WO2013131463A1 - Three-dimensional metal-based pcb circuit board assembly structure, corresponding light-emitting lamp and manufacturing method - Google Patents
Three-dimensional metal-based pcb circuit board assembly structure, corresponding light-emitting lamp and manufacturing method Download PDFInfo
- Publication number
- WO2013131463A1 WO2013131463A1 PCT/CN2013/072156 CN2013072156W WO2013131463A1 WO 2013131463 A1 WO2013131463 A1 WO 2013131463A1 CN 2013072156 W CN2013072156 W CN 2013072156W WO 2013131463 A1 WO2013131463 A1 WO 2013131463A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal
- circuit board
- pcb circuit
- light
- board assembly
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/10—Light sources with three-dimensionally disposed light-generating elements on concave supports or substrates, e.g. on the inner side of bowl-shaped supports
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/20—Light sources with three-dimensionally disposed light-generating elements on convex supports or substrates, e.g. on the outer surface of spheres
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
Definitions
- Three-dimensional metal-based PCB circuit board assembly structure corresponding illuminating luminaire and manufacturing method thereof
- the invention relates to the field of illuminating illumination, in particular to the field of illuminating lighting equipment and structure technology, and in particular to a three-dimensional metal-based PCB circuit board assembly structure, a corresponding illuminating luminaire and a manufacturing method thereof.
- Background technique
- lighting devices With the continuous advancement of human civilization and the continuous development of science and technology, lighting devices have long been widely known.
- such lighting devices include a housing and a lighting component disposed within the housing.
- LEDs have been able to provide enough light energy for lighting purposes.
- incandescent and halogen lamps have been used in order to reduce the energy consumption of lighting and reduce carbon dioxide emissions.
- LED light sources have been It is the trend of the times that consumers need products that can achieve the light output of incandescent or halogen lamps, have lower energy consumption and longer service life, and are cheaper.
- many different LED products are already on the market, most of them are too expensive for the average consumer, and the initiatives and original intentions of reducing energy consumption have not achieved the desired results.
- LEDs need to work within a certain temperature range in order to have reasonable performance and service life. Due to the compact structure, especially the illuminating device is received in the housing, the following disadvantages exist:
- the illuminating equipment itself consumes electric energy, and the efficiency of electro-optical conversion is not 100%. Some of the heat is always generated. Since the inside of the casing is mostly sealed, heat cannot be released in time.
- the object of the present invention is to overcome the above-mentioned shortcomings in the prior art, and to provide a multi-directional illumination on a single metal-based PCB circuit board, effectively increase the heat transfer area, and the structure is simple and convenient to process, and is convenient and quick to process. Large-scale mechanized production, low cost, stable and reliable performance, wide application range of three-dimensional metal-based PCB circuit board assembly structure, corresponding lighting fixtures and manufacturing methods.
- the three-dimensional metal-based PCB circuit board assembly structure, the corresponding illuminating luminaire and the manufacturing method of the present invention are as follows:
- the main feature of the three-dimensional metal-based PCB circuit board assembly structure in the illuminating lamp is that the component structure is composed of a single continuous metal-based circuit board and a plurality of illuminating elements disposed on the surface of the metal-based circuit board.
- Each of the light-emitting elements is electrically connected to the metal-based circuit board, and the portions of the metal-based circuit board having the light-emitting elements are not on the same plane or the same continuous curved surface, and the metal-based circuit board has a three-dimensional shape structure.
- the metal-based circuit board in the three-dimensional metal-based PCB circuit board assembly structure of the light-emitting fixture includes:
- each part having the light-emitting element is on the same plane or the same continuous curved surface; or each part having the light-emitting element is not in the same plane or the same continuous curved surface;
- each part of the metal-based circuit sub-block having the light-emitting element is on the same plane or the same continuous curved surface; or the metal-based circuit
- the portions of the panel having the illuminating elements are not in the same plane or on the same continuous curved surface;
- the respective portions of the metal-based circuit sub-block having the light-emitting elements are not in the same plane or the same continuous curved surface as the respective portions of the metal-based circuit master block having the light-emitting elements.
- the metal-based circuit board in the three-dimensional metal-based PCB circuit board assembly structure of the light-emitting fixture is a three-dimensional structure formed by one or more continuous planes or curved surfaces.
- the projection area of the metal-based circuit board in the three-dimensional metal-based PCB circuit board assembly structure of the light-emitting fixture in the mounting direction of the heat sink attached to the lower surface of the metal-based circuit board is smaller than the metal-based circuit board and the heat sink Contact area.
- the shape of the three-dimensional structure of the metal-based circuit board in the three-dimensional metal-based PCB circuit board assembly structure in the light-emitting fixture matches the shape of the heat sink to which the lower surface of the metal-based circuit board is attached.
- the metal-based circuit board in the three-dimensional metal-based PCB circuit board assembly structure of the light-emitting lamp has a three-dimensional structure of a regular polyhedron, an irregular polyhedron, a concave body, a convex body, a conical body, a composite conical body, and a square cone. , compound square cone, polygonal cone, composite polygonal cone, free plane, symmetrically bent structure, asymmetrically bent structure or a combination of the above various structures.
- the free facet in the three-dimensional metal-based PCB circuit board assembly structure of the illuminating luminaire is a non-uniform rational B-spline NURBS facet.
- the light-emitting element in the three-dimensional metal-based PCB circuit board assembly structure of the light-emitting fixture is a light-emitting diode LED.
- the light-emitting component in the three-dimensional metal-based PCB circuit board assembly structure of the light-emitting fixture is a patch LED, and the patch LED is attached to the surface of the metal-based circuit board.
- Each of the patch LEDs in the three-dimensional metal-based PCB circuit board assembly structure of the illuminating lamp is evenly distributed on the surface of the metal-based circuit board.
- the main feature of the illuminating lamp having the above-mentioned component structure is that the illuminating lamp further comprises a heat sink body, and the heat sink body is fixedly provided with one or more metal-based PCB circuit boards.
- the component structure, the metal-based circuit board in the metal-based PCB circuit board assembly structure is electrically connected to the main body phase, and the metal-based PCB circuit board is matched with the surface of the heat sink main body.
- the main feature is that the method comprises the following steps:
- the method for manufacturing a three-dimensional metal-based PCB circuit board assembly structure in the illuminating lamp performs heat conduction layer formation and illuminating element coating processing on the surface of the planar metal-based PCB circuit board, and includes the following steps:
- a light-emitting element is attached to the upper surface of the planar metal-based PCB circuit board, and circuit soldering is performed.
- the circuit soldering process in the manufacturing method of the three-dimensional metal-based PCB circuit board assembly structure in the illuminating lamp is a planar reflow soldering process.
- the manufacturing method of the metal-based PCB circuit board assembly structure in the illuminating lamp further comprises the following steps:
- the three-dimensional metal-based PCB circuit board assembly structure, the corresponding illuminating luminaire and the manufacturing method thereof are used. Since a single metal-based circuit board is used, the illuminating diode is first attached to the flat pre-prepared by conventional techniques. Molding On the metal-based circuit board, the metal-based circuit board is molded into a desired three-dimensional structure by a suitable deformation process, thereby realizing multi-directional illumination using only a single metal-based PCB circuit board.
- FIG. 1 is a schematic view showing the structure of a metal-based PCB circuit board assembly in the illuminating lamp of the present invention.
- 2 to 4 are schematic views showing the manufacturing process of the metal-based PCB circuit board assembly structure in the illuminating lamp of the present invention.
- 5 to 8 are schematic views showing various three-dimensional structures of the metal-based circuit board of the present invention. detailed description
- a three-dimensional metal-based PCB circuit board assembly structure in the light-emitting fixture wherein the component structure comprises a single continuous metal-based circuit board 1 and a number disposed on an upper surface of the metal-based circuit board 1
- the metal-based circuit board 1 has the light-emitting elements 2 not in the same plane or on the same continuous curved surface.
- the metal base circuit board 1 has a three-dimensional structure.
- the metal base circuit board comprises:
- a metal-based circuit master block 11 in which the respective portions having the light-emitting elements 2 may be on the same plane or the same continuous curved surface; or the respective portions having the light-emitting elements are not on the same plane or the same continuous curved surface;
- a metal-based circuit sub-block 12 integrally formed with the metal-based circuit master block 11, and the portions of the metal-based circuit sub-block 12 having the light-emitting elements 2 may be in the same plane or the same continuous curved surface. Or the respective portions of the metal-based circuit sub-block having the light-emitting elements are not on the same plane or the same continuous curved surface; and at the same time, the respective portions of the metal-based circuit sub-block having the light-emitting elements and the metal-based circuit The portions of the master block having the light-emitting elements are not on the same plane or on the same continuous curved surface.
- the metal-based circuit board is a three-dimensional structure formed by one or more continuous planes or curved surfaces, the metal
- the projection area of the base board in the mounting direction of the heat sink attached to the lower surface of the metal base circuit board is smaller than the contact area of the metal base circuit board and the heat sink, that is, the metal base circuit board is in the mounting direction.
- Any projection size is smaller than the projection size of the planar metal-based circuit board before forming, and the shape of the three-dimensional structure of the metal-based circuit board is matched with the heat sink 3 of the lower surface of the metal-based circuit board. The shapes match.
- the three-dimensional structure of the metal-based circuit board may be a regular polyhedron, an irregular polyhedron, a concave body, a convex body, a conical body, a composite conical body, a square cone, a compound square cone, a polygonal cone, A composite polygonal cone, a free plane, a symmetrically bent structure, an asymmetrically bent structure or a combination of the above plurality of structures, wherein the free face is a non-uniform rational B-spline NURBS facet.
- a metal-based PCB circuit board assembly structure in the illuminating lamp of the present invention has an "S"-shaped undulating line shape which cannot be formed by splicing a plurality of flat PCB boards.
- the three-dimensional structure that can be realized by the metal-based circuit board 1 in the metal-based PCB circuit board assembly structure of the light-emitting lamp comprises a linear overlapping structure, a nonlinear overlapping structure, a symmetric bending structure, An asymmetrically bent structure, an irregularly bent structure, or a combination of the above various structures.
- the light-emitting element 2 is generally a light-emitting diode LED, and the light-emitting diode LED is used in order to increase the integration degree of the light-emitting lamp as much as possible, reduce the volume and be easy to install.
- the chip light emitting diode LED is attached to the surface of the metal base circuit board.
- the respective splicing LEDs can be evenly distributed on the surface of the metal-based circuit board.
- the illuminating lamp having the above-mentioned component structure, wherein the illuminating lamp further includes a heat sink body, and the heat sink body is fixedly provided with one or more of the above-mentioned a metal-based PCB circuit board assembly structure, wherein the metal-based circuit board in the metal-based PCB circuit board assembly structure is electrically connected to the heat sink body, and the metal-based PCB circuit board is matched with the surface of the heat sink body Hehe.
- the main body of the illuminating lamp is further provided with a transparent casing or a translucent casing, and the transparent casing or the semi-transparent casing surrounds the metal-based PCB circuit board assembly structure.
- the manufacturing method of the three-dimensional metal-based PCB circuit board assembly structure in the above-mentioned illuminating lamp comprises the following steps:
- FIGs. 5 to 8 Other various three-dimensional three-dimensional structure wheel corridors that can be formed by this method are shown in Figs. 5 to 8.
- the PCB circuit board of the present invention may be a single layer or a plurality of layers, and at the same time, there is no limitation on the wiring of the circuit, and the dent and the elongated through hole may be provided at the deformed bending connection portion of the circuit board.
- the dent and the elongated through hole may be provided at the deformed bending connection portion of the circuit board.
- the present invention enables a three-dimensional configuration using only a single metal-based PCB circuit board, thereby enabling multi-directional illumination without any additional optical aids. Moreover, the corresponding metal-based PCB circuit board is sufficient as a key element of multi-directional illumination. In the assembly process, no additional assembly process is required, and only the light-emitting lamp is installed and then locked.
- each metal PCB circuit board may be a linear overlap, a nonlinear overlap, a symmetric bend structure, an asymmetric bend structure, a complicated irregular random fold type or a combination of the above forms, and the specific examples are as follows :
- NURBS Non Uniform Rational B-Spline
- the manufacturing process of the metal PCB circuit board assembly structure of the present invention is as follows:
- the above process has no special requirements for the material of the metal-based PCB circuit board, and the known bending method for the metal-based PCB circuit board can be applied to the deformation bending process in the step (3).
- the specific process for how to bend the metal-based PCB circuit board is not necessarily described in detail in the present invention.
- the above three-dimensional metal-based PCB circuit board assembly structure, corresponding illuminating luminaire and manufacturing method are used. Since a single metal-based circuit board is used, the illuminating diode is first attached to a flat preform by conventional techniques. The metal-based circuit board, and then using a suitable deformation process to form the metal-based circuit board into a desired three-dimensional structure, thereby achieving multi-directional illumination using only a single metal-based PCB circuit board, not only in The same heat sink provides a larger surface area on the limited projected area, enabling LED surface mount on a larger PCB area, larger thermal conduction contact surfaces, and a single module assembly for a single-use, automated SMT process.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210056341.1 | 2012-03-05 | ||
CN201210056341.1A CN102595788B (en) | 2012-03-05 | 2012-03-05 | Manufacturing method of three-dimensional metal-based Printed Circuit Board (PCB) assembly structure in light-emitting |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013131463A1 true WO2013131463A1 (en) | 2013-09-12 |
Family
ID=46483831
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2013/072156 WO2013131463A1 (en) | 2012-03-05 | 2013-03-04 | Three-dimensional metal-based pcb circuit board assembly structure, corresponding light-emitting lamp and manufacturing method |
Country Status (2)
Country | Link |
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CN (1) | CN102595788B (en) |
WO (1) | WO2013131463A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102595788B (en) * | 2012-03-05 | 2015-02-04 | 蔡子丰 | Manufacturing method of three-dimensional metal-based Printed Circuit Board (PCB) assembly structure in light-emitting |
CN102889480B (en) * | 2012-07-19 | 2016-11-23 | 王定锋 | The LED bulb module of three-dimensional light and manufacture method |
CN103826381A (en) * | 2012-11-16 | 2014-05-28 | 深圳市锐步科技有限公司 | Metal base printed circuit board capable of 360-degree bending, and manufacturing process thereof |
US9872381B2 (en) * | 2013-05-03 | 2018-01-16 | Philips Lighting Holding B.V. | Circuit board comprising at least one fold |
CN104197281A (en) * | 2014-07-25 | 2014-12-10 | 厦门市瀚锋光电科技有限公司 | Light source for even light distribution |
CN104501002A (en) * | 2014-12-06 | 2015-04-08 | 广东聚科照明股份有限公司 | Three-dimensional LED |
CN106535481A (en) * | 2016-12-08 | 2017-03-22 | 苏州长风航空电子有限公司 | Method for pasting heat dissipating board |
RU2688581C1 (en) | 2018-06-18 | 2019-05-21 | Юрий Борисович Соколов | Method for manufacturing three-dimensional electronic module with high density of components and device |
DE102023103871A1 (en) | 2023-02-16 | 2024-08-22 | Dotlux Gmbh | LED lighting device |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5920643A (en) * | 1997-05-16 | 1999-07-06 | Northeast Robotics Llc | Flexible lighting element circuit and method of manufacturing the same |
DE102007046639A1 (en) * | 2007-09-27 | 2009-04-02 | Büchner, Thomas | Electrical printed circuit board arrangement i.e. LED-illumination device, for illuminating objects, has carrier plate sections bent in angular position along material attenuation regions i.e. material bridges |
CN101494219A (en) * | 2008-01-25 | 2009-07-29 | 珠海科利尔能源科技有限公司 | High-power LED aluminum substrate integrated module |
WO2010002156A2 (en) * | 2008-06-30 | 2010-01-07 | Park Chang Soo | Printed circuit board for led light capable of being easily changed into polyhedral and polygonal shapes |
EP2295849A1 (en) * | 2009-09-09 | 2011-03-16 | Peugeot Citroën Automobiles SA | Vehicle light |
CN201904968U (en) * | 2010-10-27 | 2011-07-20 | 厦门立达信光电有限公司 | Bridge type substrate component capable of being bent into preset shapes |
CN102595788A (en) * | 2012-03-05 | 2012-07-18 | 蔡子丰 | Three-dimensional metal-based Printed Circuit Board (PCB) assembly structure, corresponding light-emitting lamp and manufacturing method |
CN202603045U (en) * | 2012-03-05 | 2012-12-12 | 蔡子丰 | Three-dimensional metal-matrix PCB assembly structure and corresponding light emitting light fixture thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4290887B2 (en) * | 1998-09-17 | 2009-07-08 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | LED bulb |
AUPS297902A0 (en) * | 2002-06-14 | 2002-07-04 | Lednium Pty Limited | A method of producing a lamp |
EP2133622A1 (en) * | 2008-06-12 | 2009-12-16 | Schreder | Street lighting apparatus with multiple LED-light sources |
CN201829499U (en) * | 2010-09-29 | 2011-05-11 | 任立宏 | Heat pipe type high-power LED module |
-
2012
- 2012-03-05 CN CN201210056341.1A patent/CN102595788B/en not_active Expired - Fee Related
-
2013
- 2013-03-04 WO PCT/CN2013/072156 patent/WO2013131463A1/en active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5920643A (en) * | 1997-05-16 | 1999-07-06 | Northeast Robotics Llc | Flexible lighting element circuit and method of manufacturing the same |
DE102007046639A1 (en) * | 2007-09-27 | 2009-04-02 | Büchner, Thomas | Electrical printed circuit board arrangement i.e. LED-illumination device, for illuminating objects, has carrier plate sections bent in angular position along material attenuation regions i.e. material bridges |
CN101494219A (en) * | 2008-01-25 | 2009-07-29 | 珠海科利尔能源科技有限公司 | High-power LED aluminum substrate integrated module |
WO2010002156A2 (en) * | 2008-06-30 | 2010-01-07 | Park Chang Soo | Printed circuit board for led light capable of being easily changed into polyhedral and polygonal shapes |
EP2295849A1 (en) * | 2009-09-09 | 2011-03-16 | Peugeot Citroën Automobiles SA | Vehicle light |
CN201904968U (en) * | 2010-10-27 | 2011-07-20 | 厦门立达信光电有限公司 | Bridge type substrate component capable of being bent into preset shapes |
CN102595788A (en) * | 2012-03-05 | 2012-07-18 | 蔡子丰 | Three-dimensional metal-based Printed Circuit Board (PCB) assembly structure, corresponding light-emitting lamp and manufacturing method |
CN202603045U (en) * | 2012-03-05 | 2012-12-12 | 蔡子丰 | Three-dimensional metal-matrix PCB assembly structure and corresponding light emitting light fixture thereof |
Also Published As
Publication number | Publication date |
---|---|
CN102595788B (en) | 2015-02-04 |
CN102595788A (en) | 2012-07-18 |
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