CN106982544A - A kind of radiator structure of high power density Switching Power Supply - Google Patents
A kind of radiator structure of high power density Switching Power Supply Download PDFInfo
- Publication number
- CN106982544A CN106982544A CN201710396697.2A CN201710396697A CN106982544A CN 106982544 A CN106982544 A CN 106982544A CN 201710396697 A CN201710396697 A CN 201710396697A CN 106982544 A CN106982544 A CN 106982544A
- Authority
- CN
- China
- Prior art keywords
- copper
- heater members
- power supply
- radiator structure
- power density
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Air-Conditioning For Vehicles (AREA)
Abstract
The present invention provides a kind of radiator structure of high power density Switching Power Supply, its heater members is mounted in the one side of circuit board, radiator aluminium base plate is mounted in the another side of circuit board, in the reserved one block of dew copper of the corresponding one side of heater members, reveal and a copper billet welded on copper, there are multiple through holes on circuit board between heater members and dew copper, it is characterised in that, heater members are radiated by through hole and copper billet, reduce temperature.The present invention provides a kind of high performance radiator structure, improves the reliability of power supply, while reducing the production cost of radiator aluminium base plate, the power density of power module is further lifted, is that the performance boost of new and high technology electronic product contributes.
Description
Technical field
The present invention relates to field of switch power, more particularly to a kind of radiator structure of high power density Switching Power Supply.
Background technology
The anxiety and environmental pollution supplied with global energy are on the rise, clean energy vehicle-electric automobile by
Step is paid attention to by various countries, and especially in recent years, electric automobile is flourished, high power vehicular controller, and DC/DC becomes
Parallel operation, OBC promotes Power Electronic Technique large-scale use on automotive electronics.It is right due to the use environment that automotive electronics is harsh
High efficiency, high power density, high reliability proposes higher requirement, in this context, and the radiating of power device progressively turns into
Bottleneck, patent of the present invention proposes a kind of efficient radiating mode, promote application of the Power Electronic Technique on automotive electronics closer to
One step.
On complicated radiating mode, traditional way is as shown in figure 1, radiator aluminium base plate needs the knot according to power module
Structure cuts into various shapes, and not only difficulty of processing is big, and cost of manufacture is high.
In view of the above-mentioned problems, the present invention proposes a kind of easy processing, the low radiator structure of cost.
The content of the invention
The technical problems to be solved by the invention be for high power density switch power module there is provided it is a kind of efficiently it is low
The radiator structure of cost.
The present invention is to realize above-mentioned purpose by following technical proposals：
A kind of radiator structure of high power density Switching Power Supply, its heater members are mounted in the one side of circuit board, radiator aluminium base plate dress
In the another side of circuit board, beside heater members or the reserved one block of dew copper of corresponding one side, a copper billet is welded on dew copper,
There are multiple through holes on circuit board between heater members and dew copper, it is characterised in that heater members are radiated by through hole and copper billet, drop
Low temperature.
Preferably, the radiator structure of above-mentioned high power density Switching Power Supply, it is characterised in that heater members are welded on circuit
Dew Copper treatment has been done in position on plate, in favor of the conduction of thermal source.
Preferably, the radiator structure of above-mentioned high power density Switching Power Supply, it is characterised in that copper billet height and the same face
Highest device is consistent, or lower slightly, and so overall radiator aluminium base plate just can be using standard sections processing, it is not necessary to processes in addition
Into special shape, processing cost is reduced.
Preferably, the radiator structure of above-mentioned high power density Switching Power Supply, it is characterised in that copper billet is by thermal paste with dissipating
Hot aluminium base is in contact, and forms three-dimensional radiating, and equivalent thermal resistance is greatly reduced.
The present invention provides a kind of high performance radiator structure, the reliability of power supply is improved, while reducing heat-radiating aluminum
The production cost of plate, makes the power density of power module further be lifted, and is that the performance boost of new and high technology electronic product is made
Contribution.
Brief description of the drawings
Fig. 1 is traditional radiator aluminium base plate.
Fig. 2 is the partial side schematic view of radiating structure.
Fig. 3 is the overall side schematic view of radiating structure.
Embodiment
Present pre-ferred embodiments are provided below in conjunction with the accompanying drawings, to describe technical scheme in detail.
The present invention provides a kind of radiator structure of high power density Switching Power Supply, as shown in figure 3, the structure includes heating element
Part 10, PCB 20, through hole 30, copper billet 40, radiator aluminium base plate 50, heater members 10 are the elements for needing to radiate, and place heating element
To reveal copper on the PCB positions of part, and have another side of multiple through holes to PCB, the corresponding PCB of heater members another side is reserved
One block of dew copper, for welding copper billet, in the outside of dress copper billet, whole power module fills radiator aluminium base plate, and thermal source is passed by through hole
To copper billet, there is thermal paste between copper billet and aluminum cooling substrates, it is ensured that thermal source is transmitted to aluminium base well, while copper billet is formed
Solid radiating, equivalent thermal resistance is greatly reduced, in addition, the height of copper billet is flushed or lower slightly than the highest component of the same face, so
Aluminium base can be processed and formed at one time just without being reprocessed into rough shape with standard sections, and operation is convenient, is produced into
Originally substantially reduce.
Although the foregoing describing the specific implementation case of the present invention, it will be appreciated by those of skill in the art that these
It is merely illustrative of, on the premise of the principle and essence without departing substantially from the present invention, a variety of changes can be made to these case study on implementation
More or modification.Therefore, protection scope of the present invention is defined by the appended claims.
Claims (4)
1. a kind of radiator structure of high power density Switching Power Supply, its heater members are mounted in the one side of circuit board, radiator aluminium base plate
Mounted in the another side of circuit board, beside heater members or the reserved one block of dew copper of corresponding one side, a copper billet is welded on dew copper,
There are multiple through holes on circuit board between heater members and dew copper, it is characterised in that heater members are radiated by through hole and copper billet,
Reduce temperature.
2. a kind of radiator structure of high power density Switching Power Supply as described in claim 1, it is characterised in that heater members
Dew Copper treatment has been done in the position of welding on circuit boards, in favor of the conduction of thermal source.
3. a kind of radiator structure of high power density Switching Power Supply as claimed in claim 1, it is characterised in that copper billet height and
The highest device of the same face is consistent, or lower slightly, and so overall radiator aluminium base plate just can be using standard sections processing, it is not necessary to
Special shape is otherwise processed into, processing cost is reduced.
4. a kind of radiator structure of high power density Switching Power Supply as claimed in claim 1, copper billet passes through thermal paste and radiating
Aluminium base is in contact, and forms three-dimensional radiating, and equivalent thermal resistance is greatly reduced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710396697.2A CN106982544A (en) | 2017-05-31 | 2017-05-31 | A kind of radiator structure of high power density Switching Power Supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710396697.2A CN106982544A (en) | 2017-05-31 | 2017-05-31 | A kind of radiator structure of high power density Switching Power Supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106982544A true CN106982544A (en) | 2017-07-25 |
Family
ID=59343112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710396697.2A Withdrawn CN106982544A (en) | 2017-05-31 | 2017-05-31 | A kind of radiator structure of high power density Switching Power Supply |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106982544A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108650851A (en) * | 2018-05-21 | 2018-10-12 | 苏州春兴精工股份有限公司 | A kind of process of enhancing microwave product heat dissipation |
| CN108925027A (en) * | 2018-07-16 | 2018-11-30 | 惠州市华星光电技术有限公司 | Radiator structure |
| CN110402061A (en) * | 2018-04-25 | 2019-11-01 | 保时捷股份公司 | The cooling of power electronic circuit |
| CN110890062A (en) * | 2019-11-21 | 2020-03-17 | Tcl华星光电技术有限公司 | Display device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004363183A (en) * | 2003-06-02 | 2004-12-24 | Toyota Motor Corp | Heat dissipating structure of electronic part |
| CN101556941A (en) * | 2009-05-13 | 2009-10-14 | 重庆三祥汽车电控系统有限公司 | Heat radiation structure of surface mounting high-power element |
| CN101645478A (en) * | 2008-08-08 | 2010-02-10 | 鸿富锦精密工业（深圳）有限公司 | Light emitting diode (LED) radiating structure |
| CN106061099A (en) * | 2016-06-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | Printed circuit board and mobile terminal having the same |
| US9641254B1 (en) * | 2014-10-10 | 2017-05-02 | Google Inc. | Heat dissipation approach in chip on board assembly by using stacked copper microvias |
| CN207083348U (en) * | 2017-05-31 | 2018-03-09 | 江苏兆能电子有限公司 | A kind of radiator structure of high power density Switching Power Supply |
-
2017
- 2017-05-31 CN CN201710396697.2A patent/CN106982544A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004363183A (en) * | 2003-06-02 | 2004-12-24 | Toyota Motor Corp | Heat dissipating structure of electronic part |
| CN101645478A (en) * | 2008-08-08 | 2010-02-10 | 鸿富锦精密工业（深圳）有限公司 | Light emitting diode (LED) radiating structure |
| CN101556941A (en) * | 2009-05-13 | 2009-10-14 | 重庆三祥汽车电控系统有限公司 | Heat radiation structure of surface mounting high-power element |
| US9641254B1 (en) * | 2014-10-10 | 2017-05-02 | Google Inc. | Heat dissipation approach in chip on board assembly by using stacked copper microvias |
| CN106061099A (en) * | 2016-06-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | Printed circuit board and mobile terminal having the same |
| CN207083348U (en) * | 2017-05-31 | 2018-03-09 | 江苏兆能电子有限公司 | A kind of radiator structure of high power density Switching Power Supply |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110402061A (en) * | 2018-04-25 | 2019-11-01 | 保时捷股份公司 | The cooling of power electronic circuit |
| CN108650851A (en) * | 2018-05-21 | 2018-10-12 | 苏州春兴精工股份有限公司 | A kind of process of enhancing microwave product heat dissipation |
| CN108925027A (en) * | 2018-07-16 | 2018-11-30 | 惠州市华星光电技术有限公司 | Radiator structure |
| CN110890062A (en) * | 2019-11-21 | 2020-03-17 | Tcl华星光电技术有限公司 | Display device |
| WO2021097904A1 (en) * | 2019-11-21 | 2021-05-27 | Tcl华星光电技术有限公司 | Display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 212000 No.298, daijiamen Road, Zhenjiang high tech Zone, Zhenjiang City, Jiangsu Province Applicant after: JIANGSU ZHAONENG ELECTRONIC CO.,LTD. Address before: No.99, dingmaojing 15th Road, Zhenjiang New District, Zhenjiang City, Jiangsu Province, 212009 Applicant before: JIANGSU ZHAONENG ELECTRONIC CO.,LTD. |
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| CB02 | Change of applicant information | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170725 |
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| WW01 | Invention patent application withdrawn after publication |