CN205331826U - Light -emitting device - Google Patents
Light -emitting device Download PDFInfo
- Publication number
- CN205331826U CN205331826U CN201521074857.4U CN201521074857U CN205331826U CN 205331826 U CN205331826 U CN 205331826U CN 201521074857 U CN201521074857 U CN 201521074857U CN 205331826 U CN205331826 U CN 205331826U
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- CN
- China
- Prior art keywords
- base plate
- light
- emitting device
- radiator
- circuit base
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Abstract
The utility model relates to a light -emitting device's manufacturing technology discloses a light -emitting device. The utility model discloses in, metal printed circuit board's line base plate has the thickness that is greater than 1mm to can directly regard it as the partly of radiator, so that arrange that the heat conduction way of this metal printed circuit board's light source is the shortest, the thermal resistance is little in, and the consumptive material is few, the equipment simple, the reliability is high. In addition, it is smooth through the printed circuit board side of punching press to line base plate laterally goes up the contact that can form great area with all the other parts of radiator, with the radiating effect that reaches the preferred.
Description
Technical field
This utility model relates to the manufacturing technology of light-emitting device, particularly to light-emitting device。
Background technology
Surface mount device (SMD, SurfaceMountedDevices) it is one in surface mounting technology components and parts, existing SMD technology is by the light emitting diode (LED of SMD, LightEmittingDiode) light source is welded on printed substrate or operplate printing wiring board (MPCB, MetalPrintingCircuitBoard)。As shown in Figure 1, operplate printing wiring board includes conducting wire 2 ', insulating barrier 3 ' and circuit base plate 4 ', SMD1 ' is welded on the surface of conducting wire 2 ', and then again through heat-conducting glue 6 ' or screw or heat-conducting glue adds screw (riveted joint or crimping) to operplate printing wiring board or soldering is connected with radiator 5 '。
But it was found by the inventors of the present invention that said structure has the disadvantage in that
1) for the LED bulb being finally made, LED light source heat conduction path is long, and thermal resistance is big；
2) production process consumption material, power consumption is big, and production cost is high；
3) production process has chemical attack and cleaning process, not environmentally；
4) LED light source cumbersome when the production and assembly of LED bulb, production efficiency is low。
5) reliable long-term working is poor。
Utility model content
The purpose of this utility model is in that to provide a kind of light-emitting device so that the heat conduction path of light source is the shortest, thermal resistance is little, and consumptive material is few, it is simple to assemble, and reliability is high。
For solving above-mentioned technical problem, embodiment of the present utility model discloses a kind of light-emitting device, and light-emitting device includes light source and operplate printing wiring board；
Operplate printing wiring board includes conducting wire, insulating barrier and circuit base plate, is provided with insulating barrier between conducting wire and circuit base plate, and the thickness of circuit base plate is more than 1mm and as the part of radiator；
Light source is placed in the surface of conducting wire。
Compared with prior art, the main distinction and effect thereof are in that this utility model embodiment:
In this utility model, the circuit base plate of operplate printing wiring board is made with the thickness more than 1mm, such that it is able to by its part directly as radiator, so that the heat conduction path being placed in the light source of this operplate printing wiring board is the shortest, thermal resistance is little, and consumptive material is few, assembling is simple, reliability is high。
Further, stamped printed substrate smooth-sided compression candles, thus circuit base plate can form contacting of larger area with the remainder of radiator on side, to reach preferably radiating effect。
Further, the material that light source substrate is identical with radiator base plate use, there is identical thermal coefficient of expansion, thus being not easy the damage caused because deformation causes, reliability is high。
Accompanying drawing explanation
Fig. 1 is the structural representation of existing light-emitting device；
Fig. 2 is the structural representation of a kind of light-emitting device in this utility model the first embodiment。
Fig. 3 is the schematic flow sheet of the manufacture method of a kind of light-emitting device in this utility model the second embodiment。
Fig. 4 A is the structural representation of many yoke plates of a kind of light-emitting device in second embodiment of the invention。
Fig. 4 B is the structural representation of many yoke plates of the light-emitting device not placing light source in second embodiment of the invention。
Detailed description of the invention
In the following description, many ins and outs are proposed in order to make reader be more fully understood that the application。But, it will be understood by those skilled in the art that even without these ins and outs with based on the many variations of following embodiment and amendment, it is also possible to realize the application each claim technical scheme required for protection。
For making the purpose of this utility model, technical scheme and advantage clearly, below in conjunction with accompanying drawing, embodiment of the present utility model is described in further detail。
This utility model the first embodiment relates to a kind of light-emitting device。Fig. 2 is the structural representation of this light-emitting device。As in figure 2 it is shown, this light-emitting device includes light source 1 and operplate printing wiring board。
Operplate printing wiring board includes conducting wire 2, insulating barrier 3 and circuit base plate 4, is provided with insulating barrier 3 between conducting wire 2 and circuit base plate 4, and the thickness of circuit base plate 4 is more than 1mm and as the part of radiator, for instance as radiator base plate。Alternatively, the thickness of above-mentioned circuit base plate 4 is more than 2mm or 3mm。In a preference, the thickness of above-mentioned circuit base plate 4 is 3mm。
Light source 1 is placed in the surface of conducting wire 2。In the present embodiment, light source 1 is preferably surface mount device。Being appreciated that light source can be made up of the series, parallel of one single chip or multiple chip or connection in series-parallel, chip is the general designation of semiconductor element product, is the carrier of integrated circuit。
In the present embodiment, the circuit base plate of operplate printing wiring board is made with the thickness more than 1mm, such that it is able to by its part directly as radiator, so that the heat conduction path being placed in the light source of this operplate printing wiring board is the shortest, thermal resistance is little, and consumptive material is few, assembling is simple, reliability is high。
In the various embodiments of the utility model, the remainder 5 of above-mentioned circuit base plate 4 and radiator can be integrated, it is also possible to is assemble to form radiator。
Such as, above-mentioned circuit base plate 4 can interference fit with the remainder 5 of radiator。Now, the remainder 5 of radiator can be the structure that the shape be suitable to circuit base plate 4 carries out interference fit, for instance radiator sleeve, radiator heronsbill or other structures etc.。Owing to the heat conductivity of the material of circuit base plate 4 own is much larger than the heat conductivity of conventional pilot hot glue, has only to less contact area between the remainder 5 of circuit base plate 4 and radiator, radiating effect can be reached。
In a preference, operplate printing wiring board is made by punching press。Stamped printed substrate smooth-sided compression candles, thus circuit base plate 4 can form contacting of larger area with the remainder 5 of radiator on side, with further up to preferably radiating effect。It is appreciated that the conducting wire 2 at edge is removed to prevent the generation electric short circuit when punching press。
In addition, it is appreciated that, in other embodiments of the present utility model, operplate printing wiring board can also pass through V-arrangement incision (Vcut) technology and be formed, although the area that circuit base plate contacts with the remainder of radiator on side reduces to some extent, but the technical solution of the utility model can be realized equally。
As optional embodiment, the material of circuit base plate 4 is identical with the material of the remainder 5 of radiator, for instance all use copper, aluminum or other Heat Conduction Materials etc.。The remainder 5 of circuit base plate 4 and radiator uses identical material, has identical thermal coefficient of expansion, thus being not easy the damage caused because deformation causes, reliability is high。
Furthermore, it is to be understood that in other embodiments of the present utility model, the material of the material of circuit base plate 4 and the remainder 5 of radiator can also be different。Select type and the material of circuit base plate as required, while realizing optimum radiating effect, it is possible to suitable in various forms of radiators, flexibly and easily。
This utility model the second embodiment relates to the manufacture method of a kind of light-emitting device。Fig. 3 is the schematic flow sheet of the manufacture method of this light-emitting device。As it is shown on figure 3, the manufacture method of this light-emitting device comprises the following steps:
In step 301, it is provided that operplate printing wiring board, operplate printing wiring board includes conducting wire, insulating barrier and circuit base plate, is provided with insulating barrier between conducting wire and circuit base plate, and the thickness of circuit base plate is more than 1mm and as the part of radiator。Alternatively, the thickness of above-mentioned circuit base plate is more than 2mm or 3mm。In a preference, the thickness of above-mentioned circuit base plate is 3mm。
Then into step 302, place light source on the surface of conducting wire。In the present embodiment, light source is preferably surface mount device。Being appreciated that light source can be made up of the series, parallel of one single chip or multiple chip or connection in series-parallel, chip is the general designation of semiconductor element product, is the carrier of integrated circuit。
In the present embodiment, the circuit base plate of operplate printing wiring board is made with the thickness more than 1mm, such that it is able to by its part directly as radiator, so that the heat conduction path being placed in the light source of this operplate printing wiring board is the shortest, thermal resistance is little, and consumptive material is few, assembling is simple, reliability is high。
In the various embodiments of the utility model, the remainder 5 of above-mentioned circuit base plate 4 and radiator can be integrated, it is also possible to is assemble to form radiator。
Such as, above-mentioned manufacture method can also comprise the following steps:
Make the remainder interference fit of circuit base plate and radiator。
Now, the remainder of radiator is the structure that the shape be suitable to circuit base plate carries out interference fit, for instance radiator sleeve, radiator heronsbill or other structures etc.。Owing to the heat conductivity of the material of circuit base plate own is much larger than the heat conductivity of conventional pilot hot glue, has only to less contact area between circuit base plate and the remainder of radiator, radiating effect can be reached。
Preferably, in step 301, operplate printing wiring board is made by punching press。Stamped printed substrate smooth-sided compression candles, thus circuit base plate can form contacting of larger area with the remainder of radiator on side, with further up to preferably radiating effect。
It is appreciated that, in other embodiments of the present utility model, operplate printing wiring board can also pass through V-arrangement incision (Vcut) technology and be formed, although the area that circuit base plate contacts with the remainder of radiator on side reduces to some extent, but the technical solution of the utility model can be realized equally。
In a preference, in step 302, it is possible to place multiple light sources on the surface of conducting wire, to make many yoke plates (as shown in Figure 4 A) of light-emitting device, then depress from many yoke plates upper punch of this light-emitting device by single light-emitting device。First place multiple light sources on surface, conducting wire, more single light-emitting device is swept away, it is possible to be easy to technological operation。
It is appreciated that, in other embodiments of the present utility model, first single metal printed substrate can also be punched down from many yoke plates (as shown in Figure 4 B) before light source is placed on the surface of conducting wire, light source is placed again, to make single light-emitting device on the surface, conducting wire of each operplate printing wiring board。
As optional embodiment, the material of circuit base plate is identical with the material of the remainder of radiator。The material that circuit base plate is identical with the remainder use of radiator, has identical thermal coefficient of expansion, thus being not easy the damage caused because deformation causes, reliability is high。
Furthermore, it is to be understood that in other embodiments of the present utility model, the material of circuit base plate can also be different from the material of the remainder of radiator。Select type and the material of circuit base plate as required, while realizing optimum radiating effect, it is possible to suitable in various forms of radiators, flexibly and easily。
Present embodiment is the method embodiment corresponding with the first embodiment, and present embodiment can be worked in coordination enforcement with the first embodiment。The relevant technical details mentioned in first embodiment is still effective in the present embodiment, in order to reduce repetition, repeats no more here。Correspondingly, the relevant technical details mentioned in present embodiment is also applicable in the first embodiment。
It should be noted that, in the claim and description of this patent, the relational terms of such as first and second or the like is used merely to separate an entity or operation with another entity or operating space, and not necessarily requires or imply the relation that there is any this reality between these entities or operation or sequentially。And, term " includes ", " comprising " or its any other variant are intended to comprising of nonexcludability, so that include the process of a series of key element, method, article or equipment not only include those key elements, but also include other key elements being not expressly set out, or also include the key element intrinsic for this process, method, article or equipment。When there is no more restriction, statement " including " key element limited, it is not excluded that there is also other identical element in including the process of described key element, method, article or equipment。
Although by referring to some preferred implementation of the present utility model, this utility model is shown and described, but it will be understood by those skilled in the art that and in the form and details it can be done various change, without departing from spirit and scope of the present utility model。
Claims (8)
1. a light-emitting device, it is characterised in that described light-emitting device includes light source and operplate printing wiring board；
Described operplate printing wiring board includes conducting wire, insulating barrier and circuit base plate, is provided with described insulating barrier between described conducting wire and described circuit base plate, and the thickness of described circuit base plate is more than 1mm and as the part of radiator；
Described light source is placed in the surface of described conducting wire。
2. light-emitting device according to claim 1, it is characterised in that the remainder interference fit of described circuit base plate and radiator。
3. light-emitting device according to claim 1, it is characterised in that described operplate printing wiring board is made by punching press。
4. light-emitting device according to claim 1, it is characterised in that the thickness of described circuit base plate is 3mm。
5. light-emitting device according to claim 1, it is characterised in that the material of described circuit base plate is identical with the material of the remainder of radiator。
6. light-emitting device according to claim 5, it is characterised in that the material of the remainder of described circuit base plate and described radiator is copper or aluminum。
7. light-emitting device according to claim 1, it is characterised in that the material of described circuit base plate is different from the material of the remainder of radiator。
8. light-emitting device according to any one of claim 1 to 7, it is characterised in that described light source is surface mount device。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521074857.4U CN205331826U (en) | 2015-12-21 | 2015-12-21 | Light -emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521074857.4U CN205331826U (en) | 2015-12-21 | 2015-12-21 | Light -emitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205331826U true CN205331826U (en) | 2016-06-22 |
Family
ID=56208324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521074857.4U Expired - Fee Related CN205331826U (en) | 2015-12-21 | 2015-12-21 | Light -emitting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205331826U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106898680A (en) * | 2015-12-21 | 2017-06-27 | 上海威廉照明电气有限公司 | Light-emitting device and its manufacture method |
-
2015
- 2015-12-21 CN CN201521074857.4U patent/CN205331826U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106898680A (en) * | 2015-12-21 | 2017-06-27 | 上海威廉照明电气有限公司 | Light-emitting device and its manufacture method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160622 Termination date: 20211221 |