CN101153703A - Cooling structure of LED lamp - Google Patents
Cooling structure of LED lamp Download PDFInfo
- Publication number
- CN101153703A CN101153703A CNA2006101226049A CN200610122604A CN101153703A CN 101153703 A CN101153703 A CN 101153703A CN A2006101226049 A CNA2006101226049 A CN A2006101226049A CN 200610122604 A CN200610122604 A CN 200610122604A CN 101153703 A CN101153703 A CN 101153703A
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- insulating layer
- wiring board
- metal level
- led
- led lamp
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a heat dissipation structure of LED lamp, aiming at providing a heat dissipation structure of LED lamp which has the advantages of good heat dissipation effect, long LED service life and high integration level. The invention comprises a plurality of LEDs(1), a circuit board(2), a heat conduction insulating layer(3), a metallic layer(4) and a bonding pad(5), wherein, the heat conduction insulating layer(3) is coated on the surface of the circuit board(2), the metallic layer(4) is coated on the outer surface of the heat conduction insulating layer(3). The invention can be widely applied to the LED illuminating field.
Description
Technical field
The present invention relates to a kind of radiator structure of LED lamp, relate in particular to the radiator structure of a kind of integrated use LED as lighting source.
Background technology
LED has long characteristics of the high and low heating of luminous efficiency, power saving and life-span, therefore uses more and more widely.Single led luminous quantity is limited, if will be used for normal lighting, then will especially for the higher light fixtures such as shot-light of brightness requirement, require integrated LED more the densely arranged integrated together use of a plurality of LED, and promptly closeness is higher.But, LED is very high to the temperature requirement of environment, the LED lantern festival that high integration is used causes heat to accumulate in a large number in the less space and can not distribute rapidly, when LED and environment temperature reach balance, the temperature of LED is very high, thereby cause the decay of LED illumination and aging rapidly, shorten service life greatly.Present LED light fixture generally is that LED is integrated on traditional single face wiring board, because traditional wiring board thermal resistance is big, and heat transfer, area of dissipation are little, can only lean on the heat radiation of LED pin, therefore its radiating efficiency is very low, thereby has limited the scope of application of high illuminance LED lamp.
So existing technology has the following disadvantages: radiating effect is poor, influence life-span and the integrated level of LED.
Summary of the invention
Technical problem to be solved by this invention is to overcome the deficiencies in the prior art, and the radiator structure of the LED lamp of a kind of good heat dissipation effect, raising LED life-span and integrated level is provided.
The technical solution adopted in the present invention is: the present invention includes several LED, wiring board, pad, the radiator structure of described LED lamp also comprises heat conductive insulating layer, metal level, described heat conductive insulating layer is covered in described PCB surface, and described metal level is covered in described heat conductive insulating layer outer surface.
Described wiring board is a double-sided wiring board, and described heat conductive insulating layer, described metal level respectively have one deck respectively in described wiring board upper and lower surface.
The present invention also comprises several screws, crosses the tin hole, and described screw contacts with described heat conductive insulating layer, described metal level, and described bonding pad area strengthens, and the described aperture, tin hole of crossing is strengthened.
The described metal level outer surface that is positioned at below the described wiring board is corrugated or zigzag.
Described heat conductive insulating layer adopts the silica type soft material to make, and described metal level is adopted and is made of aluminum or copper.
The invention has the beneficial effects as follows: owing to the present invention includes the heat conductive insulating layer, metal level, described heat conductive insulating layer is covered in described PCB surface, described metal level is covered in described heat conductive insulating layer outer surface, the heat of each LED passes on the described pad by pin, described insulating heat-conductive layer by described PCB surface is delivered to described metal level again, by described metal level heat is dispersed in the air, described metal level has improved the area of dissipation of LED greatly, reduced the thermal resistance in the hot transmission, can solve high-density arrangement LED because of the problem of aging of heat radiation due to smooth, improve the service life of LED, thereby reduce the integrated cost that the illumination of LED lamp is used, be convenient to high density LED lamp and extensively enter the normal lighting field, so good heat dissipation effect of the present invention can improve LED life-span and integrated level;
Because wiring board of the present invention is a double-sided wiring board, described heat conductive insulating layer, described metal level respectively have one deck respectively in described wiring board upper and lower surface, adopt this double-sided wiring board to add the structure of two heat conductive insulating layers, double-metal layer, the heat of LED is distributed from two surfaces up and down of described wiring board, more help heat radiation, so radiating effect of the present invention is better;
Because the present invention also comprises several screws, crosses the tin hole, described screw contacts with described heat conductive insulating layer, described metal level, described screw also can conduct and distribute a part of heat, described bonding pad area strengthens and the described aperture, tin hole of crossing is strengthened, more help the heat of LED pin is delivered to described heat conductive insulating layer rapidly and passes to described metal level, two surface radiatings are even up and down can to make simultaneously described wiring board, with better heat radiation; Because the described metal level outer surface that is positioned at below the described wiring board is corrugated or zigzag, more increased the area of dissipation that contacts of described metal level and air, so radiating effect of the present invention is better.
Description of drawings
Fig. 1 is a structural representation of the present invention.
The specific embodiment
As shown in Figure 1, the present invention includes LED1, wiring board 2, heat conductive insulating layer 3, metal level 4, pad 5, screw 6, cross tin hole 7, described heat conductive insulating layer 3 is covered in described wiring board 2 surfaces, described metal level 4 is covered in described heat conductive insulating layer 3 outer surface, described wiring board 2 is that length is 329mm, width is the rectangle double-sided wiring board of 220mm, on described wiring board 2, arrange the LED of 450 φ 8mm or the LED of 320 φ 10mm, described heat conductive insulating layer 3, described metal level 4 respectively has one deck respectively in described wiring board 2 upper and lower surfaces, be positioned at described metal level 4 outer surface indentations below the described wiring board 2 to increase area of dissipation, can certainly adopt corrugated, described heat conductive insulating layer 3 adopts the silica type soft material to make, described metal level 4 adopts aluminium to make, can certainly adopt the metal of other good heat dissipation such as copper to make, described screw 6 and described heat conductive insulating layer 3, described metal level 4 contacts, the quantity of described screw 6 can be arranged as much as possible according to the idle space of wiring board, described pad 5 areas strengthen, described 7 apertures, tin hole of crossing are strengthened, in order to better heat conduction, certain described screw 6 also can adopt rivet.
The heat of LED1 of the present invention passes on the described pad 5 by pin, described insulating heat-conductive layer 3 by described wiring board 2 surfaces is delivered to described metal level 4 again, by described metal level 4 heat is dispersed in the air, described metal level 4 has improved the area of dissipation of LED greatly, reduced the thermal resistance in the hot transmission, after tested, be under 20 ℃ the situation in environment temperature, the heat radiation equilibrium temperature of the common LED lamp that same density is arranged is 70 ℃～75 ℃, the present invention in environment temperature be under 30 ℃ the situation heat radiation equilibrium temperature between 43 ℃～45 ℃, as seen, therefore radiating effect of the present invention is very good, can solve high-density arrangement LED because of the problem of aging of heat radiation due to smooth, the service life of improving LED, thereby reduce the integrated cost that the illumination of LED lamp is used, be convenient to high density LED lamp and extensively enter the normal lighting field.
The present invention can be widely used in the LED lighting field.
Claims (5)
1. the radiator structure of a LED lamp, comprise several LED (1), wiring board (2), pad (5), it is characterized in that: the radiator structure of described LED lamp also comprises heat conductive insulating layer (3), metal level (4), described heat conductive insulating layer (3) is covered in described wiring board (2) surface, and described metal level (4) is covered in described heat conductive insulating layer (3) outer surface.
2. the radiator structure of a kind of LED lamp according to claim 1 is characterized in that: described wiring board (2) is a double-sided wiring board, and described heat conductive insulating layer (3), described metal level (4) respectively have one deck respectively in described wiring board (2) upper and lower surface.
3. the radiator structure of a kind of LED lamp according to claim 2, it is characterized in that: the radiator structure of described LED lamp also comprises several screws (6), crosses tin hole (7), described screw (6) contacts with described heat conductive insulating layer (3), described metal level (4), described pad (5) area strengthens, and the described aperture, tin hole (7) of crossing is strengthened.
4. the radiator structure of a kind of LED lamp according to claim 2 is characterized in that: be positioned at following described metal level (4) outer surface of described wiring board (2) and be corrugated or zigzag.
5. according to claim 1 or 2 or the radiator structure of 3 or 4 described a kind of LED lamps, it is characterized in that: described heat conductive insulating layer (3) adopts the silica type soft material to make, and described metal level (4) is adopted and is made of aluminum or copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101226049A CN101153703A (en) | 2006-09-30 | 2006-09-30 | Cooling structure of LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101226049A CN101153703A (en) | 2006-09-30 | 2006-09-30 | Cooling structure of LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101153703A true CN101153703A (en) | 2008-04-02 |
Family
ID=39255501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101226049A Pending CN101153703A (en) | 2006-09-30 | 2006-09-30 | Cooling structure of LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101153703A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101694271A (en) * | 2009-05-26 | 2010-04-14 | 北京中庆微数字设备开发有限公司 | LED module and LED display device |
| CN102164074A (en) * | 2011-03-15 | 2011-08-24 | 深圳市恒宝通光电子有限公司 | Heat sink of Ethernet SFP (Small Form-factor Pluggable) electric port module |
| CN106895278A (en) * | 2017-03-20 | 2017-06-27 | 京东方科技集团股份有限公司 | A kind of preparation method of LED, backlight module, display device and backlight module |
-
2006
- 2006-09-30 CN CNA2006101226049A patent/CN101153703A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101694271A (en) * | 2009-05-26 | 2010-04-14 | 北京中庆微数字设备开发有限公司 | LED module and LED display device |
| CN102164074A (en) * | 2011-03-15 | 2011-08-24 | 深圳市恒宝通光电子有限公司 | Heat sink of Ethernet SFP (Small Form-factor Pluggable) electric port module |
| CN106895278A (en) * | 2017-03-20 | 2017-06-27 | 京东方科技集团股份有限公司 | A kind of preparation method of LED, backlight module, display device and backlight module |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20080402 |