal conductivity (plane thermal conductivity 3000-5000W/mK) of Graphene, heat is carried out heat propagation in spreader surface rapidly, and reach heat balance in radiator.Thereby, reduce or eliminate temperature gradient on heat conduction path, make the temperature step-down of heater members, the global reliability of device and equipment and the ability that works long hours are improved in the uneven focus of the temperature zone of abatement apparatus inside.
Description of drawings
Fig. 1 is the schematic diagram of existing radiator;
Fig. 2 is the schematic diagram of the embodiment of the present invention 1;
Fig. 3 is the schematic diagram of the embodiment of the present invention 2;
Fig. 4 is the schematic diagram of the embodiment of the present invention 3;
Fig. 5 is the schematic diagram of the embodiment of the present invention 4.
Embodiment
For making the purpose, technical solutions and advantages of the present invention clearer, below in conjunction with specific embodiment, and with reference to accompanying drawing, the present invention is described in more detail.
Graphene is a kind of carbonaceous new material by the tightly packed one-tenth bi-dimensional cellular of monolayer carbon atom shape lattice structure.Result of study shows, the heat conductivility of Graphene is better than carbon nano-tube, more than the conductive coefficient of common carbon nano-tube can reach 3000W/mK, in various metals, conductive coefficient is relatively high silver (429W/mK), copper (401W/mK), gold (317W/mK), aluminium (237W/mK), and the conductive coefficient of single-layer graphene can reach 5300W/mK.
Therefore, the present invention selects chemical vapour deposition technique directly to make graphene film in the particular surface deposition of radiator, and the surface of radiator is directly contacted with graphene film, reaches best heat-transfer effect.
Certainly, the present invention also can use any one method in chemical vapour deposition technique, tape stripping method, chemical stripping method, independently make graphene film or contain the carrier of graphene film, with physics fixing meanss such as gum, thermal conductivity bonding agent, thermal conductivity two-sided tapes, make the particular surface of radiator be covered with graphene film.
Embodiment 1
With reference to figure 2, be the schematic diagram of the embodiment of the present invention 1.As one embodiment of the present of invention, adopt chemical vapour deposition technique, surface deposition graphene film 204 at radiator 103, for making the heat on heater members 101 reach fast radiator 103 by heat-conducting interface material 102, range of deposition is the area of the contact site of the corresponding heat-conducting interface material 102 of heater members 101 and radiator 103.
Therefore, after any one part of graphene film 204 receives the heat that heat-conducting interface material 102 transmits, heat carries out rapidly cross conduction on graphene film 204, then whole graphene film 204 simultaneously to radiator 103 transferring heats, improved the speed of the corresponding heat-conducting interface material 102 of heater members 101 to radiator 103 transmission heats.
It is to be noted, also adopting can chemical vapour deposition technique, any one method in tape stripping method, chemical stripping method, independently make graphene film 204, make graphene film 204 cover the contact site of the corresponding heat-conducting interface material 102 of heater members 101 and radiator 103 with gum.
Also adopting can chemical vapour deposition technique, any one method in tape stripping method, chemical stripping method, independently make the carrier 204 that contains graphene film, make graphene film 204 cover the contact site of the corresponding heat-conducting interface material 102 of heater members 101 and radiator 103 with the thermal conductivity bonding agent.
Also adopting can chemical vapour deposition technique, any one method in tape stripping method, chemical stripping method, independently make graphene film 204, make graphene film 204 cover the contact site of the corresponding heat-conducting interface material 102 of heater members 101 and radiator 103 with the thermal conductivity bonding agent.
Also adopting can chemical vapour deposition technique, any one method in tape stripping method, chemical stripping method, independently make the carrier 204 that contains graphene film, make graphene film 204 cover the contact site of the corresponding heat-conducting interface material 102 of heater members 101 and radiator 103 with gum.
Embodiment 2
With reference to figure 3, be the schematic diagram of the embodiment of the present invention 2.The present embodiment is preferred embodiment of the present invention, adopts chemical vapour deposition technique, at the surface deposition graphene film 304 of radiator 103.For further improving the heat transfer rate of radiator 103, range of deposition is the whole contact-making surface at the place, contact site of the corresponding heat-conducting interface material 102 of heater members 101 and radiator 103.
So, after any one part of graphene film 304 receives the heat that the corresponding heat-conducting interface material 102 of heater members 101 transmits, heat carries out rapidly cross conduction on graphene film 304, then whole graphene film 304 vertically conducts heat to radiator 103 simultaneously, make radiator 103 inside also vertically conduct heat, shortened heat-transfer path.
Equally, also can use any one method in chemical vapour deposition technique, tape stripping method, chemical stripping method, independently make the carrier 30 as one kind 4 that contains graphene film, with the thermal conductivity two-sided tape, graphene film 304 is covered on the whole contact-making surface at the corresponding heat-conducting interface material of heater members 101 102 and the place, contact site of radiator 103.
Also can use any one method in chemical vapour deposition technique, tape stripping method, chemical stripping method, independently make graphene film 304, with the thermal conductivity two-sided tape, graphene film 304 is covered on the whole contact-making surface at the corresponding heat-conducting interface material of heater members 101 102 and the place, contact site of radiator 103.
This example has not only improved the speed of heat-conducting interface material 102 to radiator 103 transmission heats, has also improved the heat transfer rate of radiator 103 inside.
Embodiment 3
The coating scope of graphene film is not limited in above-described embodiment, for further improving the heat transfer rate of radiator, and can be at its more surface-coated graphene film.
With reference to figure 4, be the schematic diagram of the embodiment of the present invention 3, also can directly deposit graphene film 404 with chemical vapour deposition technique on the whole surface of radiator 103.In the present embodiment, after any one part of graphene film 404 received the heat that heat-conducting interface material 102 transmits, heat transmitted on graphene film 404 rapidly.Because the whole surface of radiator 103 all is covered with graphene film 404, heat reaches rapidly the surface of radiator 103, need not to carry out the heat conduction of radiator 103 inside, and radiator 103 just can carry out to the external world heat and exchange transmission.
Embodiment 4
The present embodiment adopts the application mode identical with embodiment 2, but adopt any one method in chemical vapour deposition technique, tape stripping method, chemical stripping method, independently make graphene film 504, or contain the carrier 504 of graphene film, with gum or other physics fixing meanss, graphene film 504 is covered on the whole contact-making surface at heater members 101 and the place, contact site of radiator 103.Difference is, does not use heat-conducting interface material 102, and Fig. 5 is its schematic diagram, and heater members 101 is directly connected in graphene film 504.
Graphene film due to independent system has certain structural elasticity, can not use heat-conducting interface material 102, allow heater members 101 directly to radiator 103 flash heat transfers, thereby eliminated the thermal resistance of thermal interfacial material, improved the heat efficiency, thereby saved production cost.
Certainly, can not use heat-conducting interface material 102 in embodiment 1 and 3 yet, heater members 101 is directly contacted with graphene film.
It is to be noted, except the above embodiment, also can be except the contact site of radiator and heat-conducting interface material or heater members, any one or the graphene coated film in many places, make the heat transfer speed at this place improve, thereby improve the radiating rate of radiator.Preferably, be coated on the contact site of radiator and heat-conducting interface material or heater members to major general's graphene film.So, not only can improve the radiating rate of radiator, can also shorten heat-conducting interface material or heater members and conduct heat the required time to radiator.
The radiator that above-described embodiment uses, its bulk material are any one in metal, metal alloy, nonmetallic materials.Better, affiliated metal material is any one in aluminium, copper; Described metal alloy compositions is any one in aluminium alloy, copper alloy; Described nonmetallic materials are any one in polymethyl methacrylate, structural plastic.
The shape of described radiator is not unique, can be computer chip with fin-shaped band fan radiator, with fin-shaped not with any one in the nonmetal structure spare that can serve as radiator in the hardware that can serve as radiator in fan radiator, power electronics devices die cast metal heat radiation chamber, power electronics devices die cast metal casing, mobile electronic device, mobile electronic device.
As mentioned above, surface provided by the invention is covered with the radiator of graphene film, utilize the high thermal conductivity of Graphene, heat can carry out the face transmission along graphene film rapidly, thereby reduced the heat conduction path of radiator inside, improved the radiating rate of radiator, can also shorten heat-conducting interface material or heater members and conduct heat the required time to radiator.Therefore, the present invention has higher heat-transfer rate, and superior thermal diffusivity.This novel radiator can carry out rapidly heat propagation on the surface, and reach heat balance in radiator, thereby, temperature gradient on reduction or elimination heat conduction path, make the temperature step-down of heater members, the global reliability of device and equipment and the ability that works long hours are improved in the uneven focus of the temperature of abatement apparatus inside zone.
Those of ordinary skill in the field are to be understood that: the above only is specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any modification of making, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (9)
1. a surface is covered with the radiator of graphene film, it is characterized in that, the surface of described radiator is covered with graphene film.
2. surface according to claim 1 is covered with the radiator of graphene film, it is characterized in that, the described surface that is covered with graphene film is the contact site of the corresponding heat-conducting interface material of heater members and radiator.
3. surface according to claim 1 is covered with the radiator of graphene film, it is characterized in that, the described surface that is covered with graphene film is the whole contact-making surface at the place, contact site of the corresponding heat-conducting interface material of heater members and radiator.
4. surface according to claim 1 is covered with the radiator of graphene film, it is characterized in that, the surface of described radiator all is covered with graphene film.
5. according to claim 1～4 any one described surfaces are covered with the radiator of graphene film, it is characterized in that, described graphene film selects the chemical vapour deposition technique Direct precipitation to make in spreader surface.
6. according to claim 1～4 any one described surfaces are covered with the radiator of graphene film, it is characterized in that, described radiator, select any one method in chemical vapour deposition technique, tape stripping method, chemical stripping method, independently make graphene film or contain the carrier of graphene film, with gum or other physics fixing meanss, make graphene film be covered in the surface of radiator.
7. surface according to claim 1 is covered with the radiator of graphene film, it is characterized in that, the bulk material of described radiator is any one in metal, metal alloy, nonmetallic materials.
8. surface according to claim 7 is covered with the radiator of graphene film, it is characterized in that, described metal material is any one in aluminium, copper; Described metal alloy compositions is any one in aluminium alloy, copper alloy; Described nonmetallic materials are any one in polymethyl methacrylate, structural plastic.
9. surface according to claim 1 is covered with the radiator of graphene film, it is characterized in that, described radiator be computer chip with fin-shaped band fan radiator, with fin-shaped not with serving as the hardware of radiator, any one in nonmetal structure spare in fan radiator, power electronics devices die cast metal heat radiation chamber or casing, mobile electronic device.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100997497A CN103107147A (en) | 2012-04-06 | 2012-04-06 | Radiator with surface covered with graphene film |
| PCT/CN2012/075192 WO2013149420A1 (en) | 2012-04-06 | 2012-05-08 | Highly heat-conductive adhesive tape of metal foil |
| DE112012006195.0T DE112012006195T5 (en) | 2012-04-06 | 2012-05-08 | Strong thermally conductive adhesive tape made of metal foil |
| PCT/CN2012/079662 WO2013149446A1 (en) | 2012-04-06 | 2012-08-03 | Heat-dissipater coated with graphene thin film on surface |
| DE112012006196.9T DE112012006196T5 (en) | 2012-04-06 | 2012-08-03 | Heat sink, coated with graphene film on the surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100997497A CN103107147A (en) | 2012-04-06 | 2012-04-06 | Radiator with surface covered with graphene film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103107147A true CN103107147A (en) | 2013-05-15 |
Family
ID=48314895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100997497A Pending CN103107147A (en) | 2012-04-06 | 2012-04-06 | Radiator with surface covered with graphene film |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN103107147A (en) |
| DE (2) | DE112012006195T5 (en) |
| WO (2) | WO2013149420A1 (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014201686A1 (en) * | 2013-06-21 | 2014-12-24 | 北京中石伟业科技股份有限公司 | Heat conduction method for graphite-film heat conductor |
| CN104717876A (en) * | 2013-12-11 | 2015-06-17 | 中扬动力股份有限公司 | Heat transfer catalytic heat dissipation method |
| CN104900611A (en) * | 2015-06-09 | 2015-09-09 | 中国科学院微电子研究所 | Flexible-substrate-based three-dimensional packaging heat-radiation structure and preparation method thereof |
| EP2874479A4 (en) * | 2013-06-19 | 2015-12-16 | Amogreentech Co Ltd | Hybrid insulation sheet and electronic equipment comprising same |
| CN105974719A (en) * | 2016-06-24 | 2016-09-28 | 海信集团有限公司 | Wavelength conversion device and laser display system |
| CN106125865A (en) * | 2016-06-28 | 2016-11-16 | 太仓陶氏电气有限公司 | A kind of cpu heat of Graphene heat conduction |
| CN106211710A (en) * | 2016-07-15 | 2016-12-07 | 芜湖赛宝信息产业技术研究院有限公司 | A kind of heat radiation integrator for advanced equipments of high grade and precision |
| CN106684700A (en) * | 2017-03-02 | 2017-05-17 | 长春理工大学 | Semiconductor laser heat sink |
| CN106997873A (en) * | 2016-10-27 | 2017-08-01 | 上海大学 | A kind of encapsulating structure and method for packing |
| CN109786345A (en) * | 2019-03-13 | 2019-05-21 | 黄山宝霓二维新材科技有限公司 | The Advanced Packaging structure and processing technology of graphene-based IPM module |
| CN110214371A (en) * | 2017-01-23 | 2019-09-06 | Abb瑞士股份有限公司 | Semi-conductor power module including graphene |
| WO2020207478A1 (en) * | 2019-04-11 | 2020-10-15 | Oppo广东移动通信有限公司 | Heat-dissipating metal piece and preparation method therefor, and electronic device |
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| CN104861831A (en) * | 2015-06-10 | 2015-08-26 | 普罗旺斯科技（深圳）有限公司 | Graphene coating, graphene cooling fin and manufacturing methods of graphene coating and graphene cooling fin |
| US9709348B2 (en) * | 2015-10-27 | 2017-07-18 | Chang Chun Petrochemical Co., Ltd. | Heat-dissipating copper foil and graphene composite |
| CN112391128B (en) * | 2019-08-13 | 2023-01-10 | 上海优梯熙光学材料有限公司 | High-thermal-conductivity graphene heat dissipation material and preparation process thereof |
| CN113488442A (en) * | 2021-07-06 | 2021-10-08 | 德州宇航派蒙石墨烯科技有限责任公司 | Ultrathin radiating fin and preparation method thereof |
| US20230010755A1 (en) * | 2021-07-12 | 2023-01-12 | Dell Products L.P. | Information handling system thermal management with a liquid metal embedded elastomer |
| CN115033088A (en) * | 2022-06-28 | 2022-09-09 | 北京石墨烯技术研究院有限公司 | Graphene metal high-thermal-conductivity server radiator and preparation method thereof |
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| US20100128439A1 (en) * | 2008-11-24 | 2010-05-27 | General Electric Company | Thermal management system with graphene-based thermal interface material |
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| JP2011023670A (en) * | 2009-07-17 | 2011-02-03 | Thermo Graphitics Co Ltd | Anisotropic thermally-conductive element, and method of manufacturing the same |
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2012
- 2012-04-06 CN CN2012100997497A patent/CN103107147A/en active Pending
- 2012-05-08 WO PCT/CN2012/075192 patent/WO2013149420A1/en active Application Filing
- 2012-05-08 DE DE112012006195.0T patent/DE112012006195T5/en not_active Ceased
- 2012-08-03 DE DE112012006196.9T patent/DE112012006196T5/en not_active Withdrawn
- 2012-08-03 WO PCT/CN2012/079662 patent/WO2013149446A1/en active Application Filing
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| CN101048055A (en) * | 2006-03-30 | 2007-10-03 | 通用电气公司 | Advanced heat sinks and thermal spreaders |
| EP2034520A1 (en) * | 2006-06-08 | 2009-03-11 | International Business Machines Corporation | Highly heat conductive, flexible sheet |
| US20100085713A1 (en) * | 2008-10-03 | 2010-04-08 | Balandin Alexander A | Lateral graphene heat spreaders for electronic and optoelectronic devices and circuits |
| US20100128439A1 (en) * | 2008-11-24 | 2010-05-27 | General Electric Company | Thermal management system with graphene-based thermal interface material |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2874479A4 (en) * | 2013-06-19 | 2015-12-16 | Amogreentech Co Ltd | Hybrid insulation sheet and electronic equipment comprising same |
| WO2014201686A1 (en) * | 2013-06-21 | 2014-12-24 | 北京中石伟业科技股份有限公司 | Heat conduction method for graphite-film heat conductor |
| CN104717876A (en) * | 2013-12-11 | 2015-06-17 | 中扬动力股份有限公司 | Heat transfer catalytic heat dissipation method |
| CN104900611B (en) * | 2015-06-09 | 2017-09-08 | 中国科学院微电子研究所 | Three-dimension packaging radiator structure based on flexible base board and preparation method thereof |
| CN104900611A (en) * | 2015-06-09 | 2015-09-09 | 中国科学院微电子研究所 | Flexible-substrate-based three-dimensional packaging heat-radiation structure and preparation method thereof |
| CN105974719A (en) * | 2016-06-24 | 2016-09-28 | 海信集团有限公司 | Wavelength conversion device and laser display system |
| CN106125865A (en) * | 2016-06-28 | 2016-11-16 | 太仓陶氏电气有限公司 | A kind of cpu heat of Graphene heat conduction |
| CN106211710A (en) * | 2016-07-15 | 2016-12-07 | 芜湖赛宝信息产业技术研究院有限公司 | A kind of heat radiation integrator for advanced equipments of high grade and precision |
| CN106211710B (en) * | 2016-07-15 | 2018-07-20 | 芜湖赛宝信息产业技术研究院有限公司 | A kind of heat dissipation integrator for advanced equipments of high grade and precision |
| CN106997873A (en) * | 2016-10-27 | 2017-08-01 | 上海大学 | A kind of encapsulating structure and method for packing |
| CN110214371A (en) * | 2017-01-23 | 2019-09-06 | Abb瑞士股份有限公司 | Semi-conductor power module including graphene |
| CN106684700A (en) * | 2017-03-02 | 2017-05-17 | 长春理工大学 | Semiconductor laser heat sink |
| CN109786345A (en) * | 2019-03-13 | 2019-05-21 | 黄山宝霓二维新材科技有限公司 | The Advanced Packaging structure and processing technology of graphene-based IPM module |
| WO2020207478A1 (en) * | 2019-04-11 | 2020-10-15 | Oppo广东移动通信有限公司 | Heat-dissipating metal piece and preparation method therefor, and electronic device |
| CN111818755A (en) * | 2019-04-11 | 2020-10-23 | Oppo广东移动通信有限公司 | Heat dissipation metal part, preparation method thereof and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013149420A1 (en) | 2013-10-10 |
| DE112012006195T5 (en) | 2014-12-24 |
| DE112012006196T5 (en) | 2014-12-24 |
| WO2013149446A1 (en) | 2013-10-10 |
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Application publication date: 20130515 |