CN101881393A - LED lamp structure capable of conducting heat by using metal base plate and metal solder - Google Patents
LED lamp structure capable of conducting heat by using metal base plate and metal solder Download PDFInfo
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- CN101881393A CN101881393A CN201010219479XA CN201010219479A CN101881393A CN 101881393 A CN101881393 A CN 101881393A CN 201010219479X A CN201010219479X A CN 201010219479XA CN 201010219479 A CN201010219479 A CN 201010219479A CN 101881393 A CN101881393 A CN 101881393A
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Abstract
The invention discloses an LED lamp structure capable of conducting heat by using a metal base plate and a metal solder, which aims to improve the heat-dissipating performance of a light-emitting diode (LED). The LED lamp structure comprises the metal base plate (1), an epoxy resin printed circuit board (PCB) (2), the LED (4), the solder (8) and a mounting hole (5), wherein the LED has a thermoelectric separation structure and comprises an electric conduction pin (6) and a heat conduction pin (7); a through notch (3) is formed in the PCB; the electric conduction pin (6) of the LED is welded on the PCB (2); the PCB (2) abuts against the metal base plate (1); the LED (4) and the metal base plate (1) are arranged on the two sides of the through notch (3) of the PCB (2) respectively; the solder (8) is welded in the notch (3) of the PCB, so that the heat conduction pin (7) of the LED is connected with the metal base plate (1) through the solder (8); and the heat from the LED (4) is conducted out through the metal solder and the metal base plate sequentially. The LED lamp structure has high heat conductivity, low thermal resistance and long service life; the metal plate is the common commercial copper plate, the common copper plated or sprayed aluminum plate or the common copper plated or sprayed iron plate and is 0.5 to 5 mm thick, so the structure has low cost; and the structure can be widely applied to LED lamps.
Description
Technical field
The present invention relates to a kind of LED modulated structure, relate in particular to a kind of LED modulated structure that utilizes metal substrate and brazing metal heat conduction, be widely used in lighting field.
Background technology
LED has advantages such as luminous efficiency height, energy-saving and environmental protection as a kind of new type light source, will replace incandescent lamp and fluorescent lamp become the 4th generation light source.At present, the input power of LED can be brought up to 5W even higher, and therefore accelerating distributing of LED heat becomes more and more important.If can not in time derive these heats, consequent fuel factor can make the LED junction temperature raise, light efficiency reduces, spectrum generation red shift, parameter quality such as colour temperature, colour rendering index descends, even more serious for the white light LED part that uses fluorescent material, because the conversion efficiency of fluorescent material can reduce along with the rising of temperature.These fuel factors can have influence on service life and the reliability of LED.So heat radiation is that LED is applied to one of bottleneck problem of lighting field.
At present, in order to satisfy lighting demand, mostly the designer is to be effective with a plurality of LED.LED and pcb board, fill heat-conducting silicone grease or other heat-conducting glues carry out heat conduction with contacting of substrate is commonly used again, and the silicone oil in the heat-conducting silicone grease becomes branch to volatilize along with the increase of working time and temperature, makes thermal resistance increase; And the heat-conducting glue thermal resistance is big, and is easily aging; Thereby reduced radiating effect.And pcb board often directly is made on the metal substrate and forms MCPCB and improve heat-conducting effect, and MCPCB is the price height not only, and thermal resistance is also undesirable, so that can't satisfy the demand of illumination.
Summary of the invention
Technical problem to be solved by this invention is the deficiency that overcomes existing heat conduction technology, and a kind of good heat conduction effect is provided, and can effectively prolong the LED life-span, improve the conductive structure of reliability.
The structure of the technical solution used in the present invention is seen accompanying drawing 1 and accompanying drawing 2.Comprise metal substrate (1), epoxy resin pcb board (2), LED (4), scolder (8), installing hole (5).LED is thermoelectric isolating construction, comprises conductive pin (6) and heat conduction pin (7); Have straight-through notch (3) in the pcb board.The conductive pin of LED (6) is welded on the pcb board (2), pcb board (2) is close to metal substrate (1), the notch of pcb board (3) both sides are respectively LED (4) and metal substrate (1), be welded with scolder (8) in the notch of PCB, make the heat conduction pin (7) of LED be connected with metal substrate (1) by scolder.The heat that LED (4) sends out is derived by brazing metal, metal substrate successively.Because the thermal resistance of scolder and substrate is very little, so described LED modulated structure thermal conductivity height, thermal resistance is little, and the life-span is long, has avoided the use heat-conducting silicone grease because of silicone oil volatilization or heat-conducting glue heat conduction bad phenomenon simultaneously; Metal substrate is commercial common copper coin, or the ordinary aluminum plate of copper coating (or spray copper), or the common iron plate of copper coating (or spray copper), thickness 0.5-5mm, and price is low; Can be widely used in the LED light fixture.
Below in conjunction with the accompanying drawing 3 and the specific embodiment the present invention is elaborated.
Description of drawings
Accompanying drawing 1 is the front view and the vertical view of structure of the present invention.
Accompanying drawing 2 is three-dimensional blast structural representations of the present invention.
Accompanying drawing 3 is pictures in kind of the present invention.
The specific embodiment
Shown in accompanying drawing 1, accompanying drawing 2, accompanying drawing 3, the present invention includes the LED of copper base, epoxy resin pcb board, 3 series connection, silver-colored tin solder, installing hole; Have straight-through notch in the pcb board, LED is thermoelectric the separation, comprises conductive pin and heat conduction pin.The conductive pin of described LED is welded on the described epoxy resin pcb board, and described epoxy resin pcb board is adjacent to described copper base and contacts, and is welded with scolder in the described notch, makes described LED be welded on the described copper base by heat conduction pin, silver-colored tin solder.The heat that LED sends out is derived by heat conduction pin, silver-colored tin solder, copper base.
The present invention can be widely used in the LED lighting field.
Claims (3)
1. a LED modulated structure that utilizes metal substrate and brazing metal heat conduction comprises metal substrate (1), epoxy resin pcb board (2), LED (4), brazing metal (8), installing hole (5) composition.LED is thermoelectric isolating construction, comprises conductive pin (6) and heat conduction pin (7); Have straight-through notch (3) in the pcb board.The conductive pin of LED (6) is welded on the pcb board (2), pcb board (2) is close to metal substrate (1), the notch of pcb board (3) both sides are respectively LED (4) and metal substrate (1), be welded with scolder (8) in the notch, make the heat conduction pin (7) of LED be connected with metal substrate (1) by scolder (8).It is characterized in that the heat that described LED sends out derives by brazing metal (8), metal substrate (1) successively.
2. LED modulated structure according to claim 1 is characterized in that described metal substrate is commercial common copper coin, or the ordinary aluminum plate of copper coating (or spray copper), or the common iron plate of copper coating (or spray copper), thickness 0.5-5mm, price is low, the thermal conductivity height, thermal resistance is little, perfect heat-dissipating.
3. LED modulated structure according to claim 1 when it is characterized in that using brazing metal welding LED heat conduction pin and metal substrate, has adopted the high-performance thin adhesive layer between pcb board and metal substrate, can not slide when making welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010219479XA CN101881393A (en) | 2010-07-06 | 2010-07-06 | LED lamp structure capable of conducting heat by using metal base plate and metal solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010219479XA CN101881393A (en) | 2010-07-06 | 2010-07-06 | LED lamp structure capable of conducting heat by using metal base plate and metal solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101881393A true CN101881393A (en) | 2010-11-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010219479XA Pending CN101881393A (en) | 2010-07-06 | 2010-07-06 | LED lamp structure capable of conducting heat by using metal base plate and metal solder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101881393A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102072435A (en) * | 2010-10-22 | 2011-05-25 | 中国计量学院 | LED lamp module with functions of three-dimensional convection, metal conduction and pollution prevention |
| CN102313267A (en) * | 2011-08-11 | 2012-01-11 | 徐建国 | Light emitting diode (LED) lamp cap and special lamp holder for LED lamp cap |
| CN102313266A (en) * | 2011-07-06 | 2012-01-11 | 无锡通明科技有限公司 | A kind of thermoelectric led light source substrate that separates high heat conduction |
| WO2012116476A1 (en) * | 2011-02-28 | 2012-09-07 | Wang Dingfeng | Circuit board with heat dissipation metal |
| WO2013067841A1 (en) * | 2011-11-09 | 2013-05-16 | 东莞勤上光电股份有限公司 | Heat sink structure for high-power led |
| WO2013067843A1 (en) * | 2011-11-09 | 2013-05-16 | 东莞勤上光电股份有限公司 | Heat sink structure for high-power led |
| CN103369824A (en) * | 2012-04-08 | 2013-10-23 | 嵇刚 | High heat conducting PCB (Printed circuit board) metal base and preparation method thereof |
| WO2014089931A1 (en) * | 2012-12-13 | 2014-06-19 | Lin Peilin | Direct-welding type led down lamp |
| WO2014194498A1 (en) * | 2013-06-05 | 2014-12-11 | 福建永德吉灯业股份有限公司 | Led lamp with highly efficient heat dissipation structure and manufacturing method therefor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101162816A (en) * | 2007-09-13 | 2008-04-16 | 番禺得意精密电子工业有限公司 | Electric connector |
| CN101394052A (en) * | 2007-09-18 | 2009-03-25 | 日本航空电子工业株式会社 | Heat transfer member and connector |
| CN201373367Y (en) * | 2009-01-22 | 2009-12-30 | 深圳市成光兴实业发展有限公司 | High-power LED light source module adopting semiconductor for cooling |
| CN201396619Y (en) * | 2009-05-04 | 2010-02-03 | 张伟 | LED grille lamp |
-
2010
- 2010-07-06 CN CN201010219479XA patent/CN101881393A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101162816A (en) * | 2007-09-13 | 2008-04-16 | 番禺得意精密电子工业有限公司 | Electric connector |
| CN101394052A (en) * | 2007-09-18 | 2009-03-25 | 日本航空电子工业株式会社 | Heat transfer member and connector |
| CN201373367Y (en) * | 2009-01-22 | 2009-12-30 | 深圳市成光兴实业发展有限公司 | High-power LED light source module adopting semiconductor for cooling |
| CN201396619Y (en) * | 2009-05-04 | 2010-02-03 | 张伟 | LED grille lamp |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102072435A (en) * | 2010-10-22 | 2011-05-25 | 中国计量学院 | LED lamp module with functions of three-dimensional convection, metal conduction and pollution prevention |
| CN102072435B (en) * | 2010-10-22 | 2012-12-12 | 中国计量学院 | LED lamp module with functions of three-dimensional convection, metal conduction and pollution prevention |
| WO2012116476A1 (en) * | 2011-02-28 | 2012-09-07 | Wang Dingfeng | Circuit board with heat dissipation metal |
| CN102313266A (en) * | 2011-07-06 | 2012-01-11 | 无锡通明科技有限公司 | A kind of thermoelectric led light source substrate that separates high heat conduction |
| CN102313267A (en) * | 2011-08-11 | 2012-01-11 | 徐建国 | Light emitting diode (LED) lamp cap and special lamp holder for LED lamp cap |
| CN102313267B (en) * | 2011-08-11 | 2014-05-07 | 徐建国 | Light emitting diode (LED) lamp cap and special lamp holder for LED lamp cap |
| WO2013067841A1 (en) * | 2011-11-09 | 2013-05-16 | 东莞勤上光电股份有限公司 | Heat sink structure for high-power led |
| WO2013067843A1 (en) * | 2011-11-09 | 2013-05-16 | 东莞勤上光电股份有限公司 | Heat sink structure for high-power led |
| CN103369824A (en) * | 2012-04-08 | 2013-10-23 | 嵇刚 | High heat conducting PCB (Printed circuit board) metal base and preparation method thereof |
| WO2014089931A1 (en) * | 2012-12-13 | 2014-06-19 | Lin Peilin | Direct-welding type led down lamp |
| WO2014194498A1 (en) * | 2013-06-05 | 2014-12-11 | 福建永德吉灯业股份有限公司 | Led lamp with highly efficient heat dissipation structure and manufacturing method therefor |
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Open date: 20101110 |