CN201829533U - Circuit board for LED (Light-Emitting Diode) - Google Patents
Circuit board for LED (Light-Emitting Diode) Download PDFInfo
- Publication number
- CN201829533U CN201829533U CN2010205540573U CN201020554057U CN201829533U CN 201829533 U CN201829533 U CN 201829533U CN 2010205540573 U CN2010205540573 U CN 2010205540573U CN 201020554057 U CN201020554057 U CN 201020554057U CN 201829533 U CN201829533 U CN 201829533U
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- China
- Prior art keywords
- led
- insulating body
- circuit substrate
- radiator
- led according
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Abstract
The utility model discloses a circuit board for an LED (Light Emitting Diode), which is characterized by comprising an insulating body. A plurality of wire slots are arranged on the insulating body; adhesives are arranged in the wire slots; metal conducting strips are pressed on the adhesives; a through hole for the installation of the LED is arranged on the insulating body; and the electrodes of the LED are welded on the metal conducting strips. The utility model aims at overcoming the defects in the prior art and provides a circuit board which is simple in structure, convenient for manufacturing and very suitable for the electrode welding of an LED lamp.
Description
Technical field
The utility model relates to the circuit substrate of a kind of LED of being used for.
Background technology
Existing pcb board or the aluminium base that is used for LED, its complex manufacturing, environmental pollution is serious, and the cost of manufacture height.
The utility model content
The purpose of this utility model is in order to overcome weak point of the prior art, to provide a kind of simple in structure, easy to make, being well suited for the circuit board of LED lamp electrode welding.
In order to achieve the above object, the utility model adopts following scheme:
A kind of circuit substrate that is used for LED, it is characterized in that: comprise insulating body, on described insulating body, be provided with a plurality of wire casings, in described wire casing, be provided with adhesive glue, pressing has the metallic conduction sheet on described adhesive glue, be provided with the through hole that is used to install LED on described insulating body, the electrode of LED is welded on the described metallic conduction sheet.
Aforesaid a kind of circuit substrate that is used for LED is characterized in that being connected with radiator in described through hole bottom.
Aforesaid a kind of circuit substrate that is used for LED is characterized in that described radiator is a cylindrical radiator, is provided with a cavity in described cylindrical radiator, is provided with heat-conducting liquid in described cavity.
Aforesaid a kind of circuit substrate that is used for LED is characterized in that described insulating body is the conventional ceramic insulating body.
Aforesaid a kind of circuit substrate that is used for LED is characterized in that described insulating body is a special cermacis.
Aforesaid a kind of circuit substrate that is used for LED is characterized in that described special cermacis is an aluminium nitride ceramics.
Aforesaid a kind of circuit substrate that is used for LED is characterized in that described special cermacis is an aluminium oxide ceramics.
In sum, the utility model with respect to its beneficial effect of prior art is:
Offer wire casing in the utility model on insulating body, and by adhesive glue the metallic conduction sheet is bonded in the described wire casing, the electrode of LED is welded on the metallic conduction sheet, and is simple in structure, easy to process, energy-conserving and environment-protective.
Description of drawings
Fig. 1 is a schematic diagram of the present utility model;
Fig. 2 is the generalized section of A-A among Fig. 1;
Fig. 3 is a user mode generalized section of the present utility model.
Embodiment
Below in conjunction with description of drawings and embodiment the utility model is further described:
A kind of circuit substrate that is used for LED as illustrated in fig. 1 and 2 comprises insulating body 1, and described insulating body 1 can be made by ceramic material or special ceramic material, and wherein said special ceramic material can be aluminium nitride ceramics or aluminium oxide ceramics.On described insulating body 1, be provided with a plurality of wire casings 2, in described wire casing 2, be provided with adhesive glue 3, pressing has metallic conduction sheet 4 on described adhesive glue 3, is provided with the through hole 5 that is used to install LED7 on described insulating body 1, and the electrode 8 of LED7 is welded on the described metallic conduction sheet 4.
As shown in Figure 3, be connected with radiator 6 in described through hole 5 bottoms in the utility model.Described radiator 6 is a cylindrical radiator, is provided with a cavity 61 in described cylindrical radiator, is provided with heat-conducting liquid 62 in described cavity 61.
First kind of execution mode of the circuit substrate of the LED described in the utility model as illustrated in fig. 1 and 2, coated adhesive glue on the wire casing of conventional ceramic of making or special cermacis substrate, the metallic conduction sheet is ridden on the described adhesive glue.
Second kind of execution mode of the circuit substrate of the LED described in the utility model as illustrated in fig. 1 and 2, is glued at the metallic conduction sheet on the living embryo of conventional ceramic or special cermacis, and be by high temperature sintering, one-body molded.
Claims (7)
1. circuit substrate that is used for LED, it is characterized in that: comprise insulating body (1), on described insulating body (1), be provided with a plurality of wire casings (2), in described wire casing (2), be provided with adhesive glue (3), go up pressing at described adhesive glue (3) metallic conduction sheet (4) is arranged, be provided with the through hole (5) that is used to install LED on described insulating body (1), the electrode (8) of LED (7) is welded on the described metallic conduction sheet (4).
2. a kind of circuit substrate that is used for LED according to claim 1 is characterized in that being connected with radiator (6) in described through hole (5) bottom.
3. a kind of circuit substrate that is used for LED according to claim 2 is characterized in that described radiator (6) is a cylindrical radiator, is provided with a cavity (61) in described cylindrical radiator, is provided with heat-conducting liquid (62) in described cavity (61).
4. a kind of circuit substrate that is used for LED according to claim 1 is characterized in that described insulating body (1) is the conventional ceramic insulating body.
5. a kind of circuit substrate that is used for LED according to claim 1 is characterized in that described insulating body (1) is a special cermacis.
6. a kind of circuit substrate that is used for LED according to claim 5 is characterized in that described special cermacis is an aluminium nitride ceramics.
7. a kind of circuit substrate that is used for LED according to claim 5 is characterized in that described special cermacis is an aluminium oxide ceramics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205540573U CN201829533U (en) | 2010-09-27 | 2010-09-27 | Circuit board for LED (Light-Emitting Diode) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205540573U CN201829533U (en) | 2010-09-27 | 2010-09-27 | Circuit board for LED (Light-Emitting Diode) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201829533U true CN201829533U (en) | 2011-05-11 |
Family
ID=43968051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205540573U Expired - Fee Related CN201829533U (en) | 2010-09-27 | 2010-09-27 | Circuit board for LED (Light-Emitting Diode) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201829533U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014194498A1 (en) * | 2013-06-05 | 2014-12-11 | 福建永德吉灯业股份有限公司 | Led lamp with highly efficient heat dissipation structure and manufacturing method therefor |
-
2010
- 2010-09-27 CN CN2010205540573U patent/CN201829533U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014194498A1 (en) * | 2013-06-05 | 2014-12-11 | 福建永德吉灯业股份有限公司 | Led lamp with highly efficient heat dissipation structure and manufacturing method therefor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110511 Termination date: 20120927 |