CN201237097Y - LED luminous panel - Google Patents
LED luminous panel Download PDFInfo
- Publication number
- CN201237097Y CN201237097Y CNU2008200878567U CN200820087856U CN201237097Y CN 201237097 Y CN201237097 Y CN 201237097Y CN U2008200878567 U CNU2008200878567 U CN U2008200878567U CN 200820087856 U CN200820087856 U CN 200820087856U CN 201237097 Y CN201237097 Y CN 201237097Y
- Authority
- CN
- China
- Prior art keywords
- led
- electric conductor
- aluminium matter
- base plate
- matter heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 46
- 239000004411 aluminium Substances 0.000 claims abstract description 46
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 40
- 235000012431 wafers Nutrition 0.000 claims abstract description 33
- 239000004020 conductor Substances 0.000 claims abstract description 24
- 239000004568 cement Substances 0.000 claims abstract description 10
- 230000003287 optical effect Effects 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 33
- 230000005855 radiation Effects 0.000 claims description 15
- 150000001398 aluminium Chemical class 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 6
- 230000004888 barrier function Effects 0.000 claims description 4
- 239000003292 glue Substances 0.000 abstract description 2
- 238000009434 installation Methods 0.000 abstract description 2
- 239000006185 dispersion Substances 0.000 abstract 1
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Images
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
An LED lighting slab includes a base plate, a first electric conductor, a second electric conductor and a plurality of LED wafers electrically connected between the first electric conductor and the second electric conductor, wherein, the base plate adopts an aluminium radiating base plate; the first electric conductor and the second electric conductor are printed on the upper surface of the aluminium radiating base plate through an insulating glue, and a circle of aluminium radiating wall is fixed on the upper surface of the aluminium radiating base plate through an insulating layer; all of the LED wafers are surrounded inside the aluminium radiating wall and are fixed on the aluminium radiating base plate sequentially; and the upper part of each LED wafer is filled with optical cement blocked by the aluminium radiating wall. Since the utility model skillfully utilizes the characteristic of good diathermancy of the aluminium base plate and the aluminium radiating frame, and uses the structure of the LED wafers capable of radiating heat from the bottom parts and around at the same time, the LEDs are distributed densely on the base plate so as to have the light source with soft light, high brightness and good heat dispersion, and at the same time the LED lighting slab has the advantages of low probability of falling into pieces and capability of being made into various shapes according to requirements, so as to meet the installation requirements of various lights.
Description
Technical field
The utility model relates to a kind of illuminator, specifically refers to a kind of luminous plaque of the LED of having wafer.
Background technology
Because LED environmental-protection, energy-conservation and long service life, sufficient brightness, thereby be widely used in each field.As common energy-saving lamp with the tubular light fitting of single LEDs wafer, be often used as the indicator lamp of relative low energy, but the former is because of the existence of bulb, very easily causes the appearance of broken phenomenon.And the latter is because be spot light, and light is comparatively dazzling, and brightness can't reach the requirement of standard illuminants product.For this reason, people want on printed substrate to place a plurality of LED wafers and overcome above-mentioned defective, but the LED wafer intensive after, in use can produce a large amount of heats, if this heat can't obtain distributing effectively in time, the functional reliability that causes light fixture is low, that service life is short drawback.Thereby when actual fabrication, the comparatively evacuation that the LED wafer on printed substrate is arranged, even if but like this, it is soft inadequately also to exist light, and total brightness is not high, and can't satisfy the illuminance requirement in some places.
Summary of the invention
Technical problem to be solved in the utility model is the present situation at prior art, and a kind of perfect heat-dissipating, light is soft, brightness is high LED luminous plaque are provided.
The utility model solves the problems of the technologies described above the technical scheme that is adopted: this LED luminous plaque comprises substrate, be used to receive first of input voltage, second electric conductor and a plurality of mutual electrical connection also are connected in first, LED wafer between second electric conductor, it is characterized in that: described substrate is an aluminium matter heat-radiating substrate, described first, second electric conductor is printed on the upper surface of this aluminium matter heat-radiating substrate by insulating cement, on this aluminium matter heat-radiating substrate upper surface, also be fixed with a circle aluminium matter heat radiation wall simultaneously by insulating barrier, above-mentioned each LED wafer is enclosed in this aluminium matter heat radiation wall and is fixed on successively on the described aluminium matter heat-radiating substrate, and is filled with on each LED wafer by the described aluminium matter heat radiation optical cement that wall kept off.
In order to have better radiating effect, lower surface at aluminium matter heat-radiating substrate can be designed to the roughness structure to increase area of dissipation, consider the convenience of processing simultaneously, this roughness structure can be formed by a plurality of grooves that are opened in equably on the aluminium matter heat-radiating substrate lower surface, this groove can adopt the form of elongated slot, also can use the circular depressions form.
Described insulating barrier is made up of the heat conductive insulating glue-line that covers the insulation oil reservoir on the electric conductor and be positioned on the insulation oil reservoir, makes that the insulating properties between aluminium matter heat radiation wall and each electric conductor are better.
Described a plurality of LED wafer can be divided into some groups of LED wafers, and each organizes between the LED wafer parallel with one another, and series connection mutually between the LED wafer in each group.But preferably adopt the form that a plurality of LED wafers are connected in series mutually, in the use, help reducing the heat that luminous plaque produces like this.
In order to satisfy each light fixture needs, above-mentioned aluminium matter heat-radiating substrate can be designed to strip, also can be designed to circular configuration.Certainly, also can be designed to other shape as required.Corresponding, the shape of a circle aluminium matter heat radiation wall and the arrangement mode of each LED lamp also will be made corresponding variation.
Compared with prior art, advantage of the present utility model is to utilize dexterously the characteristics of aluminium matter heat-radiating substrate and aluminium matter heat radiation frame good heat-transfer, and by means of the LED bottom of wafer and all around simultaneously the heat radiation structure, make the utility model overcome defective of the prior art, and has the advantage of perfect heat-dissipating, thereby can be the LED wafer that distributes thick and fast on the substrate and created condition, and it is soft to obtain a light, high and the energy-conservation light source of brightness, such luminous plaque also has the fragmentation of being difficult for simultaneously, can make the advantage of different shape as required, to satisfy the installation needs of different lamps, thereby the utlity model has stronger practicality, be worth extensive use in existing light fixture.
Description of drawings
Fig. 1 is the front view of the utility model embodiment;
Fig. 2 is for removing the structural representation behind the optical cement among Fig. 1;
Fig. 3 is the upward view of Fig. 1;
Fig. 4 is that A-A among Fig. 1 is to cutaway view;
Fig. 5 be among Fig. 2 B-B to profile;
Fig. 6 be among Fig. 2 C-C to profile.
The specific embodiment
Embodiment describes in further detail the utility model below in conjunction with accompanying drawing.
Extremely shown in Figure 6 as Fig. 1, this LED luminous plaque comprises substrate, first electric conductor 2, second electric conductor 3, circle aluminium matter heat radiation wall 4 and 30 LED wafers 7, wherein, substrate is the aluminium matter heat-radiating substrate 1 of the strip of high heat radiation, in order to improve area of dissipation, the lower surface of aluminium matter heat-radiating substrate 1 is designed to the roughness structure, and here, this roughness structure is formed by a plurality of grooves 9 that are opened in equably on the aluminium matter heat-radiating substrate lower surface.Simultaneously have installing hole 5 at the two ends of aluminium matter heat-radiating substrate.
Above-mentioned first electric conductor 2 and second electric conductor 3 are printed on the upper surface of aluminium matter heat-radiating substrate 1 by the bonding insulating cement 10 of circuit respectively, are used to receive input voltage; In order to cooperate the shape of aluminium matter heat-radiating substrate, this first electric conductor and second electric conductor also are designed to strip, and along the parallel distribution of length direction of aluminium matter heat-radiating substrate, lay one deck and resistant to elevated temperatures insulation white oil layer 11 simultaneously on each electric conductor.
Consider the shape of aluminium matter heat-radiating substrate, a circle aluminium matter heat radiation wall 4 is designed to rectangle frame assembling structure, and it is fixed on the above-mentioned insulation white oil layer 11 by the bonding insulating cement 12 of high heat conduction, sees also Fig. 5.
Above-mentioned each LED wafer 7 is enclosed in aluminium matter heat radiation wall 4, and be fixed on the aluminium matter heat-radiating substrate 1 by high-heat-conductivity glue 13 successively, see also Fig. 6, in the present embodiment, above-mentioned 30 LED wafers are divided into five groups, six LED wafers in every group connect with gold thread 8 mutually, and each organizes between the LED wafer parallel with one another again, is connected between above-mentioned first conductor 2 and second conductor 3 with gold thread.
In order to obtain the light of required color, on above-mentioned each LED wafer, also be filled with the optical cement 6 that is kept off by aluminium matter heat radiation wall 4, see also Fig. 1 and Fig. 4, this optical cement is mixed by the fluorescent material and the silica gel of routine, to obtain required white light.
Claims (7)
1, a kind of LED luminous plaque, comprise substrate, be used to receive first of input voltage, second electric conductor (2,3) and a plurality of mutual electrical connection and be connected in first, LED wafer (7) between second electric conductor, it is characterized in that: described substrate is an aluminium matter heat-radiating substrate (1), described first, second electric conductor is printed on the upper surface of this aluminium matter heat-radiating substrate (1) by insulating cement, on this aluminium matter heat-radiating substrate upper surface, also be fixed with a circle aluminium matter heat radiation wall (4) simultaneously by insulating barrier, above-mentioned each LED wafer (7) is enclosed in this aluminium matter heat radiation wall (4) and is fixed on successively on the described aluminium matter heat-radiating substrate (1), and is filled with the optical cement (6) that is kept off by described aluminium matter heat radiation wall (4) on each LED wafer.
2, LED luminous plaque according to claim 1 is characterized in that: the lower surface of described aluminium matter heat-radiating substrate (1) is the roughness structure.
3, LED luminous plaque according to claim 2 is characterized in that: described roughness structure is formed by a plurality of grooves (9) that are opened in equably on the aluminium matter heat-radiating substrate lower surface.
4, according to claim 1 or 2 or 3 described LED luminous plaques, it is characterized in that: described insulating barrier is made up of the heat conductive insulating glue-line (12) that covers the insulation oil reservoir (11) on above-mentioned each electric conductor and be positioned on the insulation oil reservoir.
5, LED luminous plaque according to claim 4 is characterized in that: described a plurality of LED wafers (7) are divided into some groups of LED wafers, and each organizes between the LED wafer parallel with one another, and the LED wafer in each group is connected in series mutually.
6, LED luminous plaque according to claim 4 is characterized in that: described a plurality of LED wafers (7) are connected in series each other.
7, according to claim 1 or 2 or 3 described LED luminous plaques, it is characterized in that: described aluminium matter heat-radiating substrate (1) is designed to strip or circular configuration.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200878567U CN201237097Y (en) | 2008-05-28 | 2008-05-28 | LED luminous panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200878567U CN201237097Y (en) | 2008-05-28 | 2008-05-28 | LED luminous panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201237097Y true CN201237097Y (en) | 2009-05-13 |
Family
ID=40649828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200878567U Expired - Fee Related CN201237097Y (en) | 2008-05-28 | 2008-05-28 | LED luminous panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201237097Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102147086A (en) * | 2011-04-29 | 2011-08-10 | 东营泰克拓普光电科技有限公司 | Special integrated LED (Light Emitting Diode) backlight source for liquid crystal display television |
| CN102720961A (en) * | 2012-05-30 | 2012-10-10 | 上舜照明（中国）有限公司 | LED (light emitted diode) candle lamp capable of lightening in entire space |
| WO2013055388A3 (en) * | 2011-10-03 | 2013-08-22 | Solais Lighting, Inc. | Led illumination source with improved visual characteristics |
| TWI447326B (en) * | 2010-01-19 | 2014-08-01 | Beom-Young Myung | Led illumination device and illuminating apparatus employing the same |
| CN104252641A (en) * | 2013-06-28 | 2014-12-31 | 成都新方洲信息技术有限公司 | Half-surrounding disconnected-type heat-resistant electronic tag |
-
2008
- 2008-05-28 CN CNU2008200878567U patent/CN201237097Y/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI447326B (en) * | 2010-01-19 | 2014-08-01 | Beom-Young Myung | Led illumination device and illuminating apparatus employing the same |
| CN102147086A (en) * | 2011-04-29 | 2011-08-10 | 东营泰克拓普光电科技有限公司 | Special integrated LED (Light Emitting Diode) backlight source for liquid crystal display television |
| WO2013055388A3 (en) * | 2011-10-03 | 2013-08-22 | Solais Lighting, Inc. | Led illumination source with improved visual characteristics |
| US8579470B1 (en) | 2011-10-03 | 2013-11-12 | Solais Lighting, Inc. | LED illumination source with improved visual characteristics |
| CN102720961A (en) * | 2012-05-30 | 2012-10-10 | 上舜照明（中国）有限公司 | LED (light emitted diode) candle lamp capable of lightening in entire space |
| CN104252641A (en) * | 2013-06-28 | 2014-12-31 | 成都新方洲信息技术有限公司 | Half-surrounding disconnected-type heat-resistant electronic tag |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090513 Termination date: 20120528 |