TWI447326B - Led illumination device and illuminating apparatus employing the same - Google Patents

Description

LED lighting device and lighting device using the same

The present invention relates to a lighting device, and more particularly to an optimal heat dissipation design for a lighting device that uses an LED as a light source.

When the LED is operating, heat is inevitably generated as the light is generated. About 20% of the input energy is used as the energy of the luminescence, and the remaining 80% is converted to heat. Since the LED used for illumination uses a large current to obtain a higher optical power, but also generates a large amount of heat, the problem of heat dissipation is very important. If the heat emitted by the LED is not carried to the outside world, the heat will remain in the LED light source module intact. After a long period of time, the LED chip or printed circuit board will be in a very high temperature environment. in. If the LED is operated for a while without heat dissipation, the reliability of the LED chip or printed circuit board will be reduced, the electronic and optical properties will be destroyed, and the life cycle of the device will be extremely shortened. In addition, the worst case is that the LED will break due to electrical overload, causing serious damage to the LED itself.

On the other hand, since the thermal expansion coefficients of the LED parts are different from each other, if the LED is exposed to an extremely high temperature internal environment, the temperature is higher than the maximum rated temperature or the repeated thermal cycle is repeated, the temperature will be severely overloaded. rupture. The internal temperature in the package is increased due to the high ambient temperature and the generation of residual heat. Interlayer cracking also occurs between the wafer and the protective layer, so that the contact area between the wafer and the crucible in the package is thinned. For white LEDs, Interlayer rupture also occurs between the fluorescent coating and the protective layer or between the wafer and the fluorescent coating. In addition, excessive ambient temperature changes can cause thermal expansion or contraction of the crucible, causing the wire to break.

Therefore, it is necessary to quickly transfer the heat generated by the LED to the outside. Especially in the case of using LEDs as the light source for indoor or outdoor lighting equipment, since the LEDs are closely arranged in a small area, optimizing the heat conduction path becomes a key design to enable the LED chip. The generated heat is discharged into the adjacent space.

However, in lighting devices using conventional LEDs, there is a problem in designing a heat conduction path. Figure 1 shows a conventionally general closed LED outdoor lighting device. The heat sink (14) is attached to the printed circuit board (16), and the LED has a protective cover (12) integrally formed on the printed circuit board, and a transparent cover for protecting the device in front of the LED. (18).

The primary source of heat in the LED lighting device (10) is the LED (20). The heat from the LED (20), in the lower part, is conducted to the transparent cover (18) from the portion of the wire exposed to the wafer and the air via the air to be dispersed into the outside air via them; The part is transferred to the inner air of the protective cover (12) by heat conduction from the junction of the LED (20) via the printed circuit board (16) and the heat sink (14) (part of the heat is conducted through the wire for heat conduction) The way to the radiator) is to distribute the heat to the outside air via the protective cover (12).

Similarly, in conventional LED lighting equipment, when the LED (20) that heats itself as a heat source is sent to the outside air, the path of heat transfer usually includes a transfer process via "air", but as a gas Air, the rate of heat transfer is much lower than liquid or solid, and the heat generated by the LED cannot be dissipated very quickly. In addition, since the LED modules (16, 20) and the heat sink (14) are integrally formed and closed, the heat from the LEDs cannot be quickly dispersed, which causes a greenhouse effect. If during the summer day, the controller of a street lamp fails and the street lamp is accidentally turned on, the high temperature formed by the sun and the heat generated by the LED (20) will quickly increase the temperature beyond the LED can withstand. temperature. This condition can impair the performance of the LED, causing serious damage to its life cycle.

In addition, since the heat sink (14) is integrated with the entire LED (20), heat emitted by each of the LEDs (20) is transferred to the other LEDs (20) via the heat sink (14), thereby improving the other The temperature of the LED accelerates the damage of the device. Especially in LED lighting devices that use many clusters of LEDs as light sources, because there are multiple LEDs with three or more rows and tightly arranged LEDs on the printed circuit board, it is impossible for each LED to have the same heat dissipation or heat. Radiation conditions. That is, since the position of each LED is different, the heat transfer path from each LED to the heat sink, the arrangement of adjacent LEDs of each LED are different, and each LED has a different heat dissipation speed, thus generating Great temperature difference. As the position is farther from the edge, the LED (20) near the center receives more heat from other adjacent LEDs (20), and its operating performance and life cycle are also adversely affected (the unevenness of operating life will increase). Big). Moreover, since the life of the entire lighting device is determined by the LED having the shortest life, it is undesirable to see a large life unevenness in each LED.

Figure 2 shows another conventional illumination device (30) having a unidirectional heat dissipation structure. A heat sink (36) will be in direct contact with the printed circuit board (34) carrying the LEDs (32), but the front side through which the LED light passes is covered or sealed by a transparent protective cover (38). In this configuration, since the transparent protective cover (38) located on the front side has a poor thermal conductivity, it is difficult to have heat spread through the cover, so that a greenhouse effect occurs inside the protective cover (38). Most of the heat is released in one direction via the heat sink (36). Due to the one-way heat radiation, the heat dissipation rate is very low. Therefore, the LED (32) is heated to a high temperature as described above, resulting in various adverse effects.

Similarly, in a conventional lighting device that uses LEDs as a light source, the heat generated by the LEDs serving as the main heat source is transmitted to the heat sink via the wires and the printed circuit board on which the LEDs are mounted. Therefore, a heat transfer oil or a heat conductive tape is applied to the joint between the printed circuit board on which the LED is mounted and the heat sink. Other parts of the LED (the side of the LED chip package and one of the wires) are exposed to the air. In this heat dissipation structure, since the thermal conductivity of air is very poor, the heat generated by most of the LEDs is transmitted through the bottom surface of the LED chip and the printed circuit board, and is radiated by the heat sink, and a very small amount of heat is It is sent to the radiator via air and then directly distributed to the outside air. Since this is a one-way heat dissipation path, the heat dissipation rate is very slow. Therefore, heat will accumulate in it and cause the LED to overheat. As the temperature is overheated, the phosphor material is damaged and begins to produce yellow spots and shorted wafer leads.

In view of the above, it is an object of the present invention to provide an LED lighting device that can discharge the heat generated by the LED more quickly and efficiently to solve the problems in the prior art.

Another object of the present invention is to provide an LED lighting device which can discharge heat from each LED used as a light source evenly, so that the brightness of the LED is uniform to reduce the difference in operational life between the LEDs.

Still another object of the present invention is to provide an indoor or outdoor lighting apparatus using the above plurality of LED lighting devices.

In order to solve the above problems, an LED lighting device includes an LED light source mounted with a plurality of light emitting diodes on a printed circuit board, and a heat sink having a light source. a receiving component for accommodating the LED light source to expose the light emitting side of the light emitting diodes, and receiving heat from the LED light source and dispersing the heat into the air, the LED lighting device further comprising a heat conductive filler, The utility model is composed of a metal material having a thermal conductivity higher than air, and is filled with one available space of the light source receiving member for accommodating the LED light source, absorbs heat from a contact portion with the LED light source, and transmits the absorbed heat. To the radiator.

In the above LED lighting device, preferably, the heat transfer filler fills a usable space in the light source receiving member in a gapless manner, so that heat from the light emitting diodes passes through the printed circuit. The board reaches the path of the heat sink for transfer, and the remaining heat is transferred to the heat sink via the heat transfer filler.

Further, the above-described light emitting diodes have the same heat dissipation conditions. The same heat dissipation conditions can be achieved by setting the positional relationship of each of the light-emitting diodes to the adjacent heat source, the position of the heat sink, and the position of the heat transfer filler to be the same.

The heat conductive filler is filled in such a manner that all of the available space is filled and surrounds the light emitting diodes in all directions to form a wall between the LED light source and one of the light source receiving members. The shortest heat transfer path.

One of the ways to make the heat dissipation conditions the same is to have the LED light source have a plurality of light-emitting diodes arranged in a row or two columns in the length direction on the elongated printed circuit board, and the heat sink has all possibilities in all directions. The shortest direction surrounds each of the light-emitting diodes.

The heat sink includes a pedestal and a plurality of heat dissipating pins or heat dissipating fins protruding to a predetermined height, the pedestal being formed together with the light source accommodating member, extending in the longitudinal direction and at a central portion of the length direction Having a tunnel shape, wherein a plurality of light output holes for exposing the light emitting portions of the light emitting diodes are formed in the light source receiving member, and the heat dissipating pins or heat dissipating fins are from at least one outer surface or inner side of the base One of the surfaces extends to a predetermined length to maximize the heat radiation area.

For example, the heat sink may include: a first heat sink having a groove extending along a length direction and having a groove along a longitudinal direction of a surface, and one of the first bases Forming a plurality of heat dissipating pins or one of the heat dissipating fins on the surface; and a second heat dissipating groove having a plurality of light output holes in the length direction, and an upper opening of the light source receiving member and at least one of the first bases The cover is covered to make the light source receiving member form a tunnel shape.

In the above heat sink, preferably, one or more left and right vent holes are formed in at least one of the heat dissipating fins to allow air between the heat dissipating fins to circulate. Additionally, one or more vertical vents are formed in the base of the heat sink such that heat in the lower portion of one of the pedestals can rise.

In the above-described LED lighting device, the material of the heat-conductive filler has a thermal conductivity higher than that of air, and is gel-like or hardened after completion of filling. The thermally conductive filler is at least one of a heat transfer oil or a thermal conductive silicone.

In addition, the LED lighting device further includes a transparent heat transfer protection component covering the light emitting surface of the light emitting diodes exposed to the heat sink, protecting the light emitting surface, and transmitting the generated heat to the outside air. Or the radiator. Wherein, the heat transfer protection component comprises at least one transparent heat conductive silicone or a transparent protective film, the transparent heat conductive silicone fills the entire light output hole and covers the light emitting surface of the light emitting diode, and is emitted from the light emitting diode The heat is led out and transmitted to the heat sink and the outside air, and the transparent protective film is attached to a portion of the heat sink surface of the adjacent area including the light output holes.

In another aspect, according to another embodiment of the present invention, an LED lighting device includes: a plurality of LED light source modules, each of the LED light source modules being combined in a single module, each The single module includes: an LED light source mounted with a plurality of light emitting diodes on a printed circuit board; a heat sink having a light source receiving component for receiving the LED light source to expose the light emitting light downward a light-emitting side of the polar body, and the heat to be transferred is dispersed into the air; a heat-conductive filler, including a metal material having a thermal conductivity higher than air, is filled in the light source receiving member for accommodating the LED light source a usable space absorbing heat from a portion in contact with the LED light source and transferring the absorbed heat to the heat sink; and a transparent heat transfer protection member covering and protecting the light emitting diodes exposed from the heat sink a light emitting surface, and transferring heat from the light emitting surface to at least one of the outside air or the heat sink; and a lamp housing for covering the plurality of LED light source modules arranged side by side in a plurality of columns and supporting the same Fixed. Wherein, one part of the heat generated by each of the light-emitting diodes is transmitted to the heat sink via the printed circuit board, and another part of the heat is transferred to the heat dissipation via the heat conduction effect of the heat-conductive filler The remaining heat is transferred to the heat sink via the transparent heat transfer protection element or directly to the outside air.

In addition, in another aspect, according to another object of the present invention, a lighting device is provided, comprising: a light source set module having a plurality of LED lighting devices as described above, the LED lighting devices being parallel, serial or parallel And a series of modules arranged to form a single module; and a lamp housing for supporting and fixing the LED lighting devices and covering at least one of the upper sides of the light source module.

The LED lighting device described above further includes a power supply for converting a common power source into power suitable for operating the LED lighting devices and supplied to the printed circuit board.

The luminaire housing includes a luminaire cover for covering the light source set module, and the luminaire cover has a vent hole for quickly dissipating heat from the LED illuminating device to the outside.

In addition, the above lamp housing further includes a post connector for connecting to a support or a support body of an indoor or outdoor lighting device.

Furthermore, the lamp housing may further include a luminaire cover for covering the light source set module. Since the cover is isolated from each LED lighting device in the light source set module, the cover setting is not There is direct heat transfer between them.

According to the invention described above, the heat transfer filler is filled in such a manner that the available space in the light source housing member for housing the light source in the heat sink is filled. Further, the light-emitting surface is coated with a transparent heat interface material before the LED device, and the light output holes in the light source housing member are sealed. A large portion of the heat generated by the LED device is transferred to the heat sink or to the outside air via a heat transfer filler or a transparent heat interface material in a thermally conductive manner. In addition, because the heat sink is designed such that each LED device is surrounded by a heat sink at the closest distance, the heat transfer path established by the heat transfer filler or transparent thermal interface material is the shortest. Since the thermal interface material directly absorbs heat from all the contact parts of the LED device and is uniformly transmitted to the heat sink through the shortest comprehensive path, the heat removal or heat radiation is very fast and effective, and is also avoided. The LED is overheated, allowing the optical performance and lifetime of the device to be extended. In addition, each LED device is independent and has substantially the same heat dissipation environment, so the thermal interference between the LED devices is very low, so that the heat accumulation phenomenon is almost non-existent, and there is almost no temperature difference between the LED devices. Therefore, the LED device can be uniformly illuminated, and its life can be stable and consistent.

Since the LED device is arranged in a single column or in two columns, it is easy to design a uniform heat dissipation environment for each LED device, and the LED light source can be separately modularized.

When a plurality of LED light source modules are collectively combined into one lighting device, since even if one LED device fails, the entire lighting device does not need to be disassembled or replaced, and only the light source that specifically damages the LED device is needed. Modules can be repaired or replaced, thus reducing maintenance and management costs. In addition, different lighting device designs can also be obtained by changing the setting position of the LED light source module.

In addition, the illuminating device has a cover for blocking sunlight, and each of the LED light source modules has a separate cover, so that the LED chip is protected by the cover even if the automatic switch system malfunctions and is accidentally opened.

The above described objects, features and advantages of the present invention will become more apparent and understood.

Preferred embodiments in accordance with the present invention will now be described. It is to be understood that the invention is not limited by the scope of the invention.

1. First embodiment

3a and 3b to 6 are perspective and exploded views showing the structure of the light source module (120) in the first embodiment of the present invention. The light source module (120) is an LED lighting device that includes an LED light source (105), a heat sink (110), and a heat transfer filler (126).

The LED light source (105) includes a plurality of LED devices (102) mounted on a printed circuit board (124) having a circuit pattern required to operate the LEDs. The circuit pattern of the printed circuit board (124) is connected to a power supply (described later), receives power and supplies operating current to each of the LED devices (102). The LED device (102) includes an LED chip (102a) and a light emitting surface (102b) covering the upper end of the LED chip (102a), wherein when current flows in the LED chip (102a), This fluorescent material generates light and is emitted via the light emitting surface (102b). The LED light source (105) is housed in a light source housing member (122) such that one of the front side light emitting surfaces of the LED device (102) is exposed. The light source housing element (122) is part of the heat sink (110). The structural material of the heat sink (110) absorbs heat from the LED light source (105) as a heat source and rapidly discharges heat to the atmosphere. A printed circuit board (124) of the LED light source (105) is attached to the bottom surface of the light source housing member (122) via a commercially available heat transfer oil or thermal conductive tape.

In addition to these basic components, the most important new feature of the present invention is that the space formed by the light source housing member (122) after housing the LED light source (105) is not only air but is filled with a heat transfer filler. (126), its thermal conductivity is much higher than air. The heat transfer filler (126) can be any material having good thermal conductivity, or it can be transparent or opaque. The thermal conductivity of the thermal interface material is higher than that of air, and is preferably latex-like and can be easily filled and treated and hardened after filling. For example, it may be a heat transfer oil, a hot silicone (thermal conductive silicone), or the like. However, it does not necessarily have to be in the form of a latex, and even if it is only a solid or liquid, it can be used as long as it has a good thermal conductivity.

In order to maximize the heat rejected by the heat transfer filler (126), it is preferred to fill the heat transfer filler (126) into the available space of the light source receiving member (122) in a seamless manner. Thereby, the heat transfer filler (126) covers all of the side surfaces of the LED device (102), the wires, the entire inner wall of the light source receiving member (122), and the printed circuit board (124). Thus, the four sides of the LED device (102) to the heat sink (110) (that is, the inner wall of the light source receiving member (122)) have a path for heat dissipation by heat transfer of the filler (126). .

Preferably, the LED device (102) described above has substantially the same heat dissipation conditions. The life of the light source module composed of the LED device (102) is determined by the LED device having the shortest life in the entire LED device (102). If the heat dissipation conditions of each of the LED devices (102) are greatly different, one of the LED devices (102) will be damaged earlier than other LED devices, and the life of the light source module is greatly shortened. If the heat dissipation conditions of the LED device (102) are the same, the illuminating performance and the average life span will be relatively uniform. Therefore, the average life of the light source module (120) is thus substantially extended. The heat dissipation conditions of the LED device (102) can be determined by the positional relationship of each of the LED devices (102) with an adjacent heat source (other LED devices), a heat sink (110), and a thermal interface material (described later). By aligning the positional relationship of each LED device (102), uniform heat dissipation conditions can be obtained.

In addition, each LED device (102) and heat sink (110) are preferably placed as close as possible to rapidly transfer the heat generated by each of the LED devices (102) to the heat sink (110). To this end, it is preferred that the entire LED device (102) be arranged in a row or two on the printed circuit board (124) side by side. This arrangement can be used to provide the LED device (102) with the same heat dissipation conditions. In addition, shortening the distance between each of the LED devices (102) and the inner wall of the light source housing member (122) shortens the heat transfer path formed by the heat transfer filler (126), and thus contributes to rapid heat dissipation.

Of course, the LED devices (102) can also be arranged in three columns, but in this arrangement, it is not easy to design and manufacture LED devices having the same heat dissipation conditions, and in the same heat dissipation conditions as the printed circuit boards and heat sinks. A compromise must also be made between design effects.

The printed circuit board (124) also has a long rectangular shape to conform to the shape of the LED device (102). For example, in the case of a single row, the spacing between the LED devices (102) is the same, and the heat sink (110) and the heat transfer filler (126) are symmetrically disposed on each of the LED devices (102). Right and left. In the case of a double row, the heat sink (110) and the heat transfer filler (126) can also be arranged next to each of the LED devices (102) in the same manner. However, in the case of being arranged in more than three columns, since the LED devices (102) in the outermost row have only other adjacent LED devices on one side, the LED devices (102) in the middle row have other sides on the other side. Adjacent LED devices, so their positional relationship with adjacent heat sources is different, and the distance from the heat sink and other heat dissipation conditions on the right and left sides are different. The heat dissipation rate of the LED device (102) will be more along with its position. The slower you are near the middle column, the higher the temperature will be.

The heat sink (110) includes a light source housing member (122) for housing the LED light source (105) to expose the front side light emitting surface of the LED device (102). The heat sink (110) is preferably made of a metal having a good thermal conductivity (for example, aluminum, aluminum alloy, copper or copper alloy) to absorb heat generated from the LED light source (105) and efficiently discharge it to In the atmosphere. The heat sink (110) has a base (111) extending in the longitudinal direction, and a plurality of heat sink pins (not shown) or heat sink wings (112). Wherein, the heat dissipating pin protrudes from the outer surface or the inner side surface of the base (111) by a predetermined height to maximize the heat dissipating area. The heat dissipating fins (112) protrude to a predetermined height and extend to a predetermined length. The base (111) has a long rectangular shape, and a light source housing member (122) having a tunnel outer shape is formed at a center of one side thereof in the longitudinal direction, and a light output hole (119) is provided in the light source housing member (122). ) for exposing the light emitting surface of the LED device (102). In order to increase the heat dissipation area, heat dissipation protrusions (not shown) or other various protruding shapes may be used, and are not limited to the use of the heat dissipation fins (112). The shape of the light source receiving member (122) itself may also vary, and any shape such as a vertical shape, a ring shape, or an elliptical shape is suitable. The position of the light source housing member (122) is preferably at the center of the heat sink (110), but is not limited thereto, and may be biased to one side due to different needs. Further, a side cover engaging groove (127) may be provided on one side surface of the heat sink (110) to lock the screw when the mounting side is covered.

For the heat sink (110) of Figures 3a, 3b and 4, the upper heat sink (first heat sink) (110a) and the lower heat sink (second heat sink) (110b) can be combined and the LED light source (105) Placed in between to make it easy to produce. Of course, the heat sink (110) can also be integrally formed. The upper heat dissipation groove (110a) includes a first base extending in the longitudinal direction and having a long rectangular groove formed at the center in the longitudinal direction of one side surface, and a plurality of surfaces disposed on the first base (111a) A heat sink or heat sink (112) for maximizing the heat dissipation area. The lower heat sink (110b) includes a second base (111b) having a plurality of light output holes (119) in the longitudinal direction, covering the upper end opening of the light source receiving member (122), and At least one of the first pedestals (111a) is joined and joined to form a tunnel. A heat sink or fin (112) may be provided on the surface of the second pedestal (111b). The light source receiving member (122) formed in the tunnel shape has a usable space for filling the heat transfer filler (126) when it houses the LED light source (105). This available space is preferably located near all of the side surfaces of each of the LED devices (102).

In the case where the heat dissipating fins (114) are formed on the heat sink (110), it is preferable to form a horizontal vent hole (114a) which is traversed in a direction perpendicular to the heat dissipating fins (114) so that air can be radiated in the fins Circulate horizontally between (114). The horizontal vents (114a) can be mounted in the fins (114) or only on the outermost fins. Further, one or more vertical vent holes (114b) may be formed in the base (111) of the heat sink (110) so that heat under the heat sink (110) can rise and be effectively discharged to the outside. With these horizontal vents (114a) and/or vertical vents (114b), the heat sink (110) can exchange heat with the outside air to make heat dissipation more efficient.

In these configurations, since the light emitting surface is exposed outward through the light output aperture (119), the LED device (102) is at risk of being damaged by the external environment. Further, if the heat transfer filler (126) is in the form of a latex, it may leak through the gap of the light output hole (119). In addition, the heat generated by the LED device (102) must also be efficiently discharged from the light emitting surface. Therefore, after considering these factors, it is preferable to provide a transparent heat transfer protection element to cover the light emitting surface (102b) exposed by the LED device (102) via the light output hole (119) of the heat sink (110). The light output aperture (119) is sealed to protect the light emitting surface and transfer heat from the light emitting surface to the outside air and/or heat sink (110). For example, a material for sealing the light output aperture (119) may preferably use a transparent thermal conductive silicone (128). The transparent thermal conductive adhesive is applied to the light-emitting surface (102b) exposed by the LED device via the light output hole (119), and it is also preferably in direct contact with the lower heat sink (110b). With such direct contact, the thermal conductive silicone (128) can quickly dissipate heat absorbed from the light emitting surface (102b) of the LED device (102) via the heat sink (110). Since the transparent thermal conductive silicone (128) is in contact with the light emitting surface (102b) of the LED device (102) and rapidly dissipates heat in the manner described above, the heat dissipation rate of the light source module (120) is increased. Alternatively, the sealing may be performed by covering the light-emitting surface (102b) with a transparent protective film (129). In addition, the sealing method of the above two methods may also be used for sealing, that is, the thermal conductive silicone (128) may be coated on the light emitting surface (102b) of the LED device (102), and then The vicinity of the light-emitting surface is covered with a transparent protective film (129). Thereby, the LED device (102) can be protected, and the heat emitted from the self-illuminating surface (102b) can be absorbed and discharged to the outside.

In the heat dissipation structure of the light source module (120) according to the first embodiment of the present invention, since the heat dissipation mechanism is disposed around the center of the heat source and is in contact with the air, the heat dissipation rate is optimized. That is to say, the LED device (102) as the main heat source is mainly through some parts of the LED device (102) and the heat sink (110), the heat transfer filler (126), the thermal conductive silicone (128) and the printed circuit board ( 124) - direct contact of the thermal conductive adhesive (not shown) to dissipate heat by heat conduction, and by the heat sink (110), heat transfer filler (126), thermal conductive silicone (128) and printed circuit board (124) ) - The heat absorbed by the thermal conductive adhesive is again transferred to the heat sink (110) and then discharged, making the overall heat dissipation mechanism very efficient. Since heat is discharged to the outside air by means of heat conduction, heat transfer from all points of the LED light source (105) to the inner wall of the light source receiving member is uniform in all directions, and the heat conduction paths in each direction are It is the shortest. Similarly, due to the heat dissipation mechanism, a substantial portion of the heat generated from the LED device (102) is transferred from all directions to the heat sink via the heat transfer filler (126) in contact with the LED device (102) ( 110), and the heat is also distributed in all directions and transmitted to the heat sink via the thermal conductive silicone (128), so the heat dissipation rate of the light source module (120) in the present invention is much higher than that of the conventional light source module. .

2. Second Embodiment

Figures 7 and 8 show the structure of the light source module (220) in the second embodiment of the present invention. The light source module (220) includes a heat sink (310) including a light source receiving member (312) having a rectangular groove along the center of the base (314) in the longitudinal direction. A printed circuit board (124) having an LED light source (105) extending in the longitudinal direction is attached to the bottom of the light source housing member (312) via a thermal conductive adhesive. A plurality of symmetrically disposed radiating fins (316) are disposed between the left and right sides of the base (314) and the light source receiving member (312). The middle portion of the entire heat sink (310) covers the LED light source (105) and exhibits a mirror shape. The light source housing member (312) in which the LED light source (105) is housed is covered by a housing member cover (320). A light output aperture (322) is provided on the receiving element cover (320) corresponding to the position of the LED device (102). Each of the light output apertures (322) will be sealed in the same manner as in the first embodiment. The internal space in the light source housing member (312) covered by the housing member cover (320) is filled with the heat transfer filler (126). The bottom surface of the receiving member cover (320) and the inner wall of the light source housing member (312) are in direct contact with the heat transfer filler (126). The inner wall of the light output aperture (322) of the receiving element cover (320) is in direct contact with the thermal conductive silicone (128). The heat sink (310) and the receiving member cover (320) are made of a metal material having excellent thermal conductivity.

Therefore, the heat transfer filler (126) absorbs a large amount of heat generated from the side surfaces of each of the LED devices (102) and the printed circuit board (124), and transfers them to the heat sink (310) and the storage member cover ( 320) to discharge it to the outside air. The thermal conductive silicone (128) also absorbs heat from the light emitting surface of each of the LED devices (102) and discharges it directly to the outside air or the receiving member cover (320). The storage element cover (320) also acts as a heat sink (in this view, the heat sink (310) can be considered an upper heat sink, and the storage element cover (320) can be considered as a lower heat sink. groove). This heat dissipation mechanism is almost the same as that in the first embodiment.

The light source module (220) may further include a protective film (330) covering the receiving member cover (320). In addition, a mounting cover (340) is screwed into the longitudinal direction of both ends of the heat sink (310) to mount the heat sink (310), the LED light source (105) and the receiving component cover (320). A module. The printed circuit board (124) is coupled to a conductor (350) for connection to a power supply (134) that provides the power required for LED operation.

3. Third Embodiment

The light source module (120, 220) itself is a complete lighting device, as long as it provides a power required for operation to the printed circuit board (124), it can operate normally, but by combining a plurality of light source modules (120, 220) It can also form a larger lighting device (100). Figures 9 and 10 show a lighting apparatus (100) of a third embodiment of the present invention.

The lighting device (100) includes a light source set module (130) and a light fixture housing (150). The light source set module (130) is formed by a group of four light source modules (120), and the light source module (150) supports the light source module (120). Forming a kit with four light source modules (120) is merely illustrative. The light source kit (130) can be formed by more light source modules (120 and or 220). One of the functions of the lamp housing (150) is as a frame for fixing the LED light source package module (130) and the power supply (134), and another function is to protect them from external factors. Such as snow, rain, fog, moisture, sun and so on. More specifically, a plurality of light source modules (120) are arranged side by side (in a parallel manner) in the lamp housing (140), and the LED device (102) is illuminated in the light source kit (130). The face is facing down and fixed. The light source modules (120) may also be arranged in series as needed, or in a parallel or series mixing manner. The bottom surface of the lamp housing (140) may be transparent or directly open at a position opposite to each of the light source modules (120). The luminaire housing (140) can be of different types as desired.

The light source set module (130) is covered by a lamp cover (142) having a mirror shape. A vent hole (143) may be provided in the lamp cover (142) to quickly discharge heat generated by the light source module (120) to the outside. In particular, because the lampshade (142) is separate from each of the LED light source modules (120 or 220), the lampshade (142) is not designed to provide direct heat transfer. The function of the lampshade (142) is to act as a mask for outdoor sunlight, but the heat generated by daylight is not directly transmitted to each of the LED light source modules (120 or 220) via heat conduction. Even if the LED light source module is accidentally opened during the day, it can protect the LED chip from overheating.

A connecting member (146) is joined to the upper side of the lamp cover (142), and has a receiving space therein. The connecting member (146) is coupled to a post connector (144) for connecting to support a lighting device, such as a street light. A wire extending from the normal power source and passing through the post connector (144), and a controller (145) connected to the wire for operating the light source module (120) are also housed in the interior space of the connecting member (146). The controller (145) is all or part of the power supply (134). The primary function of the power supply (134) is to convert the normal power supply to operate the LED device and generate a voltage of light that is supplied to the printed circuit board (124). The power supply (134) may be an AC-DC converter, a DC-DC converter, a DC-AC converter, or an AC-AC converter.

In addition, the lighting device (100) in FIG. 10 can be used as a street light by connecting two or three lighting devices (100) as shown in FIG. 11 as needed. For example, a set of lighting devices can be formed by radially arranging a plurality of lighting devices (100) and integrating each of the pillar connecting brackets (144) with the pillar connecting frame receiving members (148). . A street light (not shown) can be formed by attaching a set of struts of the luminaire to the struts (148) of a street light (not shown). In addition, for example, an indoor lighting device can also be formed by connecting a set of lighting devices to other pillars.

In the structure of the illumination device (100) of the present invention, the LED light source module, the lamp cover and the power supply are separated in structure and function, and have various possible combinations, and the application range thereof is wide. In addition, the illumination range can be easily adjusted as needed, and the manufacturing cost is very low.

Those skilled in the art can use the light source modules (120, 220) of the present invention to produce a variety of different types and shapes of illumination devices in accordance with the above description. Figure 12 shows the structure of another lighting device. It is formed by arranging the light source modules (220) of the five second embodiments side by side and fixing them in a lamp cover (240) having a mirror shape. The bottom surface of each light source module (220) is covered with a transparent light source protection cover (230). In the upper end portion of the luminaire housing (240) there is a connecting element (235) for connection to the struts of another luminaire.

4. Comparison of traditional lighting equipment and lighting equipment of the present invention

In conventional lighting devices, heat is transferred from the LED device to the heat sink via air, while in the lighting device of the present invention, heat transfer is transmitted in all directions via the heat transfer filler (126). Figure 13(a) shows a photograph of the LED lighting device in the prior art of Figure 1, and Figures 13(b) and 13(c) are respectively operated for a long period of time at the initial operation of the LED lighting device. Infrared photos taken after time. Figure 14(a) shows a photograph of the LED lighting device (220) of the present invention in Figure 7, and Figures 14(b) and 14(c) are respectively operated at the initial time when the LED lighting device is operated. Infrared photos taken after a long period of time.

According to the infrared photo of traditional LED lighting equipment (Sections 13(b) and (c)), as the operating time of the LED device increases, the temperature difference between the LED device and the heat sink becomes larger and larger. Inefficient relationship. As can be seen from the detailed temperature data, the temperature of the LED device and the heat sink are about 49.5 ° C and 37.5 ° C, respectively, and the temperature difference is 12 ° C during the initial operating time of the LED device. After a sufficient period of operation, the temperature of the LED device and the heat sink are about 56 ° C and 34.7 ° C, respectively, and the temperature difference is 21.3 ° C, which does increase. These measurements show that as time increases, the LED device overheats, and the heat removal through the heat sink is inefficient.

In contrast, according to the infrared photograph (14(b) and (c)) of the LED lighting device of the present invention, even if the operation time is increased, the color representing the temperature is hardly changed, which shows that the entire heat exhaust efficiency is good. As can be seen from the detailed temperature data, at the beginning of the operation, the temperature of the LED device and the heat sink were about 36.2 ° C and 27.5 ° C, respectively, and the temperature difference was 8.7 ° C. After a sufficient period of operation, the temperature of the LED device and the heat sink are about 37.5 ° C and 28.0 ° C, respectively, and the temperature difference is 9.5 ° C. The temperature of the LED device and the heat sink increased by only 1.3 and 0.5 °C from the beginning of the operation. These measurement results show that even if the operation time continues, the heat generated from the LED device is quickly discharged through the heat sink, so that the LED device does not overheat. Therefore, the present invention does have an excellent heat removal rate. Of course, the life of the LED device of the present invention will also be extended.

As described above, the present invention has been described in terms of several embodiments and illustrations, and those skilled in the art can make appropriate modifications without departing from the spirit and scope of the invention.

The present invention can be applied to a lighting device without being particularly limited. For example, the invention can be applied to the use of different lighting devices, for example as outdoor or indoor lighting, architectural interior lighting, advertising displays or backlights.

14, 36, 110, 310. . . heat sink

16, 34, 124. . . A printed circuit board

12. . . protection cap

18, 38. . . Transparent cover

10. . . LED lighting device

20, 32. . . led

30. . . Traditional lighting

100. . . lighting device

120, 220. . . Light source module

105. . . LED light source

126. . . Heat transfer filler

102. . . LED device

102a. . . LED chip

102b. . . Luminous surface

122, 312. . . Light source receiving component

111, 111a, 111b, 314. . . Pedestal

112, 114, 316. . . Cooling fin

119, 322. . . Light output aperture

127. . . Side cover engagement groove

110a. . . Upper heat sink

110b. . . Lower heat sink

114a. . . Horizontal vent

114b. . . Vertical vent

128. . . Thermal conductive silicone

129. . . Transparent protective film

320. . . Storage element covering

330. . . Protective film

340. . . Mounting cover

350. . . wire

134. . . Power Supplier

130. . . Light source set module

150, 240. . . Lamp housing

142, 240. . . lampshade

146, 235. . . Connecting element

144. . . Pillar connector

145. . . Controller

148. . . Pillar connecting frame storage element

230. . . Transparent light source cover

Figure 1 shows a cross-sectional view of a conventional universal enclosed LED outdoor lighting device;

Figure 2 shows an LED lighting device with a unidirectional heat dissipation structure;

3 to 6 show the structure of the light source module (120) in the first embodiment of the present invention; wherein, the 3a and 3b are combined perspective views, and the fifth diagram shows the LEDs (120) arranged in a single column. The bottom surface of the LED light source module, and the sixth figure is a cross-sectional view along the line A-A' in the second (a) diagram;

7 and 8 are respectively an exploded view of the structure of the light source module (220) according to the second embodiment of the present invention and a cross-sectional view of the combination completed;

9 and 10 are views showing a lighting apparatus according to a third embodiment of the present invention, which is a combination of a plurality of light source modules of the present invention, and FIGS. 9(a) and 9(b) are side plan views, respectively. And the plan view of the lower view, and the 10th plan is a cross-sectional view along the tangential line B-B' in the 9th (a) figure;

Figures 11(a) and 11(b) respectively show top plan views of illuminating devices that radially connect the illuminating devices (100) of the two and three Figure 10;

12(a) and 12(b) are a cross-sectional view and a bottom plan view showing another lighting device in which the LED light source module of the second embodiment of the present invention is combined;

Figure 13(a) shows photographs of LED lighting devices in the prior art, and Figures 13(b) and 13(c) are taken at the initial time when the LED lighting device is operated and after being operated for a long period of time, respectively. Infrared photo; and

Figure 14(a) shows a photograph of the LED lighting device (220) of the present invention, and Figures 14(b) and 14(c) are respectively operated for a long time at the initial time when the LED lighting device is operated. Infrared photos taken afterwards.

102. . . LED device

110. . . heat sink

110a. . . Upper heat sink

110b. . . Lower heat sink

111. . . Pedestal

112. . . Cooling fin

114a. . . Horizontal vent

114b. . . Vertical vent

120. . . Light source module

124. . . A printed circuit board

126. . . Heat transfer filler

128. . . Thermal conductive silicone

134. . . Power Supplier

Claims (10)

An LED lighting device comprising an LED light source mounted with a plurality of light emitting diodes on a printed circuit board, a heat sink made of metal, the heat sink having a light source receiving component, except the light exposure component The light source receiving member shields the LED light source and closely surrounds all sides of the light emitting diodes and a heat dissipating protrusion for increasing heat dissipation of the outer surface of the light source receiving member. An area of heat-conducting filler, which is composed of a metal material having a thermal conductivity higher than that of air, and the heat-conducting filler is completely filled in one of the light source receiving members without leaving a gap in the space, wherein the light-emitting materials of the LED light source are The pole body and the printed circuit board are covered by the heat conductive filler, the heat conductive filler absorbs heat from the printed circuit board and the light emitting diodes, and transfers the absorbed heat to the heat sink; The heat sink receives the heat of the LED light source by heat conduction around all the sides of the light emitting diodes and the heat conductive filler, and disperses the heat to the LED light source Gas. The LED lighting device of claim 1, wherein the heat sink has a first heat dissipation groove and a second heat dissipation groove, the first heat dissipation groove has a plurality of heat dissipation protrusions extending or protruding from an outer side thereof, and a bottom opening groove is formed on the inner side thereof to accommodate the LED light source, the second heat dissipation groove covers the bottom opening groove, and the first heat dissipation groove forms the light source receiving component, wherein the second heat dissipation groove corresponds to some light emitting diodes Forming a plurality of light output holes, the light emitting diodes are inserted into the light output holes one by one and exposing the light emitting surfaces, and all sides of the light emitting diodes are These light output apertures are tightly enclosed. The LED lighting device of claim 2, wherein the second heat sink has a base covering the bottom open slot and a plurality of heat dissipating fins, the fins are downwardly formed by the two long sides of the base Bending and extending to limit the beam angle of the light-emitting diodes. The LED lighting device of claim 1, wherein the light emitting diodes are arranged in a row or two columns along the length direction of the elongated printed circuit board and have the same heat dissipation condition. The heat dissipation condition can be achieved by setting the position of each of the light-emitting diodes and the plurality of adjacent heat sources, the position of the heat sink, and the positional relationship of the heat transfer filler to be the same. The LED lighting device of claim 1, wherein one or more vertical vent holes are formed in the heat sink such that heat in a portion below one of the heat sinks can rise, and vice versa. The LED lighting device of claim 1, wherein the heat conductive filler is at least one of a heat conductive oil or a thermal conductive silicone. The LED lighting device of claim 1, further comprising a transparent heat transfer protection element covering the light emitting surface of the light emitting diodes exposed to the heat sink, and protecting the light emitting surface, and The generated heat is transferred to the outside air and the radiator. A lighting device comprising: a light source set module having a plurality of LED lighting devices according to items 1 to 7 of the application range, wherein the LED lighting devices are arranged in a parallel, series or parallel, series mixing manner to form a a single module; A lamp housing for supporting and fixing the LED lighting devices and covering at least one of the upper sides of the light source package module. The illuminating device of claim 8, wherein the luminaire housing comprises a luminaire cover for covering the light source set module, wherein the luminaire cover is isolated from each LED illuminating device in the light source set module So that the setting of the cover does not create direct heat transfer between them. The illuminating device of claim 9, wherein the illuminating device has a plurality of vent holes for quickly discharging heat generated by the LED lighting devices.