CN205640308U

CN205640308U - Powerful LED base plate of on -plane surface wide -angle and LED lamp

Info

Publication number: CN205640308U
Application number: CN201620231086.3U
Authority: CN
Inventors: 黄仁民
Original assignee: Individual
Current assignee: Individual
Priority date: 2016-03-24
Filing date: 2016-03-24
Publication date: 2016-10-12
Anticipated expiration: 2026-03-24

Abstract

The utility model relates to a good heat dissipation in LED lamp field, the powerful LED base plate of on -plane surface wide -angle and LED lamp that the angle is wide. The utility model provides a powerful LED base plate of on -plane surface wide -angle, include: basement, insulating layer and electronic circuit layer, this basement are non planar formation, the surface in this basement is laid to the insulating layer, the electronic circuit layer sets up on the insulating layer surface. Set up the electronic circuit layer in nonplanar basement, put the LED lamp -hour into production, can be directly with LED chip package on this electronic circuit layer, save the encapsulation flow of LED lamp pearl, save the cost, nonplanar structure makes the LED luminous angle of encapsulation on this base plate big, and simultaneously, nonplanar structure makes this base plate big with the area of contact of air, and has seted up the louvre, and its radiating effect is good, is particularly useful for in the powerful LED lamp. It has characteristics such as good heat dissipation, angle guangZhou.

Description

A kind of on-plane surface wide-angle high-power LED substrate and LED

Technical field

This utility model relates to the on-plane surface wide-angle that a kind of thermal diffusivity is good, angle is wide in LED field High-power LED substrate and LED.

Background technology

In existing LED, substrate is planar substrates, and LED lamp bead is arranged on planar substrates, its Angular is limited, to this end, the Chinese utility model patent of Application No.: CN201320114878U discloses one Plant LED, polylith planar substrates is assembled on pedestal the light-emitting area forming a column, to strengthen lighting angle, But this patent documentation adds packaging technology, increasing cost, planar substrates is arranged on pedestal, its radiating effect Difference, need to additionally increase heat abstractor, i.e. add production cost, increase again the weight of LED.Further, Shen Please number be: CN201420775955 discloses a kind of high-efficiency and energy-saving type LED, and described LED includes: lamp Cover, spherical substrate, described spherical substrate is arranged in lampshade, even away from being provided with several on described spherical substrate Identical LED lamp source.LED lamp source is arranged on spherical substrate by this patent documentation, to reach lighting angle Big effect, but LED lamp source be packaged after be inserted on spherical substrate, also cannot save encapsulation step, It is unable to reach real cost degradation.

Utility model content

To this end, this utility model need the problem solved be to provide a kind of thermal diffusivity is good, angle is wide substrate and LED.

For solving the problems referred to above, a kind of on-plane surface wide-angle high-power LED substrate that this utility model provides, Including: substrate, insulating barrier and electronic circuit layer, this substrate is nonplanar structure, and described insulating barrier is laid on The surface of this substrate, described electronic circuit layer is arranged on surface of insulating layer.

A kind of preferred version of the present utility model, this substrate material is aluminum, copper, ferrum, pottery, graphite or leads Thermoplastic materials.

Another kind of preferred version of the present utility model, the structure of described substrate is a hollow ball build.

Another kind of preferred version of the present utility model, the structure of described substrate is that hollow is tapered or column type.

Another kind of preferred version of the present utility model, described substrate is provided with louvre.

Another kind of preferred version of the present utility model, the material of described electronic circuit layer is copper or electrically conductive ink.

This utility model also provides for a kind of LED, including: lamp holder, shell, driving power supply, substrate and many Individual LED chip, described lamp holder is arranged on shell, and this substrate is the big merit of on-plane surface wide-angle described above The LED-baseplate of rate, described substrate is arranged on shell, LED chip be encapsulated in substrate and with on this substrate Electronic circuit electrically connects, and described lamp holder, driving power supply and substrate sequentially form electrical connection.

A kind of preferred version of the present utility model, also includes that diffuser, described diffuser are arranged on substrate surface And cover LED chip.

The technical scheme provided by this utility model, is had the advantages that

Nonplanar substrate arranges electronic circuit layer, when producing LED, can be directly by LED chip It is encapsulated on this electronic circuit layer, saves the encapsulation flow process of LED lamp bead, cost-effective；Nonplanar structure Making encapsulation LED light source lighting angle on the substrate big, meanwhile, nonplanar structure makes this substrate with empty The contact area of gas is big, and offers louvre, and its good heat dissipation effect is particularly suited for high-power LED In lamp.It has the features such as thermal diffusivity is good, angle is wide.

Accompanying drawing explanation

Fig. 1 show the schematic appearance of a kind of substrate that this utility model provides；

Fig. 2 show a kind of substrate cross section structure schematic diagram that this utility model provides；

Fig. 3 show a kind of LED schematic appearance one that this utility model provides；

Fig. 4 show a kind of LED schematic appearance two that this utility model provides.

Detailed description of the invention

For further illustrating each embodiment, this utility model is provided with accompanying drawing.These accompanying drawings are this utility model A part for disclosure, it is mainly in order to illustrate embodiment, and the associated description of description can be coordinated to solve Release the operation principles of embodiment.Coordinating with reference to these contents, those of ordinary skill in the art will be understood that other Possible embodiment and advantage of the present utility model.Assembly in figure is not necessarily to scale, and is similar to Element numbers be conventionally used to indicate similar assembly.

Shown in reference Fig. 1, Fig. 2, a kind of substrate 10 in LED provided for this utility model, Including: the substrate 101 of aluminium material, insulating barrier 102 and electronic circuit layer 103, the structure of substrate 101 is one Hollow ball build, substrate 101 is provided with multiple louvre 104, and it is topmost provided with for the shell with LED even The joint 105 connect, insulating barrier 102 is laid on the surface of substrate 101, and electronic circuit layer 103 is arranged on insulation The surface of layer 102.

In the present embodiment, the material of substrate 101 is aluminum, has the features such as good, the good stability of thermal diffusivity, In other embodiments, its material can be the Heat Conduction Materials such as copper, ferrum, pottery, graphite or heat-conducting plastic.

In the present embodiment, the structure of substrate 101 is a hollow ball build, and ball-shape structural table area is big, with Air contact area increases, and increases heat radiation.In other embodiments, its substrate can also be the triangle of hollow Tapered, columnar structures or other irregular nonplanar structures etc..

In the present embodiment, arranging louvre 104 in substrate 101, air passes through louvre 104 at ball-shape Substrate 101 surfaces externally and internally carries out convection current, strengthens radiating effect.

In the present embodiment, the purpose of insulating barrier 102 be to stop aluminum matter substrate 101 and electronic circuit 103 it Between contact, its material can be aluminium oxide or other isolation material.

In the present embodiment, the preparation method of the electronic circuit layer 103 in this substrate 10 can be at insulating barrier 102 On by plating layer of metal layers of copper, then by development, etching by the way of prepare electronic circuit layer 103, In other embodiments, it is also possible to plating layers of copper by the way of electroless copper, then by development, etching Mode prepares electronic circuit layer 103.Or the mode such as printing conductive inks realizes on insulating barrier 102.With Upper type is prior art, does not launches to describe to it at this.

With reference to shown in Fig. 3, for aforesaid substrate 10 is fabricated to LED schematic appearance, including: lamp holder 20, Shell 30, driving power supply (not shown), substrate 10 and multiple LED chip 40, outside lamp holder 20 is arranged on On shell 30, the joint of substrate 10 is connected with the shell 30 of this LED, LED chip 40 is directly encapsulated On the electronic circuit layer 103 of substrate 10, and form electrical connection therewith, lamp holder 20, driving power supply and substrate 10 sequentially form electrical connection.

With reference to shown in Fig. 4, the light for preventing LED chip from sending is the most dazzling, in LED chip in figure 3 Surface is respectively equipped with diffuser 50, and diffuser 50 is arranged on substrate 10 surface and covers LED chip.

The technical scheme provided by this utility model, arranges electronic circuit layer in nonplanar substrate 101 103, when producing LED, directly LED chip can be encapsulated on this electronic circuit layer 103, save LED The encapsulation flow process of lamp bead, cost-effective；Nonplanar structure makes the LED light source being encapsulated on this substrate 10 send out Angular is big, and meanwhile, nonplanar structure makes this substrate 10 big with the contact area of air, and offers scattered Hot hole, its good heat dissipation effect, it is particularly suited in high-power LED lamp.It has, and thermal diffusivity is good, angle The feature such as wide.Along with improving constantly of production automation technology, the LED heat radiation substrate of on-plane surface multidimensional Radix Rumicis Conductor layouts manufacture become a reality, substantially increase living standard and the market competitiveness.

Although specifically show and describe this utility model in conjunction with preferred embodiment, but the technology of art Personnel should be understood that in the spirit and scope of the present utility model limited without departing from appended claims, This utility model can be made a variety of changes in the form and details, be protection model of the present utility model Enclose.

Claims

1. an on-plane surface wide-angle high-power LED substrate, it is characterised in that including: substrate, insulation Layer and electronic circuit layer, this substrate is nonplanar structure, and described insulating barrier is laid on the surface of this substrate, institute State electronic circuit layer and be arranged on surface of insulating layer.

On-plane surface wide-angle high-power LED substrate the most according to claim 1, it is characterised in that: This substrate material is aluminum, copper, ferrum, pottery, graphite or heat-conducting plastic.

On-plane surface wide-angle high-power LED substrate the most according to claim 1, it is characterised in that: The structure of described substrate is a hollow ball build.

On-plane surface wide-angle high-power LED substrate the most according to claim 1, it is characterised in that: The structure of described substrate is that hollow is tapered or column type.

On-plane surface wide-angle high-power LED substrate the most according to claim 1, it is characterised in that: Described substrate is provided with louvre.

On-plane surface wide-angle high-power LED substrate the most according to claim 1, it is characterised in that: The material of described electronic circuit layer is copper or electrically conductive ink.

7. a LED, including: lamp holder, shell, driving power supply, substrate and multiple LED chip, institute State lamp holder to be arranged on shell, it is characterised in that this substrate is that the claims 1-6 are arbitrary described non- Planar big-angle high-power LED substrate, described substrate is arranged on shell, and LED chip is encapsulated on substrate And electrically connect with the electronic circuit on this substrate, described lamp holder, driving power supply and substrate sequentially form electrical connection.

LED the most according to claim 7, it is characterised in that: also include diffuser, described printing opacity Cover is arranged on substrate surface and covers LED chip.