CN206283715U - A kind of two-sided PCB - Google Patents
A kind of two-sided PCB Download PDFInfo
- Publication number
- CN206283715U CN206283715U CN201621485571.XU CN201621485571U CN206283715U CN 206283715 U CN206283715 U CN 206283715U CN 201621485571 U CN201621485571 U CN 201621485571U CN 206283715 U CN206283715 U CN 206283715U
- Authority
- CN
- China
- Prior art keywords
- copper foil
- foil layer
- substrate
- sided pcb
- heat conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model is related to pcb board technical field, refers in particular to a kind of two-sided PCB.It includes substrate, and the two sides of the substrate is provided with the first copper foil layer and the second copper foil layer, is etched with conducting channel on first copper foil layer and the second copper foil layer respectively, and component is additionally provided with first copper foil layer and the second copper foil layer;It is crisscross on first copper foil layer to be provided with least two pairs the first heat conduction roads;It is crisscross on second copper foil layer to be provided with least two pairs the second heat conduction roads;The metal throuth hole of substrate is provided through on substrate, the metal throuth hole is connected with the first copper foil layer and the second copper foil layer respectively.In the utility model, the first heat conduction road and the second heat conduction road can draw the heat on the first copper foil layer and the second copper foil layer respectively, reach more preferable radiating effect, further improve heat-sinking capability;By metal throuth hole so that PCB upper and lower surface temperature Fast-Balance and quick heat radiating, reach more preferable radiating effect.
Description
Technical field
The utility model is related to pcb board technical field, refers in particular to a kind of two-sided PCB.
Background technology
Pcb board is the supplier of electronic component electrical connection, and his is mainly designed to layout design.Using circuit board
Major advantage is the mistake for greatly reducing wiring and assembling, improves the gentle productive labor rate of Automated water, so being printed to the modern times
The processing technology of making sheet has requirement very high.
With the development of electronic product industry, widely, but two-sided PCB makes for two-sided PCB application
During, because power is larger, the heat that it is produced is also larger, easily causes that PCB is damaged.
Utility model content
The utility model provides a kind of two-sided PCB, good heat dissipation effect for problem of the prior art.
In order to solve the above-mentioned technical problem, the utility model is adopted the following technical scheme that:
A kind of two-sided PCB that the utility model is provided, includes substrate, and the two sides of the substrate is provided with the
One copper foil layer and the second copper foil layer, are etched with conducting channel, described first respectively on first copper foil layer and the second copper foil layer
Component is additionally provided with copper foil layer and the second copper foil layer;It is crisscross on first copper foil layer to be provided with least two pairs first
Heat conduction road;It is crisscross on second copper foil layer to be provided with least two pairs the second heat conduction roads;It is provided through on the substrate
The metal throuth hole of substrate, the metal throuth hole is connected with the first copper foil layer and the second copper foil layer respectively.
Wherein, it is crisscross on first copper foil layer to be provided with six pairs of the first heat conduction roads.
Wherein, it is crisscross on second copper foil layer to be provided with six pairs of the second heat conduction roads.
Wherein, the inwall of the metal throuth hole is coated with Copper Foil.
Wherein, the side of the substrate is provided with aluminium radiator, the aluminium radiator and the baseplate-laminating.
Wherein, the aluminium radiator is " mountain " font.
Wherein, the opposite side of the substrate is provided with semiconductor chilling plate, the cold end of the semiconductor chilling plate respectively with
The opposite side connection of the first copper foil layer, the second copper foil layer and substrate.
Wherein, the fixed spiral shell for semiconductor chilling plate to be fixedly connected with substrate is provided with the semiconductor chilling plate
Nail.
Wherein, be provided with the screw for coordinating with fixing screws on the substrate, the fixing screws include screw head and
Screw rod, during the screw rod stretches into screw through semiconductor chilling plate, the bottom of the screw rod is provided with locating piece, the screw
Bottom is provided with the location hole for coordinating with locating piece.
The beneficial effects of the utility model:
A kind of two-sided PCB that the utility model is provided, causes to lead by the first copper foil layer and the second copper foil layer
Heat is concentrated quick, it is ensured that the normal operation of component;Wherein, it is crisscross respectively on first copper foil layer and the second copper foil layer
It is provided with least two pairs the first heat conduction roads and the secondth heat conduction road;The first heat conduction road and the second heat conduction road respectively can be by the
Heat on one copper foil layer and the second copper foil layer is drawn, and reaches more preferable radiating effect, further improves heat-sinking capability;Together
When, the first copper foil layer and the second copper foil layer are connected by metal throuth hole, metal throuth hole penetrates substrate, by the first copper foil layer, the
Two copper foil layers and substrate connection are overall so that PCB upper and lower surface temperature Fast-Balance and quick heat radiating, are reached more preferably
Radiating effect.
Brief description of the drawings
Fig. 1 is a kind of structural representation of two-sided PCB of the present utility model.
Fig. 2 is the structural representation of the first copper foil layer of the present utility model.
Fig. 3 is the structural representation of the second copper foil layer of the present utility model.
Fig. 4 is the structural representation that fixing screws of the present utility model coordinate with substrate.
Reference in Fig. 1 to Fig. 4 includes:
The copper foil layer of the copper foil layer of 1-substrate 2-the first 3-the second
The heat conduction of 4-component 5-the first road the 6-the second heat conduction road
7-metal throuth hole, 8-aluminium radiator, 9-semiconductor chilling plate
10-fixing screws, 11-screw, 12-screw head
13-screw rod, 14-locating piece, 15-location hole.
Specific embodiment
For the ease of the understanding of those skilled in the art, further is made to the utility model with reference to embodiment and accompanying drawing
Explanation, the content that implementation method is referred to is not to restriction of the present utility model.The utility model is carried out below in conjunction with accompanying drawing
Detailed description.
A kind of two-sided PCB described in the present embodiment, includes substrate 1, and the two sides of the substrate 1 is provided with
One copper foil layer 2 and the second copper foil layer 3, conducting channel is etched with the copper foil layer 3 of first copper foil layer 2 and second respectively, described
Component 4 is additionally provided with first copper foil layer 2 and the second copper foil layer 3;It is crisscross on first copper foil layer 2 to be provided with least
Two pairs of the first heat conduction roads 5;It is crisscross on second copper foil layer 3 to be provided with least two pairs the second heat conduction roads 6;The substrate 1
On be provided through the metal throuth hole 7 of substrate 1, the metal throuth hole 7 is connected with the first copper foil layer 2 and the second copper foil layer 3 respectively.
Specifically, because copper thermal conductivity factor is high, cause that heat conduction is concentrated by the first copper foil layer 2 and the second copper foil layer 3 quick, it is ensured that first device
The normal operation of part 4;Wherein, it is crisscross respectively on the copper foil layer 3 of first copper foil layer 2 and second to be provided with least two pairs
One heat conduction road 5 and the secondth heat conduction road 6;First heat conduction road, the 5 and second heat conduction road 6 respectively can be by the He of the first copper foil layer 2
Heat on second copper foil layer 3 is drawn, and reaches more preferable radiating effect, further improves heat-sinking capability;Meanwhile, by metal
Through hole 7 connects the first copper foil layer 2 with the second copper foil layer 3, and metal throuth hole 7 penetrates substrate 1, by the first copper foil layer 2, the second Copper Foil
Layer 3 and substrate 1 are connected as entirety so that PCB upper and lower surface temperature Fast-Balance and quick heat radiating, reach and preferably dissipate
Thermal effect.
A kind of two-sided PCB described in the present embodiment, it is crisscross on first copper foil layer 2 to be provided with six pairs
First heat conduction road 5.Specifically, six pairs of the first heat conduction roads 5 are provided with so that the radiating effect of the first copper foil layer 2 is good, and are dissipated
It is hot uniform, be not in the too high situation of the portion temperature of the first copper foil layer 2, good stability.
A kind of two-sided PCB described in the present embodiment, it is crisscross on second copper foil layer 3 to be provided with six pairs
Second heat conduction road 6.Specifically, six pairs of the second heat conduction roads 6 are provided with so that the radiating effect of the second copper foil layer 3 is good, and are dissipated
It is hot uniform, be not in the too high situation of the portion temperature of the second copper foil layer 3, good stability.
A kind of two-sided PCB described in the present embodiment, the inwall of the metal throuth hole 7 is coated with Copper Foil.Specifically
Ground, the inwall of metal throuth hole 7 is coated with Copper Foil can further improve radiating effect.
A kind of two-sided PCB described in the present embodiment, the side of the substrate 1 is provided with aluminium radiator 8, described
Aluminium radiator 8 is fitted with the substrate 1.Specifically, the aluminium radiator 8 can be to substrate 1, the first copper foil layer 2 and the second bronze medal
Layers of foil 3 carries out heat conduction and radiating, good heat dissipation effect.
A kind of two-sided PCB described in the present embodiment, the aluminium radiator 8 is " mountain " font.Specifically, it is described
Aluminium radiator 8 is " mountain " font, increase aluminium radiator 8 and the contact area of air, further improves radiating effect.
A kind of two-sided PCB described in the present embodiment, the opposite side of the substrate 1 is provided with semiconductor chilling plate
9, the opposite side of the cold end of the semiconductor chilling plate 9 respectively with the first copper foil layer 2, the second copper foil layer 3 and substrate 1 is connected.Tool
Body ground, the semiconductor chilling plate 9 further increasing the heat radiation energy of the first copper foil layer 2, the second copper foil layer 3 and substrate 1
Power, it is ensured that the stability of PCB.
A kind of two-sided PCB described in the present embodiment, is provided with the semiconductor chilling plate 9 for will partly lead
The fixing screws 10 that body cooling piece 9 is fixedly connected with substrate 1.Specifically, the fixing screws 10 are by semiconductor chilling plate 9 and base
Plate 1 is fixedly connected, and prevents that semiconductor chilling plate 9 from being come off when temperature is too high or semiconductor chilling plate 9 is taken off due to long-term use
Situation about falling occurs.
A kind of two-sided PCB described in the present embodiment, is provided with the substrate 1 for matching somebody with somebody with fixing screws 10
The screw 11 of conjunction, the fixing screws 10 include screw head 12 and screw rod 13, and the screw rod 13 stretches into spiral shell through semiconductor chilling plate 9
In hole 11, the bottom of the screw rod 13 is provided with locating piece 14, and the bottom of the screw 11 is provided with for matching somebody with somebody with locating piece 14
The location hole 15 of conjunction.Specifically, when semiconductor chilling plate 9 is fixed on substrate 1 by fixing screws 10, the screw rod 13
Stretch into screw 11, when the locating piece 14 stretches into location hole 15, show fixed screw installation, can prevent from continuing to press
Close fixed screw and cause that semiconductor chilling plate 9 and substrate 1 are damaged.
The above, is only the utility model preferred embodiment, not makees any formal to the utility model
Limitation, although the utility model is disclosed as above with preferred embodiment, but is not limited to the utility model, any to be familiar with sheet
Technical professional, is not departing from the range of technical solutions of the utility model, when the technology contents using the disclosure above are made
A little change is modified to the Equivalent embodiments of equivalent variations, as long as being without departing from technical solutions of the utility model content, foundation
The utility model technology refers to any simple modification, equivalent variations and the modification made to above example, belongs to this practicality
In the range of new technique scheme.
Claims (9)
1. a kind of two-sided PCB, it is characterised in that:Substrate is included, the two sides of the substrate is provided with the first Copper Foil
Layer and the second copper foil layer, are etched with conducting channel, first copper foil layer respectively on first copper foil layer and the second copper foil layer
Component is additionally provided with the second copper foil layer;It is crisscross on first copper foil layer to be provided with least two pairs the first heat conduction
Road;It is crisscross on second copper foil layer to be provided with least two pairs the second heat conduction roads;Substrate is provided through on the substrate
Metal throuth hole, the metal throuth hole connects with the first copper foil layer and the second copper foil layer respectively.
2. a kind of two-sided PCB according to claim 1, it is characterised in that:On first copper foil layer in length and breadth
It is staggeredly equipped with six pairs of the first heat conduction roads.
3. a kind of two-sided PCB according to claim 1, it is characterised in that:On second copper foil layer in length and breadth
It is staggeredly equipped with six pairs of the second heat conduction roads.
4. a kind of two-sided PCB according to claim 1, it is characterised in that:The inwall of the metal throuth hole is applied
It is covered with Copper Foil.
5. a kind of two-sided PCB according to claim 1, it is characterised in that:The side of the substrate is provided with
Aluminium radiator, the aluminium radiator and the baseplate-laminating.
6. a kind of two-sided PCB according to claim 5, it is characterised in that:The aluminium radiator is " mountain " word
Shape.
7. a kind of two-sided PCB according to claim 1, it is characterised in that:The opposite side of the substrate is set
There is semiconductor chilling plate, the cold end of the semiconductor chilling plate is another with the first copper foil layer, the second copper foil layer and substrate respectively
Side connects.
8. a kind of two-sided PCB according to claim 7, it is characterised in that:Set on the semiconductor chilling plate
It is equipped with the fixing screws for semiconductor chilling plate to be fixedly connected with substrate.
9. a kind of two-sided PCB according to claim 8, it is characterised in that:Be provided with the substrate for
The screw coordinated with fixing screws, the fixing screws include screw head and screw rod, and the screw rod is stretched into through semiconductor chilling plate
In screw, the bottom of the screw rod is provided with locating piece, and the bottom of the screw is provided with the positioning for coordinating with locating piece
Hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621485571.XU CN206283715U (en) | 2016-12-31 | 2016-12-31 | A kind of two-sided PCB |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621485571.XU CN206283715U (en) | 2016-12-31 | 2016-12-31 | A kind of two-sided PCB |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206283715U true CN206283715U (en) | 2017-06-27 |
Family
ID=59071855
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201621485571.XU Expired - Fee Related CN206283715U (en) | 2016-12-31 | 2016-12-31 | A kind of two-sided PCB |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN206283715U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107570799A (en) * | 2017-09-27 | 2018-01-12 | 常州格力博有限公司 | Electric tool |
CN113454571A (en) * | 2019-03-06 | 2021-09-28 | 思科技术公司 | Multi-slot server assembly |
CN113726128A (en) * | 2021-08-25 | 2021-11-30 | 南京远驱科技有限公司 | Layout wiring method for high-power true vector variable frequency controller components |
-
2016
- 2016-12-31 CN CN201621485571.XU patent/CN206283715U/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107570799A (en) * | 2017-09-27 | 2018-01-12 | 常州格力博有限公司 | Electric tool |
CN113454571A (en) * | 2019-03-06 | 2021-09-28 | 思科技术公司 | Multi-slot server assembly |
CN113726128A (en) * | 2021-08-25 | 2021-11-30 | 南京远驱科技有限公司 | Layout wiring method for high-power true vector variable frequency controller components |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170627 Termination date: 20191231 |
|
CF01 | Termination of patent right due to non-payment of annual fee |