WO2012152195A1 - Method for manufacturing led lamp light source component and led roadway lighting lamp involving said method - Google Patents

Method for manufacturing led lamp light source component and led roadway lighting lamp involving said method Download PDF

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Publication number
WO2012152195A1
WO2012152195A1 PCT/CN2012/074838 CN2012074838W WO2012152195A1 WO 2012152195 A1 WO2012152195 A1 WO 2012152195A1 CN 2012074838 W CN2012074838 W CN 2012074838W WO 2012152195 A1 WO2012152195 A1 WO 2012152195A1
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WO
WIPO (PCT)
Prior art keywords
led
led lamp
lamp bead
light source
circuit board
Prior art date
Application number
PCT/CN2012/074838
Other languages
French (fr)
Chinese (zh)
Inventor
文新国
Original Assignee
陕西斯达煤矿安全装备有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 陕西斯达煤矿安全装备有限公司 filed Critical 陕西斯达煤矿安全装备有限公司
Publication of WO2012152195A1 publication Critical patent/WO2012152195A1/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00Gas-tight or water-tight arrangements
    • F21V31/005Sealing arrangements therefor
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90Methods of manufacture
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21WINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10Outdoor lighting
    • F21W2131/103Outdoor lighting of streets or roads
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Definitions

  • the invention relates to a method for manufacturing a lamp and a lamp, and particularly to a method for preparing an LED lamp light source assembly and an LED roadway lamp involved in the method.
  • Thermal performance is one of the key factors affecting the life of LED lamps. During the use of LED lights, about 80% of the energy is converted into heat energy, and as the power density and packing density of the LED lamp products increase, the heat inside the lamps will inevitably accumulate, which will cause the wavelength of the light to drift and the light-emitting efficiency to decrease. And the problem of the life of the lamp is reduced.
  • the installation method of the light source component LED lamp bead, the LED lamp bead printed circuit board (LED lamp bead PCB) and the heat conducting plate is the most important factor in the preparation method of the light source component.
  • Common installation and connection methods such as the use of high thermal conductivity glue to connect the light source with the lamp holder or the heat conduction plate, improve the thermal conductivity between the light source and the lamp holder, and then effectively derive the heat.
  • the LED roadway lamp disclosed in ZL201020132511.6 is the light source substrate. The heat is introduced into the light source panel through the high thermal conductivity silica gel layer, and is radiated into the air.
  • the heat conductive glue often appears to be off due to dryness.
  • the thermal conductivity of the lamp is degraded, and there are undesirable phenomena such as light decay and dead light.
  • the LED lamp bead and the LED lamp bead PCB are directly mounted on the lamp holder with good thermal conductivity by mechanical connection, which not only improves the thermal conductivity of the lamp.
  • the processing compaction is not easy to control, and it is easy to cause damage to the components.
  • the lamps prepared by mechanical connection are bulky and clumsy, and the parts are prone to occur during use. Loose and other phenomena.
  • the heat dissipation performance of the LED roadway lamp is directly dependent on the relevant structure inside the lamp, that is, in the luminous efficiency of the existing LED lamp, the heat emitted by the light source is effectively derived by the scientific selection of the component and the reasonable assembly between the components. That is, by optimizing the design, increasing the heat dissipation area and ventilation convection effect, and improving the surface emissivity, and using the conventional light source assembly mounting method, the lamp body is eventually increased. The increase in size and the cumbersome appearance affect the appearance.
  • the object of the present invention is to provide a method for preparing a light source component of the LED lamp.
  • the method not only can stably and permanently assemble the components in the light source assembly, but also can improve the heat transfer performance of the light source component in the LED lamp, thereby optimizing the heat dissipation performance of the entire lamp.
  • a method for preparing an LED lamp light source assembly characterized in that the method comprises the following steps: at least one LED lamp bead, a copper-based LED lamp bead printed circuit board and an aluminum-based heat conduction plate with a lamp bead base as components; :
  • Step one applying solder paste at a position where the lamp bead base of the LED lamp bead is connected with the LED lamp bead printed circuit board; after applying the solder paste, hot air welding is performed at 230 ° C - 260 ° C, thereby obtaining LED mounted LED bead printed circuit board of lamp beads;
  • Step 2 plating the portion of the LED printed circuit board on the aluminum-based heat conducting plate for copper plating; tinning the portion of the LED lamp bead printed circuit board obtained in the first step with the aluminum-based heat conducting plate; and then plating the copper
  • the aluminum-based heat-conducting plate is coated with solder paste at a position where the tin-plated LED lamp bead printed circuit board is connected; after the solder paste is applied, hot-air welding is performed at 225 ° C - 255 ° C to obtain an LED lamp light source assembly.
  • the copper plating is performed by a bonding process, and the thickness of the copper plating layer is 30 micrometers to 50 micrometers; and the thickness of the tin plating layer is 100 micrometers to 150 micrometers.
  • the LED lamp bead is a patch type lamp bead.
  • the solder paste is applied to the entire surface of the copper-plated aluminum-based heat conducting plate and the tin-plated LED lamp bead printed circuit board.
  • Another object of the invention is the use of an LED lamp source assembly prepared by the above method for the preparation of an LED roadway lamp.
  • An LED roadway lamp includes a light source assembly, a driving circuit board, and a heat dissipation housing, wherein the light source assembly is a light source assembly obtained by the above method, wherein the aluminum-based heat conduction plate of the light source assembly is mounted on the heat dissipation housing The bottom portion is assembled into a cavity with the heat dissipation housing, and the driving circuit board is mounted in the cavity.
  • the copper-based LED lamp bead printed circuit board and the LED lamp bead of the light source assembly are located outside the cavity, and the copper base of the light source component The LED lamp bead printed circuit board is electrically connected to the driving circuit board.
  • the heat dissipation housing is a sun heat dissipation fin.
  • the aluminum-based heat conducting plate is provided with a wire through hole, and the wire passing through the wire through hole is connected with the copper-based LED lamp bead printed circuit board and the driving circuit board.
  • the roadway lamp further includes a cable passage, the cable passage includes a top case fixed to the top of the heat dissipation case, a connection hole disposed on the top case, and a compression nut threadedly connected to the connection hole, wherein the connection hole is inside A waterproof rubber is disposed, and a hollow steel sheet is disposed between the waterproof rubber and the compression nut, and a top cover is mounted on the top of the top shell.
  • the roadway lamp further includes a transparent cover, the transparent cover is mounted on the aluminum-based heat-conducting plate by bolts, and a pressing ring is disposed between the bolt and the transparent cover, and a gasket is disposed between the transparent cover and the aluminum-based heat-conductive plate.
  • the present invention has the following technical effects:
  • the present invention uses soldering as the only connection method between the components in the preparation method of the LED light source component, and does not assist other thermal adhesives and mechanical connection modes, completely eliminating the installation of the light source components in the original LED lamp.
  • the disadvantages of the process are that the obtained product has poor heat dissipation performance, short service life, and difficult to control the preparation process conditions.
  • the base with good heat resistance during the preparation of the light source component is a copper-based LED lamp bead.
  • the LED lamp bead is soldered to the copper base at a higher temperature.
  • the copper-based LED lamp bead PCB soldered with the LED lamp bead is soldered to the aluminum-based heat-conducting plate in the lamp at a lower temperature, and the LED lamp bead is soldered according to the welding temperature requirement. Used The melting point of the solder paste is higher than the melting point of the solder paste used to solder the copper-based LED lamp bead PCB.
  • the characteristics of aluminum and copper during soldering shall be copper and tin-plated on the aluminum-based heat-conducting plate and the copper-based LED lamp bead PCB, and plated on the copper-based LED lamp bead PCB. Tin can greatly shorten the welding time and improve the welding quality.
  • the LED roadway lamp of the invention has the characteristics of compact structure, beautiful appearance, moisture and earthquake resistance, high efficiency and long life.
  • the total area of heat dissipation of the LED roadway lamp of the present invention is relatively small, but the heat dissipation rate is improved, the heat resistance is good, and the product has a long service life, and the product volume is small and beautiful.
  • the LED roadway lamp of the present invention is suitable for use as a lighting fixture in a coal mine working face, a roadway, and a diverticulum having a danger of methane or coal dust explosion.
  • Figure 1 is a schematic structural view of the present invention
  • Fig. 2 is an enlarged schematic view showing the structure at B in Fig. 1.
  • Soldering is a soldering method in which a low melting point metal solder is used to heat and melt, and penetrates and fills the gap between the metal parts. Because the solder is often a tin-based alloy, hence the name. It is widely used in the electronics industry. At the same time, the thermal conductivity of tin is also superior. The invention is based on the characteristics of the tin material and the characteristics of the soldering. The following steps are taken to prepare the light source assembly in the LED lamp:
  • the LED lamp bead, the copper-based LED lamp bead printed circuit board and the aluminum-based heat conducting plate with at least one lamp bead base are used as components, and the following steps are specifically adopted:
  • Step one Apply solder paste to the position of the LED lamp bead base and the LED lamp bead printed circuit board.
  • the specific application method is: or apply on the corresponding position of the copper-based lamp bead base of the LED lamp bead. Or smearing on the corresponding position of the copper-based LED lamp bead PCB, or properly affixing at the corresponding position of the copper-based lamp bead base of the LED lamp bead and the corresponding position of the copper-based LED lamp bead PCB, and then docking the two;
  • hot air welding is carried out at 230 ° C - 260 ° C to obtain LED lamp beads.
  • LED lamp bead printed circuit board
  • Step 2 the part of the LED printed circuit board is plated with copper on the aluminum-based heat conducting plate, the copper plating process is a bonding process, and the thickness of the plated copper layer is 3 micrometers 0 to 50 micrometers; the LED lamp beads obtained in the first step
  • the part of the printed circuit board that is connected to the aluminum-based heat-conducting plate is tin-plated, the tin-plating process is a general conventional process, and the tin-plated layer has a thickness of 100 ⁇ m to 150 ⁇ m; then the copper-plated surface and the LED are on the aluminum-based heat conductive plate. Solder paste is applied to the surface where the tin-plated surface of the lamp bead is connected.
  • the specific application method is as follows: Apply solder paste to the corresponding part of the aluminum-based heat-conducting plate, or copper-based LED with LED lamp bead installed. Solder paste on the corresponding part of the lamp bead PCB, or solder paste on the corresponding part of the aluminum-based heat-conducting plate and the corresponding part of the copper-based LED lamp bead PCB on which the LED lamp bead is mounted; after applying the solder paste at 225 °C- Hot air welding was carried out at 255 ° C to finally produce an LED light source assembly.
  • the LED lamp bead used in the above preparation process is preferably a patch type lamp bead.
  • the tin connecting the LED lamp bead and the LED lamp bead printed circuit board in the above step 1 has electrical conduction, connection and heat conduction
  • the tin connecting the LED lamp bead printed circuit board and the aluminum-based heat conduction plate in the second step has connection and heat conduction.
  • the solder paste is applied to the entire surface of the surface of the aluminum-based heat-conducting plate which is plated with copper and the surface of the LED lamp-printed circuit board.
  • the temperature in the above step 1 is lower than the hot air welding temperature in the second step, and the installed LED lamp beads are prevented from falling off.
  • the LED lamp light source assembly prepared by the above method is used for preparing an LED roadway lamp.
  • the LED roadway lamp of the application comprises a light source assembly 11, a driving circuit board 12, a heat dissipation housing 6, the light source assembly 11 is a light source assembly manufactured by the above method, and the aluminum-based heat conduction plate 7 of the light source assembly 11 is fitted to The bottom of the heat dissipation housing 6 is assembled into a cavity with the heat dissipation housing 6.
  • the driving circuit board 12 is mounted in the cavity, and the LED lamp bead printed circuit board 15 and the LED lamp bead 14 of the light source assembly 11 are located in the cavity. Externally, the LED bead printed circuit board 15 of the light source assembly 11 is electrically connected to the drive circuit board 12.
  • the above-mentioned heat dissipation housing 6 is a solar heat dissipation fin.
  • a specific light source assembly of the copper-based LED lamp bead printed circuit board 15 is electrically connected to the driving circuit board 12, a wire through hole is formed in the aluminum-based heat conducting plate 7, a wire passing through the wire through hole and a copper-based LED
  • the lamp bead printed circuit board 15 is connected to the driving circuit board 12, and electrical connection between the LED lamp bead printed circuit board 15 and the driving circuit board 12 is realized.
  • the above-mentioned roadway lamp further includes a cable passage including a top case 16 fixed to the top of the heat dissipation housing 6 and a wiring hole 2 provided on the top case 16 and screwed to the connection hole 2.
  • a pressure rubber 5 is disposed in the wiring hole 2
  • a waterproof rubber 3 is disposed between the waterproof rubber 3 and the compression nut 5.
  • the LED roadway lamp further includes a top cover 1. The top cover 1 is mounted on the top of the top case 16.
  • the above-mentioned roadway lamp further includes a transparent cover 10 which is mounted on the aluminum-based heat conducting plate 7 and assembled into a cavity A in the aluminum-based heat conducting plate 7, in which the LED lamp bead 14 is located.
  • the transparent cover 10 can be attached to the aluminum-based heat-conducting plate 7 by bolts, and a pressure ring 9 is disposed between the bolt and the transparent cover 10, and a gasket 8 is disposed between the transparent cover 10 and the aluminum-based heat-conductive plate 7.
  • the chip-type LED lamp bead, the copper-based LED lamp bead printed circuit board and the aluminum-based heat conducting plate with twenty-eight bases are copper-based components, and the specific preparation steps are as follows:
  • Step 1 Apply solder paste to the position where the lamp bead base of each LED lamp bead is connected with the LED lamp bead printed circuit board, apply the solder paste, and perform hot air welding at 250 ° C to obtain the LED lamp bead.
  • LED lamp bead printed circuit board
  • Step 2 the part of the LED printed circuit board mounted on the aluminum-based heat conducting plate is plated by a bonding process, and the thickness of the plated copper layer is 40 micrometers; then the LED lamp bead printed circuit board obtained in the first step is thermally conductive with the aluminum base.
  • the parts where the plates are connected are tinned by a conventional process, and the thickness of the tin-plated layer is 130 micrometers; then the solder paste is applied to the entire surface of the aluminum-based heat-conductive plate copper-plated surface and the tin-plated surface of the LED lamp bead printed circuit board. After applying the solder paste, hot air welding is performed at 245 ° C to finally obtain an LED light source assembly.
  • the LED lamp light source assembly prepared by the method of the above Embodiment 1 is used for preparing an LED roadway lamp.
  • the LED roadway lamp of the application comprises the light source component 11 prepared by the above method, the driving circuit board 12, and the sun cooling fin type heat dissipation housing 6
  • the aluminum-based heat conducting plate 7 of the light source assembly 11 is mounted on the bottom of the heat dissipation housing 6 and assembled into a cavity with the heat dissipation housing 6.
  • the driving circuit board 12 is mounted in the cavity, and the light source assembly 11 is disposed.
  • the LED lamp bead 14 and the LED lamp bead PCB 15 are located outside the cavity, and the LED lamp bead printed circuit board 15 of the light source assembly 11 and the driving circuit board 12 are passed through the through-holes of the wires provided on the aluminum-based heat conducting plate 7. The wires are electrically connected.
  • the final performance is that the LED lamp bead 14 and the LED lamp bead PCB15 are electrically connected by soldering, and the copper-based LED lamp bead PCB 15 is integrally soldered to the aluminum-based heat conducting plate 7;
  • the aluminum-based heat conducting plate 7 is mounted with a transparent cover 10, and the transparent cover 10 is assembled with the aluminum-based heat conducting plate 7 into a cavity B.
  • the LED lamp bead 14 and the LED lamp bead PCB 15 are located in the cavity B;
  • the top of the 6 is provided with a cable passage including a top case 16 fixed to the top of the heat dissipation housing 6 and a wiring hole 2 disposed on the top case 16 and a compression nut 5 screwed to the connection hole 2,
  • a waterproof rubber 3 is disposed in the wiring hole 2 and a hollow steel sheet 4 is disposed between the waterproof rubber 3 and the compression nut 5;
  • the LED roadway lamp further includes a top cover 1, and the top cover 1 is mounted on the top case 16. the top of.
  • the difference between this embodiment and the embodiment 1 is that the temperature of the LED lamp bead 14 and the LED lamp bead PCB 15 during soldering is 230 ° C, and the soldering temperature between the LED lamp bead PCB 15 and the aluminum-based heat conducting plate 7 is 225 °. C.

Abstract

A method for manufacturing an LED lamp light source component (11) and an LED roadway lighting lamp manufactured using the method. In the manufacturing method, an LED lamp bead (14) is first installed on an LED lamp bead PCB (15) by means of high-temperature hot-air soldering, and then the LED lamp bead PCB (15) provided with said LED lamp bead (14) is soldered to an aluminum-based heat conducting plate (7) at a lower temperature. The LED lamp light source component manufactured using the method is applicable to an LED roadway lighting lamp. The light source component (11) is installed on the heat-dissipation housing (6) of an LED roadway lighting lamp by means of soldering, said heat-dissipation housing (6) of the LED roadway lighting being cooling fins in the shape of a sunflower. The LED roadway lighting lamp has the benefits of good heat-dissipation performance, compact structure, good appearance, high efficiency, low energy cost, and long service life.

Description

LED灯光源组件的制备方法及涉及 法的 LED巷道灯 技术领域  Method for preparing LED light source assembly and LED roadway lamp related to the same
本发明涉及灯具及灯具的加工制作方法, 具体涉及一种 LED灯光源组件的 制备方法及该方法所涉及的 LED巷道灯。  The invention relates to a method for manufacturing a lamp and a lamp, and particularly to a method for preparing an LED lamp light source assembly and an LED roadway lamp involved in the method.
背景技术 Background technique
散热性能是影响 LED灯使用寿命的关键因素之一。 LED灯在使用过程中, 有 80%左右的能量转化成了热能, 且随着 LED灯产品功率密度和封装密度的提 高, 必然会引起灯具内部热量的聚集, 进而导致发光波长飘移、 出光效率下降 以及灯具使用寿命下降等问题。  Thermal performance is one of the key factors affecting the life of LED lamps. During the use of LED lights, about 80% of the energy is converted into heat energy, and as the power density and packing density of the LED lamp products increase, the heat inside the lamps will inevitably accumulate, which will cause the wavelength of the light to drift and the light-emitting efficiency to decrease. And the problem of the life of the lamp is reduced.
在诸多关乎 LED灯散热性能的因素中, 光源组件 LED灯珠、 LED灯珠印 刷电路板 (LED灯珠 PCB) 与导热板之间的安装连接方式即光源组件的制备方 法是其中最源头的因素之一。 常见的安装连接方式如利用高导热胶连接光源与 灯座或导热板, 提高光源与灯座之间的导热性能, 进而有效地将热量导出, ZL201020132511.6所公开的 LED巷道灯就是由光源基板通过高导热硅胶层将热 量导入光源灯盘, 并散发到空气中, 采取此方式虽然在一定程度上可提高灯具 的散热性能, 但实际的使用过程中经常会出现导热胶因过干而脱落, 灯具导热 率下降, 出现光衰、 死灯等不良现象; 另外, 采用机械连接方式将 LED灯珠和 LED灯珠 PCB直接安装于导热性能好的灯座上, 此方式不但在改良灯具的导热 性能上存在很大的局限性, 且在加工灯具的过程中, 其加工压紧度不易调控, 很容易导致部件损坏, 同时, 采用机械连接方式制备的灯具体积大而笨拙, 使 用过程易出现零部件松动等现象。  Among the many factors related to the heat dissipation performance of LED lamps, the installation method of the light source component LED lamp bead, the LED lamp bead printed circuit board (LED lamp bead PCB) and the heat conducting plate is the most important factor in the preparation method of the light source component. one. Common installation and connection methods, such as the use of high thermal conductivity glue to connect the light source with the lamp holder or the heat conduction plate, improve the thermal conductivity between the light source and the lamp holder, and then effectively derive the heat. The LED roadway lamp disclosed in ZL201020132511.6 is the light source substrate. The heat is introduced into the light source panel through the high thermal conductivity silica gel layer, and is radiated into the air. Although this method can improve the heat dissipation performance of the lamp to a certain extent, in actual use, the heat conductive glue often appears to be off due to dryness. The thermal conductivity of the lamp is degraded, and there are undesirable phenomena such as light decay and dead light. In addition, the LED lamp bead and the LED lamp bead PCB are directly mounted on the lamp holder with good thermal conductivity by mechanical connection, which not only improves the thermal conductivity of the lamp. There are great limitations on the process, and in the process of processing the luminaire, the processing compaction is not easy to control, and it is easy to cause damage to the components. At the same time, the lamps prepared by mechanical connection are bulky and clumsy, and the parts are prone to occur during use. Loose and other phenomena.
对于 LED巷道灯的散热性能, 直接取决于灯具内部的相关构造, 即在已有 的 LED灯的发光效率上, 借助部件的科学选用和部件间的合理组装将光源所散 发的热量有效地导出, 即通过优化设计, 增加散热面积和通风对流效果以及改 善表面辐射系数, 加之采用上述常规的光源组件的安装方式, 最终导致灯体增 加尺寸增加、 外观笨重, 影响美观。 The heat dissipation performance of the LED roadway lamp is directly dependent on the relevant structure inside the lamp, that is, in the luminous efficiency of the existing LED lamp, the heat emitted by the light source is effectively derived by the scientific selection of the component and the reasonable assembly between the components. That is, by optimizing the design, increasing the heat dissipation area and ventilation convection effect, and improving the surface emissivity, and using the conventional light source assembly mounting method, the lamp body is eventually increased. The increase in size and the cumbersome appearance affect the appearance.
发明内容 Summary of the invention
针对现有技术的缺陷或不足, 基于 LED灯的光源组件中的部件之间的安装 连接方式对于提高灯具散热性能的作用, 本发明的目的为提供一种 LED灯的光 源组件的制备方法, 采用该方法不仅可以稳定而持久地将光源组件中的各部件 组装在一起, 并且可以改善 LED灯中光源组件处的传热性能, 进而可以优化整 个灯具的散热性能。  In view of the defects or deficiencies of the prior art, the effect of the mounting connection between the components in the light source assembly of the LED lamp is to improve the heat dissipation performance of the lamp. The object of the present invention is to provide a method for preparing a light source component of the LED lamp. The method not only can stably and permanently assemble the components in the light source assembly, but also can improve the heat transfer performance of the light source component in the LED lamp, thereby optimizing the heat dissipation performance of the entire lamp.
为了实现上述技术任务, 本发明采取如下的技术解决方案:  In order to achieve the above technical tasks, the present invention adopts the following technical solutions:
一种 LED灯光源组件的制备方法, 其特征在于, 该方法以至少一个灯珠底 座为铜基的 LED灯珠、铜基 LED灯珠印刷电路板和铝基导热板为元件,按下列 步骤进行:  A method for preparing an LED lamp light source assembly, characterized in that the method comprises the following steps: at least one LED lamp bead, a copper-based LED lamp bead printed circuit board and an aluminum-based heat conduction plate with a lamp bead base as components; :
步骤一,在 LED灯珠的灯珠底座与 LED灯珠印刷电路板相接的位置处涂抹 锡膏; 涂抹锡膏后于 230°C-260°C条件下进行热风焊接, 进而得到安装有 LED 灯珠的 LED灯珠印刷电路板;  Step one, applying solder paste at a position where the lamp bead base of the LED lamp bead is connected with the LED lamp bead printed circuit board; after applying the solder paste, hot air welding is performed at 230 ° C - 260 ° C, thereby obtaining LED mounted LED bead printed circuit board of lamp beads;
步骤二, 于铝基导热板上安装 LED印刷电路板的部位镀铜; 于步骤一中所 得的 LED灯珠印刷电路板上与铝基导热板相接的部位镀锡; 然后在镀有铜的铝 基导热板与镀有锡的 LED灯珠印刷电路板相接的位置处涂抹锡膏; 涂抹锡膏后 于 225°C-255°C条件下进行热风焊接, 最终制得 LED灯光源组件。  Step 2: plating the portion of the LED printed circuit board on the aluminum-based heat conducting plate for copper plating; tinning the portion of the LED lamp bead printed circuit board obtained in the first step with the aluminum-based heat conducting plate; and then plating the copper The aluminum-based heat-conducting plate is coated with solder paste at a position where the tin-plated LED lamp bead printed circuit board is connected; after the solder paste is applied, hot-air welding is performed at 225 ° C - 255 ° C to obtain an LED lamp light source assembly.
所述步骤二中以键合工艺进行镀铜, 且所镀铜层厚度为 30微米 ~50微米; 所镀锡层厚度为 100微米 ~150微米。  In the second step, the copper plating is performed by a bonding process, and the thickness of the copper plating layer is 30 micrometers to 50 micrometers; and the thickness of the tin plating layer is 100 micrometers to 150 micrometers.
所述 LED灯珠为贴片式灯珠。  The LED lamp bead is a patch type lamp bead.
所述步骤二中是在镀有铜的铝基导热板与镀有锡的 LED灯珠印刷电路板相 接的整面涂抹锡膏。  In the second step, the solder paste is applied to the entire surface of the copper-plated aluminum-based heat conducting plate and the tin-plated LED lamp bead printed circuit board.
本发明的另一目的在于上述方法制备的 LED灯光源组件用于制备 LED巷道 灯的应用。  Another object of the invention is the use of an LED lamp source assembly prepared by the above method for the preparation of an LED roadway lamp.
经过科学地选用 LED巷道灯中的光源部件和辅助散热部件, 并将这些部件 与电路等其他部件之间进行科学合理地组装, 本发明的另一目的是提供一种上 述应用所生产的散热性能好、 使用寿命长且体积小的 LED巷道灯。 为实现该技 术任务, 本发明采取如下的技术解决方案: Scientifically selecting the light source components and auxiliary heat dissipating components in the LED roadway lights, and using these components It is scientifically and rationally assembled with other components such as circuits, and another object of the present invention is to provide an LED roadway lamp which has good heat dissipation performance, long service life and small volume, which is produced by the above application. To achieve this technical task, the present invention adopts the following technical solutions:
一种 LED巷道灯包括光源组件、 驱动电路板、 散热壳体, 其特征在于, 所 述光源组件为上述方法所制得的光源组件, 其中, 光源组件的铝基导热板配装 于散热壳体底部并与该散热壳体拼装成一腔体, 所述驱动电路板安装于该腔体 中,光源组件的铜基 LED灯珠印刷电路板和 LED灯珠位于该腔体外部,光源组 件的铜基 LED灯珠印刷电路板与驱动电路板电连接。  An LED roadway lamp includes a light source assembly, a driving circuit board, and a heat dissipation housing, wherein the light source assembly is a light source assembly obtained by the above method, wherein the aluminum-based heat conduction plate of the light source assembly is mounted on the heat dissipation housing The bottom portion is assembled into a cavity with the heat dissipation housing, and the driving circuit board is mounted in the cavity. The copper-based LED lamp bead printed circuit board and the LED lamp bead of the light source assembly are located outside the cavity, and the copper base of the light source component The LED lamp bead printed circuit board is electrically connected to the driving circuit board.
所述的散热壳体为太阳花散热鳍。  The heat dissipation housing is a sun heat dissipation fin.
所述的铝基导热板上设有导线通孔, 穿过该导线通孔的导线与铜基 LED灯 珠印刷电路板和驱动电路板连接。  The aluminum-based heat conducting plate is provided with a wire through hole, and the wire passing through the wire through hole is connected with the copper-based LED lamp bead printed circuit board and the driving circuit board.
所述的巷道灯还包括缆线通道, 该缆线通道包括固定于散热壳体顶部的顶 壳和设置在顶壳上的接线孔以及与接线孔螺纹连接的压紧螺母, 所述接线孔内 设置有防水橡胶, 所述防水橡胶与压紧螺母之间设置有空心钢片, 所述顶壳的 顶部安装有顶盖。  The roadway lamp further includes a cable passage, the cable passage includes a top case fixed to the top of the heat dissipation case, a connection hole disposed on the top case, and a compression nut threadedly connected to the connection hole, wherein the connection hole is inside A waterproof rubber is disposed, and a hollow steel sheet is disposed between the waterproof rubber and the compression nut, and a top cover is mounted on the top of the top shell.
所述的巷道灯还包括透明罩, 该透明罩通过螺栓安装于铝基导热板上, 且 螺栓与透明罩之间设置有压圈, 所述透明罩与铝基导热板之间设置有垫圈。  The roadway lamp further includes a transparent cover, the transparent cover is mounted on the aluminum-based heat-conducting plate by bolts, and a pressing ring is disposed between the bolt and the transparent cover, and a gasket is disposed between the transparent cover and the aluminum-based heat-conductive plate.
与现有技术相比, 本发明具有如下的技术效果:  Compared with the prior art, the present invention has the following technical effects:
( 1 ) 本发明首次将锡焊作为 LED灯光源组件制备方法中各组件之间的唯 一连接方法, 并未辅助有其他导热胶、 机械的连接方式, 完全摈弃了原有 LED 灯中光源组件安装工艺所存在的弊端即所得产品散热性能差、 使用寿命短、 制 备工艺条件不易控制等。  (1) For the first time, the present invention uses soldering as the only connection method between the components in the preparation method of the LED light source component, and does not assist other thermal adhesives and mechanical connection modes, completely eliminating the installation of the light source components in the original LED lamp. The disadvantages of the process are that the obtained product has poor heat dissipation performance, short service life, and difficult to control the preparation process conditions.
(2) 光源组件制备过程中选择耐热性能好的底座为铜基的 LED灯珠, 为 了对焊好灯珠的 PCB进行检验,先将该 LED灯珠在较高温度下锡焊于铜基 LED 灯珠 PCB上,然后再将焊接有 LED灯珠的铜基 LED灯珠 PCB在较低温度下锡 焊于灯具中的铝基导热板上, 同时根据焊接温度的要求, 焊接 LED灯珠时所用 锡膏的熔点高于焊接铜基 LED灯珠 PCB时所用锡膏的熔点。且过程中,应铝材 与铜材在锡焊时的特性,分别在铝基导热板上和铜基的 LED灯珠 PCB上镀铜和 镀锡,并且在铜基的 LED灯珠 PCB上镀锡可以大大缩短焊接时间并提高焊接质 (3) 本发明的 LED巷道灯具有结构紧凑、 外形美观、 耐潮抗震、 高效节 會^ 超长寿命等特点。 (2) The base with good heat resistance during the preparation of the light source component is a copper-based LED lamp bead. In order to inspect the PCB of the soldered lamp bead, the LED lamp bead is soldered to the copper base at a higher temperature. On the LED lamp bead PCB, the copper-based LED lamp bead PCB soldered with the LED lamp bead is soldered to the aluminum-based heat-conducting plate in the lamp at a lower temperature, and the LED lamp bead is soldered according to the welding temperature requirement. Used The melting point of the solder paste is higher than the melting point of the solder paste used to solder the copper-based LED lamp bead PCB. In the process, the characteristics of aluminum and copper during soldering shall be copper and tin-plated on the aluminum-based heat-conducting plate and the copper-based LED lamp bead PCB, and plated on the copper-based LED lamp bead PCB. Tin can greatly shorten the welding time and improve the welding quality. (3) The LED roadway lamp of the invention has the characteristics of compact structure, beautiful appearance, moisture and earthquake resistance, high efficiency and long life.
(4) 本发明的 LED巷道灯散热总面积相对较小, 但散热率有所提高, 耐 热性好, 且产品使用寿命长, 产品体积小而美观。  (4) The total area of heat dissipation of the LED roadway lamp of the present invention is relatively small, but the heat dissipation rate is improved, the heat resistance is good, and the product has a long service life, and the product volume is small and beautiful.
(5) 本发明的 LED巷道灯适用于具有甲烷或煤尘爆炸危险的煤矿井下工 作面、 巷道、 嗣室中作照明用灯具。  (5) The LED roadway lamp of the present invention is suitable for use as a lighting fixture in a coal mine working face, a roadway, and a diverticulum having a danger of methane or coal dust explosion.
附图说明 DRAWINGS
图 1为本发明的结构示意图;  Figure 1 is a schematic structural view of the present invention;
图 2为图 1中 B处的结构放大示意图。  Fig. 2 is an enlarged schematic view showing the structure at B in Fig. 1.
以下结合实施例与附图对本发明做进一步详细说明。  The present invention will be further described in detail below with reference to the embodiments and the accompanying drawings.
具体实 式 Specific form
锡焊是利用低熔点的金属焊料加热熔化后, 渗入并充填金属件连接处间隙 的焊接方法。 因焊料常为锡基合金, 故名。 其广泛用于电子工业中。 同时, 锡 的导热性能也较优。 本发明正是基于锡材料的特性与锡焊的特点采取如下的步 骤对 LED灯中的光源组件进行制备:  Soldering is a soldering method in which a low melting point metal solder is used to heat and melt, and penetrates and fills the gap between the metal parts. Because the solder is often a tin-based alloy, hence the name. It is widely used in the electronics industry. At the same time, the thermal conductivity of tin is also superior. The invention is based on the characteristics of the tin material and the characteristics of the soldering. The following steps are taken to prepare the light source assembly in the LED lamp:
制备过程中是以至少一个灯珠底座为铜基的 LED灯珠、铜基 LED灯珠印刷 电路板和铝基导热板为元件, 并具体采用下列步骤进行:  In the preparation process, the LED lamp bead, the copper-based LED lamp bead printed circuit board and the aluminum-based heat conducting plate with at least one lamp bead base are used as components, and the following steps are specifically adopted:
步骤一,在 LED灯珠的灯珠底座与 LED灯珠印刷电路板相接的位置处涂抹 锡膏, 具体的涂抹方式为: 或在 LED灯珠的铜基灯珠底座的相应位置上涂抹, 或在铜基 LED灯珠 PCB的相应位置上涂抹, 或在 LED灯珠的铜基灯珠底座的 相应位置上和铜基 LED灯珠 PCB的相应位置上均适当涂抹, 而后将二者对接; 涂抹锡膏后于 230°C-260°C条件下进行热风焊接, 进而得到安装有 LED灯珠的 LED灯珠印刷电路板; Step one: Apply solder paste to the position of the LED lamp bead base and the LED lamp bead printed circuit board. The specific application method is: or apply on the corresponding position of the copper-based lamp bead base of the LED lamp bead. Or smearing on the corresponding position of the copper-based LED lamp bead PCB, or properly affixing at the corresponding position of the copper-based lamp bead base of the LED lamp bead and the corresponding position of the copper-based LED lamp bead PCB, and then docking the two; After applying the solder paste, hot air welding is carried out at 230 ° C - 260 ° C to obtain LED lamp beads. LED lamp bead printed circuit board;
步骤二, 于铝基导热板上安装 LED印刷电路板的部位镀铜, 镀铜工艺为键 合工艺, 且所镀铜层厚度为 3微米 0~50微米; 于步骤一中所得的 LED灯珠印 刷电路板上与铝基导热板相接的部位镀锡, 镀锡工艺为一般常规工艺, 且所镀 锡层厚度为 100微米 ~150微米;然后在铝基导热板上镀铜的面与 LED灯珠印刷 电路板上镀锡的面相接的位置处涂抹锡膏, 具体的涂抹方式为: 或在铝基导热 板上的相应部位涂抹锡膏, 或在安装有 LED灯珠的铜基 LED灯珠 PCB的相应 部位涂抹锡膏,或在铝基导热板上的相应部位和安装有 LED灯珠的铜基 LED灯 珠 PCB的相应部位均涂抹锡膏; 涂抹锡膏后于 225 °C-255°C条件下进行热风焊 接, 最终制得 LED灯光源组件。  Step 2, the part of the LED printed circuit board is plated with copper on the aluminum-based heat conducting plate, the copper plating process is a bonding process, and the thickness of the plated copper layer is 3 micrometers 0 to 50 micrometers; the LED lamp beads obtained in the first step The part of the printed circuit board that is connected to the aluminum-based heat-conducting plate is tin-plated, the tin-plating process is a general conventional process, and the tin-plated layer has a thickness of 100 μm to 150 μm; then the copper-plated surface and the LED are on the aluminum-based heat conductive plate. Solder paste is applied to the surface where the tin-plated surface of the lamp bead is connected. The specific application method is as follows: Apply solder paste to the corresponding part of the aluminum-based heat-conducting plate, or copper-based LED with LED lamp bead installed. Solder paste on the corresponding part of the lamp bead PCB, or solder paste on the corresponding part of the aluminum-based heat-conducting plate and the corresponding part of the copper-based LED lamp bead PCB on which the LED lamp bead is mounted; after applying the solder paste at 225 °C- Hot air welding was carried out at 255 ° C to finally produce an LED light source assembly.
上述制备过程中所用的 LED灯珠优选贴片式灯珠。  The LED lamp bead used in the above preparation process is preferably a patch type lamp bead.
上述步骤一中的连接 LED灯珠与 LED灯珠印刷电路板的锡具有导电、 连接 和导热作用, 步骤二中的连接 LED灯珠印刷电路板和铝基导热板的锡具有连接 和导热作用,以使部件之间充分连接,步骤二中是在铝基导热板镀铜的面与 LED 灯珠印刷电路板镀锡的面相接的整面涂抹锡膏。  The tin connecting the LED lamp bead and the LED lamp bead printed circuit board in the above step 1 has electrical conduction, connection and heat conduction, and the tin connecting the LED lamp bead printed circuit board and the aluminum-based heat conduction plate in the second step has connection and heat conduction. In order to make the components fully connected, in the second step, the solder paste is applied to the entire surface of the surface of the aluminum-based heat-conducting plate which is plated with copper and the surface of the LED lamp-printed circuit board.
上述步骤一中的温度较步骤二中的热风焊接温度低, 防止已安装好的 LED 灯珠脱落。  The temperature in the above step 1 is lower than the hot air welding temperature in the second step, and the installed LED lamp beads are prevented from falling off.
上述方法制备的 LED灯光源组件用于制备 LED巷道灯的应用。 该应用的 LED巷道灯包括光源组件 11、 驱动电路板 12、 散热壳体 6, 所述光源组件 11 为上述方法所制得的光源组件, 并且, 光源组件 11的铝基导热板 7配装于散热 壳体 6底部并与该散热壳体 6拼装成一腔体, 所述驱动电路板 12安装于该腔体 中, 光源组件 11的 LED灯珠印刷电路板 15和 LED灯珠 14位于该腔体外部, 光源组件 11的 LED灯珠印刷电路板 15与驱动电路板 12电连接。  The LED lamp light source assembly prepared by the above method is used for preparing an LED roadway lamp. The LED roadway lamp of the application comprises a light source assembly 11, a driving circuit board 12, a heat dissipation housing 6, the light source assembly 11 is a light source assembly manufactured by the above method, and the aluminum-based heat conduction plate 7 of the light source assembly 11 is fitted to The bottom of the heat dissipation housing 6 is assembled into a cavity with the heat dissipation housing 6. The driving circuit board 12 is mounted in the cavity, and the LED lamp bead printed circuit board 15 and the LED lamp bead 14 of the light source assembly 11 are located in the cavity. Externally, the LED bead printed circuit board 15 of the light source assembly 11 is electrically connected to the drive circuit board 12.
作为一种全新的应用, 上述的散热壳体 6为太阳花散热鳍。  As a completely new application, the above-mentioned heat dissipation housing 6 is a solar heat dissipation fin.
一种具体的光源组件的铜基 LED灯珠印刷电路板 15与驱动电路板 12电连 接方式, 在铝基导热板 7上开设导线通孔, 穿过该导线通孔的导线与铜基 LED 灯珠印刷电路板 15和驱动电路板 12连接, 实现了 LED灯珠印刷电路板 15与 驱动电路板 12的电连接。 A specific light source assembly of the copper-based LED lamp bead printed circuit board 15 is electrically connected to the driving circuit board 12, a wire through hole is formed in the aluminum-based heat conducting plate 7, a wire passing through the wire through hole and a copper-based LED The lamp bead printed circuit board 15 is connected to the driving circuit board 12, and electrical connection between the LED lamp bead printed circuit board 15 and the driving circuit board 12 is realized.
以达到通用的目的, 上述的巷道灯还包括缆线通道, 该缆线通道包括固定 于散热壳体 6顶部的顶壳 16和设置在顶壳 16上的接线孔 2以及与接线孔 2螺 纹连接的压紧螺母 5, 所述接线孔 2内设置有防水橡胶 3, 所述防水橡胶 3与压 紧螺母 5之间设置有空心钢片 4, 除此之外, 该 LED巷道灯还包括顶盖 1, 该 顶盖 1安装于顶壳 16的顶部。  For the purpose of general purpose, the above-mentioned roadway lamp further includes a cable passage including a top case 16 fixed to the top of the heat dissipation housing 6 and a wiring hole 2 provided on the top case 16 and screwed to the connection hole 2. a pressure rubber 5 is disposed in the wiring hole 2, and a waterproof rubber 3 is disposed between the waterproof rubber 3 and the compression nut 5. In addition, the LED roadway lamp further includes a top cover 1. The top cover 1 is mounted on the top of the top case 16.
上述的巷道灯还包括透明罩 10,该透明罩 10安装于铝基导热板 7上并于铝 基导热板 7拼装成一腔体 A, LED灯珠 14位于该腔体 A中。 透明罩 10可通过 螺栓安装于铝基导热板 7上, 且螺栓与透明罩 10之间设置有压圈 9, 所述透明 罩 10与铝基导热板 7之间设置有垫圈 8。  The above-mentioned roadway lamp further includes a transparent cover 10 which is mounted on the aluminum-based heat conducting plate 7 and assembled into a cavity A in the aluminum-based heat conducting plate 7, in which the LED lamp bead 14 is located. The transparent cover 10 can be attached to the aluminum-based heat-conducting plate 7 by bolts, and a pressure ring 9 is disposed between the bolt and the transparent cover 10, and a gasket 8 is disposed between the transparent cover 10 and the aluminum-based heat-conductive plate 7.
需要说明的是, LED巷道灯中所用驱动电路板 12上所设的具体电路构成均 为现有技术, 具体设计如 GB/T24825_2009。  It should be noted that the specific circuit configuration on the driving circuit board 12 used in the LED roadway lamp is prior art, and the specific design is as GB/T24825_2009.
以下是发明人给出的实施例, 需要说明的是该实施例是对本发明的进一步 解释和说明, 本发明并不限于该实施例。  The following is an embodiment given by the inventors, and it should be noted that this embodiment is a further explanation and description of the present invention, and the present invention is not limited to the embodiment.
实施例 1 : Example 1
该实施例中是以二十八个底座为铜基的贴片式 LED灯珠、铜基 LED灯珠印 刷电路板和铝基导热板为元件, 具体制备方法步骤如下:  In this embodiment, the chip-type LED lamp bead, the copper-based LED lamp bead printed circuit board and the aluminum-based heat conducting plate with twenty-eight bases are copper-based components, and the specific preparation steps are as follows:
步骤一,在各 LED灯珠的灯珠底座与 LED灯珠印刷电路板相接的位置处涂 抹锡膏, 涂抹锡膏后于 250°C条件下进行热风焊接, 进而得到安装有 LED灯珠 的 LED灯珠印刷电路板;  Step 1: Apply solder paste to the position where the lamp bead base of each LED lamp bead is connected with the LED lamp bead printed circuit board, apply the solder paste, and perform hot air welding at 250 ° C to obtain the LED lamp bead. LED lamp bead printed circuit board;
步骤二, 于铝基导热板上安装 LED印刷电路板的部位采用键合工艺镀铜, 所镀铜层厚度为 40微米; 接着于步骤一中所得的 LED灯珠印刷电路板上与铝 基导热板相接的部位采用常规工艺镀锡, 所镀锡层的厚度为 130微米; 然后在 铝基导热板镀铜的面与 LED灯珠印刷电路板镀锡的面相接的整面涂抹锡膏; 涂 抹锡膏后于 245°C条件下进行热风焊接, 最终制得 LED灯光源组件。 上述上述实施例 1方法制备的 LED灯光源组件用于制备 LED巷道灯的应 用, 该应用的 LED巷道灯包括上述方法制备的光源组件 11、驱动电路板 12、太 阳花散热鳍式散热壳体 6, 其中, 光源组件 11中的铝基导热板 7配装于散热壳 体 6底部并与该散热壳体 6拼装成一腔体,所述驱动电路板 12安装于该腔体中, 光源组件 11中的 LED灯珠 14和 LED灯珠 PCB15位于该腔体外部, 光源组件 11的 LED灯珠印刷电路板 15与驱动电路板 12之间由穿过铝基导热板 7上所设 的导线通孔的导线实现电连接。最终表现为 LED灯珠 14与 LED灯珠 PCB15电 连接方式为锡焊, 铜基 LED灯珠 PCB15整体锡焊于铝基导热板 7上; Step 2, the part of the LED printed circuit board mounted on the aluminum-based heat conducting plate is plated by a bonding process, and the thickness of the plated copper layer is 40 micrometers; then the LED lamp bead printed circuit board obtained in the first step is thermally conductive with the aluminum base. The parts where the plates are connected are tinned by a conventional process, and the thickness of the tin-plated layer is 130 micrometers; then the solder paste is applied to the entire surface of the aluminum-based heat-conductive plate copper-plated surface and the tin-plated surface of the LED lamp bead printed circuit board. After applying the solder paste, hot air welding is performed at 245 ° C to finally obtain an LED light source assembly. The LED lamp light source assembly prepared by the method of the above Embodiment 1 is used for preparing an LED roadway lamp. The LED roadway lamp of the application comprises the light source component 11 prepared by the above method, the driving circuit board 12, and the sun cooling fin type heat dissipation housing 6 The aluminum-based heat conducting plate 7 of the light source assembly 11 is mounted on the bottom of the heat dissipation housing 6 and assembled into a cavity with the heat dissipation housing 6. The driving circuit board 12 is mounted in the cavity, and the light source assembly 11 is disposed. The LED lamp bead 14 and the LED lamp bead PCB 15 are located outside the cavity, and the LED lamp bead printed circuit board 15 of the light source assembly 11 and the driving circuit board 12 are passed through the through-holes of the wires provided on the aluminum-based heat conducting plate 7. The wires are electrically connected. The final performance is that the LED lamp bead 14 and the LED lamp bead PCB15 are electrically connected by soldering, and the copper-based LED lamp bead PCB 15 is integrally soldered to the aluminum-based heat conducting plate 7;
上述的铝基导热板 7安装一透明罩 10,该透明罩 10与铝基导热板 7拼装成 一腔体 B, LED灯珠 14和 LED灯珠 PCB15位于该腔体 B中; 上述的散热壳体 6顶部设有一缆线通道, 该缆线通道包括固定于散热壳体 6顶部的顶壳 16和设 置在顶壳 16上的接线孔 2以及与接线孔 2螺纹连接的压紧螺母 5, 所述接线孔 2内设置有防水橡胶 3, 所述防水橡胶 3与压紧螺母 5之间设置有空心钢片 4; 所述 LED巷道灯还包括一顶盖 1, 该顶盖 1安装于顶壳 16的顶部。  The aluminum-based heat conducting plate 7 is mounted with a transparent cover 10, and the transparent cover 10 is assembled with the aluminum-based heat conducting plate 7 into a cavity B. The LED lamp bead 14 and the LED lamp bead PCB 15 are located in the cavity B; The top of the 6 is provided with a cable passage including a top case 16 fixed to the top of the heat dissipation housing 6 and a wiring hole 2 disposed on the top case 16 and a compression nut 5 screwed to the connection hole 2, A waterproof rubber 3 is disposed in the wiring hole 2, and a hollow steel sheet 4 is disposed between the waterproof rubber 3 and the compression nut 5; the LED roadway lamp further includes a top cover 1, and the top cover 1 is mounted on the top case 16. the top of.
实施例 2: Example 2:
该实施例与实施例 1不同之处在于: LED灯珠 14与 LED灯珠 PCB15锡 焊时的温度为 255 °C, LED灯珠 PCB15与铝基导热板 7之间的锡焊温度为 250 °C。 实施例 3:  The difference between this embodiment and the embodiment 1 is that the temperature of the LED lamp bead 14 and the LED lamp bead PCB 15 is 255 ° C, and the soldering temperature between the LED lamp bead PCB 15 and the aluminum-based heat conducting plate 7 is 250 °. C. Example 3:
该实施例与实施例 1不同之处在于: LED灯珠 14与 LED灯珠 PCB15锡焊 时的温度为 230°C, LED灯珠 PCB15与铝基导热板 7之间的锡焊温度为 225°C。  The difference between this embodiment and the embodiment 1 is that the temperature of the LED lamp bead 14 and the LED lamp bead PCB 15 during soldering is 230 ° C, and the soldering temperature between the LED lamp bead PCB 15 and the aluminum-based heat conducting plate 7 is 225 °. C.

Claims

权利要求 Rights request
1、 一种 LED灯光源组件的制备方法, 其特征在于, 该方法以至少一个灯 珠底座为铜基的 LED灯珠、铜基 LED灯珠印刷电路板和铝基导热板为元件,按 下列步骤进行:  A method for preparing an LED lamp light source assembly, characterized in that the method comprises a copper lamp bead, a copper-based LED lamp bead printed circuit board and an aluminum-based heat conduction plate with at least one lamp bead base as components, according to the following The steps are carried out:
步骤一,在 LED灯珠的灯珠底座与 LED灯珠印刷电路板相接的位置处涂抹 锡膏; 涂抹锡膏后于 230°C-260°C条件下进行热风焊接, 进而得到安装有 LED 灯珠的 LED灯珠印刷电路板;  Step one, applying solder paste at a position where the lamp bead base of the LED lamp bead is connected with the LED lamp bead printed circuit board; after applying the solder paste, hot air welding is performed at 230 ° C - 260 ° C, thereby obtaining LED mounted LED bead printed circuit board of lamp beads;
步骤二, 于铝基导热板上安装 LED印刷电路板的部位镀铜; 于步骤一中所 得的 LED灯珠印刷电路板上与铝基导热板相接的部位镀锡; 然后在镀有铜的铝 基导热板与镀有锡的 LED灯珠印刷电路板相接的位置处涂抹锡膏; 涂抹锡膏后 于 225°C-255°C条件下进行热风焊接, 最终制得 LED灯光源组件。  Step 2: plating the portion of the LED printed circuit board on the aluminum-based heat conducting plate for copper plating; tinning the portion of the LED lamp bead printed circuit board obtained in the first step with the aluminum-based heat conducting plate; and then plating the copper The aluminum-based heat-conducting plate is coated with solder paste at a position where the tin-plated LED lamp bead printed circuit board is connected; after the solder paste is applied, hot-air welding is performed at 225 ° C - 255 ° C to obtain an LED lamp light source assembly.
2、 如权利要求 1所述的制备方法, 其特征在于, 所述步骤二中以键合工艺 进行镀铜, 且所镀铜层厚度为 30微米 ~50微米; 所镀锡层厚度为 100微米 ~150 微米。  2. The preparation method according to claim 1, wherein in the second step, copper plating is performed by a bonding process, and the thickness of the copper plating layer is 30 micrometers to 50 micrometers; and the thickness of the tin plating layer is 100 micrometers. ~150 microns.
3、 如权利要求 1所述的制备方法, 其特征在于, 所述 LED灯珠为贴片式 灯珠。  3. The method according to claim 1, wherein the LED lamp bead is a patch type lamp bead.
4、 如权利要求 1所述的制备方法, 其特征在于, 所述步骤二中是在镀有铜 的铝基导热板与镀有锡的 LED灯珠印刷电路板相接的整面涂抹锡膏。  The preparation method according to claim 1, wherein in the second step, the solder paste is applied to the entire surface of the copper-plated aluminum-based heat conducting plate and the tin-plated LED lamp bead printed circuit board. .
5、 权利要求 1所述方法制备的 LED灯光源组件用于制备 LED巷道灯的应 用。  5. An LED lamp light source assembly prepared by the method of claim 1 for use in the preparation of an LED roadway lamp.
6、 如权利要求 5所述的应用, 其特征在于, 所述的 LED巷道灯包括光源 组件 (11 )、 驱动电路板 (12)、 散热壳体 (6), 所述光源组件 (11 ) 为权利要 求 1、 2或 3任一权利要求所述方法制得的光源组件, 其中, 光源组件 (11 ) 的 铝基导热板(7)配装于散热壳体(6)底部并与该散热壳体(6)拼装成一腔体, 所述驱动电路板 (12) 安装于该腔体中, 光源组件 (11 ) 的 LED灯珠印刷电路 板(15)和 LED灯珠(14)位于该腔体外部, 光源组件(11 ) 的 LED灯珠印刷 电路板 (15 ) 与驱动电路板 (12) 电连接。 The application according to claim 5, wherein the LED roadway lamp comprises a light source assembly (11), a driving circuit board (12), and a heat dissipation housing (6), wherein the light source assembly (11) is A light source assembly produced by the method of any one of claims 1, 2 or 3, wherein the aluminum-based heat conducting plate (7) of the light source assembly (11) is fitted to the bottom of the heat-dissipating casing (6) and to the heat-dissipating casing The body (6) is assembled into a cavity, the driving circuit board (12) is mounted in the cavity, and the LED lamp bead printed circuit board (15) and the LED lamp bead (14) of the light source component (11) are located in the cavity. External, light source assembly (11) LED bead printing The circuit board (15) is electrically connected to the drive circuit board (12).
7、 如权利要求 6所述的 LED巷道灯, 其特征在于, 所述的散热壳体 (6) 为太阳花散热鳍。  The LED roadway lamp according to claim 6, wherein the heat dissipation housing (6) is a sun cooling fin.
8、如权利要求 6所述的 LED巷道灯, 其特征在于, 所述的铝基导热板(7) 上设有导线通孔, 穿过该导线通孔的导线与铜基 LED灯珠印刷电路板 (15) 和 驱动电路板 (12) 连接。  The LED roadway lamp according to claim 6, wherein the aluminum-based heat conducting plate (7) is provided with a wire through hole, a wire passing through the wire through hole and a copper-based LED lamp bead printed circuit The board (15) is connected to the drive board (12).
9、 如权利要求 6所述的 LED巷道灯, 其特征在于, 所述的巷道灯还包括 缆线通道, 该缆线通道包括固定于散热壳体 (6) 顶部的顶壳 (16) 和设置在顶 壳 (16) 上的接线孔 (2) 以及与接线孔 (2) 螺纹连接的压紧螺母 (5), 所述 接线孔 (2) 内设置有防水橡胶 (3), 所述防水橡胶 (3) 与压紧螺母 (5) 之间 设置有空心钢片 (4), 所述顶壳 (16) 的顶部安装有顶盖 (1 )。  9. The LED roadway lamp of claim 6, wherein the lane light further comprises a cable passage comprising a top case (16) and a setting fixed to the top of the heat dissipation housing (6) a wiring hole (2) on the top case (16) and a compression nut (5) threadedly connected to the wiring hole (2), wherein the wiring hole (2) is provided with a waterproof rubber (3), the waterproof rubber (3) A hollow steel piece (4) is disposed between the compression nut (5), and a top cover (1) is mounted on the top of the top case (16).
10、 如权利要求 6所述的 LED巷道灯, 其特征在于, 所述的巷道灯还包括透明 罩 (10), 该透明罩 (10) 通过螺栓安装于铝基导热板 (7) 上, 且螺栓与透明 罩 (10) 之间设置有压圈 (9), 所述透明罩 (10) 与铝基导热板 (7) 之间设置 有垫圈 (8)。 The LED roadway lamp of claim 6, wherein the roadway lamp further comprises a transparent cover (10), the transparent cover (10) is bolted to the aluminum-based heat conducting plate (7), and A pressure ring (9) is disposed between the bolt and the transparent cover (10), and a gasket (8) is disposed between the transparent cover (10) and the aluminum-based heat conduction plate (7).
PCT/CN2012/074838 2011-05-11 2012-04-27 Method for manufacturing led lamp light source component and led roadway lighting lamp involving said method WO2012152195A1 (en)

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