CN207744313U - Ray machine heat-pipe radiator - Google Patents
Ray machine heat-pipe radiator Download PDFInfo
- Publication number
- CN207744313U CN207744313U CN201721897048.2U CN201721897048U CN207744313U CN 207744313 U CN207744313 U CN 207744313U CN 201721897048 U CN201721897048 U CN 201721897048U CN 207744313 U CN207744313 U CN 207744313U
- Authority
- CN
- China
- Prior art keywords
- heat
- conducting pipe
- pipe
- absorber plate
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000006096 absorbing agent Substances 0.000 claims abstract description 32
- 230000017525 heat dissipation Effects 0.000 claims abstract description 16
- 239000002250 absorbent Substances 0.000 claims abstract description 15
- 239000006071 cream Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 2
- 239000008358 core component Substances 0.000 description 2
- 201000005947 Carney Complex Diseases 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of ray machine heat-pipe radiator, includes heat conducting pipe, fin and absorber plate；The fin is arranged on heat conducting pipe, and the outer surface of fin is coated with nanometer heat dissipation Tu layer；The absorber plate is fixed on one end of heat conducting pipe, and absorber plate has a heat-absorbent surface being in contact with computer CPU and the thermal conductive surface contacted with heat conducting pipe, is coated with heat-sink shell on heat-absorbent surface, is coated with heat-conducting layer on thermal conductive surface, which is in contact with heat conducting pipe.The heat that computer CPU generates is absorbed by absorber plate, the heat of absorption is transmitted on heat conducting pipe, and heat conducting pipe, which is conducted heat to again on fin, to radiate, and the outer surface of fin is coated with nanometer heat dissipation Tu layer, makes its heat dissipation faster；It is coated with heat-sink shell on the heat-absorbent surface of absorber plate, quickly carries out heat transfer heat absorption, heat-conducting layer is coated on the thermal conductive surface of absorber plate, heat is quickly led on heat conducting pipe；The utility model excellent in heat dissipation effect.
Description
Technical field
The utility model is related to radiator field technologies, refer in particular to a kind of ray machine heat-pipe radiator.
Background technology
Ray machine is the product of numerically-controlled machine tool, and for the lathes core component such as digital control system, technology content is relatively low.So
And this is not as much as to say, ray machine is very easy to manufacture.The design and manufacturing technology level of ray machine are directly related to numerically-controlled machine tool
Quality, life and reliability, it is desirable that manufacturing enterprise has very high technology and management level.Ray machine manufacturing enterprise of China is improving
While product quality and level, it is also necessary to walk autonomous innovation road, the core component of development of CNC improves the life of enterprise
Production level and economic benefit.And the heat dissipation problem that brings of heat that ray machine computer CPU generates also with.
Utility model content
In view of this, the utility model is in view of the existing deficiencies of the prior art, main purpose is to provide a kind of ray machine heat
Tube radiator efficiently solves the heat dissipation problem that the heat of computer CPU generation is brought.
To achieve the above object, the utility model is using following technical solution：
A kind of ray machine heat-pipe radiator includes heat conducting pipe, fin and absorber plate；The fin is arranged on heat conducting pipe, fin
The outer surface of piece is coated with nanometer heat dissipation Tu layer；The absorber plate is fixed on one end of heat conducting pipe, and absorber plate has one and computer CPU phase
The heat-absorbent surface of contact and the thermal conductive surface contacted with heat conducting pipe are coated with heat-sink shell on heat-absorbent surface, heat conduction are coated on thermal conductive surface
Layer, the heat-conducting layer are in contact with heat conducting pipe.
As a preferred embodiment, the heat-sink shell is heat-conducting cream, and heat-conducting cream coating is on heat-absorbent surface.
As a preferred embodiment, one end of the heat conducting pipe is provided with fixed support plate, is opened up on the fixed support plate
It is useful for the through-hole of lock screw.
As a preferred embodiment, the heat conducting pipe, absorber plate and fixed support plate are copper material.
As a preferred embodiment, the absorber plate and fixed support plate are all made of the mode of welding and are fixed on heat conducting pipe
On.
As a preferred embodiment, the heat conducting pipe is two, corresponding, and absorber plate is two.
The utility model has clear advantage and advantageous effect compared with prior art, specifically, by above-mentioned technology
Known to scheme：
The heat that computer CPU generates is absorbed by absorber plate, the heat of absorption is transmitted on heat conducting pipe, heat conducting pipe
It conducts heat on fin and radiates again, the outer surface of fin is coated with nanometer heat dissipation Tu layer, makes its heat dissipation faster；Absorber plate
Heat-absorbent surface on be coated with heat-sink shell, quickly carry out heat transfer heat absorption, heat-conducting layer be coated on the thermal conductive surface of absorber plate, will be hot
Amount is quickly led on heat conducting pipe；The utility model excellent in heat dissipation effect.
More clearly to illustrate the structure feature and effect of the utility model, come below in conjunction with the accompanying drawings with specific embodiment pair
The utility model is described in detail.
Description of the drawings
Fig. 1 is the stereogram of the preferred embodiment of the utility model；
Fig. 2 be the utility model preferred embodiment in absorber plate partial cross-sectional view.
Description of drawing identification：
10, heat conducting pipe 20, fin
30, absorber plate 31, heat-absorbent surface
32, thermal conductive surface 40, fixed support plate
50, heat-sink shell 60, heat-conducting layer.
Specific implementation mode
It please refers to shown in Fig. 1 to Fig. 2, that show the concrete structures of the preferred embodiment of the utility model, include
Heat conducting pipe 10, fin 20 and absorber plate 30.
One end of the heat conducting pipe 10 is provided with fixed support plate 40, is offered on the fixed support plate 40 for locking screw
Through-hole 401, fixed support plate 40 are fixed on by the way of welding on heat conducting pipe 10.
The fin 20 is arranged on heat conducting pipe 10, and the outer surface of fin 20 is coated with nanometer heat dissipation Tu layer, makes its heat dissipation faster.
The absorber plate 30 is fixed on one end of heat conducting pipe 10, and absorber plate 30 has a heat-absorbent surface being in contact with computer CPU
31 and the thermal conductive surface 32 that is contacted with heat conducting pipe 10, heat-sink shell 50 is coated on heat-absorbent surface 31, and heat-sink shell 50 generates computer CPU
Heat quickly absorb, in the present embodiment, heat-sink shell 50 be heat-conducting cream, heat-conducting cream coating is on heat-absorbent surface 31, heat-conducting cream
With good heat conductivity and electrical insulating property, damping, impact resistance.Heat-conducting layer 60 is coated on thermal conductive surface 32, the heat-conducting layer
60 are in contact with heat conducting pipe 10, and heat-conducting layer 60 quickly leads heat on heat conducting pipe 10.
The heat conducting pipe 10, absorber plate 30 and fixed support plate 40 are copper material, copper material good heat conductivity, in this implementation
In example, the mode that absorber plate 10 and fixed support plate 40 are all made of welding is fixed on heat conducting pipe 10.Heat conducting pipe 10 is two, phase
Corresponding, absorber plate 30 is two.
The design focal point of the utility model is：
The heat that computer CPU generates is absorbed by absorber plate, the heat of absorption is transmitted on heat conducting pipe, heat conducting pipe
It conducts heat on fin and radiates again, the outer surface of fin is coated with nanometer heat dissipation Tu layer, makes its heat dissipation faster；Absorber plate
Heat-absorbent surface on be coated with heat-sink shell, quickly carry out heat transfer heat absorption, heat-conducting layer be coated on the thermal conductive surface of absorber plate, will be hot
Amount is quickly led on heat conducting pipe；The utility model excellent in heat dissipation effect.
The above descriptions are merely preferred embodiments of the present invention, not makees to the technical scope of the utility model
Any restrictions, therefore any trickle amendment made by the above technical examples according to the technical essence of the present invention, equivalent change
Change and modify, is still within the scope of the technical solutions of the present invention.
Claims (6)
1. a kind of ray machine heat-pipe radiator, it is characterised in that：Include heat conducting pipe, fin and absorber plate；Fin setting is being led
On heat pipe, the outer surface of fin is coated with nanometer heat dissipation Tu layer；The absorber plate is fixed on one end of heat conducting pipe, absorber plate have one with
The heat-absorbent surface that computer CPU is in contact and the thermal conductive surface contacted with heat conducting pipe are coated with heat-sink shell on heat-absorbent surface, are wrapped on thermal conductive surface
It is covered with heat-conducting layer, which is in contact with heat conducting pipe.
2. ray machine heat-pipe radiator according to claim 1, it is characterised in that：The heat-sink shell is heat-conducting cream, heat-conducting cream
Coating is on heat-absorbent surface.
3. ray machine heat-pipe radiator according to claim 1, it is characterised in that：One end of the heat conducting pipe is provided with fixation
Support plate offers the through-hole for locking screw on the fixed support plate.
4. ray machine heat-pipe radiator according to claim 3, it is characterised in that：The heat conducting pipe, absorber plate and fixed branch
Fagging is copper material.
5. ray machine heat-pipe radiator according to claim 3, it is characterised in that：The absorber plate and fixed support plate are adopted
It is fixed on heat conducting pipe with the mode of welding.
6. ray machine heat-pipe radiator according to claim 1, it is characterised in that：The heat conducting pipe is two, corresponding,
Absorber plate is two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721897048.2U CN207744313U (en) | 2017-12-29 | 2017-12-29 | Ray machine heat-pipe radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721897048.2U CN207744313U (en) | 2017-12-29 | 2017-12-29 | Ray machine heat-pipe radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207744313U true CN207744313U (en) | 2018-08-17 |
Family
ID=63120816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721897048.2U Active CN207744313U (en) | 2017-12-29 | 2017-12-29 | Ray machine heat-pipe radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207744313U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109449729A (en) * | 2018-09-20 | 2019-03-08 | 深圳市大德激光技术有限公司 | A kind of optical fiber coiling device of ultrafast pulsed laser device |
| CN111412550A (en) * | 2020-04-03 | 2020-07-14 | 浙江大学 | New forms of energy special type air conditioner and condenser heat pipe processing equipment thereof |
-
2017
- 2017-12-29 CN CN201721897048.2U patent/CN207744313U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109449729A (en) * | 2018-09-20 | 2019-03-08 | 深圳市大德激光技术有限公司 | A kind of optical fiber coiling device of ultrafast pulsed laser device |
| CN111412550A (en) * | 2020-04-03 | 2020-07-14 | 浙江大学 | New forms of energy special type air conditioner and condenser heat pipe processing equipment thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231127 Address after: 523000, Building C1, No.10 Gaoli Fifth Road, Qinghutou Community, Tangxia Town, Dongguan City, Guangdong Province Patentee after: Dongguan Xinhao Hardware Machinery Co.,Ltd. Address before: No. 10 Gaoli Fifth Road, Tangxia Town, Dongguan City, Guangdong Province, 523000 Patentee before: DONGGUAN DAYI HARDWARE MACHINERY Co.,Ltd. |
|
| TR01 | Transfer of patent right |