WO2014194498A1

WO2014194498A1 - Led lamp with highly efficient heat dissipation structure and manufacturing method therefor

Info

Publication number: WO2014194498A1
Application number: PCT/CN2013/076803
Authority: WO
Inventors: 赖勇清; 潘钰铭
Original assignee: 福建永德吉灯业股份有限公司
Priority date: 2013-06-05
Filing date: 2013-06-05
Publication date: 2014-12-11

Abstract

Disclosed are an LED lamp with a highly efficient heat dissipation structure and a manufacturing method therefor. The LED lamp comprises an LED lamp housing (10), an LED lamp bead (20), and an ordinary PCB board (30). The back surface of the LED lamp bead (20) is provided with a heat-conductive surface (22) and two electrode points (23). The LED lamp housing (10) is provided with at least one heat-conductive surface (11) and adjacent thereto is provided at least one groove (13) for placing the ordinary PCB board (30), and the depth of the groove (13) is such that a circuit layer (31) of the ordinary PCB board (30) is in the same plane as the heat-conductive surface (11) on the LED lamp housing (10) when the ordinary PCB board is placed in the groove (13). The heat-conductive surface (22) on the back surface of the LED lamp bead (20) is welded to the heat-conductive surface (11) on the LED lamp housing (10) at a corresponding position. The two electrode points (23) on the back surface of the LED lamp bead (20) are respectively welded to an electrode solder pad (32) on the ordinary PCB board (30). The LED lamp has a good heat dissipation effect and a low manufacturing cost.

Description

LED lamp with high efficiency heat dissipation structure and manufacturing method thereof

Technical field

The invention belongs to the technical field of LEDs, and particularly relates to an LED lamp with an efficient heat dissipation structure and a manufacturing method thereof.

Background technique

LED process is generally: LED epitaxial wafer generation - LED chip preparation - LED lamp bead package - LED lamp assembly.

LEDs have high luminous efficiency, but because of the small size of the LED chip, high heat is generated during operation, and the heat of the LED chip must be efficiently extracted by heat conduction and convection to reduce the junction temperature of the chip. At present, the poor thermal conductivity of LED lamps is a key factor affecting the quality of existing LED lamps. Usually, the back side of the LED lamp bead has a heat conducting surface and two electrode connection points.

As shown in Figure 1 and Figure 2, the current heat dissipation technology of LED lamps consists of two parts: the heat spreader of the LED lamp bead 1 and the heat sink directly in contact with the heat spreader. The heat spreader is used to heat the LED lamp bead. The heat of the chip is derived, and the heat spreader mainly uses a PCB aluminum substrate 2. The LED lamp bead 1 is soldered on the PCB aluminum substrate 2, and the heat sink radiates heat to the air through the heat convection to directly contact the heat sink, and the heat sink is mainly made of the LED lamp housing 3. The LED lamp housing is mainly a structural bracket of the LED lamp. The PCB board is divided into a common PCB board and a PCB aluminum substrate, and a common PCB board such as phenolic resin glass fiber, epoxy resin PolyamideBT, Epoxy, and the like.

Since the PCB aluminum substrate 2 for soldering the LED lamp bead is composed of an aluminum plate, an insulating layer, and a conductive layer copper foil. Since the thermal conductivity of the insulating layer is much lower than that of aluminum and copper, the thermal conductivity is reduced, and the manufacturing process of the insulating layer of the PCB aluminum substrate 2 is difficult, resulting in high price; the contact surface of the PCB aluminum substrate and the LED lamp housing is generally coated first. The thermal conductive silica gel is then mechanically pressed. Due to the flatness of the contact surface machining, the consistency of the coated silica gel, and the uneven influence of the mechanical pressing force, the heat dissipation consistency of each LED lamp bead is poor. In particular, the thermal conductivity of silica gel is only about one-fiftieth of that of aluminum, and the heat dissipation effect is even worse. Therefore, the current heat dissipation technology of the LED lamp has poor heat dissipation effect, poor heat dissipation consistency, or affects the life of the LED lamp, or increases the volume of the LED lamp shell in order to reduce the temperature of the LED chip, and increases the cost of the LED lamp.

Chinese invention patent ZL201210061848.6 discloses a high-power LED lamp group without aluminum substrate and a preparation process thereof, wherein the LED lamp group is welded on the lamp plate, and the heat-dissipating fin and the LED lamp are arranged on one side of the lamp housing facing away from the LED lamp group. The group is composed of a plurality of LED lamp beads; the lamp plate is provided with a plurality of circular holes having a diameter larger than the outer diameter of the LED lamp bead, and the LED lamp bead is located inside the circular hole, and the bottom of the lamp is directly in contact with the inner wall of the lamp housing, the LED lamp The pins of the beads are in the shape of upturned on both sides, and the height between the pins and the bottom of the lamp bead is greater than the thickness of the lamp plate. The preparation process is as follows: the pin of the LED lamp bead is pressed into the shape of the two sides upturned, and the height between the bottom of the LED lamp bead and the upturned pin is greater than the thickness of the lamp plate; design and manufacture of the printed circuit board PCB The position of the lamp bead on the PCB is set to a diameter larger than the outer diameter of the LED lamp bead, so that the LED lamp bead can be loosely placed inside the circular hole, and the pad is placed on both sides of the circular hole and the corresponding position of the pin. The PCB is fastened to the inner wall of the lamp housing, and the two pins of the LED lamp bead are soldered on the pads on both sides of the circular hole, so that the bottom of the LED lamp bead is in close contact with the inner wall of the lamp housing.

It can be seen that the structure of the LED lamp bead used in the technology is a structure in which the two sides of the pin are upturned. In the disclosed preparation process, LED lamp beads of the structure in which the two sides of the pin are upturned are first processed. This adds manufacturing difficulty in the preparation process and is not suitable for mass production.

The bottom of the technology LED lamp bead is only in close contact with the inner wall of the lamp housing, so the heat dissipation effect is even worse.

In view of this, the inventors have intensively studied the defects of the prior art, and have produced the present case.

Summary of the invention

One of the technical problems to be solved by the present invention is to provide an LED lamp with an efficient heat dissipation structure.

The second technical problem to be solved by the present invention is to provide a method for manufacturing an LED lamp with an efficient heat dissipation structure.

The invention adopts the following technical solutions to solve one of the above technical problems:

An LED lamp with high-efficiency heat dissipation structure includes an LED lamp shell, an LED lamp bead, and an ordinary PCB board; the LED lamp bead has a heat conducting surface and two electrode points on the back surface thereof;

At least one heat conducting surface is disposed on the LED lamp housing, and at least a recess for positioning the common PCB board is disposed adjacent to the heat conducting surface of the LED lamp housing, the depth of the recess is such that the common PCB board is disposed in the recess The circuit layer is in the same plane as the heat conducting surface on the LED lamp housing;

The common PCB board is disposed in the recess of the LED lamp housing, and the heat conducting surface on the back side of the LED lamp bead is disposed at a corresponding position of the heat conducting surface on the LED lamp housing, and is soldered to the back of the LED lamp bead. The two electrode points are respectively soldered to the electrode pads on the common PCB board.

The LED lamp housing is made of an aluminum material.

The LED lamp housing is a mixture of one or more heat conductive materials wrapped with another material having a higher thermal conductivity; the heat conducting surface of the LED lamp housing soldered to the heat conducting surface of the LED lamp bead is caused by the thermal conductivity Made of higher materials.

The LED lamp housing is a mixture of aluminum-wrapped copper posts, and the heat conducting surface of the LED lamp housing welded to the LED lamp bead heat conducting surface is made of a copper post.

The LED lamp housing is a mixture of plastic wrapped copper posts, and the heat conducting surface of the LED lamp housing welded to the LED lamp bead heat conducting surface is made of a copper column.

The LED lamp housing is a mixture of plastic-clad aluminum and aluminum-wrapped copper pillars, and the heat-conducting surface of the LED lamp shell welded to the LED lamp bead heat-conducting surface is made of copper pillars.

The present invention solves the above technical problem by adopting the following technical solutions:

An LED lamp housing is a method for manufacturing an LED lamp with an efficient heat dissipation structure of aluminum material, comprising the following steps:

Tin plating at a position where the heat conducting surface of the one or more LED lamp housings is in contact with the heat conducting surface of the LED lamp bead;

A common PCB board is mounted in a groove adjacent to the heat conducting surface of the one or more LED lamp housings, and a solder paste is applied to the pad position of the common PCB board and the LED lamp bead electrode point;

The LED lamp bead is respectively pasted on the conductive surface of the one or more LED lamp shells which have been tinned and the electrode pads of the ordinary PCB board;

Heating completes the welding of the LED lamp beads.

The tin plating is tinned by an ultrasonic process.

The invention relates to a method for manufacturing an LED lamp with an efficient heat dissipation structure of a mixture of aluminum-wrapped copper pillars, comprising the following steps:

Mounting a common PCB board in a recess adjacent to the heat conducting surface of the one or more LED lamp housings;

Applying solder paste to the electrode pad position of the ordinary PCB board and the heat conducting surface of the LED lamp shell copper pillar;

The LED lamp bead is respectively pasted on the copper post heat conducting surface of one or more LED lamp shells and the pad of the ordinary PCB board;

Heating completes the welding of the LED lamp beads.

The advantages of the invention are:

1. An LED lamp of an efficient heat dissipation structure of the present invention mainly eliminates the prior art PCB aluminum substrate. The heat conduction function and the power supply function of the PCB aluminum substrate are respectively borne by the LED lamp housing and the ordinary PCB board. The ordinary PCB board bears the power-on function of the PCB aluminum substrate, the effect is the same, but the common PCB cost is much lower; the LED lamp shell made of aluminum or the material with higher thermal conductivity bears the heat conduction function of the PCB aluminum substrate, and the bottom of the lamp bead The heat conducting surface and the heat conducting surface of the lamp shell are seamlessly welded together, and the heat conduction effect is better; since the PCB aluminum substrate is omitted, the machining flatness of the contact surface of the heat conducting surface of the PCB aluminum substrate and the LED lamp housing does not exist, and does not exist. The uniformity of the coated silica gel and the non-uniform influence of the mechanical pressing force solve the problem of heat dissipation consistency of the LED lamp bead and improve the heat dissipation effect of the LED chip.

2. Compared with the Chinese invention patent ZL201210061848.6, the invention has a lower heat dissipation effect because the bottom of the LED lamp bead is only in close contact with the inner wall of the lamp housing. The bottom of the LED lamp bead of the invention is seamlessly welded to the heat conducting surface of the lamp housing, so that the heat dissipation effect is good.

3. The present invention can meet the requirements of light distribution at any angle since the heat conducting surface can be arbitrarily disposed on the lamp housing.

4. The invention adopts the special LED lamp bead structure, can adopt the SMT process for mass production, has high production efficiency and low cost.

5. The invention can process a plurality of LED lamp shells together in a process, so that high efficiency and low cost of the production process can be achieved.

DRAWINGS

The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings.

1 is a schematic view showing the structure of a prior art LED lamp.

Fig. 2 is a cross-sectional view taken along line A-A of Fig. 1;

3 is a schematic view showing the structure of an LED lamp bead of the present invention.

Fig. 4 is a cross-sectional view taken along line B-B of Fig. 3;

Figure 5 is a schematic view showing the structure of a PCB board of the present invention.

FIG. 6 is a schematic structural view of an LED lamp housing according to an embodiment of the present invention.

Fig. 7 is a cross-sectional view taken along line C-C of Fig. 6;

FIG. 8 is a schematic view showing the assembly structure of an LED lamp according to an embodiment of the present invention.

Figure 9 is a cross-sectional view taken along line D-D of Figure 8;

FIG. 10 is a partial schematic view showing the assembly structure of an LED lamp according to an embodiment of the present invention.

Figure 11 is a partial schematic view showing the assembly structure of the multi-heat conducting surface of the LED lamp housing in an embodiment of the present invention.

FIG. 12 is a schematic structural view of an LED lamp housing according to another embodiment of the present invention.

Fig. 13 is a sectional view taken along line E-E of Fig. 12;

FIG. 14 is a schematic view showing the assembly structure of an LED lamp according to another embodiment of the present invention.

Fig. 15 is a sectional view taken along line F-F of Fig. 14;

Figure 16 is a partial schematic view showing the assembly structure of an LED lamp according to another embodiment of the present invention.

Figure 17 is a schematic view showing the structure of the present invention in mass production.

detailed description

An LED lamp with an efficient heat dissipation structure includes an LED lamp housing 10, a plurality of LED lamp beads 20, and a common PCB board 30.

As shown in FIG. 3 and FIG. 4, it is a schematic structural view of an LED lamp bead. The LED lamp bead 20 has an LED chip 21 therein, and the back surface of the LED lamp bead 20 has a heat conducting surface 22 and two electrode points 23.

As shown in FIG. 5, it is a schematic structural view of the PCB board 30 having an energized layer 31 and electrode pads 32.

As shown in FIG. 6 to FIG. 11 , the material of the LED lamp housing 10 is aluminum, and the LED lamp housing 10 is provided with a heat conducting surface 11 which is in contact with the heat conducting surface 22 of the LED lamp bead 20 , as shown in FIG. 6 . Contact position 12; at least a recess 13 for locating the ordinary PCB board 30 is disposed adjacent to the heat conducting surface 11 of the LED lamp housing 10, the depth of the recess 13 is such that the normal PCB board 30 is energized when it is placed in the recess 13 The layer 31 is in the same plane as the heat conducting surface 11 on the LED lamp housing 10; when the ordinary PCB board 30 is disposed in the recess 13 of the LED lamp housing 10, the heat conducting surface 22 of the LED lamp bead 20 and the heat conducting on the LED lamp housing 10 The face 11 is in contact and has no gap solder connection, and the two electrode points 23 on the back surface of the LED lamp bead 20 are soldered to the electrode pads 32 on the common PCB board 30, respectively.

Its manufacturing method is:

Tin plated on the heat conducting surface 11 of the plurality of lamp housings 10 at a position in contact with the LED lamp heat conducting surface 22;

The PCB board 30 is mounted in the groove 13 adjacent to the heat conducting surface 11 of the plurality of lamp housings 10, and the solder paste 40 is disposed on the PCB board 30 and the pad 32 of the LED lamp bead 20 electrode point 23;

The LED lamp bead 20 is respectively pasted on the conductive surface 11 of the plurality of lamp housings 10 and the pads 32 of the PCB board 30;

Heating of the LED bead 20 is completed by heating. Among them, tin plating is tinned by an ultrasonic process.

12 to FIG. 16 is another embodiment of the present invention, wherein the structural part is the same as the previous embodiment, and the different parts are: the LED lamp housing 10 is made of a mixture of aluminum-clad copper columns, wherein the LED lamp housing is The heat conducting surface 11 of 10 is a copper pillar.

Its manufacturing method is:

Mounting a PCB board 30 in a recess 13 adjacent to the heat conducting surface 11 of the plurality of lamp housings 10;

Applying solder paste 40 at the position of the pad 32 of the PCB board 30 and the heat conducting surface 11 of the lamp shell copper pillar;

The LED lamp bead 20 is respectively pasted on the copper post heat conducting surface 11 of the plurality of lamp housings and the pad 32 of the PCB board 30;

Heating of the LED bead 20 is completed by heating.

The LED lamp of the high-efficiency heat dissipation structure of the invention mainly eliminates the prior art PCB aluminum substrate. The heat conduction function and the power supply function of the PCB aluminum substrate are respectively borne by the LED lamp housing and the ordinary PCB board. The ordinary PCB board bears the power-on function of the PCB aluminum substrate, the effect is the same, but the common PCB cost is much lower; the LED lamp shell made of aluminum or the material with higher thermal conductivity bears the heat conduction function of the PCB aluminum substrate, and the bottom of the lamp bead The heat conducting surface and the heat conducting surface of the lamp shell are seamlessly welded together, and the heat conduction effect is better; since the PCB aluminum substrate is omitted, the machining flatness of the contact surface of the heat conducting surface of the PCB aluminum substrate and the LED lamp housing does not exist, and does not exist. The uniformity of the coated silica gel and the non-uniform influence of the mechanical pressing force solve the problem of heat dissipation consistency of the LED lamp bead and improve the heat dissipation effect of the LED chip. The bottom of the LED lamp bead of the invention is seamlessly welded to the heat conducting surface of the lamp housing, so that the heat dissipation effect is good. Since the heat conducting surface can be arbitrarily disposed on the lamp housing, the present invention can meet the requirements of light distribution at any angle. The invention adopts the special LED lamp bead structure, can adopt the SMT process for mass production, has high production efficiency and low cost. The invention can process a plurality of LED lamp shells together in a process, so that high efficiency and low cost of the production process can be achieved.

The above is only the preferred embodiment of the present invention and is not intended to limit the scope of the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and scope of the present invention are intended to be included within the scope of the present invention.

Claims

1. An LED lamp with an efficient heat dissipation structure, comprising: an LED lamp housing, an LED lamp bead, and an ordinary PCB board; the LED lamp bead has a heat conducting surface and two electrode points on the back surface;

2. An LED lamp with an efficient heat dissipation structure according to claim 1, wherein the LED lamp housing is made of an aluminum material.

3. The LED lamp of claim 1, wherein the LED lamp housing is a mixture of one or more heat conductive materials and another material having a higher thermal conductivity; The heat conducting surface of the LED lamp housing soldered to the heat conducting surface of the LED lamp bead is made of a material having a higher thermal conductivity.

4. The LED lamp of claim 3, wherein the LED lamp housing is a mixture of aluminum-wrapped copper posts, and the LED lamp housing has a heat conducting surface with the LED lamp bead. The welded heat conducting surface is made of copper posts.

The LED lamp of the high-efficiency heat dissipation structure according to claim 3, wherein the LED lamp housing is a mixture of plastic wrapped copper posts, and the LED lamp housing has a heat conducting surface with the LED lamp bead. The welded heat conducting surface is made of copper posts.

The LED lamp of the high-efficiency heat dissipation structure according to claim 3, wherein the LED lamp housing is a mixture of plastic-clad aluminum and aluminum-wrapped copper pillars, and the LED lamp housing is The heat conducting surface of the LED lamp bead heat conducting surface is made of copper pillars.

7. An LED lamp housing is a method for manufacturing an LED lamp with an efficient heat dissipation structure of aluminum material, characterized in that it comprises the following steps:

Heating completes the welding of the LED lamp beads.

8. The LED lamp housing according to claim 7, which is a method for manufacturing an LED lamp with an efficient heat dissipation structure of aluminum material, characterized in that:

The tin plating is tinned by an ultrasonic process.

9. A method of manufacturing an LED lamp with an efficient heat dissipation structure of a mixture of aluminum-wrapped copper pillars, comprising: the following steps:

Heating completed

led

Welding of the lamp beads.