CN105588025A - LED lighting device - Google Patents

LED lighting device Download PDF

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Publication number
CN105588025A
CN105588025A CN201410654638.7A CN201410654638A CN105588025A CN 105588025 A CN105588025 A CN 105588025A CN 201410654638 A CN201410654638 A CN 201410654638A CN 105588025 A CN105588025 A CN 105588025A
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CN
China
Prior art keywords
lighting device
led lighting
substrate
heat abstractor
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410654638.7A
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Chinese (zh)
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CN105588025B (en
Inventor
肖锟
暴志峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carent Lighting Solutions Co ltd
Kensumo Lighting Usa Co ltd
Saivante Technology Co ltd
Original Assignee
GE Lighting Solutions LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GE Lighting Solutions LLC filed Critical GE Lighting Solutions LLC
Priority to CN201410654638.7A priority Critical patent/CN105588025B/en
Publication of CN105588025A publication Critical patent/CN105588025A/en
Application granted granted Critical
Publication of CN105588025B publication Critical patent/CN105588025B/en
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Anticipated expiration legal-status Critical

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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

The invention relates to an LED lighting device which comprises a lamp cap, a shell, a base plate and a plurality of LED chips arranged on the base plate. The shell comprises a lamp housing and a heat dissipation device connected to the top of the lamp housing. The bottom of the lamp housing is connected with the lamp cap. A containing cavity is formed between the lamp cap and the shell. The base plate is assembled in the containing cavity. The base plate comprises a top end and a bottom end, the top end is connected with the heat dissipation device, and the bottom end is connected with the heat dissipation device. According to the LED lighting device disclosed by the invention, the heat dissipation device is assembled at the top of the lamp housing, the top end of the base plate is connected with the heat dissipation device, and the bottom end of the base plate is connected with the lamp cap, so that the heat dissipation effect of the LED lighting device can be enhanced; and a vertical support structure of the LED chips is formed, so that the lighting effect of the LED lighting device can be improved.

Description

LED lighting device
Technical field
The present invention is about a kind of LED lighting device, relating in particular to a kind of simple in structure, light transmittance can be better,The better LED lighting device of radiating effect.
Background technology
Traditional lighting device is incandescent lighting device, and its illumination is lower, and light is not bright, not energy-conservation.After incandescent lighting device, occurred fluorescence lamp lighting device, although it is energy-conservation, light is brighter,Due to a large amount of fluorescent material that uses, therefore environmental protection not. There is at present more energy-conservation and LED light environmental protectionSource has produced LED lighting device thereupon.
LED lighting device is applied to daily due to the manufacturing cost of high efficiency and reduction more and moreIn illumination. Actual light emitting diode is owing to being arranged on support member in the most situation of its less size,On this external this support member, other element can also be installed, for example other light emitting diode, lead-in wire orCircuit.
But existing LED lighting device common configuration complexity, mainly comprises three parts: lamp holder, neckAnd lamp housing. Lamp holder is all generally standard component. Neck generally has plastics and metal bi-material. Neck is generalBe lighttight, be mainly used in connecting and heat radiation or placement driver. Lamp housing generally has plastic and glass twoKind of material, is used for printing opacity. Existing LED lighting device generally needs additionally to set up heat abstractor, heat radiationDevice generally can see from outside and profile strange, the therefore profile of existing LED lighting device and insideStructure has bigger difference compared with ordinary incandescent lamp lighting device.
China publication application CN101907240A has disclosed a kind of existing LED lighting device, instituteState LED lighting device and comprise LED module, power supply, radiator, lamp holder and cloche. LED moduleBe arranged on circular cooling base, outside LED module, be covered with a hemispheroidal cloche, glassUnder cover, connecting radiator, is lamp holder below radiator, and power supply is arranged in the space within radiator.
The limitation of this existing LED lighting device is mainly limited directionality light output. UsingWhen the high output of tradition LED lighting device, heat abstractor or radiator are arranged on lamp holder and the lamp of lighting deviceBetween shell (or lid), lamp housing or lid are generally used for the light of protecting LED and scattering to launch from LED.It's a pity, the heat abstractor of heat or the size of radiator that the LED that is enough to dissipate generates stop conventionallyApproach the output of the light of lighting device substrate. This lighting device is in desk lamp upward time, at lighting deviceThe low-density light output and the shade that in region below, produce make most of user uncomfortable.
And traditional LED lighting device conventionally need respectively gripper shoe for LED module is installed andIn addition for the substrate of LED drive circuit is installed. Described substrate is generally perpendicular to LED mould is installedThe gripper shoe of group. Assemble traditional LED lighting device multiple part time conventionally need hand assembled, such as,Carrying out machinery, electric and hot (heat transfer) is connected. Therefore increased the system of traditional LED lighting deviceCause this.
Therefore, be necessary to provide a kind of novel LED lighting device, the LED lighting device that this is novelCan replace incandescent lamp, on the one hand otherwise infringement light output characteristic want on the other hand to reduce or eliminate handWork number of assembling steps, thereby the manufacturing cost of reduction LED lighting device. Simultaneously need to be at LED illumination dressPut interior raising heat radiation, to reduce the needs for large-sized external heat abstractor, thereby in general orientation scope moreLight output is provided.
Summary of the invention
Technical problem to be solved by this invention is to overcome the deficiencies in the prior art, and a kind of light transmittance energy is providedGood, luminous LED lighting device even, simple in structure, easy to assembly.
A kind of LED lighting device, is characterized in that, it comprises lamp holder, housing, substrate and installsMultiple LED chips on substrate. Described housing comprises lamp housing and is connected in the heat abstractor at lamp housing top.The bottom of described lamp housing is connected in described lamp holder. Between described lamp holder and housing, form a host cavity. DescribedSubstrate mounting is in described host cavity. Described substrate comprises a top and a bottom, described top and heat radiationDevice is connected, and described bottom is connected with lamp holder.
LED lighting device of the present invention is mounted on heat abstractor at the top of lamp housing, simultaneously the top of substrateBe connected with heat abstractor, the bottom of substrate is connected with lamp holder, can strengthen on the one hand thus LED illumination dressThe radiating effect of putting, substrate in batch is located at and between heat abstractor and lamp holder, forms the perpendicular of LED chip on the other handVertical supporting construction, can make the LED chip can be luminous to all directions, luminous evenly, illumination effect is good.
Brief description of the drawings
Be described for embodiments of the present invention in conjunction with the drawings, the present invention may be better understood,In the accompanying drawings:
Figure 1 shows that the assembling schematic diagram of the first embodiment of LED lighting device of the present invention;
Figure 2 shows that the decomposing schematic representation of the LED lighting device shown in Fig. 1;
Figure 3 shows that along the cutaway view of the A-A direction of the LED lighting device shown in Fig. 1;
Figure 4 shows that the assembling schematic diagram of the second embodiment of LED lighting device of the present invention;
Figure 5 shows that the decomposing schematic representation of the LED lighting device shown in Fig. 4;
Figure 6 shows that the assembling schematic diagram of another angle of the LED lighting device shown in Fig. 4;
Figure 7 shows that along the cutaway view of the B-B direction of the LED lighting device shown in Fig. 6;
Figure 8 shows that the assembling schematic diagram of the 3rd embodiment of LED lighting device of the present invention;
Figure 9 shows that the decomposing schematic representation of the LED lighting device shown in Fig. 8;
Figure 10 shows that along the cutaway view of the C-C direction of the LED lighting device shown in Fig. 8.
Detailed description of the invention
Unless otherwise defined, technical term used herein or scientific terminology are led under shoulding be the present inventionIn territory, there is the ordinary meaning that the personage of general technical ability understands. Patent application specification of the present invention and power" first " " second " using in profit claim and similarly word do not represent any order, quantityOr importance, and be just used for distinguishing different parts. Equally, " one " or " one " etc.Similar word does not represent restricted number yet, but represents to exist at least one. " comprise " or " comprising "Meaning to appear at " comprising " or " comprising " element or object above etc. similar word contains" comprise " now or element or object that " comprising " enumerates below and be equal to, do not get rid of itHis element or object. " connection " or " being connected " etc. similarly word be not defined in physics orThe connection of machinery, but can comprise directly or indirectly electrical connection, or comprise thermally coupled,Heat conduction connects and the connection etc. of conducting heat.
Fig. 1 to Fig. 3 has illustrated the LED lighting device 100 of the first embodiment of the present invention. This LED shinesBright device 100 comprises lamp holder 101, housing 102, substrate 103, drive circuit assembly 104, Yi JiduoIndividual LED chip 105. Between described lamp holder 101 and housing 102, form a host cavity 107, for receivingHold described substrate 103 and be mounted on drive circuit assembly 104 and the multiple LED chip on substrate 103105。
Described lamp holder 101 is standardized screw element in current embodiment, and its model is E26, whenCan be also so E27 or other models. Described lamp holder 101 is provided with internal thread 1011, connects for fixingBody contact body 102.
Shown in Figure 2, described housing 102 comprises two parts, comprises lamp housing 108 and heat radiation dressPut 106. The profile of described housing 102 and the shape of existing incandescent lamp are roughly the same. Described lamp housing 108Comprise the top 1081 that is roughly spherical and be positioned at the roughly cylindrical bottom 1082 of below, top.The top 1081 of described lamp housing 108 is connected with heat abstractor 106. The bottom 1082 of described lamp housing 108Be connected with lamp holder 101. The top 1081 of described lamp housing 108 is provided with the opening 1083 of a circle, usesIn accommodating described heat abstractor 106. The inner side of the bottom 1082 of described lamp housing 102 is provided with ribs 1084,For the bottom 1032 of fixing base 103. Described lamp housing 108 is by external screw thread (the not figure of bottom 1082Show) be threaded and fix with the internal thread 1011 of lamp holder 101. Described lamp housing 108 knot that is formed in oneStructure, generally can adopt glass manufacture. In addition, described lamp housing 108 can also be made of plastics, and this makesManufacture simple and with low cost. Described lamp housing 108 can be set as complete printing opacity, can certainly partPrinting opacity.
Described substrate 103 is existing board structure of circuit, can be existing aluminum base circuit board or CEM3 multipleClose substrate. Described substrate 103 comprises at least three layers, and wherein both sides are metal conducting layer, and intermediate course isThermal insulation layer. The metal conducting layer of described substrate 103 is to be made up of Copper Foil, with LED chip 105The leg electrical connection of pad and electronic devices and components (not shown). The intermediate insulation of described substrate 103Heat-conducting layer, is to be made up of organic polymer and glass fibre, and basic electric insulation is provided, again simultaneouslyThe thermal diffusion that LED chip 105 can be sent is gone out.
Described substrate 103 is fixed between lamp holder 101 and heat abstractor 106, at lamp holder 101 and housingThe 102 interior vertical extensions of host cavity 107 that form, form the setting supporting construction of LED chip 105 with this.This substrate 103 is roughly flat, and the width of the bottom 1032 of described substrate 103 is less than top1031 width. The size of top 1031 width of this substrate 103 is less than the top 1081 of lamp housing 108The size of opening 1083. Described substrate 103 has two parallel the first relative installed surface 1033 HesThe second installed surface 1034. Described LED chip 105 is installed on the first installed surface 1033 of described substrate 103Upper end. Erectting the substrate 103 arranging can provide LED chip 105 better lighting angle, canLuminous to all directions, improve the luminescent properties of LED lighting device 100, light transmittance can be better. ?In the present embodiment, LED chip 105 always has 12, is divided into two groups, and every group has 6 LED chips 105.Described LED chip 105 aligns between two and is arranged at the first installed surface 1033 and second installation of substrate 103On face 1034. Arcuate structure is arranged on the top 1031 of substrate 103, is convenient to heat abstractor 106 to pacifyBe contained on described substrate 103.
Described drive circuit assembly 104 is also arranged on the first installed surface 1033 of substrate 103, is positioned at manyThe below of individual LED chip 105. Described drive circuit assembly 104 is by 100 volts of interchanges to 240VElectricity is converted to direct current, luminous with driving LED chip 105. Described drive circuit assembly 104 is knownCircuit structure, only do simple description at this. This drive circuit assembly 104 mainly comprises three parts:Filter circuit 1041, circuit for power conversion 1042 and control circuit (not shown). This filter circuit1041 are used for filtering the clutter in alternating current. Described circuit for power conversion 1042, can be converted to alternating currentDirect current, its comprised again rectifier bridge stack (not shown), transformer (1043), triode (not shown),And back segment rectification electrochemical capacitor 1044. Control circuit (not shown), by the action of opening and turn-offing,To realize the stable work of circuit for power conversion 1042.
Described heat abstractor 106 is roughly rounded, its shape and just big or small and LED lighting device 100The opening 1083 of lamp housing 108 consistent. Described heat abstractor 106 can be by having good heat radiating or thermal conductivityCan material make, for example metal, there is the composite plastic of heat conductivility or there is the pottery of heat conductivilityThe materials such as porcelain are made. The bottom of described heat abstractor 106 is provided with holding section 1061, for by heat abstractor106 are fixed on the top 1031 of substrate 103. Described holding section 1061 comprises two parallel be oppositely arranged protrudingPiece, forms a conduit 1062 between this projection. The thickness of the width of described conduit 1062 and substrate 103Roughly the same, the top of substrate 103 can be held, thereby by stable heat abstractor 106 base that is retained onThe top 1031 of plate 103. Described holding section 1061 can be two projections that be arranged in parallel, also canMultiple projections that be arranged in parallel.
When assembling, can first 106 groups of heat abstractors be located on the top 1031 of substrate 103, then willHeat abstractor 106 is put into lamp housing 108 together with substrate 103, finally by lamp holder 101 and lamp housing 108Fit together. The LED lighting device 100 of embodiments of the invention is simple in structure, easy to assembly, canTo realize assembling automation, enhance productivity, reduce production costs. In addition by described heat abstractor 106Group is located at the top 1081 of lamp housing 108, and described substrate 103 is fixed on lamp holder 101 and heat abstractor 106Between, form the setting supporting construction of LED chip 105, can improve the luminous effect of LED chip 105Really, improve light transmittance. Described heat abstractor 106 is connected with substrate 103, can be by LED chip 105 HesThe heat that substrate 103 produces is directly derived lamp housing 108, has good radiating effect.
Fig. 4 to Fig. 7 shows the LED lighting device 200 of the second embodiment of the present invention. This LED shinesBright device 200 comprises lamp holder 201, housing 202, substrate 203, drive circuit assembly 204, Yi JiduoIndividual LED chip 205. The lamp holder 201 of LED lighting device 200, substrate 203 and in the second embodimentGeneral structure and the operation principle of drive circuit assembly 204 and the first embodiment are similar, do not repeat them here.
The difference of the present embodiment and the first embodiment is, the shape of described housing 202 is different fromOne embodiment, is roughly column. Described housing 202 comprises the lamp housing 208 of column and is connected in lamp housing 208The U-shaped heat abstractor 206 at top. The top of described lamp housing 208 is provided with U-shaped opening 2083, usesIn accommodating the heat abstractor 206 that is equally U-shaped setting. Described heat abstractor 206 is provided with U-shaped arm 2062,The inner side of this U-shaped arm 2062 is provided with the first plat part 2063 and the second plat part that relatively stagger and arrange2064. Described substrate 203 comprises the first installed surface 2033 and second for LED chip 205 is installedInstalled surface 2034. Described LED chip 205 be arranged at respectively the first installed surface 2033 upper ends left side andThe right side of the second installed surface 2034 upper ends. First of described the first plat part 2063 and substrate 203 installedThe part that face 2033 upper ends do not arrange LED chip 205 fits. Described the second plat part 2064 and baseThe part that the second installed surface 2034 upper ends of plate 203 do not arrange LED chip 205 fits. From heat radiationThe first plat part 2063 and the second plat part that the inner side of the U-shaped arm 2062 of device 206 extends out2064 have increased the contact area of heat abstractor 206 and substrate 203, have increased heat-conducting area, have strengthenedRadiating effect. Meanwhile, described substrate 203 is clamped in first flat that heat abstractor 206 relatively staggers and arrangesIn the middle of flat portion 2063 and the second plat part 2064, substrate 203 can be stably fixed to heat abstractor 206And between lamp holder 201, the structure of fixing base 203 need not be set in addition again.
Fig. 8 to Figure 10 shows the LED lighting device 300 of the third embodiment of the present invention. This LEDLighting device 300 comprise lamp holder 301, housing 302, substrate 303, drive circuit assembly 304 andMultiple LED. The lamp holder 301 of LED lighting device 300, substrate 303 and driving electricity in the 3rd embodimentGeneral structure and the operation principle of road assembly 304 and the first embodiment and the second embodiment are all similar, at thisRepeat no more. The housing 302 of the lighting device 300 of the 3rd embodiment and the lighting device of the second embodiment200 housing 202 shapes are identical, also comprise the lamp housing 308 and the U that is connected in lamp housing 308 tops of columnThe heat abstractor 306 of type. The top of described lamp housing 208 is provided with U-shaped opening 3083, same for accommodatingSample is the heat abstractor 306 of U-shaped setting.
Shown in Figure 9, described heat abstractor 306 is provided with U-shaped arm 3062 equally, this U-shaped arm3062 inner side is provided with the first plat part 3063 and the second plat part 3064 that relatively stagger and arrange. DescribedSubstrate 303 comprises the first installed surface 3033 and the second installed surface 3034 for LED chip 305 is installed.Described LED chip 305 is arranged at respectively left side and second installed surface of the first installed surface 3033 upper endsThe right side of 3034 upper ends. The first installed surface 3033 upper ends of described the first plat part 3063 and substrate 203The part that LED chip 305 is not set fits. Of described the second plat part 3064 and substrate 303The part that two installed surface 3034 upper ends do not arrange LED chip 305 fits.
The difference of the lighting device 300 of the 3rd embodiment and the lighting device 200 of the second embodiment existsIn, described lighting device 300 also comprises reflection cap 309, described reflection cap 309 is housed in lamp holder 302In the host cavity 307 forming with housing 302. Described reflection cap 309 is by having better light reflective propertiesPlastics are made. In the 3rd embodiment, reflection cap 309 comprises two independently the first cover plates 3091 and secondCover plate 3092. The first cover plate 3091 be provided with towards a side of substrate 303 be oppositely arranged up and down firstSnap fit 3093. Described the first cover plate 3091 is fastened on heat abstractor 306 by the first snap fit 3093On the first plat part 3063. Described the first cover plate 3091 is also at the first installed surface 3033 of counterpart substrate 303On corresponding first through hole 3094 that is provided with in position of LED chip 305, by corresponding LED chip 305Expose. Described the first cover plate 3091 is also established on away from substrate 303 directions on the first through hole 3094 sidesThere is the first protuberance 3095, the LED chip 305 on can reflection substrate 303 first installed surfaces 3031Light, makes the LED chip 305 on the first installed surface 3031 luminous more even. The second cover plate 3092 HesShape and the structure of the first cover plate 3091 are similar. The second cover plate 3092 is same in the side towards substrate 303Sample is provided with the second snap fit 3096 being oppositely arranged up and down, the second cover plate 3092 can be fastened on to heat abstractorOn the second plat part 3064 of 306. Described the second cover plate 3092 is also pacified at second of counterpart substrate 303Corresponding second through hole 3097 that is provided with in position of the LED chip 305 on dress face 3034, by corresponding LEDChip 305 exposes. Described the second cover plate 3091 is also provided with outward extending on the second through hole 3097 sidesThe second protuberance 3098, the light of the LED chip 305 on can reflection substrate 303 second installed surfaces 3034,Make the LED chip 305 on the second installed surface 3031 luminous more even.
When assembling, can first 306 groups of U-shaped heat abstractors be located to the top of substrate 303, then willThe first cover plate 3091 be fastened on heat abstractor 306 the first plat part 3063 on, by the second cover plate 3092Be fastened on heat abstractor 306 the second plat part 3064 on, then by heat abstractor 306 and substrate 303Group is located in lamp housing 308 together, finally lamp holder 301 is fixed on to the bottom of lamp housing 308.
The reflection cap 309 of the LED lighting device 300 of the 3rd embodiment is not limited to embodiments of the present invention,Reflection cap 309 can be two cover plates independently in present embodiment, can be also integrated reflectionLid. As long as reflection cap 309 can cover the some or all of of substrate 303, and expose substrate 303 simultaneouslyOn LED chip 305. By set up one in the host cavity 307 of LED lighting device 300Reflection cap 309, can strengthen LED chip 305 reflection of lights, can make the distribution of light more even.
Although describe the present invention in conjunction with specific embodiment, those skilled in the art canTo understand, can make many amendments and modification to the present invention. Therefore, recognize claimsIntention be to be encompassed in all such modifications and the modification in true spirit of the present invention and scope.

Claims (10)

1. a LED lighting device, is characterized in that, it comprises:
Lamp holder;
Housing, comprises lamp housing and the heat abstractor that is connected in lamp housing top, and the bottom of described lamp housing is connected inDescribed lamp holder;
Host cavity, is arranged between described lamp holder and housing;
Substrate, is assembled in described host cavity, and described substrate comprises a top and a bottom, described topBe connected with heat abstractor, described bottom is connected with lamp holder; And
Multiple LED chips are installed on described substrate.
2. LED lighting device as claimed in claim 1, is characterized in that: described LED illumination dressPut and also comprise the drive circuit assembly being also mounted on substrate.
3. LED lighting device as claimed in claim 2, is characterized in that: described drive circuit groupPart is mounted on the below of described multiple LED chips.
4. LED lighting device as claimed in claim 2, is characterized in that: described lamp housing is at topBe provided with an opening, described opening and host cavity are communicated with, and described heat abstractor covers described opening.
5. LED lighting device as claimed in claim 4, is characterized in that: described lamp housing is spherical,Described heat abstractor is rounded, and described lamp housing is provided with at top for accommodating the circular of described heat abstractorOpening.
6. LED lighting device as claimed in claim 5, is characterized in that: described heat abstractor existsBottom is provided with holding section, and described holding section comprises at least two projections respect to one another, for fixing baseTop.
7. LED lighting device as claimed in claim 4, is characterized in that: described lamp housing is column,Described heat abstractor is U-shaped, and described lamp housing is provided with at top for accommodating the U-shaped of described heat abstractorOpening.
8. LED lighting device as claimed in claim 7, is characterized in that: described heat abstractor bagDraw together U-shaped arm, at least one plat part extends out from the inner side of the U-shaped arm of heat abstractor, at least describedPlat part and substrate thermal conduction communication, in order to strengthen radiating effect.
9. LED lighting device as claimed in claim 8, is characterized in that: described substrate comprises twoIndividual parallel relative installed surface, described heat abstractor is provided with two plat parts, and described two plat parts are respectivelyContact with two installed surfaces of substrate, in order to strengthen radiating effect.
10. LED lighting device as claimed in claim 7, is characterized in that: described LED illuminationDevice also comprises a reflection cap, and described reflection cap group is located in host cavity, and described reflection cap at least covers instituteState a part for substrate, in order to improve the light output of multiple LED chips.
CN201410654638.7A 2014-11-17 2014-11-17 LED lighting device Active CN105588025B (en)

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Application Number Priority Date Filing Date Title
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CN105588025B CN105588025B (en) 2020-02-21

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CN107435821A (en) * 2016-05-26 2017-12-05 漳州立达信光电子科技有限公司 Led
CN109140263A (en) * 2017-06-14 2019-01-04 通用电气照明解决方案有限公司 LED light
WO2019037752A1 (en) * 2017-08-23 2019-02-28 Zhejiang Shenghui Lighting Co., Ltd. Led lamp

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CN103443537A (en) * 2011-01-11 2013-12-11 皇家飞利浦有限公司 Lighting device
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Publication number Priority date Publication date Assignee Title
CN107435821A (en) * 2016-05-26 2017-12-05 漳州立达信光电子科技有限公司 Led
CN109140263A (en) * 2017-06-14 2019-01-04 通用电气照明解决方案有限公司 LED light
US10794544B2 (en) 2017-06-14 2020-10-06 Consumer Lighting (US), LLC LED lamp
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WO2019037752A1 (en) * 2017-08-23 2019-02-28 Zhejiang Shenghui Lighting Co., Ltd. Led lamp

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