CN201652219U - LED lamp - Google Patents

LED lamp Download PDF

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Publication number
CN201652219U
CN201652219U CN2009202902847U CN200920290284U CN201652219U CN 201652219 U CN201652219 U CN 201652219U CN 2009202902847 U CN2009202902847 U CN 2009202902847U CN 200920290284 U CN200920290284 U CN 200920290284U CN 201652219 U CN201652219 U CN 201652219U
Authority
CN
China
Prior art keywords
heat
led lamp
lamp housing
radiating substrate
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2009202902847U
Other languages
Chinese (zh)
Inventor
吉爱华
姜滨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goer Tek Inc
Goertek Inc
Original Assignee
Goertek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goertek Inc filed Critical Goertek Inc
Priority to CN2009202902847U priority Critical patent/CN201652219U/en
Application granted granted Critical
Publication of CN201652219U publication Critical patent/CN201652219U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model discloses an LED lamp, which comprises a lamp shell, a heat-dissipating base plate is mounted in the lamp shell, and a light-emitting diode is soldered on the heat-dissipating base plate through low-temperature soldering paste. Generally, the thermal conductivity of the low-temperature soldering paste is higher than 40W/(m.K), consequently, the heat transfer between the light-emitting diode and the heat-dissipating base plate is greatly increased, the heat generated by the light-emitting diode can be quickly dissipated, the service life of the light-emitting diode is prolonged, the use reliability is enhanced as well, and thereby the service life of the whole LED lamp is prolonged.

Description

A kind of LED lamp
Technical field
The utility model relates to a kind of LED lamp, relates in particular to a kind of high-powered LED lamp.
Background technology
Advantages such as reaction speed is fast because light emitting diode has, energy-conserving and environment-protective are used widely rapidly.High-powered LED lamp mainly is used in public illumination and exploitation of mineral resources fields such as urban road, Jie Lu, tunnel illumination, mine lighting and oil field illumination.Existing large-power light-emitting diodes modulated structure is the outside at heat-dissipation lamp housing, varnishes with lacquer, and is provided with thermal grease, heat-radiating substrate, thermal grease, great power LED, secondary lens from bottom to top successively in the inside of heat-dissipation lamp housing.This kind assembly structure because between heat-radiating substrate and the great power LED, what be provided with between heat-radiating substrate and the lamp housing all is thermal grease (heat-conducting silicone grease), the thermal conductivity of thermal grease is the highest to be not more than 4, heat conductivility is poor, bad so dispel the heat, cause luminous efficiency lower, have a strong impact on the reliability and the life-span of LED lamp.
The utility model content
Technical problem to be solved in the utility model provides a kind of LED lamp of a kind of good heat dissipation, reliability height and long service life.
For solving the problems of the technologies described above, the technical solution of the utility model is: a kind of LED lamp, comprise lamp housing, and in the described lamp housing heat-radiating substrate is installed, be welded with light emitting diode by the eutectic welding tin cream on the described heat-radiating substrate.
As a kind of improvement, described eutectic welding tin cream is the SnBiCu solder(ing) paste.
As further improvement, be provided with the thermal conductive silicon rubber cushion between described lamp housing and the described heat-radiating substrate.
As further improvement, described heat-radiating substrate comprises aluminium base that contacts with described thermal conductive silicon rubber cushion and the copper-clad that carries described SnBiCu solder(ing) paste, is provided with insulating barrier between described aluminium base and the copper-clad.
As further improvement, the outer surface of described lamp housing is provided with some heat radiation wings, and the contact-making surface of described lamp housing and heat radiation wing and air is provided with the nano spray plating layer.
Owing to adopted technique scheme, a kind of LED lamp comprises lamp housing, in the described lamp housing heat-radiating substrate is installed, and is welded with light emitting diode by the eutectic welding tin cream on the described heat-radiating substrate; The beneficial effects of the utility model are: the thermal conductivity of eutectic welding tin cream is generally greater than 40W/ (mK), improved the heat transmission between light emitting diode and the heat-radiating substrate greatly, the heat that light emitting diode is produced can shed rapidly, increased the service life of light emitting diode, dependability also improves thereupon, thus the service life of having improved the whole LED lamp.
Description of drawings
Accompanying drawing is the structural representation of the utility model embodiment.
The specific embodiment
As shown in drawings, a kind of LED lamp, comprise lamp housing 1, described lamp housing 1 inboard is installed with heat-radiating substrate, be welded with light emitting diode 7 by the eutectic welding tin cream on the described heat-radiating substrate, the eutectic welding tin cream that adopts in the present embodiment is a SnBiCu solder(ing) paste 6, and the thermal conductivity of SnBiCu solder(ing) paste 6 is greater than 40W/ (mK), be ten times of thermal grease (heat-conducting silicone grease) thermal conductivity generally used in the present common LED lamp, the heat radiation that has improved large-power light-emitting diodes greatly.The outside mask of powerful light emitting diode 7 is provided with lens 8, plays the effect of protection light emitting diode 7.
Be provided with thermal conductive silicon rubber cushion 2 between described lamp housing 1 and the described heat-radiating substrate, described heat-radiating substrate comprises aluminium base 3 that contacts with described thermal conductive silicon rubber cushion 2 and the copper-clad 5 that carries described SnBiCu solder(ing) paste 6, be provided with insulating barrier 4 between described aluminium base 3 and the copper-clad 5, insulating barrier 4 can prevent to produce between aluminium base 3 and the copper-clad 5 and be electrically connected, to improve the reliability that the LED lamp uses.
Be welded with light emitting diode 7 by the eutectic welding tin cream on the described copper-clad 5, in public illuminations such as urban road, Jie Lu, tunnel illumination, mine lighting and oil field illumination and exploitation of mineral resources field, normally used LED power is bigger, so also adopt powerful light emitting diode in the present embodiment.
Be provided with thermal conductive silicon rubber cushion 2 between described lamp housing 1 and the described aluminium base 3, the thermal conductivity of thermal conductive silicon rubber cushion 2 helps distributing the heat that large-power light-emitting diodes produces also greater than thermal grease when work.The outside of described lamp housing 1 is provided with some heat radiation wings 11, be provided with nano spray plating layer 9 through nano spray plating on the contact-making surface of described lamp housing 1 and heat radiation wing 11 and air, being provided with of nano spray plating layer 9 can make lamp housing 1 heat radiation evenly, rate of heat dissipation is also than higher, and nano spray plating layer 9 also has the dustproof effect, can prevent that lamp housing 1 and heat radiation wing 11 are outside because its heat-sinking capability of deposition affects of dust further improves the heat-sinking capability of LED lamp and efficient.
The mode that nano spray plating layer described in the present embodiment is the applied chemistry principle by direct spraying is painted on the surface of lamp housing and heat radiation wing, this nano spray plating layer has excellent adhesive force, anti-impact force, corrosion resistance, against weather, wearability and marresistance, and has good anti-rust properties, can help prolonging the service life of lamp housing and heat radiation wing, thereby the service life of minimizing LED etc., and technology is simple, environmental protection.

Claims (5)

1. a LED lamp comprises lamp housing, in the described lamp housing heat-radiating substrate is installed, and it is characterized in that: be welded with light emitting diode by the eutectic welding tin cream on the described heat-radiating substrate.
2. a kind of LED lamp as claimed in claim 1 is characterized in that: described eutectic welding tin cream is the SnBiCu solder(ing) paste.
3. a kind of LED lamp as claimed in claim 2 is characterized in that: be provided with the thermal conductive silicon rubber cushion between described lamp housing and the described heat-radiating substrate.
4. a kind of LED lamp as claimed in claim 3 is characterized in that: described heat-radiating substrate comprises aluminium base that contacts with described thermal conductive silicon rubber cushion and the copper-clad that carries described SnBiCu solder(ing) paste, is provided with insulating barrier between described aluminium base and the copper-clad.
5. as the described a kind of LED lamp of the arbitrary claim of claim 1 to 4, it is characterized in that: the outer surface of described lamp housing is provided with some heat radiation wings, and the contact-making surface of described lamp housing and heat radiation wing and air is provided with the nano spray plating layer.
CN2009202902847U 2009-12-16 2009-12-16 LED lamp Expired - Lifetime CN201652219U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009202902847U CN201652219U (en) 2009-12-16 2009-12-16 LED lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009202902847U CN201652219U (en) 2009-12-16 2009-12-16 LED lamp

Publications (1)

Publication Number Publication Date
CN201652219U true CN201652219U (en) 2010-11-24

Family

ID=43117458

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009202902847U Expired - Lifetime CN201652219U (en) 2009-12-16 2009-12-16 LED lamp

Country Status (1)

Country Link
CN (1) CN201652219U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102278662A (en) * 2011-05-11 2011-12-14 陕西斯达煤矿安全装备有限公司 Preparation method of light source assembly of light emitting diode (LED) lamp and LED roadway lamp involving in method
CN110171197A (en) * 2019-06-27 2019-08-27 南京伯克利新材料科技有限公司 A kind of UV-LED cure lamp

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102278662A (en) * 2011-05-11 2011-12-14 陕西斯达煤矿安全装备有限公司 Preparation method of light source assembly of light emitting diode (LED) lamp and LED roadway lamp involving in method
WO2012152195A1 (en) * 2011-05-11 2012-11-15 陕西斯达煤矿安全装备有限公司 Method for manufacturing led lamp light source component and led roadway lighting lamp involving said method
CN102278662B (en) * 2011-05-11 2013-05-08 陕西斯达煤矿安全装备有限公司 Preparation method of light source assembly of light emitting diode (LED) lamp and LED roadway lamp involving in method
CN110171197A (en) * 2019-06-27 2019-08-27 南京伯克利新材料科技有限公司 A kind of UV-LED cure lamp

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CX01 Expiry of patent term
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Granted publication date: 20101124