CN104252641A - Half-surrounding disconnected-type heat-resistant electronic tag - Google Patents
Half-surrounding disconnected-type heat-resistant electronic tag Download PDFInfo
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- CN104252641A CN104252641A CN201310265286.1A CN201310265286A CN104252641A CN 104252641 A CN104252641 A CN 104252641A CN 201310265286 A CN201310265286 A CN 201310265286A CN 104252641 A CN104252641 A CN 104252641A
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- heat
- electronic tag
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Abstract
The invention discloses a half-surrounding disconnected-type heat-resistant electronic tag which comprises a substrate, a chip, a communication antenna, a spiral antenna and a heat-resistant piece. Both the chip and the communication antenna are arranged on the substrate, the spiral antenna is arranged on the chip and is correspondingly connected with a communication end of the chip, the communication antenna is a strip-shaped dipole antenna, the middle section of the communication antenna is U-shaped and half surrounds the periphery of the spiral antenna, two ends of the communication antenna are in the shapes of pulse waves and are arranged at two ends on the front of the substrate, the spiral antenna and the communication antenna are wirelessly connected through electromagnetic coupling, the heat-resistant piece is mounted on the back of the substrate, and multiple mutually-parallel heat-radiating grooves are formed in an outer plane of the heat-resistant piece. The spiral antenna is added, so that a disconnected-type structure is formed between the chip and the communication antenna, part processing accuracy and connecting stability requirements are lowered, the electronic tag is enabled to be convenient to process, and production efficiency is improved; the heat-resistant piece provided with the heat-radiating grooves is added, so that service life of the electronic tag is prolonged.
Description
Technical field
The present invention relates to a kind of electronic tag, particularly relate to the heat-resisting electronic tag of a kind of semi-surrounding type Non-connecting.
Background technology
Along with the deep development of wireless radio-frequency, the application of electronic tag (i.e. RFID) is more and more extensive, and no matter industrial product orientation is followed the tracks of, or the bus position in life shows in real time, all will use electronic tag.Stable connection degree between the machining precision of electronic tag, parts requires also more and more higher, and the quality of the communication distance of electronic tag also its practical application effect of direct relation.
Existing electronic tag, is substantially all made up of substrate, chip and communication antenna, and chip and communication antenna are all located on substrate, and the communication terminal of chip is connected with communication antenna correspondence.Different according to its power supply, electronic tag is divided into active electronic label and passive electronic label, and the former relies on the cell powers carried, and volume is comparatively large, power consumption is comparatively large, and the latter relies on communication antenna to obtain power supply from electronic label read/write, and volume is little, power consumption is little.All there is following problem in above-mentioned traditional electronic tag: the communication terminal of chip is connected with communication antenna correspondence, so have higher requirement to the machining precision of parts and stable connection degree, not so easily cause the later stage assembling parts or junction cannot to disconnect and cause electronic tag normally to use, will inevitably production efficiency be reduced like this; Because electronic tag generates electromagnetic waves when communication, thus produce heat, if in running order for a long time, the heat of electronic tag accumulation will get more and more, and concentrate between substrate and object, can electronic tag be burnt time serious, reduce the life-span of electronic tag; Communication antenna many employings linear pattern chip aerial, requires that it has enough length, there is unconformable problem for the electronic tag that whole length requirement is less while guarantee signal intensity.These defects all limit the deep application of electronic tag and further developing of radio-frequency technique.
Summary of the invention
Object of the present invention is just to provide a kind of semi-surrounding type Non-connecting heat-resisting electronic tag to solve the problem.
The present invention is achieved through the following technical solutions above-mentioned purpose:
The heat-resisting electronic tag of semi-surrounding type Non-connecting of the present invention comprises substrate, chip, communication antenna, helical aerials and heat-resistant sheet, described chip and described communication antenna are all located on the front of described substrate, described helical aerials to be located on described chip and correspondingly with the communication terminal of described chip to be connected, described communication antenna is bar shaped dipole antenna, the stage casing of described communication antenna is surrounded by half in the periphery of described helical aerials in " U " shape, the two ends, front of described substrate are located at the two ends of described communication antenna respectively in pulse waveform, by electromagnetic coupled wireless connections between described helical aerials and described communication antenna, described heat-resistant sheet is installed on the back side of described substrate, the outerplanar of described heat-resistant sheet is provided with multiple heat radiation groove be parallel to each other.
As preferably, described helical aerials is be printed on copper wire on described chip or copper sheet.
For reaching best radiating effect, the heat radiation groove on described heat-resistant sheet is the groove that two ends communicate with the outside of described heat-resistant sheet.
For ease of producing, described heat-resistant sheet is pasted on the back side of described substrate by bonding agent.
Particularly, described heat-resistant sheet is heat-resisting steel disc.Described bonding agent is epoxy resin.
Beneficial effect of the present invention is:
The present invention, by increasing helical aerials, makes the structure forming Non-connecting between chip and communication antenna, greatly reduces machining precision and the requirement of stable connection degree of parts, makes electronic tag be convenient to processing, improves production efficiency; By increasing the heat-resistant sheet being provided with heat radiation groove, making it can not damage by temperatures involved, extending the life-span of electronic tag; By adopting bar shaped dipole antenna as communication antenna, and adopting semi-surrounding and pulse waveform structure, while meeting signal intensity, reducing the length of electronic tag, be applicable to small size object exterior pasting and use.
Accompanying drawing explanation
Fig. 1 is one of vertical view of the heat-resisting electronic tag of semi-surrounding type Non-connecting of the present invention;
Fig. 2 is the A-A cutaway view Amplified image in Fig. 1;
Fig. 3 is the vertical view two of the heat-resisting electronic tag of semi-surrounding type Non-connecting of the present invention.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described:
As depicted in figs. 1 and 2, the heat-resisting electronic tag of semi-surrounding type Non-connecting of the present invention comprises substrate 2, chip 4, communication antenna 3, helical aerials 5 and heat-resisting steel disc 1, chip 4 and communication antenna 3 are all located on the front of substrate 2, helical aerials 5 to be located on chip 4 and correspondingly with the communication terminal of chip 4 to be connected, communication antenna 3 is bar shaped dipole antenna, the stage casing of communication antenna 3 is surrounded by half in the periphery of helical aerials 5 in " U " shape, the two ends, front of substrate 2 are located at the two ends of communication antenna 3 respectively in pulse waveform, by electromagnetic coupled wireless connections between helical aerials 5 and communication antenna 3, the back side being installed on substrate 2 pasted by heat-resisting steel disc 1 by epoxy resin (not shown), the outerplanar (lower plane in Fig. 2) of heat-resisting steel disc 1 is provided with multiple heat radiation groove 6 be parallel to each other, heat radiation groove 6 is the groove that two ends communicate with the outside of heat-resisting steel disc 1.Above-mentioned pulse waveform is the waveform of electronic pulse signal, be specifically as follows multiple dense arrangement shape, it is the dense arrangement shape at straight line+right angle in this example, and narrow gradually from inside to outside according to the shape of substrate 2, make whole communication antenna 3 form roughly oval shape, be applicable to oval electronic tag.No matter whether contact between helical aerials 5 with communication antenna 3, all can not change electromagnetic coupled wireless connections relation between the two, so low to the requirement on machining accuracy of parts.Communication antenna 3 is pasted on the front of substrate 2 by epoxy resin (not shown).
As depicted in figs. 1 and 2, helical aerials 5, for being printed on the copper wire on chip 4, also can be the copper sheet of strip.
The shape of chip 4 is determined as required, and as shown in Figure 1, chip 4 is circular, and as shown in Figure 3, chip 4 is square.
During use, whole electronic tag is mounted on body surface, by electronic label read/write, electronic tag is completed to reading and the write of data, realize the accurate modernization tracing management of modern society's every profession and trade.
Claims (6)
1. the heat-resisting electronic tag of semi-surrounding type Non-connecting, comprises substrate, chip and communication antenna, and described chip and described communication antenna are all located on the front of described substrate, and described chip is connected with described communication antenna communication, it is characterized in that: also comprise helical aerials and heat-resistant sheet, described helical aerials to be located on described chip and correspondingly with the communication terminal of described chip to be connected, described communication antenna is bar shaped dipole antenna, the stage casing of described communication antenna is surrounded by half in the periphery of described helical aerials in " U " shape, the two ends, front of described substrate are located at the two ends of described communication antenna respectively in pulse waveform, by electromagnetic coupled wireless connections between described helical aerials and described communication antenna, described heat-resistant sheet is installed on the back side of described substrate, the outerplanar of described heat-resistant sheet is provided with multiple heat radiation groove be parallel to each other.
2. the heat-resisting electronic tag of semi-surrounding type Non-connecting according to claim 1, is characterized in that: described helical aerials is be printed on copper wire on described chip or copper sheet.
3. the heat-resisting electronic tag of semi-surrounding type Non-connecting according to claim 1, is characterized in that: the heat radiation groove on described heat-resistant sheet is the groove that two ends communicate with the outside of described heat-resistant sheet.
4. the heat-resisting electronic tag of semi-surrounding type Non-connecting according to claim 1 or 3, is characterized in that: described heat-resistant sheet is pasted on the back side of described substrate by bonding agent.
5. the heat-resisting electronic tag of semi-surrounding type Non-connecting according to claim 4, is characterized in that: described heat-resistant sheet is heat-resisting steel disc.
6. the heat-resisting electronic tag of semi-surrounding type Non-connecting according to claim 4, is characterized in that: described bonding agent is epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310265286.1A CN104252641A (en) | 2013-06-28 | 2013-06-28 | Half-surrounding disconnected-type heat-resistant electronic tag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310265286.1A CN104252641A (en) | 2013-06-28 | 2013-06-28 | Half-surrounding disconnected-type heat-resistant electronic tag |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104252641A true CN104252641A (en) | 2014-12-31 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310265286.1A Pending CN104252641A (en) | 2013-06-28 | 2013-06-28 | Half-surrounding disconnected-type heat-resistant electronic tag |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104252641A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105224981A (en) * | 2015-10-15 | 2016-01-06 | 桂林市味美园餐饮管理有限公司 | A kind of plastic nameplate type electronic tag |
| CN107210513A (en) * | 2015-01-21 | 2017-09-26 | 阿莫绿色技术有限公司 | The Anneta module of integral fin |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101276430A (en) * | 2007-03-30 | 2008-10-01 | 索尼株式会社 | Anneta module |
| CN101393614A (en) * | 2007-09-19 | 2009-03-25 | 株式会社日立制作所 | RFID tag |
| CN201237097Y (en) * | 2008-05-28 | 2009-05-13 | 高锦阳 | LED luminous panel |
| US20100097280A1 (en) * | 2008-10-20 | 2010-04-22 | Smartrac Ip B.V. | Transponder device |
| CN102313188A (en) * | 2010-07-02 | 2012-01-11 | 刘胜 | Integrated display shell and intelligently-controlled LCD (Liquid Crystal Display) backlight module |
| CN203414986U (en) * | 2013-06-28 | 2014-01-29 | 成都新方洲信息技术有限公司 | Half-surrounded type non-connected heatproof electronic label |
-
2013
- 2013-06-28 CN CN201310265286.1A patent/CN104252641A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101276430A (en) * | 2007-03-30 | 2008-10-01 | 索尼株式会社 | Anneta module |
| CN101393614A (en) * | 2007-09-19 | 2009-03-25 | 株式会社日立制作所 | RFID tag |
| CN201237097Y (en) * | 2008-05-28 | 2009-05-13 | 高锦阳 | LED luminous panel |
| US20100097280A1 (en) * | 2008-10-20 | 2010-04-22 | Smartrac Ip B.V. | Transponder device |
| CN102313188A (en) * | 2010-07-02 | 2012-01-11 | 刘胜 | Integrated display shell and intelligently-controlled LCD (Liquid Crystal Display) backlight module |
| CN203414986U (en) * | 2013-06-28 | 2014-01-29 | 成都新方洲信息技术有限公司 | Half-surrounded type non-connected heatproof electronic label |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107210513A (en) * | 2015-01-21 | 2017-09-26 | 阿莫绿色技术有限公司 | The Anneta module of integral fin |
| CN105224981A (en) * | 2015-10-15 | 2016-01-06 | 桂林市味美园餐饮管理有限公司 | A kind of plastic nameplate type electronic tag |
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| C10 | Entry into substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141231 |
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| WD01 | Invention patent application deemed withdrawn after publication |