WO2013131463A1 - Three-dimensional metal-based pcb circuit board assembly structure, corresponding light-emitting lamp and manufacturing method - Google Patents

Three-dimensional metal-based pcb circuit board assembly structure, corresponding light-emitting lamp and manufacturing method Download PDF

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Publication number
WO2013131463A1
WO2013131463A1 PCT/CN2013/072156 CN2013072156W WO2013131463A1 WO 2013131463 A1 WO2013131463 A1 WO 2013131463A1 CN 2013072156 W CN2013072156 W CN 2013072156W WO 2013131463 A1 WO2013131463 A1 WO 2013131463A1
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WO
WIPO (PCT)
Prior art keywords
metal
circuit board
pcb circuit
light
board assembly
Prior art date
Application number
PCT/CN2013/072156
Other languages
French (fr)
Chinese (zh)
Inventor
蔡子丰
Original Assignee
Cai Zifeng
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Filing date
Publication date
Application filed by Cai Zifeng filed Critical Cai Zifeng
Publication of WO2013131463A1 publication Critical patent/WO2013131463A1/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90Methods of manufacture
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0284Details of three-dimensional rigid printed circuit boards
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/10Light sources with three-dimensionally disposed light-generating elements on concave supports or substrates, e.g. on the inner side of bowl-shaped supports
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/20Light sources with three-dimensionally disposed light-generating elements on convex supports or substrates, e.g. on the outer surface of spheres
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0323Working metal substrate or core, e.g. by etching, deforming
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302Bending a rigid substrate; Breaking rigid substrates by bending

Definitions

  • Three-dimensional metal-based PCB circuit board assembly structure corresponding illuminating luminaire and manufacturing method thereof
  • the invention relates to the field of illuminating illumination, in particular to the field of illuminating lighting equipment and structure technology, and in particular to a three-dimensional metal-based PCB circuit board assembly structure, a corresponding illuminating luminaire and a manufacturing method thereof.
  • Background technique
  • lighting devices With the continuous advancement of human civilization and the continuous development of science and technology, lighting devices have long been widely known.
  • such lighting devices include a housing and a lighting component disposed within the housing.
  • LEDs have been able to provide enough light energy for lighting purposes.
  • incandescent and halogen lamps have been used in order to reduce the energy consumption of lighting and reduce carbon dioxide emissions.
  • LED light sources have been It is the trend of the times that consumers need products that can achieve the light output of incandescent or halogen lamps, have lower energy consumption and longer service life, and are cheaper.
  • many different LED products are already on the market, most of them are too expensive for the average consumer, and the initiatives and original intentions of reducing energy consumption have not achieved the desired results.
  • LEDs need to work within a certain temperature range in order to have reasonable performance and service life. Due to the compact structure, especially the illuminating device is received in the housing, the following disadvantages exist:
  • the illuminating equipment itself consumes electric energy, and the efficiency of electro-optical conversion is not 100%. Some of the heat is always generated. Since the inside of the casing is mostly sealed, heat cannot be released in time.
  • the object of the present invention is to overcome the above-mentioned shortcomings in the prior art, and to provide a multi-directional illumination on a single metal-based PCB circuit board, effectively increase the heat transfer area, and the structure is simple and convenient to process, and is convenient and quick to process. Large-scale mechanized production, low cost, stable and reliable performance, wide application range of three-dimensional metal-based PCB circuit board assembly structure, corresponding lighting fixtures and manufacturing methods.
  • the three-dimensional metal-based PCB circuit board assembly structure, the corresponding illuminating luminaire and the manufacturing method of the present invention are as follows:
  • the main feature of the three-dimensional metal-based PCB circuit board assembly structure in the illuminating lamp is that the component structure is composed of a single continuous metal-based circuit board and a plurality of illuminating elements disposed on the surface of the metal-based circuit board.
  • Each of the light-emitting elements is electrically connected to the metal-based circuit board, and the portions of the metal-based circuit board having the light-emitting elements are not on the same plane or the same continuous curved surface, and the metal-based circuit board has a three-dimensional shape structure.
  • the metal-based circuit board in the three-dimensional metal-based PCB circuit board assembly structure of the light-emitting fixture includes:
  • each part having the light-emitting element is on the same plane or the same continuous curved surface; or each part having the light-emitting element is not in the same plane or the same continuous curved surface;
  • each part of the metal-based circuit sub-block having the light-emitting element is on the same plane or the same continuous curved surface; or the metal-based circuit
  • the portions of the panel having the illuminating elements are not in the same plane or on the same continuous curved surface;
  • the respective portions of the metal-based circuit sub-block having the light-emitting elements are not in the same plane or the same continuous curved surface as the respective portions of the metal-based circuit master block having the light-emitting elements.
  • the metal-based circuit board in the three-dimensional metal-based PCB circuit board assembly structure of the light-emitting fixture is a three-dimensional structure formed by one or more continuous planes or curved surfaces.
  • the projection area of the metal-based circuit board in the three-dimensional metal-based PCB circuit board assembly structure of the light-emitting fixture in the mounting direction of the heat sink attached to the lower surface of the metal-based circuit board is smaller than the metal-based circuit board and the heat sink Contact area.
  • the shape of the three-dimensional structure of the metal-based circuit board in the three-dimensional metal-based PCB circuit board assembly structure in the light-emitting fixture matches the shape of the heat sink to which the lower surface of the metal-based circuit board is attached.
  • the metal-based circuit board in the three-dimensional metal-based PCB circuit board assembly structure of the light-emitting lamp has a three-dimensional structure of a regular polyhedron, an irregular polyhedron, a concave body, a convex body, a conical body, a composite conical body, and a square cone. , compound square cone, polygonal cone, composite polygonal cone, free plane, symmetrically bent structure, asymmetrically bent structure or a combination of the above various structures.
  • the free facet in the three-dimensional metal-based PCB circuit board assembly structure of the illuminating luminaire is a non-uniform rational B-spline NURBS facet.
  • the light-emitting element in the three-dimensional metal-based PCB circuit board assembly structure of the light-emitting fixture is a light-emitting diode LED.
  • the light-emitting component in the three-dimensional metal-based PCB circuit board assembly structure of the light-emitting fixture is a patch LED, and the patch LED is attached to the surface of the metal-based circuit board.
  • Each of the patch LEDs in the three-dimensional metal-based PCB circuit board assembly structure of the illuminating lamp is evenly distributed on the surface of the metal-based circuit board.
  • the main feature of the illuminating lamp having the above-mentioned component structure is that the illuminating lamp further comprises a heat sink body, and the heat sink body is fixedly provided with one or more metal-based PCB circuit boards.
  • the component structure, the metal-based circuit board in the metal-based PCB circuit board assembly structure is electrically connected to the main body phase, and the metal-based PCB circuit board is matched with the surface of the heat sink main body.
  • the main feature is that the method comprises the following steps:
  • the method for manufacturing a three-dimensional metal-based PCB circuit board assembly structure in the illuminating lamp performs heat conduction layer formation and illuminating element coating processing on the surface of the planar metal-based PCB circuit board, and includes the following steps:
  • a light-emitting element is attached to the upper surface of the planar metal-based PCB circuit board, and circuit soldering is performed.
  • the circuit soldering process in the manufacturing method of the three-dimensional metal-based PCB circuit board assembly structure in the illuminating lamp is a planar reflow soldering process.
  • the manufacturing method of the metal-based PCB circuit board assembly structure in the illuminating lamp further comprises the following steps:
  • the three-dimensional metal-based PCB circuit board assembly structure, the corresponding illuminating luminaire and the manufacturing method thereof are used. Since a single metal-based circuit board is used, the illuminating diode is first attached to the flat pre-prepared by conventional techniques. Molding On the metal-based circuit board, the metal-based circuit board is molded into a desired three-dimensional structure by a suitable deformation process, thereby realizing multi-directional illumination using only a single metal-based PCB circuit board.
  • FIG. 1 is a schematic view showing the structure of a metal-based PCB circuit board assembly in the illuminating lamp of the present invention.
  • 2 to 4 are schematic views showing the manufacturing process of the metal-based PCB circuit board assembly structure in the illuminating lamp of the present invention.
  • 5 to 8 are schematic views showing various three-dimensional structures of the metal-based circuit board of the present invention. detailed description
  • a three-dimensional metal-based PCB circuit board assembly structure in the light-emitting fixture wherein the component structure comprises a single continuous metal-based circuit board 1 and a number disposed on an upper surface of the metal-based circuit board 1
  • the metal-based circuit board 1 has the light-emitting elements 2 not in the same plane or on the same continuous curved surface.
  • the metal base circuit board 1 has a three-dimensional structure.
  • the metal base circuit board comprises:
  • a metal-based circuit master block 11 in which the respective portions having the light-emitting elements 2 may be on the same plane or the same continuous curved surface; or the respective portions having the light-emitting elements are not on the same plane or the same continuous curved surface;
  • a metal-based circuit sub-block 12 integrally formed with the metal-based circuit master block 11, and the portions of the metal-based circuit sub-block 12 having the light-emitting elements 2 may be in the same plane or the same continuous curved surface. Or the respective portions of the metal-based circuit sub-block having the light-emitting elements are not on the same plane or the same continuous curved surface; and at the same time, the respective portions of the metal-based circuit sub-block having the light-emitting elements and the metal-based circuit The portions of the master block having the light-emitting elements are not on the same plane or on the same continuous curved surface.
  • the metal-based circuit board is a three-dimensional structure formed by one or more continuous planes or curved surfaces, the metal
  • the projection area of the base board in the mounting direction of the heat sink attached to the lower surface of the metal base circuit board is smaller than the contact area of the metal base circuit board and the heat sink, that is, the metal base circuit board is in the mounting direction.
  • Any projection size is smaller than the projection size of the planar metal-based circuit board before forming, and the shape of the three-dimensional structure of the metal-based circuit board is matched with the heat sink 3 of the lower surface of the metal-based circuit board. The shapes match.
  • the three-dimensional structure of the metal-based circuit board may be a regular polyhedron, an irregular polyhedron, a concave body, a convex body, a conical body, a composite conical body, a square cone, a compound square cone, a polygonal cone, A composite polygonal cone, a free plane, a symmetrically bent structure, an asymmetrically bent structure or a combination of the above plurality of structures, wherein the free face is a non-uniform rational B-spline NURBS facet.
  • a metal-based PCB circuit board assembly structure in the illuminating lamp of the present invention has an "S"-shaped undulating line shape which cannot be formed by splicing a plurality of flat PCB boards.
  • the three-dimensional structure that can be realized by the metal-based circuit board 1 in the metal-based PCB circuit board assembly structure of the light-emitting lamp comprises a linear overlapping structure, a nonlinear overlapping structure, a symmetric bending structure, An asymmetrically bent structure, an irregularly bent structure, or a combination of the above various structures.
  • the light-emitting element 2 is generally a light-emitting diode LED, and the light-emitting diode LED is used in order to increase the integration degree of the light-emitting lamp as much as possible, reduce the volume and be easy to install.
  • the chip light emitting diode LED is attached to the surface of the metal base circuit board.
  • the respective splicing LEDs can be evenly distributed on the surface of the metal-based circuit board.
  • the illuminating lamp having the above-mentioned component structure, wherein the illuminating lamp further includes a heat sink body, and the heat sink body is fixedly provided with one or more of the above-mentioned a metal-based PCB circuit board assembly structure, wherein the metal-based circuit board in the metal-based PCB circuit board assembly structure is electrically connected to the heat sink body, and the metal-based PCB circuit board is matched with the surface of the heat sink body Hehe.
  • the main body of the illuminating lamp is further provided with a transparent casing or a translucent casing, and the transparent casing or the semi-transparent casing surrounds the metal-based PCB circuit board assembly structure.
  • the manufacturing method of the three-dimensional metal-based PCB circuit board assembly structure in the above-mentioned illuminating lamp comprises the following steps:
  • FIGs. 5 to 8 Other various three-dimensional three-dimensional structure wheel corridors that can be formed by this method are shown in Figs. 5 to 8.
  • the PCB circuit board of the present invention may be a single layer or a plurality of layers, and at the same time, there is no limitation on the wiring of the circuit, and the dent and the elongated through hole may be provided at the deformed bending connection portion of the circuit board.
  • the dent and the elongated through hole may be provided at the deformed bending connection portion of the circuit board.
  • the present invention enables a three-dimensional configuration using only a single metal-based PCB circuit board, thereby enabling multi-directional illumination without any additional optical aids. Moreover, the corresponding metal-based PCB circuit board is sufficient as a key element of multi-directional illumination. In the assembly process, no additional assembly process is required, and only the light-emitting lamp is installed and then locked.
  • each metal PCB circuit board may be a linear overlap, a nonlinear overlap, a symmetric bend structure, an asymmetric bend structure, a complicated irregular random fold type or a combination of the above forms, and the specific examples are as follows :
  • NURBS Non Uniform Rational B-Spline
  • the manufacturing process of the metal PCB circuit board assembly structure of the present invention is as follows:
  • the above process has no special requirements for the material of the metal-based PCB circuit board, and the known bending method for the metal-based PCB circuit board can be applied to the deformation bending process in the step (3).
  • the specific process for how to bend the metal-based PCB circuit board is not necessarily described in detail in the present invention.
  • the above three-dimensional metal-based PCB circuit board assembly structure, corresponding illuminating luminaire and manufacturing method are used. Since a single metal-based circuit board is used, the illuminating diode is first attached to a flat preform by conventional techniques. The metal-based circuit board, and then using a suitable deformation process to form the metal-based circuit board into a desired three-dimensional structure, thereby achieving multi-directional illumination using only a single metal-based PCB circuit board, not only in The same heat sink provides a larger surface area on the limited projected area, enabling LED surface mount on a larger PCB area, larger thermal conduction contact surfaces, and a single module assembly for a single-use, automated SMT process.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

A three-dimensional metal-based PCB circuit board assembly structure in a light-emitting lamp, a light-emitting lamp having the assembly structure, and manufacturing method thereof, the three-dimensional metal-based PCB circuit board assembly structure consisting of a single continuous metal-based circuit board (1) and a plurality of light-emitting elements (2) disposed on the upper surface of the metal-based circuit board (1); each of the light-emitting elements (2) is connected to the metal-based circuit board (1) via a circuit; the parts on the metal-based circuit board(1) having the light-emitting elements (2) are not on the same plane or curved surface; and the metal-based circuit board (1) has a three-dimensional solid structure. The three-dimensional metal-based PCB circuit board assembly structure, the corresponding light-emitting lamp and the manufacturing method, have a large heat conduction contact surface, a simple and practical single modularized assembly structure, a simplified process, simple and quick processing, large scale mechanical production, low cost, high circuit reliability, stable and reliable performance, firmness and durability, thus improving mounting stability and mechanical strength of the circuit board assembly, being unlikely to deform, and having a wide range of application.

Description

三维金属基 PCB电路板组件结构、 相应的发光灯具及制造方法 技术领域  Three-dimensional metal-based PCB circuit board assembly structure, corresponding illuminating luminaire and manufacturing method thereof
本发明涉及发光照明领域, 特别涉及发光照明器材及结构技术领域, 具体是指一种三维 金属基 PCB电路板组件结构、 相应的发光灯具及制造方法。 背景技术  The invention relates to the field of illuminating illumination, in particular to the field of illuminating lighting equipment and structure technology, and in particular to a three-dimensional metal-based PCB circuit board assembly structure, a corresponding illuminating luminaire and a manufacturing method thereof. Background technique
随着人类文明的不断进步以及科学技术的不断发展, 照明装置早已广为人知。 总的说来, 这类照明装置包括壳体和设置在所述壳体内的发光部件。  With the continuous advancement of human civilization and the continuous development of science and technology, lighting devices have long been widely known. In general, such lighting devices include a housing and a lighting component disposed within the housing.
随着技术的进步, LED已经能够提供足够的光能用于照明用途, 为了减少照明的能源消 耗, 减少二氧化碳的排放, 为推动替代光源市场的不断前进, 用 LED光源取代白炽灯和卤素 灯已经是大势所趋, 消费者所需要的是能够达到白炽灯或卤素灯的光量输出、 同时具有更低 的能耗和更长的使用寿命、物美价廉的产品。虽然市场上已经有许多不同的 LED产品在推出, 但其中大多数对一般消费者来说太过于昂贵, 而且产品降低能耗的倡议和初衷并没有达到预 期效果。  With the advancement of technology, LEDs have been able to provide enough light energy for lighting purposes. In order to reduce the energy consumption of lighting and reduce carbon dioxide emissions, in order to promote the continuous advancement of the alternative light source market, replacing incandescent and halogen lamps with LED light sources has been It is the trend of the times that consumers need products that can achieve the light output of incandescent or halogen lamps, have lower energy consumption and longer service life, and are cheaper. Although many different LED products are already on the market, most of them are too expensive for the average consumer, and the initiatives and original intentions of reducing energy consumption have not achieved the desired results.
但是, LED需要在一定的温度范围内工作才能有合理的性能和使用寿命, 由于结构紧凑, 尤其发光器材被接纳于壳体内, 因此存在以下缺点:  However, LEDs need to work within a certain temperature range in order to have reasonable performance and service life. Due to the compact structure, especially the illuminating device is received in the housing, the following disadvantages exist:
发光器材本身消耗电能, 而且电光转换的效率不会是 100 % , 总会有一部分变成热能产 生出来, 由于壳体内部大多为密封状态, 热量无法及时散发出来。  The illuminating equipment itself consumes electric energy, and the efficiency of electro-optical conversion is not 100%. Some of the heat is always generated. Since the inside of the casing is mostly sealed, heat cannot be released in time.
因此, 整个灯的散热问题一直是技术上的瓶颈, 而现有技术中为了能够获得更好的导热 和散热效果, 很多 LED灯都应用了金属基作为 PCB电路板的基底, 而对于众多的发光灯具 产品来说,发光二极管 LED通常都是通过自动化表面贴覆设备贴覆于金属基 PCB( MC-PCB ) 电路板上的,因此在表面贴覆工艺中,必须确保金属基 PCB电路板为同一个平面的(平坦的), 这就是为什么现有技术中绝大多数的 LED发光灯具中必须将 LED元件贴覆于平坦的 PCB电 路板表面,或者需要釆用复杂的方法将多个独立的平坦的 PCB电路板组装在一起成为三维结 构形式才能达到多方位或全方位照明效果的原因。  Therefore, the heat dissipation problem of the entire lamp has always been a technical bottleneck. In the prior art, in order to obtain better heat conduction and heat dissipation effects, many LED lamps use a metal base as a substrate for a PCB circuit board, and for many light sources. For luminaire products, LEDs are usually mounted on metal-based PCB (MC-PCB) boards by automated surface mount equipment. Therefore, in the surface mount process, metal-based PCB boards must be the same. A flat (flat), which is why most of the LED luminaires in the prior art must be attached to the surface of a flat PCB board, or a complex method is required to flatten multiple independent flats. The PCB boards are assembled together into a three-dimensional structure to achieve multi-directional or omnidirectional illumination.
同时, 在现有技术中, 有一种在 LED发光灯具中使用柔性可弯折的 PCB电路板的技术 方案, 这样虽然可以达到多个方向的照明的特点, 但是由于柔性 PCB电路板大多具有弹性和 韧性, 但缺乏必要的刚度和强度, 弯折后必须给予必要的约束方可定型, 因此无法实现复杂 的自由造型形状, 而且无法提供较大的热负荷能力, 这样就大大限制了发光灯具的设计和制 造, 无法实现低成本的全方位照明。 发明内容 Meanwhile, in the prior art, there is a technical solution for using a flexible bendable PCB circuit board in an LED lighting fixture, so that although the characteristics of illumination in multiple directions can be achieved, since the flexible PCB circuit board is mostly flexible and Resilience, but lacks the necessary rigidity and strength, must be given the necessary constraints after bending, so it can not achieve complex free-form shape, and can not provide greater thermal load capacity, which greatly limits the design of illuminating lamps And manufacturing, can not achieve low-cost all-round lighting. Summary of the invention
本发明的目的是克服了上述现有技术中的缺点,提供一种能够在单一的金属基 PCB电路 板上实现多方向照明、 有效增大传热面积、 结构筒单实用、 加工方便快捷、 利于大批量机械 化生产、 成本低廉、 性能稳定可靠、 适用范围较为广泛的三维金属基 PCB电路板组件结构、 相应的发光灯具及制造方法。  The object of the present invention is to overcome the above-mentioned shortcomings in the prior art, and to provide a multi-directional illumination on a single metal-based PCB circuit board, effectively increase the heat transfer area, and the structure is simple and convenient to process, and is convenient and quick to process. Large-scale mechanized production, low cost, stable and reliable performance, wide application range of three-dimensional metal-based PCB circuit board assembly structure, corresponding lighting fixtures and manufacturing methods.
为了实现上述的目的, 本发明的三维金属基 PCB电路板组件结构、 相应的发光灯具及制 造方法如下:  In order to achieve the above object, the three-dimensional metal-based PCB circuit board assembly structure, the corresponding illuminating luminaire and the manufacturing method of the present invention are as follows:
该发光灯具中的三维金属基 PCB电路板组件结构, 其主要特点是, 所述的组件结构由单 一连续的金属基电路板和设置于该金属基电路板上表面的数个发光元件组成, 所述的各个发 光元件均与该金属基电路板相电路连接, 该金属基电路板上具有发光元件的各个部分不处于 同一个平面或同一个连续曲面上, 且该金属基电路板具有三维立体型结构。  The main feature of the three-dimensional metal-based PCB circuit board assembly structure in the illuminating lamp is that the component structure is composed of a single continuous metal-based circuit board and a plurality of illuminating elements disposed on the surface of the metal-based circuit board. Each of the light-emitting elements is electrically connected to the metal-based circuit board, and the portions of the metal-based circuit board having the light-emitting elements are not on the same plane or the same continuous curved surface, and the metal-based circuit board has a three-dimensional shape structure.
该发光灯具中的三维金属基 PCB电路板组件结构中的金属基电路板包括:  The metal-based circuit board in the three-dimensional metal-based PCB circuit board assembly structure of the light-emitting fixture includes:
金属基电路母版块, 其中的具有发光元件的各个部分处于同一个平面或同一个连续曲面 上; 或者具有发光元件的各个部分不处于同一个平面或同一个连续曲面上;  a metal-based circuit master block, wherein each part having the light-emitting element is on the same plane or the same continuous curved surface; or each part having the light-emitting element is not in the same plane or the same continuous curved surface;
金属基电路子版块, 与所述的金属基电路母版块一体成型, 且该金属基电路子版块中的 具有发光元件的各个部分处于同一个平面或同一个连续曲面上; 或者该金属基电路子版块中 的具有发光元件的各个部分不处于同一个平面或同一个连续曲面上;  a metal-based circuit sub-block integrally formed with the metal-based circuit master block, and each part of the metal-based circuit sub-block having the light-emitting element is on the same plane or the same continuous curved surface; or the metal-based circuit The portions of the panel having the illuminating elements are not in the same plane or on the same continuous curved surface;
同时, 该金属基电路子版块中的具有发光元件的各个部分与该金属基电路母版块中的具 有发光元件的各个部分不处于同一个平面或同一个连续曲面上。  At the same time, the respective portions of the metal-based circuit sub-block having the light-emitting elements are not in the same plane or the same continuous curved surface as the respective portions of the metal-based circuit master block having the light-emitting elements.
该发光灯具中的三维金属基 PCB电路板组件结构中的金属基电路板为由一个或多个连续 平面或曲面所形成的三维立体型结构。  The metal-based circuit board in the three-dimensional metal-based PCB circuit board assembly structure of the light-emitting fixture is a three-dimensional structure formed by one or more continuous planes or curved surfaces.
该发光灯具中的三维金属基 PCB电路板组件结构中的金属基电路板在与该金属基电路板 的下表面所贴合的散热器的安装方向的投影面积小于该金属基电路板与散热器的接触面积。  The projection area of the metal-based circuit board in the three-dimensional metal-based PCB circuit board assembly structure of the light-emitting fixture in the mounting direction of the heat sink attached to the lower surface of the metal-based circuit board is smaller than the metal-based circuit board and the heat sink Contact area.
该发光灯具中的三维金属基 PCB电路板组件结构中的金属基电路板的三维立体型结构的 形状与该金属基电路板的下表面所贴合的散热器形状相匹配。  The shape of the three-dimensional structure of the metal-based circuit board in the three-dimensional metal-based PCB circuit board assembly structure in the light-emitting fixture matches the shape of the heat sink to which the lower surface of the metal-based circuit board is attached.
该发光灯具中的三维金属基 PCB电路板组件结构中的金属基电路板具有的三维立体型结 构可以为规则多面体、 不规则多面体、 凹面体、 凸面体、 圆锥形体、 复合圆锥形体、 方锥体, 复合方锥体、 多边锥体, 复合多边锥体、 自由面体、 对称弯折结构体、 非对称弯折结构体或 者以上多种结构体的组合。 该发光灯具中的三维金属基 PCB 电路板组件结构中的自由面体为非均匀有理 B 样条 NURBS面体。 The metal-based circuit board in the three-dimensional metal-based PCB circuit board assembly structure of the light-emitting lamp has a three-dimensional structure of a regular polyhedron, an irregular polyhedron, a concave body, a convex body, a conical body, a composite conical body, and a square cone. , compound square cone, polygonal cone, composite polygonal cone, free plane, symmetrically bent structure, asymmetrically bent structure or a combination of the above various structures. The free facet in the three-dimensional metal-based PCB circuit board assembly structure of the illuminating luminaire is a non-uniform rational B-spline NURBS facet.
该发光灯具中的三维金属基 PCB电路板组件结构中的发光元件为发光二极管 LED。 该发光灯具中的三维金属基 PCB电路板组件结构中的发光元件为贴片发光二极管 LED, 所述的贴片发光二极管 LED贴覆于所述的金属基电路板的表面。  The light-emitting element in the three-dimensional metal-based PCB circuit board assembly structure of the light-emitting fixture is a light-emitting diode LED. The light-emitting component in the three-dimensional metal-based PCB circuit board assembly structure of the light-emitting fixture is a patch LED, and the patch LED is attached to the surface of the metal-based circuit board.
该发光灯具中的三维金属基 PCB电路板组件结构中的各个贴片发光二极管 LED均匀分 布在所述的金属基电路板的表面。  Each of the patch LEDs in the three-dimensional metal-based PCB circuit board assembly structure of the illuminating lamp is evenly distributed on the surface of the metal-based circuit board.
该具有上述的组件结构的发光灯具, 其主要特点是, 所述的发光灯具还包括有散热器主 体, 所述的散热器主体上固定设置有一个或一个以上的所述的金属基 PCB电路板组件结构, 该金属基 PCB电路板组件结构中的金属基电路板与主体相电路连接, 且该金属基 PCB电路 板与所述的散热器主体的表面相匹配贴合。  The main feature of the illuminating lamp having the above-mentioned component structure is that the illuminating lamp further comprises a heat sink body, and the heat sink body is fixedly provided with one or more metal-based PCB circuit boards. The component structure, the metal-based circuit board in the metal-based PCB circuit board assembly structure is electrically connected to the main body phase, and the metal-based PCB circuit board is matched with the surface of the heat sink main body.
该上述的发光灯具中的三维金属基 PCB电路板组件结构的制造方法, 其主要特点是, 所 述的方法包括以下步骤:  In the above method for manufacturing a three-dimensional metal-based PCB circuit board assembly structure, the main feature is that the method comprises the following steps:
( 1 )根据设计好的形状制造出预成型的平面金属基 PCB电路板;  (1) manufacturing a pre-formed planar metal-based PCB circuit board according to the designed shape;
( 2 )在该平面金属基 PCB电路板的表面进行导热层形成和发光元件贴覆处理, 得到平 面金属基 PCB电路板组件;  (2) forming a heat conductive layer on the surface of the planar metal-based PCB circuit board and attaching the light-emitting element to obtain a planar metal-based PCB circuit board assembly;
( 3 )将所述的平面金属基 PCB电路板组件定位于散热器上;  (3) positioning the planar metal-based PCB circuit board assembly on the heat sink;
( 4 )对该平面金属基 PCB电路板组件进行变形加工, 形成具有与所述的散热器的接触 表面相匹配的三维立体型结构轮廊的金属基 PCB电路板组件。  (4) deforming the planar metal-based PCB circuit board assembly to form a metal-based PCB circuit board assembly having a three-dimensional structure structure wheel gallery matched with the contact surface of the heat sink.
该发光灯具中的三维金属基 PCB电路板组件结构的制造方法中的在平面金属基 PCB电 路板的表面进行导热层形成和发光元件贴覆处理, 包括以下步骤:  The method for manufacturing a three-dimensional metal-based PCB circuit board assembly structure in the illuminating lamp performs heat conduction layer formation and illuminating element coating processing on the surface of the planar metal-based PCB circuit board, and includes the following steps:
( 21 )在该平面金属基 PCB电路板与散热器相接触的下表面涂覆或夹覆导热粘胶层; (21) coating or sandwiching a thermal adhesive layer on a lower surface of the planar metal-based PCB circuit board in contact with the heat sink;
( 22 )在该平面金属基 PCB电路板的上表面贴覆发光元件, 并进行电路焊接。 (22) A light-emitting element is attached to the upper surface of the planar metal-based PCB circuit board, and circuit soldering is performed.
该发光灯具中的三维金属基 PCB电路板组件结构的制造方法中的电路焊接工艺为平面回 流焊工艺。  The circuit soldering process in the manufacturing method of the three-dimensional metal-based PCB circuit board assembly structure in the illuminating lamp is a planar reflow soldering process.
该发光灯具中的金属基 PCB电路板组件结构的制造方法中还包括以下步骤:  The manufacturing method of the metal-based PCB circuit board assembly structure in the illuminating lamp further comprises the following steps:
( 5 )将所述的金属基 PCB电路板组件机械固定设置, 且使得该金属基 PCB电路板组件 的下表面与所述的散热器的表面紧密接触。  (5) mechanically fixing the metal-based PCB circuit board assembly such that a lower surface of the metal-based PCB circuit board assembly is in close contact with a surface of the heat sink.
釆用了该发明的三维金属基 PCB电路板组件结构、 相应的发光灯具及制造方法, 由于其 中使用了单一的金属基电路板, 首先将发光二极管釆用常规的工艺手段贴覆于平坦的预成型 的金属基电路板上, 然后再釆用合适的变形加工工艺将该金属基电路板成型为所需要的三维 立体型结构, 从而仅利用单一的金属基 PCB电路板就实现了多方向照明, 不仅在相同散热器 的有限投影面积上提供了更大的表面积, 从而实现了更大 PCB 面积上的 LED 表面贴装, 热传导接触表面更大, 而且单一模块组件实现了结构筒单实用, 自动化 SMT 工艺, 无人为 加工错误, 筒化了工艺过程, 加工方便快捷, 利于大批量机械化生产, 成本低廉, 并能够形 成各种复杂的三维结构形状, 比如凸出的、 凹陷的、 球面的、 不规则外形的、 非线性交叠的 等等各种复杂形状, 电路可靠性高, 各个位置的 LED之间的温度差异较小, 性能稳定可靠, 坚固耐用, 提高了电路板组件的装配稳定性和机械强度, 不易形变, 适用范围较为广泛, 给 人们带来实惠的节能照明解决方案。 附图说明 The three-dimensional metal-based PCB circuit board assembly structure, the corresponding illuminating luminaire and the manufacturing method thereof are used. Since a single metal-based circuit board is used, the illuminating diode is first attached to the flat pre-prepared by conventional techniques. Molding On the metal-based circuit board, the metal-based circuit board is molded into a desired three-dimensional structure by a suitable deformation process, thereby realizing multi-directional illumination using only a single metal-based PCB circuit board. Provides a larger surface area over the limited projected area of the same heatsink, enabling LED surface mount on a larger PCB area, larger thermal conduction contact surfaces, and a single module assembly for structural simplicity, automated SMT process No one is processing error, the process is completed, the processing is convenient and fast, it is convenient for mass mechanized production, low cost, and can form various complicated three-dimensional structural shapes, such as convex, concave, spherical, irregular shape. Various complex shapes, non-linear overlap, high circuit reliability, small temperature difference between LEDs at various positions, stable and reliable performance, ruggedness, improved assembly stability and mechanical strength of circuit board components , not easy to deform, a wide range of applications, bringing affordable energy-saving lighting to people Decision program. DRAWINGS
图 1为本发明的发光灯具中的金属基 PCB电路板组件结构示意图。  1 is a schematic view showing the structure of a metal-based PCB circuit board assembly in the illuminating lamp of the present invention.
图 2至图 4为本发明的发光灯具中的金属基 PCB电路板组件结构的制造过程示意图。 图 5至图 8为本发明的金属基电路板的各种三维立体型结构轮廓示意图。 具体实施方式  2 to 4 are schematic views showing the manufacturing process of the metal-based PCB circuit board assembly structure in the illuminating lamp of the present invention. 5 to 8 are schematic views showing various three-dimensional structures of the metal-based circuit board of the present invention. detailed description
为了能够更清楚地理解本发明的技术内容, 特举以下实施例详细说明。  In order to more clearly understand the technical content of the present invention, the following embodiments are specifically described.
请参阅图 1所示, 该发光灯具中的三维金属基 PCB电路板组件结构, 其中, 所述的组件 结构由单一连续的金属基电路板 1和设置于该金属基电路板 1上表面的数个发光元件 2组成, 所述的各个发光元件 2均与该金属基电路板 1相电路连接, 该金属基电路板 1上具有发光元 件 2的各个部分不处于同一个平面或同一个连续曲面上, 且该金属基电路板 1具有三维立体 型结构。  Referring to FIG. 1 , a three-dimensional metal-based PCB circuit board assembly structure in the light-emitting fixture, wherein the component structure comprises a single continuous metal-based circuit board 1 and a number disposed on an upper surface of the metal-based circuit board 1 Each of the light-emitting elements 2 is electrically connected to the metal-based circuit board 1 , and the metal-based circuit board 1 has the light-emitting elements 2 not in the same plane or on the same continuous curved surface. And the metal base circuit board 1 has a three-dimensional structure.
其中, 该金属基电路板包括:  Wherein, the metal base circuit board comprises:
( 1 )金属基电路母版块 11 , 其中的具有发光元件 2的各个部分可以处于同一个平面或 同一个连续曲面上; 或者具有发光元件的各个部分不处于同一个平面或同一个连续曲面上; (1) a metal-based circuit master block 11 in which the respective portions having the light-emitting elements 2 may be on the same plane or the same continuous curved surface; or the respective portions having the light-emitting elements are not on the same plane or the same continuous curved surface;
( 2 )金属基电路子版块 12, 与所述的金属基电路母版块 11一体成型, 且该金属基电路 子版块 12中的具有发光元件 2的各个部分可以处于同一个平面或同一个连续曲面上;或者该 金属基电路子版块中的具有发光元件的各个部分不处于同一个平面或同一个连续曲面上; 同时, 该金属基电路子版块中的具有发光元件的各个部分与该金属基电路母版块中的具 有发光元件的各个部分不处于同一个平面或同一个连续曲面上。 (2) a metal-based circuit sub-block 12 integrally formed with the metal-based circuit master block 11, and the portions of the metal-based circuit sub-block 12 having the light-emitting elements 2 may be in the same plane or the same continuous curved surface. Or the respective portions of the metal-based circuit sub-block having the light-emitting elements are not on the same plane or the same continuous curved surface; and at the same time, the respective portions of the metal-based circuit sub-block having the light-emitting elements and the metal-based circuit The portions of the master block having the light-emitting elements are not on the same plane or on the same continuous curved surface.
所述的金属基电路板为由一个或多个连续平面或曲面所形成的三维立体型结构, 该金属 基电路板在与该金属基电路板的下表面所贴合的散热器的安装方向的投影面积小于该金属基 电路板与散热器的接触面积, 也就是说, 该金属基电路板在安装方向的任一投影尺寸, 均小 于其成形前的平面金属基电路板的投影尺寸, 且该金属基电路板的三维立体型结构的形状与 该金属基电路板的下表面所贴合的散热器 3的形状相匹配。 The metal-based circuit board is a three-dimensional structure formed by one or more continuous planes or curved surfaces, the metal The projection area of the base board in the mounting direction of the heat sink attached to the lower surface of the metal base circuit board is smaller than the contact area of the metal base circuit board and the heat sink, that is, the metal base circuit board is in the mounting direction. Any projection size is smaller than the projection size of the planar metal-based circuit board before forming, and the shape of the three-dimensional structure of the metal-based circuit board is matched with the heat sink 3 of the lower surface of the metal-based circuit board. The shapes match.
其中, 所述的金属基电路板具有的三维立体型结构可以为规则多面体、 不规则多面体、 凹面体、 凸面体、 圆锥形体、 复合圆锥形体、 方锥体, 复合方锥体、 多边锥体, 复合多边锥 体、 自由面体、 对称弯折结构体、 非对称弯折结构体或者以上多种结构体的组合, 所述的自 由面体为非均匀有理 B样条 NURBS面体。  Wherein, the three-dimensional structure of the metal-based circuit board may be a regular polyhedron, an irregular polyhedron, a concave body, a convex body, a conical body, a composite conical body, a square cone, a compound square cone, a polygonal cone, A composite polygonal cone, a free plane, a symmetrically bent structure, an asymmetrically bent structure or a combination of the above plurality of structures, wherein the free face is a non-uniform rational B-spline NURBS facet.
作为本发明的发光灯具中的金属基 PCB 电路板组件结构, 其具有 "S"型的蜿蜒起伏的线 条形状, 这种形状特点是无法通过多个平坦的 PCB电路板拼接而成的。  As a metal-based PCB circuit board assembly structure in the illuminating lamp of the present invention, it has an "S"-shaped undulating line shape which cannot be formed by splicing a plurality of flat PCB boards.
通过上述的技术方案, 该发光灯具中的金属基 PCB电路板组件结构中的金属基电路板 1 所能够实现的三维立体型结构包括线性交叠结构、 非线性交叠结构、 对称弯折结构、 非对称 弯折结构、 不规则弯折结构或者以上多种结构的组合。  Through the above technical solution, the three-dimensional structure that can be realized by the metal-based circuit board 1 in the metal-based PCB circuit board assembly structure of the light-emitting lamp comprises a linear overlapping structure, a nonlinear overlapping structure, a symmetric bending structure, An asymmetrically bent structure, an irregularly bent structure, or a combination of the above various structures.
同时, 该发光灯具中的金属基 PCB电路板组件结构中, 所述的发光元件 2通常为发光二 极管 LED,为了尽可能提高发光灯具的集成度,缩减体积和易于安装,所述的发光二极管 LED 为贴片发光二极管 LED, 所述的贴片发光二极管 LED贴覆于所述的金属基电路板的表面。  At the same time, in the metal-based PCB circuit board assembly structure of the light-emitting lamp, the light-emitting element 2 is generally a light-emitting diode LED, and the light-emitting diode LED is used in order to increase the integration degree of the light-emitting lamp as much as possible, reduce the volume and be easy to install. For the chip light emitting diode LED, the chip light emitting diode LED is attached to the surface of the metal base circuit board.
为了使得该发光灯具在各个方向上的照明均勾度,所述的各个贴片发光二极管 LED可以 均匀分布在所述的金属基电路板的表面。  In order to make the illumination of the illuminating lamp in all directions, the respective splicing LEDs can be evenly distributed on the surface of the metal-based circuit board.
作为本发明的另一方面, 该具有上述的组件结构的发光灯具, 其中, 所述的发光灯具还 包括有散热器主体,所述的散热器主体上固定设置有一个或一个以上的所述的金属基 PCB电 路板组件结构,且该金属基 PCB电路板组件结构中的金属基电路板与散热器主体相电路连接, 且该金属基 PCB电路板与所述的散热器主体的表面相匹配贴合。  According to another aspect of the present invention, the illuminating lamp having the above-mentioned component structure, wherein the illuminating lamp further includes a heat sink body, and the heat sink body is fixedly provided with one or more of the above-mentioned a metal-based PCB circuit board assembly structure, wherein the metal-based circuit board in the metal-based PCB circuit board assembly structure is electrically connected to the heat sink body, and the metal-based PCB circuit board is matched with the surface of the heat sink body Hehe.
其中, 该发光灯具的主体上还设置有透明外壳或者半透明外壳, 所述的透明外壳或者半 透明外壳包围设置所述的金属基 PCB电路板组件结构。  Wherein, the main body of the illuminating lamp is further provided with a transparent casing or a translucent casing, and the transparent casing or the semi-transparent casing surrounds the metal-based PCB circuit board assembly structure.
再请参阅图 2至图 4所示,该上述的发光灯具中的三维金属基 PCB电路板组件结构的制 造方法, 其中包括以下步骤:  Referring to FIG. 2 to FIG. 4, the manufacturing method of the three-dimensional metal-based PCB circuit board assembly structure in the above-mentioned illuminating lamp comprises the following steps:
( 1 )根据设计好的形状制造出预成型的平面金属基 PCB电路板 1 ;  (1) manufacturing a pre-formed planar metal-based PCB circuit board 1 according to the designed shape;
( 2 )在该平面金属基 PCB电路板 1的表面进行导热层形成和发光元件贴覆处理, 得到 平面金属基 PCB电路板组件, 包括以下步骤:  (2) Conducting a heat conductive layer formation and a light emitting element attaching process on the surface of the planar metal-based PCB circuit board 1 to obtain a planar metal-based PCB circuit board assembly, comprising the following steps:
( a )在该平面金属基 PCB电路板 1与散热器 3相接触的下表面涂覆或夹覆导热粘胶 层; (a) coating or sandwiching the thermal conductive adhesive on the lower surface of the planar metal-based PCB circuit board 1 in contact with the heat sink 3 Floor;
( b )在该平面金属基 PCB电路板 1的上表面贴覆发光元件, 并进行电路焊接; 该电 路焊接工艺为平面回流焊工艺;  (b) attaching a light-emitting element to the upper surface of the planar metal-based PCB circuit board 1 and performing circuit soldering; the circuit soldering process is a planar reflow soldering process;
( 3 )将所述的平面金属基 PCB电路板组件定位于散热器 3上;  (3) positioning the planar metal-based PCB circuit board assembly on the heat sink 3;
( 4 )对该平面金属基 PCB电路板组件进行变形加工, 形成具有与所述的散热器 3的接 触表面相匹配的三维立体型结构轮廊的金属基 PCB电路板组件;  (4) deforming the planar metal-based PCB circuit board assembly to form a metal-based PCB circuit board assembly having a three-dimensional structure structure corridor matched with the contact surface of the heat sink 3;
( 5 )将所述的金属基 PCB电路板机械固定设置, 且使得该金属基 PCB电路板的下表面 与所述的散热器 3的表面紧密接触。  (5) mechanically fixing the metal-based PCB circuit board so that the lower surface of the metal-based PCB circuit board is in close contact with the surface of the heat sink 3.
通过该方法所能够形成的其它各种三维立体型结构轮廊请参阅图 5至图 8所示。  Other various three-dimensional three-dimensional structure wheel corridors that can be formed by this method are shown in Figs. 5 to 8.
在实际使用当中, 本发明的 PCB电路板可以是单层也可以是多层的, 同时, 对于电路的 布线没有任何限制, 在该电路板的变形弯折连接部位可以设置凹痕和狭长通孔, 从而有利于 产生高度形变。  In practical use, the PCB circuit board of the present invention may be a single layer or a plurality of layers, and at the same time, there is no limitation on the wiring of the circuit, and the dent and the elongated through hole may be provided at the deformed bending connection portion of the circuit board. Thus, it is advantageous to produce a high degree of deformation.
本发明仅仅使用单一的金属基 PCB电路板就能够得到三维立体构造,从而无须任何附加 的光学辅助手段就实现了多方向照明功能。 而且相应的金属基 PCB电路板作为多方向照明的 关键要素已经足够了, 在装配过程中无须额外的组装加工工艺, 仅仅就是装入发光灯具中然 后锁定即可。  The present invention enables a three-dimensional configuration using only a single metal-based PCB circuit board, thereby enabling multi-directional illumination without any additional optical aids. Moreover, the corresponding metal-based PCB circuit board is sufficient as a key element of multi-directional illumination. In the assembly process, no additional assembly process is required, and only the light-emitting lamp is installed and then locked.
作为更为复杂的照明环境要求,还可以将本发明的两个或者两个以上的金属基 PCB电路 板组件结构进行组合装配, 从而进一步满足多方向照明的要求。 每个金属 PCB电路板所形成 的三维结构形式可以为线性交叠、 非线性交叠、 对称弯折结构、 非对称弯折结构、 复杂的不 规则任意折叠型或者以上形式的组合, 具体列举如下:  As a more complicated lighting environment requirement, two or more metal-based PCB circuit board assembly structures of the present invention can also be assembled and assembled to further meet the requirements of multi-directional illumination. The three-dimensional structure formed by each metal PCB circuit board may be a linear overlap, a nonlinear overlap, a symmetric bend structure, an asymmetric bend structure, a complicated irregular random fold type or a combination of the above forms, and the specific examples are as follows :
>规则多面体、 不规则多面体  >Regular polyhedron, irregular polyhedron
>凹、 凸  > concave, convex
>对称、 非对称  >symmetric, asymmetric
>轴对称、 非轴对称  >Axisymmetric, non-axisymmetric
圆锥形、 复合圆锥形  Conical, compound conical
>自由面, 例如: 非均匀有理 B样条( NURBS , Non Uniform Rational B-Spline ) 曲面 >Free face, for example: Non-uniform rational B-spline (NURBS, Non Uniform Rational B-Spline) surface
>所有上述的复合形式 >All of the above composite forms
本发明的金属 PCB电路板组件结构的制造过程如下:  The manufacturing process of the metal PCB circuit board assembly structure of the present invention is as follows:
( 1 )首先根据设计好的形状制造出预成型的金属基 PCB电路板;  (1) First, a preformed metal-based PCB circuit board is manufactured according to the designed shape;
( 2 ) 然后按照预设的工艺过程在该金属基 PCB电路板的表面进行 LED贴覆; ( 3 )对该金属基 PCB电路板釆用合适的工艺进行三维成形, 从而得到预定的三维立体 结构形式, 这样的过程不会影响到该金属基 PCB电路板的绝缘、 电路走线和电路元器件。 (2) then performing LED coating on the surface of the metal-based PCB circuit board according to a preset process; (3) Three-dimensional forming of the metal-based PCB circuit board by a suitable process to obtain a predetermined three-dimensional structure, such a process does not affect the insulation, circuit traces and circuit elements of the metal-based PCB circuit board. Device.
以上的工艺过程对于该金属基 PCB 电路板的材料并没有特殊要求, 同时对于第 (3 ) 步 骤中的变形弯折工艺方法可以釆用任何适用于金属基 PCB电路板弯折的已知方法, 以及将来 由于技术改进而可能釆用的各种新的工艺方法, 因此对于如何弯折该金属基 PCB电路板的具 体工艺过程, 无须在本发明中进行详述。  The above process has no special requirements for the material of the metal-based PCB circuit board, and the known bending method for the metal-based PCB circuit board can be applied to the deformation bending process in the step (3). As well as various new processes that may be used in the future due to technical improvements, the specific process for how to bend the metal-based PCB circuit board is not necessarily described in detail in the present invention.
釆用了上述的三维金属基 PCB电路板组件结构、 相应的发光灯具及制造方法, 由于其中 使用了单一的金属基电路板, 首先将发光二极管釆用常规的工艺手段贴覆于平坦的预成型的 金属基电路板上, 然后再釆用合适的变形工艺将该金属基电路板成型为所需要的三维立体型 结构, 从而仅利用单一的金属基 PCB电路板就实现了多方向照明, 不仅在相同散热器的有限 投影面积上提供了更大的表面积, 从而实现了更大 PCB 面积上的 LED表面贴装, 热传导 接触表面更大, 而且单一模块组件实现了结构筒单实用, 自动化 SMT 工艺, 无人为加工错 误, 筒化了工艺过程, 加工方便快捷, 利于大批量机械化生产, 成本低廉, 并能够形成各种 复杂的三维结构形状, 比如凸出的、 凹陷的、 球面的、 不规则外形的、 非线性交叠的等等各 种复杂形状, 电路可靠性高, 各个位置的 LED之间的温度差异较小, 性能稳定可靠, 坚固耐 用, 提高了电路板组件的装配稳定性和机械强度, 不易形变, 适用范围较为广泛, 给人们带 来了实惠的节能照明解决方案。  The above three-dimensional metal-based PCB circuit board assembly structure, corresponding illuminating luminaire and manufacturing method are used. Since a single metal-based circuit board is used, the illuminating diode is first attached to a flat preform by conventional techniques. The metal-based circuit board, and then using a suitable deformation process to form the metal-based circuit board into a desired three-dimensional structure, thereby achieving multi-directional illumination using only a single metal-based PCB circuit board, not only in The same heat sink provides a larger surface area on the limited projected area, enabling LED surface mount on a larger PCB area, larger thermal conduction contact surfaces, and a single module assembly for a single-use, automated SMT process. No one is processing error, the process is finished, the processing is convenient and fast, it is convenient for mass mechanized production, low cost, and can form various complicated three-dimensional structural shapes, such as convex, concave, spherical, irregular shape. , nonlinear overlap, and other complex shapes, circuit reliability High, the temperature difference between the LEDs in each position is small, the performance is stable and reliable, the sturdy and durable, the assembly stability and mechanical strength of the circuit board assembly are improved, the deformation is not easy, and the application range is wide, which brings benefits and energy saving to people. Lighting solutions.
在此说明书中, 本发明已参照其特定的实施例作了描述。 但是, 很显然仍可以作出各种 修改和变换而不背离本发明的精神和范围。 因此, 说明书和附图应被认为是说明性的而非限 制性的。  In this specification, the invention has been described with reference to specific embodiments thereof. However, it will be apparent that various modifications and changes can be made without departing from the spirit and scope of the invention. Accordingly, the specification and figures are to be regarded as illustrative and not limiting.

Claims

权利要求 Rights request
1、 一种发光灯具中的三维金属基 PCB 电路板组件结构, 其特征在于, 所述的组件结构 由单一连续的金属基电路板和设置于该金属基电路板上表面的数个发光元件组成, 所述的各 个发光元件均与该金属基电路板相电路连接, 该金属基电路板上具有发光元件的各个部分不 处于同一个平面或同一个连续曲面上, 且该金属基电路板具有三维立体型结构。 A three-dimensional metal-based PCB circuit board assembly structure in an illuminating lamp, characterized in that: the component structure is composed of a single continuous metal-based circuit board and a plurality of light-emitting elements disposed on a surface of the metal-based circuit board Each of the light-emitting elements is electrically connected to the metal-based circuit board, and the portions of the metal-based circuit board having the light-emitting elements are not on the same plane or the same continuous curved surface, and the metal-based circuit board has three-dimensional Three-dimensional structure.
2、根据权利要求 1所述的发光灯具中的三维金属基 PCB电路板组件结构, 其特征在于, 所述的金属基电路板包括:  2. The three-dimensional metal-based PCB circuit board assembly structure of the illuminating lamp of claim 1, wherein the metal-based circuit board comprises:
金属基电路母版块, 其中的具有发光元件的各个部分处于同一个平面或同一个连续曲面 上; 或者具有发光元件的各个部分不处于同一个平面或同一个连续曲面上;  a metal-based circuit master block, wherein each part having the light-emitting element is on the same plane or the same continuous curved surface; or each part having the light-emitting element is not in the same plane or the same continuous curved surface;
金属基电路子版块, 与所述的金属基电路母版块一体成型, 且该金属基电路子版块中的 具有发光元件的各个部分处于同一个平面或同一个连续曲面上; 或者该金属基电路子版块中 的具有发光元件的各个部分不处于同一个平面或同一个连续曲面上;  a metal-based circuit sub-block integrally formed with the metal-based circuit master block, and each part of the metal-based circuit sub-block having the light-emitting element is on the same plane or the same continuous curved surface; or the metal-based circuit The portions of the panel having the illuminating elements are not in the same plane or on the same continuous curved surface;
同时, 该金属基电路子版块中的具有发光元件的各个部分与该金属基电路母版块中的具 有发光元件的各个部分不处于同一个平面或同一个连续曲面上。  At the same time, the respective portions of the metal-based circuit sub-block having the light-emitting elements are not in the same plane or the same continuous curved surface as the respective portions of the metal-based circuit master block having the light-emitting elements.
3、根据权利要求 1所述的发光灯具中的三维金属基 PCB电路板组件结构, 其特征在于, 所述的金属基电路板为由一个或多个连续平面或曲面所形成的三维立体型结构。  3. The three-dimensional metal-based PCB circuit board assembly structure in an illuminating lamp according to claim 1, wherein the metal-based circuit board is a three-dimensional structure formed by one or more continuous planes or curved surfaces. .
4、根据权利要求 1所述的发光灯具中的三维金属基 PCB电路板组件结构, 其特征在于, 所述的金属基电路板在与该金属基电路板的下表面所贴合的散热器的安装方向的投影面积小 于该金属基电路板与散热器的接触面积。  The three-dimensional metal-based PCB circuit board assembly structure of the light-emitting lamp according to claim 1, wherein the metal-based circuit board is attached to the heat sink of the lower surface of the metal-based circuit board. The projected area of the mounting direction is smaller than the contact area of the metal base circuit board and the heat sink.
5、根据权利要求 1所述的发光灯具中的三维金属基 PCB电路板组件结构, 其特征在于, 所述的金属基电路板的三维立体型结构的形状与该金属基电路板的下表面所贴合的散热器形 相匹配。  The three-dimensional metal-based PCB circuit board assembly structure of the light-emitting lamp according to claim 1, wherein the shape of the three-dimensional structure of the metal-based circuit board and the lower surface of the metal-based circuit board are The fitted heat sinks are shaped to match.
6、根据权利要求 1至 5中任一项所述的发光灯具中的三维金属基 PCB电路板组件结构, 其特征在于, 所述的金属基电路板具有的三维立体型结构为规则多面体、 不规则多面体、 凹 面体、 凸面体、 圆锥形体、 复合圆锥形体、 方锥体, 复合方锥体、 多边锥体, 复合多边锥体、 自由面体、 对称弯折结构体、 非对称弯折结构体或者以上多种结构体的组合。  The three-dimensional metal-based PCB circuit board assembly structure according to any one of claims 1 to 5, wherein the metal-based circuit board has a three-dimensional structure of a regular polyhedron, Regular polyhedron, concave body, convex body, conical body, composite cone, square cone, compound square cone, polygonal cone, composite polygonal cone, free plane, symmetrically bent structure, asymmetrically bent structure or A combination of the above various structures.
7、根据权利要求 6所述的发光灯具中的三维金属基 PCB电路板组件结构, 其特征在于, 所述的自由面体为非均匀有理 Β样条 NURBS面体。  The three-dimensional metal-based PCB circuit board assembly structure of the illuminating lamp according to claim 6, wherein the free face body is a non-uniform rational Β spline NURBS face body.
8、根据权利要求 1至 5中任一项所述的发光灯具中的三维金属基 PCB电路板组件结构, 其特征在于, 所述的发光元件为发光二极管 LED。 The three-dimensional metal-based PCB circuit board assembly structure in the light-emitting fixture according to any one of claims 1 to 5, The light emitting element is a light emitting diode LED.
9、根据权利要求 8所述的发光灯具中的三维金属基 PCB电路板组件结构, 其特征在于, 所述的发光元件为贴片发光二极管 LED,所述的贴片发光二极管 LED贴覆于所述的金属基电 路板的表面。  The three-dimensional metal-based PCB circuit board assembly structure of the illuminating lamp according to claim 8, wherein the illuminating element is a chip light emitting diode LED, and the splicing light emitting diode LED is attached to the The surface of the metal-based circuit board.
10、根据权利要求 8所述的发光灯具中的三维金属基 PCB电路板组件结构,其特征在于, 所述的各个贴片发光二极管 LED均匀分布在所述的金属基电路板的表面。  The three-dimensional metal-based PCB circuit board assembly structure of the illuminating lamp according to claim 8, wherein each of the patch LEDs is uniformly distributed on a surface of the metal-based circuit board.
11、 一种具有权利要求 1所述的组件结构的发光灯具, 其特征在于, 所述的发光灯具还 包括有散热器主体,所述的散热器主体上固定设置有一个或一个以上的所述的金属基 PCB电 路板组件结构, 该金属基 PCB电路板组件结构中的金属基电路板与散热器主体相电路连接, 且该金属基 PCB电路板与所述的散热器主体的表面相匹配贴合。  11. The illuminating luminaire having the component structure of claim 1, wherein the illuminating luminaire further comprises a heat sink body, wherein the heat sink body is fixedly disposed with one or more of the a metal-based PCB circuit board assembly structure, the metal-based circuit board in the metal-based PCB circuit board assembly structure is electrically connected to the heat sink body, and the metal-based PCB circuit board is matched with the surface of the heat sink body Hehe.
12、 一种权利要求 1所述的发光灯具中的三维金属基 PCB电路板组件结构的制造方法, 其特征在于, 所述的方法包括以下步骤:  12. A method of fabricating a three-dimensional metal-based PCB circuit board assembly structure in a light-emitting fixture according to claim 1, wherein the method comprises the steps of:
( 1 )根据设计好的形状制造出预成型的平面金属基 PCB电路板;  (1) manufacturing a pre-formed planar metal-based PCB circuit board according to the designed shape;
( 2 )在该平面金属基 PCB电路板的表面进行导热层形成和发光元件贴覆处理, 得到平 面金属基 PCB电路板组件;  (2) forming a heat conductive layer on the surface of the planar metal-based PCB circuit board and attaching the light-emitting element to obtain a planar metal-based PCB circuit board assembly;
( 3 )将所述的平面金属基 PCB电路板组件定位于散热器上;  (3) positioning the planar metal-based PCB circuit board assembly on the heat sink;
( 4 )对该平面金属基 PCB电路板组件进行变形加工, 形成具有与所述的散热器的接触 表面相匹配的三维立体型结构轮廊的金属基 PCB电路板组件。  (4) deforming the planar metal-based PCB circuit board assembly to form a metal-based PCB circuit board assembly having a three-dimensional structure structure wheel gallery matched with the contact surface of the heat sink.
13、根据权利要求 12所述的发光灯具中的三维金属基 PCB电路板组件结构的制造方法, 其特征在于, 所述的在平面金属基 PCB电路板的表面进行导热层形成和发光元件贴覆处理, 包括以下步骤:  The method of manufacturing a three-dimensional metal-based PCB circuit board assembly structure according to claim 12, wherein the surface of the planar metal-based PCB circuit board is formed by a heat conductive layer and the light-emitting element is pasted. Processing, including the following steps:
( 21 )在该平面金属基 PCB电路板与散热器相接触的下表面涂覆或夹覆导热粘胶层; (21) coating or sandwiching a thermal adhesive layer on a lower surface of the planar metal-based PCB circuit board in contact with the heat sink;
( 22 )在该平面金属基 PCB电路板的上表面贴覆发光元件, 并进行电路焊接。 (22) A light-emitting element is attached to the upper surface of the planar metal-based PCB circuit board, and circuit soldering is performed.
14、根据权利要求 13所述的发光灯具中的三维金属基 PCB电路板组件结构的制造方法, 其特征在于, 所述的电路焊接工艺为平面回流焊工艺。  14. A method of fabricating a three-dimensional metal-based PCB circuit board assembly structure in a light-emitting fixture according to claim 13, wherein said circuit soldering process is a planar reflow soldering process.
15、根据权利要求 12所述的发光灯具中的三维金属基 PCB电路板组件结构的制造方法, 其特征在于, 所述的方法中还包括以下步骤:  The method of manufacturing a three-dimensional metal-based PCB circuit board assembly structure according to claim 12, wherein the method further comprises the following steps:
( 5 )将所述的金属基 PCB电路板组件机械固定设置, 且使得该金属基 PCB电路板组件的下表 面与所述的散热器的表面紧密接触。  (5) mechanically fixing the metal-based PCB circuit board assembly such that the lower surface of the metal-based PCB circuit board assembly is in close contact with the surface of the heat sink.
PCT/CN2013/072156 2012-03-05 2013-03-04 Three-dimensional metal-based pcb circuit board assembly structure, corresponding light-emitting lamp and manufacturing method WO2013131463A1 (en)

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