KR101472400B1 - Lighting module array - Google Patents

Abstract

A module array according to the embodiment of the present invention includes at least three light emitting device modules which include a light source part, a body which includes a receiving unit to receive the light source part on one side thereof, and a plurality of heat radiation pins which are located on the other side facing one side of the body. The light emitting device modules are arranged in a direction which is parallel to one side and includes an air flow hole which is formed from one side to the other side between the light emitting device modules to make air flow.

Description

 Module Array {LIGHTING MODULE ARRAY}

Embodiments relate to a module array and a lighting device including the same.

Generally, indoor or outdoor lighting is used as a lamp or a fluorescent lamp. In the case of such a bulb or fluorescent lamp, there is a problem that its lifetime is short and it is frequently exchanged. In addition, a conventional fluorescent lamp may deteriorate over time, and the illuminance may gradually decrease.

In order to solve such a problem, a light emitting diode (LED) capable of realizing excellent controllability, fast response speed, high electric light conversion efficiency, long swimming, low power consumption, Various types of lighting modules are being developed.

Light emitting diodes (LEDs) are a type of semiconductor devices that convert electrical energy into light. The light emitting diode has advantages of low power consumption, semi-permanent lifetime, fast response speed, safety, and environmental friendliness compared with conventional light sources such as fluorescent lamps and incandescent lamps. Accordingly, much research has been conducted to replace an existing light source with a light emitting diode, and a light emitting diode has been increasingly used as a light source for lighting devices such as various liquid crystal display devices, electric sign boards, and street lamps used outside the room.

Such a light emitting device is fabricated in the form of a light emitting device module in order to protect from the convenience of assembly, external impact and moisture.

The light emitting device module has a problem that a large number of light emitting devices are integrated at a high density and high heat is generated. In addition, research is underway to effectively release such heat.

The module array and the lighting apparatus according to the embodiment are intended to effectively emit heat generated in the light emitting element.

The module array according to the embodiment includes at least three light emitting device modules including a light source part, a body having a mounting part on which the light source part is seated, and a plurality of heat radiating fins positioned on the opposite surface of the body, The light emitting device modules are arranged in a direction parallel to the one surface, and the air flow holes are formed between the light emitting device modules on the one surface in the other surface direction, and air flows.

Here, the air flow holes may be formed between the bodies of the two light emitting device modules adjacent to each other.

According to the light emitting device module of the embodiment, the inside of the air guide portion and the air hole have a higher temperature than the outside of the light emitting device module, and air in the air guide portion and the air hole receives buoyancy to move to the upper portion, The cold air in the lower region of the region is introduced, so that the heat generated in the light emitting device module can be effectively released (the chimney effect).

 Further, the flow rate of the air that has passed through the air hole and the air guide portion is faster than the convection caused by the general heat, so that the heat release effect can be increased.

In addition, the embodiment can have an effect of cooling by using a fan without using a separate fan.

The use of the lighting device of the embodiment can effectively cool the heat generated in the light emitting device module due to the chimney effect and does not use a separate fan, thereby reducing manufacturing cost.

Further, when air flow holes are further formed between the light emitting device modules, a chimney effect is generated due to a temperature difference between the inside and the outside of the air flow hole, thereby promoting air circulation.

The air circulation promoted by the chimney effect causes the light emitting element module to cool more effectively.

By using the slide projections and the slide grooves, it is possible to improve the ease of assembly while forming air flow holes between the light emitting element modules.

In addition, the number of the light emitting device modules included in the module array can be easily adjusted in consideration of the illumination capacity and the space of the lighting device.

1 is a perspective view of a module array according to an embodiment of the present invention,
Figure 2 is a top view of the module array of Figure 1,
3 is an exploded perspective view of a light emitting device module according to an embodiment,
4 is a front view of a light emitting device module according to an embodiment,
5 is a side view of a light emitting device module according to an embodiment,
6 is a view showing an air flow velocity distribution of the light emitting device module in the embodiment,
7 is a top view of a module array according to another embodiment of the present invention,
8 is a perspective view of a lighting apparatus including the light emitting device module of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Further, the angles and directions mentioned in the description of the structure of the embodiment are based on those shown in the drawings. In the description of the structures constituting the embodiments in the specification, reference points and positional relationships with respect to angles are not explicitly referred to, reference is made to the relevant drawings.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

Hereinafter, embodiments will be described in detail with reference to the drawings.

2 is a plan view of the module array of FIG. 1, FIG. 3 is an exploded perspective view of the light emitting device module according to the embodiment, FIG. 4 is a cross- 5 is a side view of a light emitting device module according to an embodiment.

In the module array 200 according to the embodiment, at least two light emitting device modules 100 are combined and arranged. First, the light emitting device module 100 constituting the module array 200 will be described.

3 to 5, the light emitting device module 100 constituting the module array 200 includes a light source unit 110, a body 120 on which a mounting unit 121 on which a light source unit 110 is mounted is formed, And a plurality of heat dissipation fins 130 located on the other surface of the body 120 facing the one surface.

The light emitting device module 100 may include an air hole 122 formed through the body 120 in the direction of the heat radiating fin 130 from the seating part 121 and through which the air flows.

The light source unit 110 may include all means for generating light.

For example, the light source unit 110 includes a substrate 112 and a light emitting device 111 disposed on the substrate 112 and electrically connected to the substrate 112.

The substrate 112 is disposed on one side of the body 120. The substrate 112 has a rectangular plate shape corresponding to one surface of the body 120, but is not limited thereto. For example, a polygonal shape, an elliptical shape, or the like.

The substrate 112 may be a circuit pattern printed on an insulator and may be a printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or the like. have.

Here, the light source unit 110 may be a COB (Chips On Board) capable of directly bonding an unpackaged LED chip on a printed circuit board. The COB contains ceramic materials to ensure heat resistance and insulation.

The upper surface of the substrate 112 may be coated with a material capable of efficiently reflecting light. For example, the upper surface of the substrate 112 may be coated with a white or silver material.

One or a plurality of the light emitting devices 111 may be disposed. Further, when the plurality of light emitting devices 111 are arranged, each of the light emitting devices 111 may emit different colors or may have different color temperatures.

For example, the light source unit 110 can be supported by the body 120 by being positioned on the seating unit 121 formed on one side of the body 120 of the light source unit 110.

The seating part 121 is formed by recessing one side of the body 120 and the substrate 112 has a shape corresponding to the shape of the seating part 121 and can be coupled to the seating part 121.

Specifically, a substrate hole 113 communicating with the air hole 122 may be formed in the substrate 112.

The substrate holes 113 are positioned so as to overlap with the air holes 122 in the vertical direction (Y-axis direction), and communicate with each other to provide space for air to flow.

Here, the vertical meaning does not mean a perfect vertical of the mathematical meaning but it means a vertical including an error in an engineering sense.

At this time, the plurality of light emitting devices 111 located on the substrate 112 may be arranged to surround the substrate holes 113.

Specifically, the substrate hole 113 may be formed by penetrating the substrate 112 in the Y-axis direction, and the light emitting devices 111 may be disposed to surround the substrate hole 113 in the X-Z axis plane.

A heat dissipation pad 150 may be further provided between the substrate 112 and the seating part 121 to improve heat transfer.

The heat dissipation pad 150 may include a material having a shape corresponding to the seating part 121 and having excellent heat transfer and adhesion. For example, the heat-radiating pad 150 may be made of a silicon material.

Specifically, the heat radiating pad 150 has a film shape and a pad hole 153 communicating with the air hole 122 may be formed.

The embodiment may further include a plurality of lenses 141 for shielding the light emitting element 111 and refracting the light generated by the light emitting element 111.

The lens 141 diffuses light generated in the light emitting element 111. The diffusion angle of the light generated in the light emitting device 111 can be determined according to the shape of the lens 141.

For example, the lens 141 can mold the light emitting element 111 in a convex shape.

Specifically, the lens 141 may include a material that transmits light.

For example, the lens 141 may be formed of transparent silicone, epoxy, and other resin materials.

The lens 141 may be disposed so as to surround the light emitting device 111 such that the light emitting device 111 is isolated from the outside in order to protect the light emitting device 111 from external moisture and impact.

More specifically, for ease of assembly, the lens 141 may be disposed on the lens cover 142 formed in correspondence with the substrate 112.

The lens cover 142 is formed so as to correspond to the substrate 112 and the lens 141 located at the lens cover 142 can be disposed at a position overlapping the light emitting element 111. [

The lens cover 142 may be formed with a cover hole 143 communicating with the air hole 122.

Specifically, the cover hole 143 may be formed in the center of the lens cover 142 so as to penetrate in the vertical direction (Y-axis direction).

The body 120 provides a place where the light source unit 110 is seated and transmits the heat generated from the light source unit 110 to the heat radiation fins 130.

In order to increase the heat transfer efficiency, the body 120 may be formed of a metal material or a resin material having a high heat dissipation efficiency, but the present invention is not limited thereto.

For example, the material of the body 120 may include at least one of aluminum (Al), nickel (Ni), copper (Cu), silver (Ag), and tin (Sn). The body 120 may be formed of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), liquid crystal polymer (PSG) (PA9T), syndiotactic polystyrene (SPS), a metal material, sapphire (Al2O3), beryllium oxide (BeO), and ceramics. The body 120 may be formed by injection molding, etching, or the like, but is not limited thereto.

Specifically, the body 120 has a seating part 121 on which a light source unit 110 is mounted, and a plurality of radiating fins 130 may be positioned on the other surface.

The body 120 may have a plate shape, and a plane (X-Z axis plane) shape may be a square shape.

The seating part 121 may be formed to be recessed toward the inside of the body 120 in a shape corresponding to the substrate 112 on one side (for example, an upper side) of the body 120.

At the corner of the body 120, a screw hole 126 through which a screw is passed may be formed when the body 120 is coupled to a lighting device or the like.

In particular, referring to FIG. 4, the radiating fin 130 may have a shape for maximizing an area in contact with air.

Specifically, the radiating fin 130 may have a plurality of plate shapes formed to extend downward (in a direction opposite to the Y axis) from the other surface (for example, the lower surface) of the body 120.

The width of the heat dissipation fin 130 is formed to be equal to the width of the body 120 so that the heat of the body 120 can be effectively transmitted to the heat dissipation fin 130. [ .

And may be integrally formed with the body 120 of the radiating fin 130, or may be manufactured as a separate component.

The heat dissipation fin 130 may include at least one of a material having excellent heat transfer properties, for example, aluminum (Al), nickel (Ni), copper (Cu), silver (Ag), and tin (Sn).

4 and 5, the radiating fin 130 is arranged long in the width direction (X-axis direction) of the body 120, has a constant pitch in the length direction (Z-axis direction) of the body 120, Can be installed.

 The center portion 131 of the radiating fin 130 may be recessed in the direction of the body 120 than the both end portions 133 of the radiating fin 130. [

The light emitting element 111 is vertically overlapped with both end portions 133 of the heat dissipation fin 130 so that the both end portions 133 of the heat dissipation fin 130 are formed higher than the center portion 131 of the heat dissipation fin 130, And the central portion 131 of the radiating fin 130 is formed so as to save manufacturing cost.

1 and 3, the air hole 122 is formed through the body 120 in the direction of the radiating fin 130 (Y axis direction) from the seating part 121, and a space through which the air flows to provide.

The air hole 122 may be formed long in the longitudinal direction of the body 120 at a central portion of the body 120.

The air hole 122 is vertically overlapped with the substrate hole 113 formed in the substrate 112, the cover hole 143 formed in the lens cover 142, and the pad hole 153 formed in the heat radiation pad 150 And can be formed to communicate with each other.

The air hole 122 circulates the air by the temperature difference between the inside and the outside of the air hole 122 and this circulated air can accelerate the cooling of the radiating fin 130 and the body 120.

The air holes 122 are vertically overlapped with the center portion 131 of the heat radiating fin 130 and the light emitting elements 111 may be vertically overlapped with the both end portions 133 of the heat radiating fin 130 .
3, the air holes 122 are elongated in the first direction (Z-axis direction) at the central portion of the body 120, the light emitting devices 111 are formed in the air holes 122, As shown in FIG.
At this time, more than half of the light emitting devices 111 may be formed adjacent to the sides formed in the longitudinal direction of the air holes 122. That is, a plurality of light emitting devices 111 are arranged in two rows in the first direction, air holes 122 are formed in the first direction between the columns of the light emitting devices 111, More than half of the light emitting devices 111 can be positioned adjacent to the sides of the light emitting devices 111. [ Thus, effective heat transfer becomes possible. Of course, the substrate hole 113 may be formed corresponding to the shape of the air hole 122.
In addition, the area of the air hole 122 may be 10% to 20% of the area of the body 120 when viewed from above.

And an air guide 160 extending from the rim of the air hole 122 to the other side of the body 120 in the direction opposite to the Y axis and communicating with the air hole 122 to guide the air.

The air guide portion 160 may have a cylindrical shape with a space therein and may be positioned so that its rim overlaps with the rim of the air hole 122. That is, the air guide portion 160 may have a shape of a chimney surrounding the air hole 122.

The air guide 160 may be made of a material having a high heat transfer efficiency. For example, the material of the air guide 160 may include at least one of aluminum (Al), nickel (Ni), copper (Cu), silver (Ag), and tin (Sn). The air guide 160 may be formed of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), liquid crystal polymer Amide 9T (PA9T), syndiotactic polystyrene (SPS), metal materials, sapphire (Al2O3), beryllium oxide (BeO), ceramics.

The air guide unit 160 is connected to at least a part of the plurality of heat dissipation fins 130 so that the heat transferred from the light emitting device 111 to the heat dissipation fins 130 can be transmitted to the air guide unit 160.

The body 120 may have a connector 190 for supplying power to the light emitting device 111 and a connector hole 124 for passing through the connector 190.

Referring again to FIGS. 1 and 2, the module array 200 according to the embodiment may be formed by coupling a plurality of light emitting device modules 100 as described above.

Specifically, the module array 200 can be arranged in a plurality of directions in a direction parallel to one surface of the body 120 of the light emitting device module 100 (XZ plane direction, hereinafter referred to as horizontal direction) .

More specifically, the module array 200 can be configured such that a plurality of light emitting device modules 100 have a constant pitch. 2, in the module array 200, a plurality of light emitting device modules 100 may be arranged in a width direction and / or a length direction of the light emitting device module 100.

The module array 200 is formed between the light emitting device modules 100 and has an air flow hole 210 formed in one surface of the module array 200 in the other surface direction (Y axis direction, hereinafter referred to as vertical direction)

The air flow holes 210 are positioned between the light emitting device modules 100 to promote air circulation by a temperature difference between the inside and the outside of the air flow holes 210.

The inside of the air flow hole 210 is heated by the heat transferred from the light emitting element 111 through the body 120 and the heated air rises upward by the buoyant force and flows upward Thereby forming an air flow (so-called chimney effect).

Accordingly, there is an effect that the air flow hole 210 is formed between the light emitting device modules 100, thereby effectively cooling the heat generated in the light emitting module 100.

For example, the air flow holes 210 may be formed between the body 120 of two adjacent light emitting device modules 100.

More specifically, the air flow hole 210 is formed in the body 120 of the first light emitting device module 100-1 and the second light emitting device module 100-2 adjacent to the first light emitting module 100-1 May be positioned between the body 120.

More specifically, the side surface 127 of the body 120 of two adjacent light emitting device modules can form a part of the inner circumferential surface of the air flow hole 210. Here, the side surface 127 of the body 120 is a surface forming a lateral outer surface of the body 120 on one surface and a surface perpendicular to the other surface.

Of course, the air flow hole 210 may be positioned between the first light emitting device module 100-1 and the second light emitting device module 100-2 arranged in the width direction, and the first light emitting module 100 -1) and the third light emitting device module 100-3 arranged in the longitudinal direction.

The module array 200 may further include a connection member 220 connecting between the adjacent light emitting device modules 100.

The connection member 220 may connect between the bodies 120 of the adjacent light emitting device modules 100.

Two connecting members 220 may be spaced apart from each other.

Since the connecting member 220 forms the rim of the air flow hole 210, it can be made of a material having excellent heat transfer.

The connection member 220 may include at least one of a material having excellent heat transfer property, for example, aluminum (Al), nickel (Ni), copper (Cu), silver (Ag), and tin (Sn).

2, the side surfaces 221 of the two connecting members 220 spaced apart from each other and the side surfaces 127 of the body 120 of the adjacent light emitting device modules 100 are connected to the air flow holes 210 can be formed. Here, the side surface 221 of the connecting member 220 may mean a plane perpendicular to the X-Z axis plane.

For example, the cross-sectional shape of the air flow hole 210 may be formed in any one of a rectangular shape, a polygonal shape, and a circular shape.

Particularly, when the sectional shape of the air flow hole 210 is a rectangle, the first light emitting device module 100-1 and the second light emitting device module 100-2 adjacent to the first light emitting device module 100-1, The side surface 127 of the body 120 of the first light emitting device module 100-1 forms two opposing sides of a quadrangle and the two connecting members 220 The side surfaces 221 of the first and second electrodes 22 and 24 will form two surfaces facing each other.

In other words, the plurality of light emitting device modules 100 are spaced apart from each other in the horizontal direction, and the plurality of light emitting device modules 100 are connected by the plurality of connecting members 220. At this time, an air flow hole 210 passing through in a vertical direction is formed by the side surface 221 of the connecting member 220 and the side surface 127 of the body 120 of the adjacent light emitting device modules.

Further, the connecting member 220 may be positioned adjacent to an edge of the side surface 127 of the body 120. 2, the connecting member 220 is positioned adjacent to an edge of the side surface 127 of the body 120 to enlarge the size of the air flow hole 210, and the air flow hole 210 The air circulation can be further promoted between the inside and the outside of the apparatus.

The connection member 220 may be integrally formed with the body 120 or may be formed separately from the body 120. [

6 is a view showing the air flow velocity distribution of the light emitting device module 100 in the embodiment.

Hereinafter, the flow of air and heat dissipation of the light emitting element module will be described with reference to FIG.

Generally, the light emitting element module 100 is installed so that the light emitting element 111 faces the gravity direction in order to illuminate an object on the ground.

When power is applied to the light emitting device 111, light is generated in the light emitting device 111 and heat is generated.

The heat generated in the light emitting device 111 is transmitted to the substrate 112 and the heat dissipation pad 150 and is diffused into the body 120, the air guide 160 and the heat dissipation fin 130.

Particularly, heat generated in the light emitting device 111 will be mostly transferred to the body 120 having excellent heat transfer rate, the heat dissipation fin 130, and the air guide 160.

Therefore, a temperature difference is generated between the outside and the inside of the light emitting element module 100.

Particularly, the inside of the air guide part 160 and the air hole 122 have a higher temperature than the outside of the light emitting device module 100.

Accordingly, the air in the air guide part 160 and the air hole 122 receives the buoyant force to move to the upper part, and cool air in the lower area of the outer area of the light emitting device 111 flows (chimney effect).

Such circulation of air can maximize the heat dissipation effect of the external air and the light emitting device 111.

Particularly, as shown in FIG. 6, the flow rate of the air that has passed through the air hole 122 and the air guide portion 160 is faster than the flow rate of the other air.

Therefore, the embodiment can have an effect of cooling using a fan without using a separate fan.

In addition, when the air flow holes 210 are further formed between the light emitting device modules 100, a chimney effect is generated due to a temperature difference between the inside and the outside of the air flow holes 210, thereby promoting air circulation.

The air circulation promoted by the chimney effect causes the light emitting element module to cool more effectively.

7 is a plan view of a module array according to another embodiment of the present invention.

In comparison with the embodiment of FIG. 2, the module array 200A according to the embodiment has a difference in the configuration of the connecting member 220. FIG.

The connecting member 220 according to the embodiment includes a slide groove 220A formed in the body 120 of one of the light emitting element modules (for example, the first light emitting element module 100-1) A slide protrusion formed on the body 120 of the other light emitting element module (for example, the second light emitting element module 100-2) adjacent to the element module 110-1 and slidably coupled to the slide groove 220A 220B.

The slide groove 220A provides a space in which the slide projection 220B is engaged and fixed.

The slide groove 220A may be formed so as to correspond to the shape of the slide projection 220B so as to be slidable and fixed to the slide projection 220B.

Specifically, the slide groove 220A may have a shape in which its width is narrowed from the inside to the outside.

The slide groove 220A may be formed in the body 120 of one of the light emitting device modules 100-1. And may be integrally or separately formed with the body 120.

Specifically, the slide groove 220A may be formed to be recessed in the horizontal direction at the side surface 127 of the body 120.

The slide projection 220B is slidably fixed to the slide groove 220A.

The slide protrusion 220B may be formed to correspond to the shape of the slide groove 220A so as to be slidable and fixed to the slide groove 220A. In particular, for ease of assembly, the slide projection 220B can be inserted into the slide groove 220A in the vertical direction.

Specifically, the slide projection 220B may have a shape in which the width thereof is widened from the inside to the outside.

The slide protrusion 220B may be formed on the body 120 of any one of the light emitting device modules 100-2. And may be integrally or separately formed with the body 120.

Specifically, the slide protrusion 220B may protrude horizontally from the side surface 127 of the body 120.

The slide grooves 220A and the slide protrusions 220B may be coupled in an interference fit manner to improve the coupling force between the light emitting device modules 100. [

The use of the slide protrusion 220B and the slide groove 220A can improve the ease of assembly while forming the air flow hole 210 between the light emitting device modules 100. [

In addition, the number of the light emitting device modules included in the module array 200 can be easily controlled in consideration of the illumination capacity and the space of the lighting device.

8 is a perspective view of a lighting device including the light emitting device module 100 of the present invention.

Referring to FIG. 8, the lighting apparatus 1000 of the embodiment includes a main body 1100 for providing a space to which the light emitting element module 100 is coupled and forming an outer space, a power supply unit coupled to one side of the main body, (Not shown), and a connection part 1200 connecting to the support part.

The lighting apparatus 1000 of the embodiment can be installed indoors or outdoors. For example, the lighting apparatus 1000 of the embodiment can be used as a street lamp.

A plurality of frames 1110 may be formed in the main body 1100 to increase the space in which at least three light emitting device modules 100 are located.

The connection unit 1200 has a built-in power supply unit, and connects the support unit (not shown) for fixing the main unit to the main unit.

The use of the lighting apparatus 1000 of the embodiment can effectively cool the heat generated in the light emitting element module 100 due to the chimney effect and can reduce the manufacturing cost by not using a separate fan.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100: Light emitting device module
120: Body
110: light source
130:

Claims (20)

A plurality of heat dissipating fins disposed on a surface opposite to the one surface of the body; a plurality of heat dissipating fins formed on the surface of the heat dissipating body in the direction of the heat dissipating fin, And at least two light emitting element modules including an air hole,
Wherein the light emitting device modules are arranged in a direction parallel to the one surface,
An air flow hole is formed between the light emitting device modules,
The light-
Further comprising an air guide portion extending from the rim of the air hole to the other surface of the body and communicating with the air hole to guide the air. The method according to claim 1,
The air flow hole
The module arrays being formed between the bodies of the two light emitting device modules adjacent to each other. 3. The method of claim 2,
Wherein a side surface of a body of the two light emitting device modules adjacent to each other forms a part of an inner circumferential surface of the air flow hole. The method of claim 3,
Further comprising at least two connecting members connecting the bodies of the light emitting element modules adjacent to each other,
Wherein the two connecting members are disposed apart from each other,
Wherein a side surface of the two connecting members and a side surface of a body of the light emitting device modules adjacent to each other form an inner peripheral surface of the air flow hole. 5. The method of claim 4,
The connecting member includes:
And is positioned adjacent an edge of a side of the body. 6. The method of claim 5,
Wherein the connecting member is formed integrally with the body. The method according to claim 1,
And a part of the plurality of radiating fins is connected to an outer surface of the air guide part. delete delete The method according to claim 1,
The light source unit includes:
A substrate mounted on the seating portion,
A plurality of light emitting devices located on the substrate,
Wherein:
And a substrate hole communicating with the air hole. 11. The method of claim 10,
Wherein the plurality of light emitting devices are arranged to surround the substrate holes. 11. The method of claim 10,
Further comprising a plurality of lenses for shielding the light emitting element and refracting light generated in the light emitting element. 13. The method of claim 12,
Wherein the plurality of lenses are disposed in a lens cover formed corresponding to the substrate,
And a cover hole communicating with the air hole is formed in the lens cover. 11. The method of claim 10,
And a heat dissipation pad positioned between the substrate and the seating portion to improve heat transfer,
And a pad hole communicating with the air hole is formed in the heat radiation pad. The method according to claim 1,
Wherein the mounting portion is formed by recessing one surface of the body. delete The method according to claim 1,
Wherein the air guide is connected to at least a portion of the plurality of radiating fins. The method according to claim 1,
Wherein the radiating fins are elongated in the width direction of the body,
And a central portion of the radiating fin is recessed toward the body from both ends of the radiating fin. The method according to claim 1,
Wherein the air hole is vertically overlapped with a central portion of the radiating fin,
Wherein the light emitting elements are vertically overlapped with both ends of the radiating fin. A lighting device comprising the module array of any one of claims 1 to 6, 10 to 15 and 17 to 19.

Images