201131105 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種 T , 種“、、明裝置，特別有關於一種針對 以LED為光源的照明設 爾所進订的最佳散熱設計。 【先前技術】 當LED在進行操作時，隨著光的產生，無可避免地會 生成熱。大約請的輸入能量會用來做為發光的能量， ㈣τ @ m都轉換為熱。由於用來照明#⑽會使用大 電流，以獲取較高的光學功率，但也因此產生了大量的赦， Γ散熱的問料十分重要的1由led發出的熱沒有被 ▼至卜界&些熱就會原封不動地留在LED光源模組之 中，在一段長時間過後，LED晶片或印刷電路板就會處在 1非常高溫的環境之中。若在沒有散熱的情況下操作⑽ 夺1就會導致LED晶片或印刷電路板的可靠度降 低，其電子及光學性能也會被破壞等等，裝置的生命週期 也會極度地被縮短。此外，最糟的情況是，⑽會因電性 上的過載而破裂，引起對LED本身的嚴重損害。 另方面，由於led各部位的熱膨脹係數相互不同， 若LED曝露在一個極高溫的内部環境，溫度高於最大額定 溫度或是不斷重複熱循環時，也會因溫度上的過載而發生 嚴重的破裂。封裝中的内部溫度會因高環境溫度及餘熱的 生成而提兩，在晶片與保護層間也會發生層間破裂的情 况使得封裝内晶片與矽之間的接觸面積變薄，對白色 201131105 來說，螢光鐘膜與μ護層n晶片與螢紐膜間也會發 生層間破裂的情況。此外’過大的環境溫度改變會導致矽 的熱膨脹或收縮，而使得導線發生斷裂。 因此，必需將LED所生成的熱快速傳導至外界。尤其 是在使用LED為室内或室外照明設備之光源的情況下，由 於LED會被緊密地排列在很小的面積之中，將熱傳導路徑 最佳化就變成是一個關鍵的設計，才能使⑽晶片所生成 的熱被排放至鄰近的空間中。 然而，在使用傳統LED的照明設備中，在設計熱傳導 路t時有個問題。第1圖顯示了 _個傳統上—般封閉型⑽201131105 VI. Description of the Invention: [Technical Field] The present invention relates to a T, a "," device, and particularly relates to an optimal heat dissipation design for lighting with LED as a light source. [Prior Art] When the LED is operating, heat is inevitably generated as the light is generated. About the input energy is used as the energy of the light, and (4) τ @ m is converted into heat. Lighting #(10) will use a large current to obtain higher optical power, but it also produces a lot of 赦, Γ heat dissipation is very important. 1 The heat emitted by led is not detected by the fire. Will stay in the LED light source module intact, after a long period of time, the LED chip or printed circuit board will be in a very high temperature environment. If there is no heat dissipation operation (10) will win 1 The reliability of the LED chip or printed circuit board is reduced, the electronic and optical properties are also destroyed, and the life cycle of the device is extremely shortened. Moreover, the worst case is that (10) will be electrically Overload and rupture, causing serious damage to the LED itself. On the other hand, since the thermal expansion coefficients of the LED parts are different from each other, if the LED is exposed to an extremely high temperature internal environment, the temperature is higher than the maximum rated temperature or the thermal cycle is repeated repeatedly, It will also cause severe cracking due to temperature overload. The internal temperature in the package will be raised due to the high ambient temperature and the generation of residual heat. Interlayer cracking will also occur between the wafer and the protective layer. The contact area between the thinner layers is thinner. For white 201131105, interlayer cracking also occurs between the fluorescent clock film and the μ layer n wafer and the fluorescent film. In addition, excessive temperature change may cause thermal expansion or contraction of the crucible. Therefore, the wire is broken. Therefore, it is necessary to quickly transfer the heat generated by the LED to the outside world, especially in the case where the LED is used as a light source for indoor or outdoor lighting equipment, since the LEDs are closely arranged in a small area. Among them, optimizing the heat conduction path becomes a key design, so that the heat generated by the (10) wafer is discharged to the neighbors. . The space, however, the use of a conventional LED lighting apparatus, there is a problem in the design of heat conducting paths t _ FIG. 1 shows a traditional - generally closed ⑽
至外，、?、明β又備。散熱器（丨4)附著於印刷電路板（1 6)上，LED 則體成型地具有一保護蓋（i 2 )，且共同設置於印刷電路 板上，而在LED的前方則有用來保護裝置之透明遮蓋（18)。 在LED照明裝置（1〇)中的主要熱源是leD(20)。來自 LED(20)的熱，在下方的部份，會經由空氣而從曝露於晶片 及空氣中的導線部位傳導至透明遮蓋(18)，以經由它們而 被散佈至外界的空氣中；在上方的部份，則會經由印刷電 路板（16)及散熱器（⑷自LED⑵）的連接處以熱傳導的方 式傳达至保濩遮蓋(丄2)的内部空氣(部份的熱是經由導線 乂，、、、傳導的方式傳送至散熱器），以經由保護遮蓋（⑺將熱 散佈至外界的空氣。 同樣地，在傳統的LED照明設備中，當熱自做為熱源 的LED(20)傳送至外界空氣時，熱傳遞的路徑通常會包含 左由二氣」的傳遞過程，但由於做為一種氣體的空氣， 201131105 其熱傳遞的速度遠遠低於液體或固體，LED生成的熱就無 法很快速地被散佈出去。此外，又由於LED模組（16、20) 及散熱器（14)是一體成型且封閉的，來自[ED的熱就無法 快速地散佈出去’這就會造成溫室效應。如果在夏日的白 天’某盒路燈的控制器故障而誤開了路燈，已經因太陽光 形成的高溫再加上LEDC20)生成的熱，就會使溫度快速提 咼至超過LED能夠承受的溫度。這種狀況會使lED的性能 受損’造成對其生命週期的嚴重損害。 此外’由於散熱器（14)是與整個LED(20)整合在一起， 由每一個LED(20)發出的熱會經由散熱器（14)被傳遞至其 他的LED(20)，而提高了其他LED的溫度，更加速了裝置 的又知。尤其是在使用許多成群LED做為光源的照明 。又備中，因為在印刷電路板上含有多個三列、三行以上且 排列緊㈣LED ’每一個LED不可能具有完全相同的散熱 或…、幅射條件。意即，由於每一個LED的位置不同，自每 LED傳送至散熱器的熱傳遞路徑、每一個[ED鄰近led 的排列方式都是不同的，且每-^ LED也有不同的散熱速 度，因此會產生極大的溫度差異。由於位置越遠離邊緣而 f近中心的LED(2〇)自其他鄰近LED(2〇)接受到的熱也越 其操作性能與生命週期也越會受到+良的影響（操作壽 °p的不均程度會加大)。又由於整個照明裝置的壽命是由具 有最短壽命的LED來決定’戶斤以在各個LED中是不希望見 到有报大壽命不均之現象的。 第2圖顯示了另一個傳統照明裝置（3〇)，其具有單向 201131105 散熱的結構。一散熱器⑽會直接與農栽L_ 電路板㈤接觸，feLED光線通過的前心㈣明的 遮蓋(38)所包覆或密封起來的。在這種結構中，由於位在 前側的透明保護遮蓋(38)具有很差的熱導率，很難有執會 經由此遮蓋散佈出纟’而使得在保護遮蓋(38)的内部發生 溫室效應。大部份的熱都是經由散熱器(36)單向散出。由 於是單向的熱幅射’其散熱速率很低。因此，卿2)會被 加熱至如上述之高溫’而導致發生各種不良效應。 同樣地纟傳統使用LED做為光源之照明設備中由 U為主熱源之LED所生成之熱’會經由導線及裝載LED之 P刷電路板傳送至散熱器。因此，在裝載led之印刷電路 板與散熱器之間的連接處會塗佈導熱油或導熱膠帶。LED 的其他。卩位（LED晶片封裝之側邊及導線之一部）會曝露於 空氣中。在這種散熱結構中，由於空氣的熱導率是很差的， 大部份LED所生成的熱是經由LED晶片及印刷電路板之底 P表面，利用散熱器散佈出去，而極少量的熱能是經由空 氣傳送至散熱器然後才直接散佈至外界空氣中的。由於這 疋一種單向的散熱路徑，其散熱速率是很慢的。因此，熱 就會累積在其中而造成LED過熱。由於溫度過熱，螢光材 料就會X損’而開始產生黃色斑點及晶片導線短路的情形。 【發明内容】 有鐘於此’本發明之一目的是提供一種LED照明裝 置’可以更快速、有效地排出LED生成的熱’以解決習知 201131105 技術中的問題。 本發明另一目的在於提供一種led照明裝置，可以將 來自每一個做為光源用的LED之熱平均地排出，使LED的 亮度均勻’以減少LED間操作壽命的差異。 本發明又另一目的在於提供一種使用上述多個照 明裝置之室内或室外照明設備。 依本發明為解決上述問題所產生之的目的，提供了一 種LED照明裝置，包括一安裝有複數位於一印刷電路板上 之發光二極體之LED光源、以及一散熱器，該散熱器具有 一光源收納元件，用以收納該LED光源，以曝露該些發光 二極體之發光側，而接收來自該LED光源之熱，並將其散 至空氣中，該LED照明裝置更包括一熱傳導填充物，由熱 導率尚於空氣之金屬材料構成，被填入用以收納該光 源之該光源收納元#中之一可用空間"及收來自與該led 光源接觸部位之熱，並將所吸收之熱傳送至該散熱器。 在上述的LED照明裝置中，較佳的方式是，熱傳送填 充物是以無縫隙的方式填入光源收納元件中的可用空間， 使付來自5亥些發光二極體之熱沿一經過該印刷電路板而抵 達該散熱器之路徑進行傳送，而其餘的熱則經由該埶傳導 填充物傳送至該散熱器。 …、傳導 此外，上述的發光二極體具有相同的散熱條件。相同 之政熱條件可經由將每一發光二極體與鄰近熱源的位置、 散熱益之位置以及熱傳送填充物之位置關係設為相同來達 成。 201131105 上述之熱傳導填充物是以填入全部的該可用空間並在 所有方向上包圍著該些發光二極體之方式進行填入，以在 該⑽光源至該光源收納元件之—内牆間形成一最短的熱 傳送路徑。 使散熱條件相同的方式之一是，使LED光源具有在該 長形印刷電路板上在長度方向上排列成一列或兩列之複數 又光極冑亥散熱器在所有方向上以所有可能最短的 方向包圍著每一個發光二極體。 上述之散熱ϋ包括一基座以及複數突出至一預設高度 之散熱針或散熱翼，該基座係與該光源收納元件共同形 成、在長度方向上延伸並在長度方向上之一側中央部位具 有-隧道外形，其中用以曝露該些發光二極體發光部位之 複數光輸出孔係形成於該光源收納元件巾，而該些散熱針 或散熱翼係、自該基座至少一外側表面或内側表面之一延伸 至—預設長度’以將熱幅射面積最大化。 牛例來°兒，上述之散熱器可以包括：一第一散熱槽， 具有一沿一長度方向延伸並在一表面沿一長度方向之中央 部位上具有-溝槽，且在該第-基座之-表面上形成有複 數散熱針或散熱翼之1 ;以及-第二散熱槽，在該長度 方向上具有複數光輸出孔，與該光源收納元件之上部開口 以及至少該第—基座之—部接合而覆蓋於上，以使該光源 收納元件形成有一隧道外形。Out of the box, and ? The heat sink (丨4) is attached to the printed circuit board (16), and the LED body has a protective cover (i2) integrally formed on the printed circuit board, and the device is protected in front of the LED. Transparent cover (18). The primary source of heat in the LED lighting device (1〇) is leD (20). The heat from the LED (20), in the lower part, is conducted to the transparent cover (18) from the portion of the wire exposed to the wafer and the air via the air to be dispersed into the outside air via them; The part is transmitted to the inner air of the cover (丄2) by heat conduction through the connection between the printed circuit board (16) and the heat sink ((4) from the LED (2)) (part of the heat is via the wire, , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , In the case of outside air, the path of heat transfer usually involves the transfer process from the left to the second gas. However, due to the air as a gas, the heat transfer rate of 201131105 is much lower than that of liquid or solid, and the heat generated by the LED cannot be very high. It is quickly spread out. In addition, since the LED modules (16, 20) and the heat sink (14) are integrally formed and closed, the heat from [ED cannot be quickly dispersed out], which causes a greenhouse effect. If in the summer The daytime 'controller failure of a cartridge is erroneously opened street lights, sunlight due to the high temperature have been formed together with LEDC20) heat generation, the temperature will quickly provide 咼 to be able to withstand temperatures of more than LED. This condition can impair the performance of the lED' causing serious damage to its life cycle. In addition, since the heat sink (14) is integrated with the entire LED (20), the heat emitted by each LED (20) is transferred to the other LEDs (20) via the heat sink (14), thereby improving the other The temperature of the LED is further accelerated by the device. Especially in the use of many groups of LEDs as a source of illumination. Also, since the printed circuit board contains a plurality of three columns, three or more rows and is closely arranged (four) LEDs, each of the LEDs may not have the same heat dissipation or radiation conditions. That is, since the position of each LED is different, the heat transfer path from each LED to the heat sink, each [ED adjacent to the led arrangement is different, and each -^ LED has a different heat dissipation speed, so Produces great temperature differences. As the position is farther from the edge, the heat received by the near-center LED (2〇) from other adjacent LEDs (2〇) is also affected by the excellent performance and life cycle (the operation life is not good) The average level will increase). Moreover, since the life of the entire lighting device is determined by the LED having the shortest life span, it is undesirable to see the phenomenon of uneven life in each LED. Figure 2 shows another conventional lighting device (3〇) with a one-way 201131105 heat dissipation structure. A heat sink (10) will be in direct contact with the farm L_ board (5), and the feLED light will be covered or sealed by the front (4) cover (38). In this configuration, since the transparent protective cover (38) on the front side has a poor thermal conductivity, it is difficult to have a greenhouse effect through the cover, thereby causing a greenhouse effect inside the protective cover (38). . Most of the heat is released in one direction via the heat sink (36). Thus, the unidirectional heat radiation 'has a very low heat dissipation rate. Therefore, the 2) will be heated to a high temperature as described above, resulting in various adverse effects. Similarly, the heat generated by the U-based heat source LED in the conventional lighting device using the LED as the light source is transmitted to the heat sink via the wire and the P-brush circuit board on which the LED is loaded. Therefore, heat transfer oil or thermal conductive tape is applied to the joint between the printed printed circuit board on which the led is mounted and the heat sink. LED other. The clamp (the side of the LED chip package and one of the wires) is exposed to the air. In this heat dissipation structure, since the thermal conductivity of air is very poor, the heat generated by most of the LEDs is transmitted through the surface of the bottom surface of the LED chip and the printed circuit board, and is radiated by the heat sink with a small amount of heat energy. It is transmitted to the radiator via air and then directly distributed to the outside air. Due to this one-way heat dissipation path, the heat dissipation rate is very slow. Therefore, heat accumulates in it and causes the LED to overheat. As the temperature is overheated, the phosphor material will X-destroy and begin to produce yellow spots and shorted wafer leads. SUMMARY OF THE INVENTION One object of the present invention is to provide an LED lighting device that can discharge the heat generated by the LED more quickly and efficiently to solve the problems in the conventional technology of 201131105. Another object of the present invention is to provide a LED lighting device which can discharge heat from each of the LEDs used as a light source evenly to make the brightness of the LEDs uniform to reduce the difference in operational life between the LEDs. Still another object of the present invention is to provide an indoor or outdoor lighting apparatus using the above plurality of lighting devices. In order to solve the above problems, an LED lighting device includes an LED light source mounted with a plurality of light emitting diodes on a printed circuit board, and a heat sink having a light source. a receiving component for accommodating the LED light source to expose the light emitting side of the light emitting diodes, and receiving heat from the LED light source and dispersing the heat into the air, the LED lighting device further comprising a heat conductive filler, It is composed of a metal material whose thermal conductivity is still in the air, and is filled with one of the available space of the light source storage unit # for accommodating the light source, and receives heat from the contact portion with the LED light source, and absorbs the absorbed material. Heat is transferred to the heat sink. In the above LED lighting device, preferably, the heat transfer filler is filled in a space freely in the light source receiving member in a gapless manner, so that the heat from the light emitting diodes of the 5 The printed circuit board arrives at the path of the heat sink for transfer, and the remaining heat is transferred to the heat sink via the conductive deposit. ..., conduction In addition, the above-mentioned light-emitting diodes have the same heat dissipation conditions. The same political thermal condition can be achieved by setting the position of each of the light-emitting diodes to the adjacent heat source, the position of the heat dissipation, and the positional relationship of the heat transfer fillers to be the same. 201131105 The heat transfer filler described above is filled in such a manner that all of the available space is filled and surrounds the light emitting diodes in all directions to form between the (10) light source and the inner wall of the light source receiving member. A shortest heat transfer path. One of the ways to make the heat dissipation conditions the same is to make the LED light source have a plurality of optical poles arranged in a row or two columns in the length direction on the long printed circuit board, and all of the shortest possible in all directions. The direction surrounds each of the light-emitting diodes. The heat dissipation device includes a base and a plurality of heat dissipation pins or heat dissipation fins protruding to a predetermined height, the base being formed together with the light source receiving member, extending in the longitudinal direction and at a central portion of the length direction Forming a tunnel shape, wherein a plurality of light output apertures for exposing the light emitting diodes are formed on the light source receiving component, and the heat sink or heat sinking wing is from at least one outer surface of the base or One of the inner side surfaces extends to a predetermined length 'to maximize the heat radiation area. In the case of a cow, the heat sink may include: a first heat sink having a groove extending along a length direction and having a groove along a central portion of a length direction, and at the first base Forming a plurality of heat dissipating pins or fins on the surface; and - a second heat dissipating groove having a plurality of light output holes in the length direction, and an upper opening of the light source receiving member and at least the first base The portion is joined to cover the upper portion such that the light source housing member is formed with a tunnel shape.
在上述的散熱器中，較佳的方式是，In the above heat sink, the preferred way is
形成有一個或一個以上之左 在至少該些散熱 、右通氣孔，以 201131105 在該散熱器之 ’以使該基座 使該些散熱翼之間的空氣能夠流通。此外， 基座中形成有一個或一個以上之垂直通氣孔 之一下方部位中的熱可以上升。 在上述的LED照明裝置中，該熱傳導填充物之材料具 有較空氣為高的熱導率，且呈現膠狀或在完成填充後硬 化該熱傳導填充物至少是導熱油或導熱矽膠之一。 此外，上述之LED照明裝置更包括一透明熱傳送保護 元件，覆蓋於曝露在該散熱器之該些發光二極體的發光 面，並保護該發光面，且將所產生之熱傳送至外界空氣或 s政，'、、器其中，該熱傳送保護元件包括至少一透明導熱 夕膠或透明保5蒦膜之一，該透明導熱矽膠填滿整個光輸 出孔且覆蓋該發光二極體之發光面，將來自發光二極體發 光面之熱導出，並傳送至該散熱器及外界空氣，而該透明 保濩膜係附著於鄰近區域中包含該些光輸出孔之該散熱器 表面之一部。 另一方面，根據本發明的另一實施例，提供了一種led 照明設備，包括：多個LED光源模組，每一該LED光源模 i X 單—換組之方式組合而成’每一該單一模組包 括·一 LED光源，安裝有複數位於一印刷電路板上之發光 一極體；一散熱器，具有一光源收納元件，用以收納該led 光源’以向下曝露該些發光二極體之發光側，而將被傳送 之熱散至空氣中；一熱傳導填充物，包括一熱導率高於空 氣之金屬材料’被填入用以收納該LED光源之該光源收納 70件中之—可用空間，吸收來自與該LED光源接觸部位之 10 201131105 熱’並將所吸收之熱傳送至該散熱器；以及一透明熱傳送 保護元件，覆蓋並保護自該散熱器曝露之該些發光二極體 之發光面，且將來自該發光面之熱傳送至至少外界空氣或 該散熱器之一；以及一燈具外殼，用以遮蓋該些以複數列 並排設置之LED光源模組’且將其支撐與固定。其中，由 每一該發光二極體所產生之熱之一部係經由該印刷電路板 傳送至該散熱器，而另一部份之熱係經由該熱傳導填充物 之熱導效應傳送至該散熱器，其餘的熱則經由該透明熱傳 送保濩元件傳送至該散熱器或直接散佈至外界空氣中。 此外，又另一方面，依據本發明另一目的，提供了一 種照明設備，包括：一光源套裝模組，具有多個如上述之 led照明裝置，該些LED照明裝置係以平行、串聯或平行、 串聯混合之方式排列而組合成一單一模組；以及一燈具外 殼，用以支撐及固定該些led照明裝置，並覆蓋至少該光 源模組之一上側。 上述之LED照明設備更包括一電源供應器，用以將一 普通電源轉換成可適用於操作該些LED照明裝置並供應至 該印刷電路板之電力。 上述之燈具外殼包括-燈具遮蓋，用以遮蓋住該光源 套裝模組，該燈具遮蓋具有一通氣孔，用以將來自該LED 照明裝置之熱快速散佈至外界。 此外，上述之燈具外殼更包括一支柱連接架，用以連 接至一支柱或一室内或室外照明設備之支撐本體。 再者’上述之燈具外殼更可以包括_燈具遮蓋，用以 201131105 遮蓋該光源套裝模組，由於該遮蓋係與該光源套裝模組中 的每一個LED照明裝置隔離，使得該遮蓋之設置不會在其 間產生直接的熱傳導。Forming one or more left at least some of the heat dissipating, right venting holes to 201131105 in the heat sink to enable the pedestal to circulate air between the radiating fins. Additionally, heat in the lower portion of one of the one or more vertical vents formed in the pedestal may rise. In the above LED lighting device, the material of the heat-conductive filler has a thermal conductivity higher than that of air, and is gel-like or hardened after the filling is completed. The heat-conductive filler is at least one of a heat-conducting oil or a heat-conductive silicone. In addition, the LED lighting device further includes a transparent heat transfer protection component covering the light emitting surface of the light emitting diodes exposed to the heat sink, protecting the light emitting surface, and transmitting the generated heat to the outside air. Or the heat transfer protection component comprises at least one of a transparent thermal conductive adhesive or a transparent protective film, the transparent thermal conductive adhesive filling the entire light output hole and covering the light emitting diode Surface, the heat from the light emitting surface of the light emitting diode is led out and transmitted to the heat sink and the outside air, and the transparent protective film is attached to one of the surface of the heat sink including the light output holes in the adjacent area . In another aspect, according to another embodiment of the present invention, a LED lighting device is provided, including: a plurality of LED light source modules, each of which is combined in a single-switching manner. The single module includes an LED light source, and a plurality of light emitting poles mounted on a printed circuit board; a heat sink having a light source receiving component for receiving the LED light source to expose the light emitting diodes downward a light-emitting side of the body, and the heat to be transferred is dispersed into the air; a heat-conductive filler, including a metal material having a thermal conductivity higher than air, is filled in the light source housing 70 for accommodating the LED light source - available space, absorbing 10 201131105 heat from the contact with the LED light source and transferring the absorbed heat to the heat sink; and a transparent heat transfer protection element covering and protecting the light-emitting two exposed from the heat sink a light emitting surface of the polar body, and transferring heat from the light emitting surface to at least one of the outside air or the heat sink; and a lamp housing for covering the LED light source modules arranged in a plurality of columns side by side And the supporting and fixing. Wherein, one part of the heat generated by each of the light-emitting diodes is transmitted to the heat sink via the printed circuit board, and another part of the heat is transferred to the heat dissipation via the heat conduction effect of the heat-conductive filler The remaining heat is transferred to the heat sink via the transparent heat transfer protection element or directly to the outside air. In addition, in another aspect, according to another object of the present invention, a lighting device is provided, comprising: a light source set module having a plurality of LED lighting devices as described above, the LED lighting devices being parallel, serial or parallel And arranging in series to form a single module; and a lamp housing for supporting and fixing the LED lighting devices and covering at least one upper side of the light source module. The LED lighting device described above further includes a power supply for converting a conventional power source into power suitable for operating the LED lighting devices and supplying the printed circuit board. The luminaire housing includes a luminaire cover for covering the light source package module, and the luminaire cover has a vent hole for quickly dissipating heat from the LED illuminating device to the outside. In addition, the above lamp housing further includes a post connector for connecting to a support or a support body of an indoor or outdoor lighting device. Furthermore, the above-mentioned lamp housing may further include a luminaire cover for covering the light source set module with 201131105, since the cover is isolated from each LED lighting device in the light source set module, so that the cover setting is not Direct heat transfer occurs between them.
如上述之發明，熱傳送填充物之填充方式是使散熱器 中用以收納光源之光源收納元件中的可用空間被填滿。此 外，在LED裝置之前發光面上塗佈有透明的熱介面材料， 而在光源收納元件中的光輸出孔是被封合的。由LED裝置 所生成的熱，一大部份會經由熱傳送填充物或透明熱介面 材料以熱傳導的方式傳送至散熱器或排放至外界空氣。此 外，因為散熱器之設計是讓每一個LED裝置以最近的距離 被散熱器包圍著，熱傳送填充物或透明熱介面材料所建立 的熱傳導路徑是最短的。由於熱介面材料會直接自LED裝 置所有的接觸部位直接吸熱並均勻地經由全面性最短的路 徑以熱傳導的方式傳送至散熱器，因此排熱或熱幅射的進 行是非常快速有效的，也避免LED過熱，使得裝置的光學 性旎與壽命可以被延長。此外，每一個led裝置是獨立的， 且具有實質相同的散熱環境，因此在led裝置之間的熱干 擾是很低的，而使得熱聚集現象幾乎不存在，又在這些LED 裝置間幾乎沒有溫差，而使得LED裝置可均勻發光，其壽 命就可穩定且一致。 由於LED裝置是以單列或兩列的方式設置，就可以很 容易為每一個LED裝置設計出一致的散熱環境，而可以單 獨地將LED光源模組化。 當藉由將多個LED光源模組共同組合成一個照明設備 201131105 的情況時，由於即使某一個LED裝置發生故障，也不需要 將整個照明設備拆解或替換，只需要將特定損壞LED敦置 之光源模組進行修理或替換即可，因此可以降低維修的難 度及管理成本。此外，藉由改變LED光源模組的設置位置， 也可以得到不同的照明設備設計。 此外，照明設備具有用以阻擋陽光之遮蓋，且每一個 LED光源模組具有單獨的遮蓋，因此即便在自動開關系統 發生故障而誤開時’ LED晶片也會受到遮蓋的保護。 【實施方式】 為使本發明之上述目的、特徵和優點能更明顯易懂， 下文特舉一較佳實施例，並配合所附圖式，作詳細說明如 下： 以下將介紹根據本發明所述之較佳實施例。必須說明 的是，本發明提供了許多可應用之發明概念，所揭露之特 定實施例僅是說明達成以及使用本發明之特定方式，不可 用以限制本發明之範圍。 1.第一實施例 第3a及3b至第6圖為本發明第一實施例中光源模組 (12 0)結構之立體圖及分解圖。光源模組（丨2 〇)是一種 照明裝置，其包括一 LED光源（105)、一散熱器（11〇)以及 熱傳送填充物（126)。 LED光源（105)包括多個安裝於具有操作LED所需電路 圖案之印刷電路板（124)上的LED裝置（1〇2)。印刷電路板 13 201131105 (124)之電路圖案係連接至一電源供應器（稍後說明），接收 電力並供應操作電流至每一個LED裝置（1 〇2 )。LED裝置 (102)包括一 LED晶片（l〇2a)及一覆蓋在LED晶片（102a) 上端之螢光材料的發光面（1〇2b)，其中，當電流在LED晶 片（102a)中流動時’就會自此螢光材料產生光，而經由發 光面（102b)發射出來。LED光源（1〇5)被收納於一光源收納 元件（122)之中，使得[ED裝置（1〇2)之一前側發光面被曝 露在外。光源收納元件（122)是散熱器（110)之一部。散熱 窃（11 〇)之結構材料，可以吸收來自做為熱源的LED光源 (1 〇 5)的熱，並快速地將熱排放至大氣中。在光源收納元件 (122)之底面上經由市面上可取得之導熱油或導熱膠帶而 附著有LED光源（1〇5)之印刷電路板（124)。 除了這些基本元件之外，本發明最重要的新特徵在 於，光源收納元件（122)在收納了 LED光源（105)之後所形 成的二間並不是只有空氣，而是填入了一種熱傳送填充物 (126)，其熱導率是遠比空氣高的。熱傳送填充物（us)可 以是任何具有良好熱導率之材料，也可以是透明或不透明 的。熱介面材料之熱導率是較空氣為高的，而且最好是呈 乳膠狀而可以很方便地進行填充及處理，並在填充完成後 會硬化。舉例來說，可以是導熱油、熱矽膠（導熱矽膠）等 等。然而，它也不一定必需是呈乳膠狀的，即使只是具彈 1·生的固體或液體，只要有良好的熱導率都可以被使用。 為了能使經由熱傳送填充物（126)排放之熱最大化，最 好能以無縫隙的方式將熱傳送填充物（126)填入光源收納 14 201131105 2件（122)之可用空間中。藉此，熱傳送填充物（i26)會覆 蓋LED裝置（102)之所有側邊表面、導線、光源收納元件 (122)整個内牆以及印刷電路板（124>如此，led裝置（1〇〇 之四個側邊至散熱器（110)(意即，光源收納元件（122)之内 牆）都具有一通過熱傳送填充物（126)以熱傳導方式進行散 熱之路徑。 上述之LED裝置（102)最好是具有實質相同的散熱條 件。以LED裝置（102)所組成的光源模組之壽命，是由整個 LED裝置（1〇2)中具最短壽命之LED裝置來決定。若每一個 LED裝置（1〇2)之散熱條件差異很大，其中一個LE])裝置 (102)會遠較其他LED裝置提早損壞，而造成光源模組的壽 命大大地被縮短。若LED裝置（1〇2)之散熱條件都相同，其 發光性能及平均壽命就會比較一致。因此，光源模組（12〇) 之平均壽命會因而實質被延長。LED裝置（1〇2)之散熱條件 可以由每一個LED裝置（1〇2)與鄰近熱源（其他的LED裝 置）、散熱器（11 0 )及熱介面材料（稍後說明）等等的位置關 係來決定。藉由將每一 LED裝置（102)之此種位置關係一致 化，就可以得到一致的散熱條件。 此外母個LED裝置（102)及散熱器（11〇)最好是設 置得越靠近越好，以將每一個LED裝置（1〇2)生成的熱快速 傳送至散熱器（11 〇)。為達此目的，最好是能將整個L仙裝 置（102)在印刷電路板（124)上以並排的方式設置成一列或 兩列。這種排列方式可用來使LED裝置（1〇2)具有相同的散 熱條件。此外，將每一個LED裝置（1〇2)與光源收納元件 15 201131105 (122)内牆的距離縮短，會縮短熱傳送填充物（126)所形成 之熱傳送路徑，所以也有助於快速地散熱。 當然，LED裝置（102)也可以被排成三列，但在這種排 列下，就不容易設計及製造出具有相同散熱條件之LED裝 置’並且在相同散熱條件與印刷電路板、散熱器的設計效 果間也必需進行折衷。 印刷電路板（124)也具有一長矩形，以符合LED裝置 (1 0 2)所排列出來的形狀。舉例來說，在排成單列的情況 下’ LED裝置（102)間的間隔是相同的，而散熱器（11〇)及 熱傳送填充物（126)會對稱地設置在每一個LED裂置（1〇2) 之右側及左側。而在排成雙列的情況下，散熱器（11〇)及熱 傳送填充物（126)也可以以同樣的方式排列在每一個led 裝置（1 02)旁。然而’在排成超過三列的情況時，由於在最 外側列的LED裝置（102)只有在單側有其他鄰近的[ED裝 置’而在中間列的LED裝置（1〇2)在兩側都有其他鄰近的 LED裝置’所以它們與鄰近熱源的位置關係是不同的，且 在右側及左側上與散熱器之距離及其他的散熱條件也不 同，LED裝置（102)之散熱速率會隨著其位置越靠近中間列 而越慢，其溫度也會越高。 散熱器（110)包括一用以收納LED光源（105)之光源收 納元件（122)，以將LED裝置（102)之前側發光面曝露在 外。散熱器（110)最好是由具有良好熱導率的金屬構成（例 如鋁、鋁合金、銅或銅合金），以吸收來自LED光源（丨05) 所生成之熱，並將其有效地排至大氣中。散熱器（110)具有 16 201131105 一沿縱長方向上延伸之其庙n B 甲之基座（lu)'以及多個散熱針（圖未 顯不）或散熱翼（112)。苴中 '、 散”·、針自基座（111 )的外側表 面或内側表面突出一箱初·古痒 , 預叹间度，以將散熱面積極大化。而 散熱翼（112)則是突出至一預設高度並延伸至—預設長 度。基座(1⑴之形狀是長矩形，在其一面沿縱長方向的中 央處形成有具有隨道外形的光源收納元件（122)，而在光源 收、内元件(1 22)中則具有光輸出孔⑴9)，用以將裝置 (102)之發光面曝露在外。為了增加散熱面積，散熱突出部 (圖未顯示）或其他各種不同的突出形狀都可以使用，不限 於使用散熱翼（112) 光源收納元件（122)本身的形狀也可 以改變，任何如垂直形、環形、橢圓形的形狀都是適用的。 光源收納元件（122)的位置最好是在散熱器（11〇)的中央， 但也不限於此，也可因不同的需求而偏向一邊。此外，在 散熱(no)的一側表面上可以具有一側蓋接合槽（127)， 以在安裝側面遮蓋時可以鎖入螺絲。 如第3a、3b及4圖之散熱器（110)，可以使用將上散 熱槽（第一散熱槽）（110a)及下散熱槽（第二散熱槽）（n〇b) 組合而成並將LED光源（1〇5)置於其間的方式來製作，以方 便生產。g然，散熱器（110)也可以是一體成型的。上散熱 槽（110a)包括在縱長方向上延伸並在一側表面的縱長方向 上中央處形成有長矩形溝槽之第一基座，以及多個設置在 第一基座（111a)表面、用以使散熱面積極大化的散熱針或 散熱翼（112)。下散熱槽（ii〇b)包括一第二基座（lllb)，第 二基座（mb)在縱長方向上具有多個光輸出孔（119)、遮蓋 17 201131105 住光源收納元件（1 2 2 )之上端開口以及至少第一基座（111 a) 之一部、並接合而形成一隧道。在第二基座（lllb)之表面 上可以提供一散熱針或散熱翼（112)。以隧道外形形成的光 源收納元件（122)具有一可用空間，用以在其收納LED光源 (105)時可將熱傳送填充物（126)填入。此可用空間最好是 位在每一個LED裝置（102)的所有側邊表面附近。 在散熱器（110)上形成有散熱翼（114)的情況下，最好 可以形成水平通氣孔（114a)，其係以垂直於散熱翼（114) 之方向穿越’以使空氣能在散熱翼（114)之間水平地流通。 水平通氣孔（114a)可以被安裝在散熱翼（114)中，或是只在 最外側的散熱翼上。此外，在散熱器（丨丨〇)之基座（丨丨丨）中 可以形成有一個或一個以上的垂直通氣孔（i 14b)，以使散 熱器（110)下方的熱可以上升並有效地被排放至外界。藉由 這些水平通氣孔（114a)及/或垂直通氣孔（114b)，散熱器 (110 )就可以與外界空氣進行熱交換，而使散熱更有效率。 在這些結構中，由於發光面是經由光輸出孔（丨丨9)向外 曝露的，因此LED裝置（102)就處於可能受到外界環境損害 的危險之中。此外’若熱傳送填充物（126)是呈乳膠狀，就 可能經由光輸出孔（11 9)的縫隙而滲漏出來。另外，led裝 置（102)生成之熱也必需有效地從發光面排放出來。所以， 在考慮這些因素後，最好能再提供一個透明的熱傳送保護 兀件，遮蓋住LED裝置（1〇2)經由散熱器（ι10)之光輸出孔 (119)所曝露之發光面（1〇2b)，並將光輸出孔（119)密封， 以保護發光面且將熱自該發光面傳送至外界空氣及/或散 201131105 熱器（110)。舉例來說，用來封合光輸出孔（119)之材料最 好可以使用透明的熱導矽膠（128)。透明熱導矽膠係塗佈在 LED裝置經由光輸出孔（119)而曝露之發光面（i〇2b)上，它 也最好能與下散熱槽（110b)直接接觸。藉由此種的直接接 觸’熱導矽膠（128)就可以將吸收自LED裝置（102)發光面 (1 02b)的熱快速地經由散熱器（丨丨〇)進行排放。由於透明熱 導矽膠（128)與LED裝置（102)發光面（102b)接觸並以上述 之方式快速排熱，光源模組（12 0)的散熱速率就會被提高。 另外，也可以藉由使用透明保護膜（129)來覆蓋發光面 (102b)的方式來進行封合。除此之外，也可以使用上述兩 種方法的混合方式來進行封合，意即，可以將熱導石夕膠（12 8) 塗佈在LED裝置（102)之發光面（i〇2b)上，然後再將包含發 光面之鄰近區域再覆上一層透明保護膜（129)。藉此，led 裝置（102)就可以受到保護，而自發光面（1〇2b)所發出的熱 就可以被吸收且排放至外界。 在上述本發明第一實施例之光源模組（12〇)之散熱結 構中’由於散熱之機制係設置在熱源中央的四周且與空氣 接觸’其散熱速率就會被最佳化。意即，做為主熱源的LED 裝置（102)主要是經由led裝置（102)某些部位與散熱器 (110)、熱傳送填充物（126)、熱導矽膠（128)及印刷電路板 (124) -熱導膠（圖未顯示）的直接接觸而以熱傳導的方式進 行散熱，而被散熱器（110)、熱傳送填充物（126)、熱導矽 膠（128)及印刷電路板（124)-熱導膠所吸收的熱則是再次 地傳送至散熱器（110)，然後再被排放出去，使得整個散熱 19 201131105 率°由於熱是藉由熱傳導的方式被排放至 1=，自LED光源(1°5)所有點至光源收納元件内牆的 :在各個方向上都是均句的，且在每個方向上的轨傳 導路徑都是最短的。同樣地，由於在散熱機制中，自識 裝置(102)生成的熱有相當大的部份是自所有方向經由盘 LED裝置⑽）㈣之㈣料充物（126)㈣送至散熱器 (110)的’且这些熱也在所有方向上散佈並經由熱導石夕膠 (128)傳送至散熱器’所以本發明中的光源模組（⑽之散 熱速率是遠高於傳統的光源模組的。 2.第二實施例 第7及8圖顯示了本發明第二實施例中之光源模組 (220)的結構。此光源模組（22〇)包括了一散熱器〇ι〇)，其 含有一光源收納元件（312)，光源收納元件（312)在縱長方 向&基座（314)之中央處具有矩形溝槽。在光源收納元件 (312)之底部經由熱導膠附著有一在縱長方向上延伸之led 光源（105)的印刷電路板（124)。在基座（314)之左、右兩側 與光源收納元件（31 2 )之間具有多個對稱排列的散熱翼 (316) I個放熱器（310)的中間部位會覆蓋住[ED光源 (105)，而呈現出反射鏡之外形。收納了 LED光源（1〇5)的 光源收納元件（312)會被一個收納元件遮蓋（3 2 〇)所遮蓋。 在收納元件遮蓋（320)上與LED裝置（102)之位置相對應處 具有光輸出孔（322)。每一個光輸出孔（322)會以如同第一 貫施例中的方式被密封◊被收納元件遮蓋（3 2 〇)所遮蓋住的 光源收納元件（312)中之内部空間是被熱傳送填充物（1 26) 201131105 所填滿°收納元件遮蓋（320)之底面及光源收納元件（31 2) 之内牆是與熱傳送填充物（1 26)直接接觸的。收納元件遮蓋 (320)之光輸出孔（322)的内牆則與熱導矽膠（128)直接接 觸。散熱器（310)及收納元件遮蓋（320)是使用具有極佳熱 導率之金屬材料所製成。 因此’熱傳送填充物（126)會吸收大量來自每一個LED 裝置（102)及印刷電路板（124)周圍側邊表面生成之熱，並 將其傳送至散熱器（310)及收納元件遮蓋（32〇)，以將其排 放至外界空氣。熱導矽膠（128)也會吸收來自每一個LED裝 置（102)發光面之熱，並將其直接排放至外界空氣或收納元 件遮蓋（320 )。收納元件遮蓋（32〇)也會扮演散熱器的角色 (以這種觀點來看，散熱器（31 0 )可以被視為是一上散熱 槽’而收納元件遮蓋（320)可以被視為是下散熱槽）。此種 散熱機制幾乎與第一實施例中的相同。 光源模組（220 )可以更包括一保護膜（330)，覆蓋在收 納元件遮蓋（320)上。此外，在散熱器（310)的兩端沿縱長 方向上是以螺絲鎖接一安裝蓋（3 4 〇 )，以將散熱器（31 〇 )、 led光源（105)及收納元件遮蓋（320)安裝成一個模組。而 印刷電路板（124)與一導線（350 )連接，以連接至可提供lED 操作所需電力之電源供應器（134)。 3.第三實施例 光源模組（120、220 )本身是個完整的照明設備，只要 提供一操作所需電力至印刷電路板（124)，就可以正常操 作’但藉由將多個光源模組（12〇、22〇)組合起來也可以形 21 201131105 成一個更大的照明設備（1 00)。第9及1 〇圖顯示了本發明 第三實施例的照明設備（1 〇〇)。 照明設備（1 0 0)包括一光源套裝模組（1 3 〇)及一燈具外 殼（150 )。光源套裝模組（1 30 )是由四個光源模組（丨20 )共同 形成一組’而燈具外殼（150)則將光源模組（丨2〇)支撐住。 以四個光源模組（1 2 0)來形成一個套裝模組只是舉例說 明’光源套裝模組（130)可以由更多的光源模組（12〇及或 220)來形成。燈具外殼（150)的功能之一在於做為固定led 光源套裝模組（1 3 0)及電源供應器（13 4)之框架，而另一功 能則疋做為保護它們不受外界因素而損壞之保護器，例如 下雪、下雨、霧氣、濕氣、曰曬等等。更具體地的是，有 多個光源模組（12 0 )被並排設置（以平行的方式）在燈具外 殼（140)中，而使光源套裝模組（13〇)中，LED裝置（102)之 發光面是面向下方且被固定住的。這些光源模組（12〇)也可 以依需要以串聯的方式設置，或以平行、串聯混合的方式 設置。燈具外殼（140)之底面與每一個光源模組（12〇)相對 之位置上可以是透明的或直接開孔。燈具外般（丨4〇)可以依 需要而有不同型式的設計。 光源套裝模組（130)係被一具有反射鏡外形的燈罩 (142)所遮蓋。在燈罩（142)中可以具有通氣孔（143)，以將 光源模組（120)所生成之熱快速排放至外界。尤其是，因為 燈罩（142)是與每一個LED光源模組（12〇或22⑸分離的， 所以燈罩（142)之設計並非要形成直接的熱傳導。燈罩（丨42) 之功能在於做為室外日光之遮罩，但並不會將日光所生成 22 201131105 的熱直接經由熱傳導的方式傳送至每_個L〇光源模组 (120或220)。即使LED光源模組在白天被誤開它也可以 保遠LED晶片不會過熱。 在燈罩（142)的上方一側接合著一連接元件（146)，其 中具有一收納空間。連接元件（146)係連接至一支柱連接架 (144)，用以連接支撐一照明設備，例如街燈。在連接元件 (14 6)的内部空間中也收納了延伸自普通電源並穿過支柱 連接架（144)之電線、以及連接至此電線而用以操作光源模 組（120)之控制器（145)。控制器（145)是電源供應器（134) 之全部或一部。電源供應器（134)之主要功能在於將普通電 源轉換可適用於操作LED裝置並產生光之電壓，並將此電 壓供應至印刷電路板（124)。電源供應器（134)可以是AC_DC 轉換器、DC-DC轉換器、DC —AC轉換器或是AC_AC轉換器。 此外，第10圖中的照明設備（100)可依需求而藉由將 兩個或三個照明設備（1〇〇)如第n圖連接在一起，做為如 街燈來使用。舉例來說，可以藉由將多個照明設備（丨〇〇) 以放射狀之方式設置，並將每一個支柱連接架（144)與支柱 連接架收納元件（1 48)結合成一體而形成一套照明設備。藉 由將一套照明設備之支柱連接架收納元件（丨48)連接至一 街燈的支柱（圖未顯示）就可以形成一街燈（圖未顯示）。另 外’再舉例來說，也可以藉由將一套照明設備連接至其他 的支柱上而形成室内的照明裝置。 由於在本發明上述之照明設備（100)之結構中，LED光 源模組、燈罩及電源供應器在結構及功能上是分離的，且 23 201131105 具有各種不同的可能組合，其應用範圍便很廣。此外，照 明範圍也可以很容易依狀況所需來進行調整，其製造成本 是很低的。 熟知此技術之人能夠依上述之說明，使用本發明中的 光源模組（120、220)來製作出各種不同型式與外形的照明 設備。第12圖顯示了另—種照明設備的結構。它是經由將 五個第二貫施例中的光源模組（2 2 〇)並排設置，且固定於一 具有反射鏡外形之燈罩（24〇)中而形成。每一個光源模組 (220 )之底面覆有一透明光源保護蓋（23〇)。在燈具外殼 (240)的上端部位中具有一連接元件（235)，用以連接至另 一照明設備之支柱。 4.傳統照明設備與本發明照明設備之比較 傳統照明設備中，熱的傳送是經由空氣，自LED裝置 傳送至散熱器，而本發明的照明設備中，熱的傳送是在所 有方向上經由熱傳送填充物（126)來傳送。第13(a)圖顯示 了第1圖習知技術中LED照明裝置之相片，而第13(b)及 13(c)圖分別是在LED照明裝置被操作之初始時間及被操 作相當長一段時間後所拍攝之紅外線相片。第14(㈧圖顯 示了第7圖中本發明LED照明裝置（22〇)之相片，而第14(b) 及14(c)圖分別是在LED照明裝置被操作之初始時間及被 操作相當長一段時間後所拍攝之紅外線相片。 依據傳統LED照明设備之紅外線相片（第13 (b)及 (c))’隨著LED裝置操作時間的增加’在led裝置及散熱 器之間的溫差就越來越大，這是因為排熱沒有效率的關 24 201131105 係。從詳細的溫度資料可以看出，在LED裝置最初的操作 時間内’ LED裝置及散熱器之溫度分別是約49. 5〇c及37· 5 C 差為1 2 C。而在一段足夠的操作時間之後，裝 置及散熱器之溫度分別是約56t& 34 rc，溫差為213 C確實有變大的現象。這些量測結果顯示了隨著時間 的增加，LED t置會過熱，而經由散熱器所進行的排熱是 效率不足的。 相反的依據本發明LED照明設備之紅外線相片（第 14(b)及(c))來看’即使操作時間增加，代表溫度的顏色仍 然幾乎沒有改變，這顯示了整個排熱效率是良好的。從詳 細的溫度貪料可以看出，在操作的一開始，LED裝置及散 熱器之溫度分別是約36.2〇c& 27·5χ：，溫差為8 7它。而 在一段足夠的刼作時間之後，LED裝置及散熱器之溫度分 別是約37.5°C及28.(TC，溫差為9.51。LED裝置及散熱 器之溫度從操作的一開始僅分別增加了 h 3及〇. 5。〇。這 些里測結果顯示了，即使操作時間不斷繼續，自裝置 所生成的熱會快速地經由散熱器排出，使得LED裝置不會 發生過熱。因此，本發明確實具有極佳的排熱速度。當然， 本發明LED裝置之壽命也會因此延長。 如上所述，雖然本發明以數個實施例及圖示進行說明 如上，熟知此技術之人仍能在不脫離本發明之精神及範圍 下，進行適當的修改。 本發明可在不受特定限制的情況下，應用於照明設備 中。舉例來說，本發明可以應用在不同照明設備的使用情 25 201131105 形下，例如做為室外或室内的照明設備、建築内部照明、 廣告顯示器或背光。 【圖式簡單說明】 第1圖顯示了 一傳統通用的封閉型LED室外照明設備 之剖面圖； 第2圖顯示了具有單向散熱結構之LED照明裝置； 第3〜6圖顯不了本發明第一實施例中光源模組（丨2〇) 之、=構，其中，第33及31^圖是組合完成之立體圖，第5 圖顯不了其LED(12G)以單列方式設置之LED光源模組的底 面，而第6圖係第2(a)圖中沿A_A，切線之剖面圖； 第7及8圖分別係本發明第二實施例之光源模組（22〇) 結構之分解圖及組合完成之剖面圖； 第9及10圖顯示了本發明第三實施例之照明設備，其 係將多個本發明中的光源模組結合而成，第9(a)及9(b) 圖係分別為側視平面圖及下視的平面圖，而第1〇圖則為第 9(a)圖中沿切線B_B，之剖面圖； 第11(a)及11(b)圖分別顯示了將兩個及三個第1〇圖 中的照明裝置（100)以放射狀連接之照明設備的上視平面 圖； 第12(a)及12(b)圖顯示了將本發明第二實施例中之 LED光源模組結合而成之另—照明設備之剖面圖及下視平 面圖； 第13 (a)顯示了習知技術中LEd照明裝置之相片，而 26 201131105 % 第13(b)及13(c)圖分別是在LED照明裝置被操作之初始時 間及被操作相當長一段時間後所拍攝之紅外線相片；及 第14(a)圖顯示了本發明中LED照明裝置（220)之相 片，而第14(b)及14(c)圖分別是在LED照明裝置被操作之 初始時間及被操作相當長一段時間後所拍攝之紅外線相 片。 【主要元件符號說明】 14、36、110、310 :散熱器 16、34、124 :印刷電路板 12 :保護蓋 18、38 :透明遮蓋 10 : LED照明裴置According to the invention described above, the heat transfer filler is filled in such a manner that the available space in the light source housing member for accommodating the light source in the heat sink is filled. Further, a transparent thermal interface material is applied to the light-emitting surface before the LED device, and the light output holes in the light source housing member are sealed. A large portion of the heat generated by the LED device is transferred to the heat sink or to the outside air via a heat transfer filler or a transparent heat interface material in a thermally conductive manner. In addition, because the heat sink is designed to have each LED device surrounded by a heat sink at the closest distance, the heat transfer path established by the heat transfer filler or transparent thermal interface material is the shortest. Since the thermal interface material directly absorbs heat from all the contact parts of the LED device and is uniformly transmitted to the heat sink through the shortest comprehensive path, the heat removal or heat radiation is very fast and effective, and is also avoided. The LED is overheated, allowing the optical 旎 and lifetime of the device to be extended. In addition, each of the LED devices is independent and has substantially the same heat dissipation environment, so the thermal interference between the LED devices is very low, so that the heat accumulation phenomenon is almost non-existent, and there is almost no temperature difference between the LED devices. Therefore, the LED device can be uniformly illuminated, and its life can be stable and consistent. Since the LED device is arranged in a single column or in two columns, it is easy to design a uniform heat dissipation environment for each LED device, and the LED light source can be modularized separately. When a plurality of LED light source modules are combined into one lighting device 201131105, even if one LED device fails, the entire lighting device does not need to be disassembled or replaced, and only a specific damaged LED needs to be placed. The light source module can be repaired or replaced, thereby reducing maintenance difficulty and management cost. In addition, different lighting device designs can also be obtained by changing the setting position of the LED light source module. In addition, the illuminating device has a cover for blocking sunlight, and each of the LED light source modules has a separate cover, so that the LED chip is protected by the cover even if the automatic switching system fails and is accidentally opened. The above described objects, features and advantages of the present invention will become more apparent from the description of the appended claims appended claims Preferred embodiment. It is to be understood that the invention is not limited to the scope of the invention. 1. First Embodiment Figs. 3a and 3b to Fig. 6 are a perspective view and an exploded view showing the structure of a light source module (12 0) according to a first embodiment of the present invention. The light source module (丨2 〇) is a lighting device that includes an LED light source (105), a heat sink (11 turns), and a heat transfer filler (126). The LED light source (105) includes a plurality of LED devices (1〇2) mounted on a printed circuit board (124) having a circuit pattern required to operate the LEDs. The circuit pattern of the printed circuit board 13 201131105 (124) is connected to a power supply (described later), receives power and supplies operating current to each of the LED devices (1 〇 2 ). The LED device (102) includes an LED chip (10a) and a light emitting surface (1〇2b) of the fluorescent material covering the upper end of the LED chip (102a), wherein when current flows in the LED chip (102a) 'The light will be generated from the phosphor material and emitted through the light emitting surface (102b). The LED light source (1〇5) is housed in a light source housing member (122) such that one of the front side light-emitting surfaces of the [ED device (1〇2) is exposed. The light source housing element (122) is part of the heat sink (110). The heat-dissipating (11 〇) structural material absorbs heat from the LED light source (1 〇 5) as a heat source and quickly discharges heat to the atmosphere. A printed circuit board (124) of the LED light source (1〇5) is attached to the bottom surface of the light source housing member (122) via a commercially available heat transfer oil or thermal conductive tape. In addition to these basic components, the most important new feature of the present invention is that the light source receiving member (122) is formed by the LED light source (105) after the storage of the LED light source (105) is not only air, but is filled with a heat transfer filling. (126), its thermal conductivity is much higher than air. The heat transfer filler (us) may be any material having a good thermal conductivity or may be transparent or opaque. The thermal conductivity of the thermal interface material is higher than that of air, and is preferably latex-like and can be easily filled and treated and hardened after filling. For example, it may be a heat transfer oil, a hot silicone (thermal conductive silicone), or the like. However, it does not necessarily have to be latex-like, even if it is only a solid or liquid with a bomb, it can be used as long as it has a good thermal conductivity. In order to maximize the heat discharged through the heat transfer filler (126), it is preferable to fill the heat transfer filler (126) into the available space of the light source housing (122) in a seamless manner. Thereby, the heat transfer filler (i26) covers all side surfaces of the LED device (102), the wires, the entire inner wall of the light source housing member (122), and the printed circuit board (124). Thus, the led device (1) The four sides to the heat sink (110) (that is, the inner wall of the light source housing member (122)) each have a path for heat dissipation by heat transfer of the filler (126). The LED device (102) described above. It is preferable to have substantially the same heat dissipation condition. The life of the light source module composed of the LED device (102) is determined by the LED device having the shortest life in the entire LED device (1〇2). If each LED device (1〇2) The heat dissipation conditions vary greatly. One of the LE]) devices (102) will be damaged earlier than other LED devices, and the life of the light source module is greatly shortened. If the LED device (1〇2) The heat dissipation conditions are the same, and the illuminating performance and average life will be relatively uniform. Therefore, the average life of the light source module (12 〇) will be substantially extended. The heat dissipation condition of the LED device (1〇2) can be made by each LED. Device (1〇2) and adjacent heat source ( The positional relationship of his LED device, the heat sink (110) and the thermal interface material (described later), etc. is determined by aligning the positional relationship of each LED device (102). Consistent heat dissipation conditions. In addition, the mother LED device (102) and the heat sink (11〇) are preferably placed as close as possible to quickly transfer the heat generated by each LED device (1〇2) to the heat sink ( 11 〇). For this purpose, it is preferable to arrange the entire L-senior device (102) in a row or two columns on the printed circuit board (124) side by side. This arrangement can be used to make the LED device ( 1〇2) has the same heat dissipation condition. In addition, shortening the distance between each LED device (1〇2) and the inner wall of the light source receiving member 15 201131105 (122) shortens the heat generated by the heat transfer filler (126). The transmission path also helps to dissipate heat quickly. Of course, the LED devices (102) can also be arranged in three columns, but in this arrangement, it is not easy to design and manufacture LED devices with the same heat dissipation conditions. Same thermal conditions with printed circuit boards, scattered The design of the device must also be compromised. The printed circuit board (124) also has a long rectangular shape to conform to the shape of the LED device (102). For example, in the case of a single column, 'LED The spacing between the devices (102) is the same, and the heat sink (11〇) and the heat transfer filler (126) are symmetrically placed on the right and left sides of each LED split (1〇2). In the case of double rows, the heat sink (11 turns) and the heat transfer filler (126) can also be arranged next to each of the led devices (102) in the same manner. However, when the arrangement is more than three columns, since the LED device (102) in the outermost row has only other adjacent [ED devices] on one side and the LED devices (1〇2) in the middle column on both sides There are other adjacent LED devices' so their positional relationship with the adjacent heat source is different, and the distance from the heat sink and other heat dissipation conditions on the right and left sides are different, and the heat dissipation rate of the LED device (102) will follow The slower the position is, the higher the temperature will be. The heat sink (110) includes a light source receiving member (122) for housing the LED light source (105) to expose the front side light emitting surface of the LED device (102). The heat sink (110) is preferably made of a metal having a good thermal conductivity (for example, aluminum, aluminum alloy, copper or copper alloy) to absorb the heat generated by the LED light source (丨05) and to effectively discharge it. To the atmosphere. The heat sink (110) has a basement (lu)' of a temple extending from the longitudinal direction of the body, and a plurality of heat dissipating pins (not shown) or fins (112).苴中', 散"·, the needle protrudes from the outer surface or the inner surface of the pedestal (111) with a box of initial itch, pre-sighing to maximize the heat dissipation area, while the heat-dissipating wing (112) is prominent Up to a predetermined height and extending to a predetermined length. The base (1 (1) is a long rectangular shape, and a light source receiving member (122) having a contour corresponding to the track is formed at a center of one side thereof in the longitudinal direction, and the light source is The receiving and inner components (1 22) have light output holes (1) 9) for exposing the light emitting surface of the device (102). In order to increase the heat dissipating area, the heat dissipating protrusions (not shown) or various other protruding shapes are provided. It can be used, not limited to the use of the heat dissipating fins (112). The shape of the light source receiving member (122) itself can also be changed, and any shape such as a vertical shape, a ring shape, or an elliptical shape is suitable. The position of the light source housing member (122) is the most It is good to be in the center of the heat sink (11〇), but it is not limited to this, and it may be biased to one side due to different needs. In addition, there may be a side cover engagement groove (127) on the side surface of the heat dissipation (no). , to cover when installing the side Lock the screws. For the heat sink (110) in Figures 3a, 3b and 4, use the upper heat sink (first heat sink) (110a) and the lower heat sink (second heat sink) (n〇b). The LED light source (1〇5) is placed between them to facilitate production. However, the heat sink (110) may also be integrally formed. The upper heat sink (110a) is included in the longitudinal direction. a first pedestal extending and forming a long rectangular groove at a center in a longitudinal direction of one side surface, and a plurality of heat dissipating pins disposed on a surface of the first pedestal (111a) for maximizing a heat dissipating area or a heat dissipating fin (112). The lower heat dissipating groove (ii〇b) includes a second base (11bb), and the second base (mb) has a plurality of light output holes (119) in the longitudinal direction, and the cover 17 201131105 The upper end opening of the light source receiving member (1 2 2 ) and at least one of the first bases (111 a) are joined to form a tunnel. A heat sink or heat sink may be provided on the surface of the second base (11lb). Wing (112). The light source receiving member (122) formed in the tunnel shape has a usable space for housing LE therein. The heat transfer filler (126) may be filled in with the D source (105). This available space is preferably located near all side surfaces of each of the LED devices (102). Heat is formed on the heat sink (110) In the case of the wings (114), it may be preferable to form horizontal vents (114a) that traverse 'in a direction perpendicular to the fins (114) to allow air to circulate horizontally between the fins (114). The vent hole (114a) may be installed in the heat dissipating fin (114) or only on the outermost radiating fin. Further, a pedestal (丨丨丨) may be formed in the heat sink (丨丨〇). Or more than one vertical vent (i 14b) so that the heat under the heat sink (110) can rise and be effectively discharged to the outside. With these horizontal vents (114a) and/or vertical vents (114b), the heat sink (110) can exchange heat with the outside air to make heat dissipation more efficient. In these structures, since the light-emitting surface is exposed to the outside through the light output hole (丨丨9), the LED device (102) is in danger of being damaged by the external environment. Further, if the heat transfer filler (126) is in the form of a latex, it may leak through the gap of the light output hole (11 9). In addition, the heat generated by the LED device (102) must also be efficiently discharged from the light emitting surface. Therefore, after considering these factors, it is preferable to provide a transparent heat transfer protection member to cover the light-emitting surface exposed by the LED device (1〇2) through the light output hole (119) of the heat sink (1). 1〇2b), and the light output hole (119) is sealed to protect the light emitting surface and transfer heat from the light emitting surface to the outside air and/or to the 201131105 heater (110). For example, the material used to seal the light output aperture (119) may preferably be a transparent thermal conductive silicone (128). The transparent thermal conductive adhesive is applied to the light-emitting surface (i〇2b) exposed by the LED device via the light output hole (119), and it is also preferably in direct contact with the lower heat sink (110b). The heat absorbed from the light-emitting surface (102b) of the LED device (102) can be quickly discharged through the heat sink (丨丨〇) by such direct contact with the heat-conductive silicone (128). Since the transparent thermal conductive silicone (128) is in contact with the light emitting surface (102b) of the LED device (102) and rapidly dissipates heat in the manner described above, the heat dissipation rate of the light source module (120) is improved. Alternatively, the sealing may be performed by covering the light-emitting surface (102b) with a transparent protective film (129). In addition, it is also possible to perform sealing using a mixing method of the above two methods, that is, a thermal conductive stone (12 8) can be applied to the light emitting surface (i〇2b) of the LED device (102). Then, the adjacent area containing the light-emitting surface is further covered with a transparent protective film (129). Thereby, the led device (102) can be protected, and the heat emitted from the self-illuminating surface (1〇2b) can be absorbed and discharged to the outside. In the heat dissipation structure of the light source module (12A) according to the first embodiment of the present invention, the heat dissipation rate is optimized because the heat dissipation mechanism is disposed around the center of the heat source and is in contact with the air. That is to say, the LED device (102) as the main heat source is mainly through some parts of the LED device (102) and the heat sink (110), the heat transfer filler (126), the thermal conductive silicone (128) and the printed circuit board ( 124) - The direct contact of the thermal conductive adhesive (not shown) to dissipate heat by heat conduction, and the heat sink (110), the heat transfer filler (126), the thermal conductive silicone (128) and the printed circuit board (124) ) - the heat absorbed by the thermal conductive adhesive is again transferred to the heat sink (110), and then discharged, so that the entire heat dissipation 19 201131105 rate ° due to heat is discharged by heat conduction to 1 =, from the LED All points of the light source (1°5) to the inner wall of the light source housing element are uniform in all directions, and the track conduction path in each direction is the shortest. Similarly, due to the heat dissipation mechanism, a considerable portion of the heat generated by the self-identification device (102) is sent from all directions to the heat sink (110) via the (4) fill (126) (4) of the disk LED device (10)) And the heat is also distributed in all directions and transmitted to the heat sink via the thermal conductive stone (128). Therefore, the light source module of the present invention (the heat dissipation rate of (10) is much higher than that of the conventional light source module) 2. Second Embodiment Figures 7 and 8 show the structure of a light source module (220) in a second embodiment of the present invention. The light source module (22) includes a heat sink 〇ι〇) A light source housing member (312) is included, and the light source housing member (312) has a rectangular groove at the center of the longitudinal direction & base (314). A printed circuit board (124) having a led light source (105) extending in the longitudinal direction is attached to the bottom of the light source housing member (312) via a thermal conductive adhesive. A plurality of symmetrically arranged heat dissipating fins (316) between the left and right sides of the base (314) and the light source receiving member (31 2 ) will cover the [ED light source (the middle portion of the radiator) (310) 105), while showing the shape of the mirror. The light source housing member (312) in which the LED light source (1〇5) is housed is covered by a housing member cover (3 2 〇). A light output hole (322) is provided on the housing member cover (320) corresponding to the position of the LED device (102). Each of the light output holes (322) is sealed by a heat sink in the manner of the first embodiment, and the inner space in the light source receiving member (312) covered by the receiving member cover (32) is filled by heat transfer. (1 26) 201131105 The inner wall of the storage element cover (320) and the inner wall of the light source storage element (31 2) are in direct contact with the heat transfer filler (1 26). The inner wall of the light output hole (322) of the receiving member cover (320) is in direct contact with the thermal conductive silicone (128). The heat sink (310) and the receiving member cover (320) are made of a metal material having excellent thermal conductivity. Therefore, the 'heat transfer filler (126) absorbs a large amount of heat generated from the side surfaces of each of the LED devices (102) and the printed circuit board (124), and transfers them to the heat sink (310) and the storage member cover ( 32〇) to discharge it to the outside air. The thermal conductive silicone (128) also absorbs heat from the light emitting surface of each of the LED devices (102) and discharges it directly to the outside air or the housing member cover (320). The cover of the storage element (32〇) also plays the role of the heat sink (in this view, the heat sink (31 0 ) can be regarded as an upper heat sink] and the storage element cover (320) can be regarded as Lower heat sink). This heat dissipation mechanism is almost the same as that in the first embodiment. The light source module (220) may further include a protective film (330) overlying the receiving element cover (320). In addition, at the two ends of the heat sink (310), a mounting cover (3 4 〇) is screwed in the longitudinal direction to cover the heat sink (31 〇), the led light source (105) and the receiving component (320). ) Installed as a module. The printed circuit board (124) is coupled to a conductor (350) for connection to a power supply (134) that provides the power required for lED operation. 3. The third embodiment of the light source module (120, 220) itself is a complete lighting device, as long as the power required for operation is applied to the printed circuit board (124), it can operate normally 'but by using multiple light source modules (12〇, 22〇) can also be combined to form 21 201131105 into a larger lighting device (1 00). The ninth and first drawings show a lighting apparatus (1 〇〇) according to a third embodiment of the present invention. The lighting device (1 0 0) includes a light source set module (1 3 〇) and a light fixture housing (150). The light source set module (1 30 ) is formed by a combination of four light source modules (丨20) and the light source module (150) supports the light source module (丨2〇). Forming a package module with four light source modules (120) is merely an example. The light source package module (130) can be formed by more light source modules (12A and 220). One of the functions of the lamp housing (150) is to act as a frame for the fixed LED light source kit (1 30) and the power supply (13 4), while the other function is to protect them from external factors. Protectors, such as snow, rain, fog, moisture, sun exposure, etc. More specifically, a plurality of light source modules (12 0 ) are arranged side by side (in a parallel manner) in the lamp housing (140), and in the light source set module (13〇), the LED device (102) The light emitting surface is facing downward and is fixed. These light source modules (12〇) can also be arranged in series as needed, or in a parallel, series hybrid manner. The bottom surface of the lamp housing (140) may be transparent or directly open at a position opposite to each of the light source modules (12 turns). The exterior of the luminaire (丨4〇) can be designed in different styles as needed. The light source set module (130) is covered by a lamp cover (142) having a mirror shape. A vent hole (143) may be provided in the lamp cover (142) to quickly discharge heat generated by the light source module (120) to the outside. In particular, since the lampshade (142) is separate from each of the LED light source modules (12〇 or 22(5), the lampshade (142) is not designed to form direct heat conduction. The function of the lampshade (丨42) is as outdoor sunlight. The mask, but does not transmit the heat generated by daylight 22 201131105 directly to each _ L 〇 light source module (120 or 220) by heat conduction. Even if the LED light source module is accidentally opened during the day, it can The Baoyuan LED chip does not overheat. On the upper side of the lampshade (142), a connecting member (146) is engaged, which has a receiving space. The connecting member (146) is connected to a post connecting frame (144) for The connection supports a lighting device, such as a street light. The inner space of the connecting component (14 6) also houses a wire extending from the ordinary power source and passing through the pillar connecting frame (144), and is connected to the wire for operating the light source module. (120) The controller (145). The controller (145) is all or part of the power supply (134). The main function of the power supply (134) is to convert the ordinary power supply to operate the LED device and generate of light Pressurize and supply this voltage to the printed circuit board (124). The power supply (134) can be an AC_DC converter, a DC-DC converter, a DC-AC converter, or an AC_AC converter. In addition, in Figure 10 The lighting device (100) can be used as a street light by connecting two or three lighting devices (1〇〇) as shown in the figure n as needed. For example, by using multiple The lighting device (丨〇〇) is arranged in a radial manner, and each of the strut connecting brackets (144) is integrated with the strut connecting frame receiving members (1 48) to form a set of lighting devices. The pillar connecting frame storage component (丨48) of the device is connected to the pillar of a street lamp (not shown) to form a street light (not shown). In addition, for example, a set of lighting devices can also be connected. The lighting device in the room is formed on the other pillars. In the structure of the lighting device (100) of the present invention, the LED light source module, the lampshade and the power supply are separated in structure and function, and 23 201131105 has Various It is possible to combine, and its application range is wide. In addition, the illumination range can be easily adjusted according to the situation, and the manufacturing cost is very low. Those skilled in the art can use the invention according to the above description. Light source modules (120, 220) to produce a variety of different types and shapes of lighting equipment. Figure 12 shows the structure of another type of lighting equipment, which is through the light source module of the five second embodiment ( 2 2 〇) are arranged side by side and fixed in a lamp cover (24〇) having a mirror shape. The bottom surface of each light source module (220) is covered with a transparent light source protection cover (23〇). In the upper end portion of the luminaire housing (240) there is a connecting member (235) for connection to the struts of the other illuminating device. 4. Comparison of conventional lighting devices with lighting devices of the present invention In conventional lighting devices, heat is transferred from the LED device to the heat sink via air, while in the lighting device of the present invention, heat transfer is via heat in all directions. The filler (126) is transferred for delivery. Figure 13(a) shows a photograph of the LED lighting device in the prior art of Figure 1, and Figures 13(b) and 13(c) are respectively operated for a long period of time at the initial operation of the LED lighting device. Infrared photos taken after time. Figure 14 ((8) shows the photograph of the LED lighting device (22〇) of the present invention in Fig. 7, and the 14th (b) and 14(c) diagrams are respectively at the initial time when the LED lighting device is operated and are operated equivalently Infrared photos taken after a long period of time. According to the infrared photos of traditional LED lighting equipment (Sections 13 (b) and (c)) 'With the increase of operating time of LED devices', the temperature difference between the LED device and the heat sink The temperature of the LED device and the heat sink is about 49.5. The difference between 〇c and 37· 5 C is 1 2 C. After a sufficient period of operation, the temperature of the device and the heat sink are about 56t & 34 rc, respectively, and the temperature difference is 213 C. The measurement is indeed large. The results show that over time, the LED t is overheated, and the heat removal via the heat sink is inefficient. The opposite infrared photo of the LED lighting device according to the invention (Articles 14(b) and (c) ) Look at 'even if the operating time increases, the temperature represents the temperature There is still almost no change, which shows that the overall heat removal efficiency is good. From the detailed temperature grazing, it can be seen that at the beginning of the operation, the temperature of the LED device and the heat sink are about 36.2〇c& 27·5χ: The temperature difference is 8 7. After a sufficient period of time, the temperature of the LED device and the heat sink are about 37.5 ° C and 28. (TC, the temperature difference is 9.51. The temperature of the LED device and the heat sink from the operation one At the beginning, only h 3 and 〇. 5 are added respectively. These results show that even if the operation time continues, the heat generated by the device will be quickly discharged through the heat sink, so that the LED device will not overheat. The present invention does have an excellent heat removal rate. Of course, the life of the LED device of the present invention is also prolonged. As described above, although the present invention has been described in terms of several embodiments and figures, the person skilled in the art still Appropriate modifications can be made without departing from the spirit and scope of the invention. The invention can be applied to a lighting device without being particularly limited. For example, the invention can be applied Used in different lighting equipment, such as outdoor or indoor lighting, architectural interior lighting, advertising display or backlight. [Simplified schematic] Figure 1 shows a traditional universal closed LED A cross-sectional view of the outdoor lighting device; FIG. 2 shows an LED lighting device having a one-way heat dissipation structure; FIGS. 3 to 6 show a light source module (丨2〇) in the first embodiment of the present invention, wherein 33 and 31 are a perspective view of the combined completion, and FIG. 5 shows the bottom surface of the LED light source module in which the LED (12G) is arranged in a single column, and FIG. 6 is along the A_A in the second (a) diagram. FIG. 7 and FIG. 8 are respectively an exploded view of the structure of the light source module (22〇) according to the second embodiment of the present invention, and a sectional view of the combination; FIGS. 9 and 10 show a third embodiment of the present invention. The illuminating device is a combination of a plurality of light source modules of the present invention, and the 9th (a) and 9 (b) drawings are a side plan view and a bottom plan view, respectively, and the first plan is Section 9(a) shows a section along the tangential line B_B; Figures 11(a) and 11(b) show A top plan view of a lighting device that radially connects two or three first lighting devices (100); Figures 12(a) and 12(b) show a second embodiment of the present invention A cross-sectional view and a lower plan view of the lighting device in combination with the LED light source module; Section 13 (a) shows a photo of the LED lighting device in the prior art, and 26 201131105 % 13(b) and 13 (c) The figure is an infrared photograph taken at an initial time when the LED lighting device is operated and after being operated for a long period of time; and FIG. 14(a) shows a photograph of the LED lighting device (220) in the present invention, Figures 14(b) and 14(c) are infrared photographs taken at the initial time when the LED lighting device was operated and after being operated for a considerable period of time. [Main component symbol description] 14, 36, 110, 310: heat sink 16, 34, 124: printed circuit board 12: protective cover 18, 38: transparent cover 10: LED lighting device
20 、 32 : LED 30 :傳統照明裝置 10 0 :照明設備 12 0、2 2 0 :光源模組 105 : LED 光源 126 :熱傳送填充物 102 : LED 裝置 102a : LED 晶片 102b :發光面 12 2、312 :光源收納元件 111、111a、111b、314 :基座 27 201131105 112、114、316 :散熱翼 119、322 :光輸出孔 127 :側蓋接合槽 11 Oa :上散熱槽 110b :下散熱槽 114a:水平通氣孔 114b :垂直通氣孔 128 :熱導矽膠 129 :透明保護膜 320 :收納元件遮蓋 330 :保護膜 340 :安裝蓋 350 :導線 134 :電源供應器 130 :光源套裝模組 150、240 :燈具外殼 142、240 :燈罩 146、235 :連接元件 144 :支柱連接架 145 :控制器 148 :支柱連接架收納元件 230 :透明光源保護蓋 2820, 32: LED 30: conventional lighting device 10 0: lighting device 12 0, 2 2 0: light source module 105: LED light source 126: heat transfer filler 102: LED device 102a: LED wafer 102b: light emitting surface 12 312: light source housing member 111, 111a, 111b, 314: base 27 201131105 112, 114, 316: heat dissipation fins 119, 322: light output hole 127: side cover engagement groove 11 Oa: upper heat dissipation groove 110b: lower heat dissipation groove 114a : Horizontal vent hole 114b : Vertical vent hole 128 : Thermal conductive silicone 129 : Transparent protective film 320 : Storage element cover 330 : Protective film 340 : Mounting cover 350 : Wire 134 : Power supply 130 : Light source set module 150 , 240 : Lamp housing 142, 240: lamp cover 146, 235: connecting element 144: post connector 145: controller 148: post connector housing element 230: transparent light source protection cover 28