CN104252642A - Full encompassing non-connection type heat-resistant electronic label - Google Patents
Full encompassing non-connection type heat-resistant electronic label Download PDFInfo
- Publication number
- CN104252642A CN104252642A CN201310268034.4A CN201310268034A CN104252642A CN 104252642 A CN104252642 A CN 104252642A CN 201310268034 A CN201310268034 A CN 201310268034A CN 104252642 A CN104252642 A CN 104252642A
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- heat
- chip
- communication antenna
- electronic tag
- resistant sheet
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Abstract
The invention discloses a full encompassing non-connection type heat-resistant electronic label. A chip is arranged on the front surface of a substrate, and a spiral antenna is arranged on the chip and is correspondingly connected to the communication terminal of the chip; an communication antenna is a stripe dipole antenna, the middle segment is in an O shape and encompasses the spiral antenna fully, and two ends are crossed and are arranged at two ends of the front surface of the substrate in pulse shapes; the spiral antenna is connected with the communication antenna in electromagnetic coupling and wireless manners, and a heat-resistant covering layer covers the front surface, the chip, the spiral antenna and the communication antenna completely; a heat-resistant sheet is mounted on the back of the substrate, and the outer plane of the heat-resistant sheet is provided with a plurality of parallel heat radiating grooves. The spiral antenna is arranged additionally, the chip and the communication antenna are in a non-connection structure, the requirements on the component machining accuracy and connection stability are lowered, and producing efficiency is improved; the heat-resistant sheet with the heat radiating grooves is arranged additionally, the heat resistance is fine, and the service life of the electronic label is prolonged.
Description
Technical field
The present invention relates to a kind of electronic tag, particularly relate to a kind of complete heat-resisting electronic tag of encirclement type Non-connecting.
Background technology
Along with the deep development of wireless radio-frequency, the application of electronic tag (i.e. RFID) is more and more extensive, and no matter industrial product orientation is followed the tracks of, or the bus position in life shows in real time, all will use electronic tag.Stable connection degree between the machining precision of electronic tag, parts requires also more and more higher, and the quality of the communication distance of electronic tag also its practical application effect of direct relation.
Existing electronic tag, is substantially all made up of substrate, chip and communication antenna, and chip and communication antenna are all located on substrate, and the communication terminal of chip is connected with communication antenna correspondence.Different according to its power supply, electronic tag is divided into active electronic label and passive electronic label, and the former relies on the cell powers carried, and volume is comparatively large, power consumption is comparatively large, and the latter relies on communication antenna to obtain power supply from electronic label read/write, and volume is little, power consumption is little.All there is following problem in above-mentioned traditional electronic tag: the communication terminal of chip is connected with communication antenna correspondence, so have higher requirement to the machining precision of parts and stable connection degree, not so easily cause the later stage assembling parts or junction cannot to disconnect and cause electronic tag normally to use, will inevitably production efficiency be reduced like this; Because electronic tag generates electromagnetic waves when communication, thus produce heat, if in running order for a long time, the heat of electronic tag accumulation will get more and more, and concentrate between substrate and object, can electronic tag be burnt time serious, reduce the life-span of electronic tag; Communication antenna many employings linear pattern chip aerial, requires that it has enough length, there is unconformable problem for the electronic tag that whole length requirement is little while guarantee signal intensity.These defects all limit the deep application of electronic tag and further developing of radio-frequency technique.
Summary of the invention
Object of the present invention is just to provide a kind of complete heat-resisting electronic tag of encirclement type Non-connecting to solve the problem.
The present invention is achieved through the following technical solutions above-mentioned purpose:
The heat-resisting electronic tag of full encirclement type Non-connecting of the present invention comprises substrate, chip, communication antenna, helical aerials, heat-resistant sheet and resistance to thermal blanket, described chip and described communication antenna are all located on the front of described substrate, described helical aerials to be located on described chip and correspondingly with the communication terminal of described chip to be connected, described communication antenna is bar shaped dipole antenna, the stage casing of described communication antenna is surrounded on the periphery of described helical aerials entirely in " O " shape, be located at the two ends, front of described substrate respectively in pulse waveform after the two ends intersection of described communication antenna, by electromagnetic coupled wireless connections between described helical aerials and described communication antenna, described resistance to thermal blanket is by the front of described substrate, described chip, described helical aerials and described communication antenna all cover, described heat-resistant sheet is installed on the back side of described substrate, the outerplanar of described heat-resistant sheet is provided with multiple heat radiation groove be parallel to each other.
As preferably, described resistance to thermal blanket is polyphenylene sulfide resin lipid layer.
As preferably, described helical aerials is be printed on copper wire on described chip or copper sheet.
In order to realize best radiating effect, the heat radiation groove on described heat-resistant sheet is the groove that two ends communicate with the outside of described heat-resistant sheet.
For ease of producing, described heat-resistant sheet is pasted on the back side of described substrate by bonding agent.
Particularly, described heat-resistant sheet is heat-resisting steel disc.Described bonding agent is epoxy resin.
Beneficial effect of the present invention is:
The present invention, by increasing helical aerials, makes the structure forming Non-connecting between chip and communication antenna, greatly reduces machining precision and the requirement of stable connection degree of parts, makes electronic tag be convenient to processing, improves production efficiency; By increasing the heat-resistant sheet being provided with heat radiation groove, making it can not damage by temperatures involved, extending the life-span of electronic tag; By adopting bar shaped dipole antenna as communication antenna, and adopting full encirclement and pulse waveform structure, while meeting signal intensity, reducing the length of electronic tag, be applicable to small size object exterior pasting and use.
Accompanying drawing explanation
Fig. 1 is the vertical view of the heat-resisting electronic tag of full encirclement type Non-connecting of the present invention;
Fig. 2 is the A-A cutaway view Amplified image in Fig. 1;
Fig. 3 is the vertical view after the heat-resisting electronic tag of full encirclement type Non-connecting of the present invention removes resistance to thermal blanket.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described:
As Fig. 1, shown in Fig. 2 and Fig. 3, the heat-resisting electronic tag of full encirclement type Non-connecting of the present invention comprises substrate 2, chip 5, communication antenna 4, helical aerials 6, heat-resisting steel disc 1 and resistance to thermal blanket 3, chip 5 and communication antenna 4 are all located on the front of substrate 2, helical aerials 6 to be located on chip 5 and correspondingly with the communication terminal of chip 5 to be connected, communication antenna 4 is bar shaped dipole antenna, the stage casing of communication antenna 4 is surrounded on the periphery of helical aerials 6 entirely in " O " shape, be located at the two ends, front of substrate 2 respectively in pulse waveform after the two ends intersection of communication antenna 4, by electromagnetic coupled wireless connections between helical aerials 6 and communication antenna 4, the back side being installed on substrate 2 pasted by heat-resisting steel disc 1 by epoxy resin (not shown), the outerplanar (lower plane in Fig. 2) of heat-resisting steel disc 1 is provided with multiple heat radiation groove 7 be parallel to each other, heat radiation groove 7 is the groove that two ends communicate with the outside of heat-resisting steel disc 1.Above-mentioned pulse waveform is the waveform of electronic pulse signal, be specifically as follows multiple dense arrangement shape, it is the dense arrangement shape at straight line+right angle in this example, and narrow gradually from inside to outside according to the shape of substrate 2, make whole communication antenna 4 form the shape of circle or nearly circle ellipse, be applicable to circle or oval electronic tag.No matter whether contact between helical aerials 6 with communication antenna 4, all can not change electromagnetic coupled wireless connections relation between the two, so low to the requirement on machining accuracy of parts.Communication antenna 4 is pasted on the front of substrate 2 by epoxy resin (not shown).
As depicted in figs. 1 and 2, helical aerials 6, for being printed on the copper wire on chip 5, also can be the copper sheet of strip.Metallic reflection plate 1 is preferably aluminium reflecting plate.Resistance to thermal blanket 3 is polyphenylene sulfide resin lipid layer.
During use, whole electronic tag is mounted on body surface, by electronic label read/write, electronic tag is completed to reading and the write of data, realize the accurate modernization tracing management of modern society's every profession and trade.
Claims (7)
1. the heat-resisting electronic tag of full encirclement type Non-connecting, comprises substrate, chip and communication antenna, and described chip and described communication antenna are all located on the front of described substrate, and described chip is connected with described communication antenna communication, it is characterized in that: also comprise helical aerials, heat-resistant sheet and resistance to thermal blanket, described helical aerials to be located on described chip and correspondingly with the communication terminal of described chip to be connected, described communication antenna is bar shaped dipole antenna, the stage casing of described communication antenna is surrounded on the periphery of described helical aerials entirely in " O " shape, be located at the two ends, front of described substrate respectively in pulse waveform after the two ends intersection of described communication antenna, by electromagnetic coupled wireless connections between described helical aerials and described communication antenna, described resistance to thermal blanket is by the front of described substrate, described chip, described helical aerials and described communication antenna all cover, described heat-resistant sheet is installed on the back side of described substrate, the outerplanar of described heat-resistant sheet is provided with multiple heat radiation groove be parallel to each other.
2. the heat-resisting electronic tag of full encirclement type Non-connecting according to claim 1, is characterized in that: described resistance to thermal blanket is polyphenylene sulfide resin lipid layer.
3. the heat-resisting electronic tag of full encirclement type Non-connecting according to claim 1, is characterized in that: described helical aerials is be printed on copper wire on described chip or copper sheet.
4. the heat-resisting electronic tag of full encirclement type Non-connecting according to claim 1, is characterized in that: the heat radiation groove on described heat-resistant sheet is the groove that two ends communicate with the outside of described heat-resistant sheet.
5. the heat-resisting electronic tag of full encirclement type Non-connecting according to claim 1 or 4, is characterized in that: described heat-resistant sheet is pasted on the back side of described substrate by bonding agent.
6. the heat-resisting electronic tag of full encirclement type Non-connecting according to claim 5, is characterized in that: described heat-resistant sheet is heat-resisting steel disc.
7. the heat-resisting electronic tag of full encirclement type Non-connecting according to claim 5, is characterized in that: described bonding agent is epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310268034.4A CN104252642A (en) | 2013-06-28 | 2013-06-28 | Full encompassing non-connection type heat-resistant electronic label |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310268034.4A CN104252642A (en) | 2013-06-28 | 2013-06-28 | Full encompassing non-connection type heat-resistant electronic label |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104252642A true CN104252642A (en) | 2014-12-31 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310268034.4A Pending CN104252642A (en) | 2013-06-28 | 2013-06-28 | Full encompassing non-connection type heat-resistant electronic label |
Country Status (1)
| Country | Link |
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| CN (1) | CN104252642A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109155452A (en) * | 2016-05-24 | 2019-01-04 | 德州仪器公司 | High frequency antenna structure with high heat conductance and high surface area |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1838867A (en) * | 2005-03-25 | 2006-09-27 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator |
| CN101097610A (en) * | 2006-06-30 | 2008-01-02 | 富士通株式会社 | RFID tag |
| EP2405054A1 (en) * | 2010-07-07 | 2012-01-11 | Datamars SA | Textile item identification tag |
| CN202736103U (en) * | 2012-07-31 | 2013-02-13 | 天津闪联科技有限公司 | Radio frequency label inlaid in special-purpose ear tag for cattle |
| CN203414979U (en) * | 2013-06-28 | 2014-01-29 | 成都新方洲信息技术有限公司 | Totally-surrounded type non-connected heatproof electronic label |
-
2013
- 2013-06-28 CN CN201310268034.4A patent/CN104252642A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1838867A (en) * | 2005-03-25 | 2006-09-27 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator |
| CN101097610A (en) * | 2006-06-30 | 2008-01-02 | 富士通株式会社 | RFID tag |
| EP2405054A1 (en) * | 2010-07-07 | 2012-01-11 | Datamars SA | Textile item identification tag |
| CN202736103U (en) * | 2012-07-31 | 2013-02-13 | 天津闪联科技有限公司 | Radio frequency label inlaid in special-purpose ear tag for cattle |
| CN203414979U (en) * | 2013-06-28 | 2014-01-29 | 成都新方洲信息技术有限公司 | Totally-surrounded type non-connected heatproof electronic label |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109155452A (en) * | 2016-05-24 | 2019-01-04 | 德州仪器公司 | High frequency antenna structure with high heat conductance and high surface area |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141231 |