CN103517557B - Process the method for groove and printed circuit board (PCB) and electronic equipment on a printed circuit - Google Patents
Process the method for groove and printed circuit board (PCB) and electronic equipment on a printed circuit Download PDFInfo
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- CN103517557B CN103517557B CN201210203134.4A CN201210203134A CN103517557B CN 103517557 B CN103517557 B CN 103517557B CN 201210203134 A CN201210203134 A CN 201210203134A CN 103517557 B CN103517557 B CN 103517557B
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Abstract
The embodiment of the invention discloses and process the method for groove and printed circuit board (PCB) and electronic equipment on a printed circuit.Wherein, a kind of method processing groove on a printed circuit, including: in the first board set, process the groove that the size with heat radiating metal base matches；Heat radiating metal base is fixedly arranged in the groove processed in the first board set；Second board set and the first board set are carried out pressing and forms tri-plate collection；The second board set surface after pressing carries out slotting to form the blind slot for mounting related components, wherein, the part or all of bottom surface of blind slot is positioned on heat radiating metal base, and at least one surface exposure of heat radiating metal base, wherein, the blind slot degree of depth in the vertical direction of tri-plate collection plate face is more than the thickness of the second board set after pressing.The embodiment of the present invention provides scheme may advantageously facilitate, and product miniaturization is integrated and cost control.
Description
Technical field
The present invention relates to field of printed circuit board fabrication, be specifically related to process the method for groove and printed circuit board (PCB) and electronic equipment on a printed circuit.
Background technology
A lot of electronic equipments are applied to such as power amplifier (PA, PowerAmplifier) contour heating element.Such as, the core being just applied to PA, PA in high-power wireless base station is matched design, heat dissipation design, the linearity, concordance and efficiency etc., wherein, in addition to coupling, other characteristic is all closely bound up with heat radiation, and the heat radiation of PA is the principal element affecting efficiency and the linearity.In existing components and parts Cooling Solution, heat radiating metal base printed circuit board (PCB, PrintedCircuitBoard) it is more effective a solution, wherein, existing heat radiating metal base PCB be carrying PA or other components and parts PCB on bonding one piece of heat-dissipating metal sheet with solve components and parts heat dissipation problem.
Practice finds, the miniaturization that existing components and parts Cooling Solution hinders PCB is integrated, and is unfavorable for the cost control of product.
Summary of the invention
The embodiment of the present invention provides a kind of method processing groove on a printed circuit and printed circuit board (PCB) and electronic equipment, to promoting product miniaturization integrated and cost control.
On the one hand the embodiment of the present invention provides a kind of method processing groove on a printed circuit, including:
First board set processes the groove that the size with heat radiating metal base matches；
Heat radiating metal base is fixedly arranged in the described groove processed in described first board set；
Second board set and described first board set are carried out pressing and forms tri-plate collection；
Described second board set surface after described pressing carries out slotting to form the blind slot for mounting related components, wherein, the part or all of bottom surface of described blind slot is positioned on described heat radiating metal base, and at least one surface exposure of described heat radiating metal base, wherein, the described blind slot degree of depth in the vertical direction of described tri-plate collection plate face, more than the thickness of the second board set after described pressing.
Optionally, described method also includes described blind slot is carried out metalized.
Optionally, described carry out also including after pressing forms tri-plate collection by the second board set and described first board set:
Enclose at described heat radiating metal primitive period and offer one or more hole,
Arranging conductive materials in the one or more hole, wherein, described heat radiating metal base contacts with the conductive materials in described hole.
Optionally, described tri-plate collection includes at least two-layer base material, there is at least one of which base material in described at least two-layer base material internal layer ground electric layer, conductive materials in described hole also contacts with described internal layer ground electric layer, so that described internal layer ground electric layer is turned on by the conductive materials in described hole with described heat radiating metal base.
Optionally, described described second board set surface after described pressing carries out slotting forming the blind slot for mounting related components, including: carry out slotting to form the blind slot for mounting related components by the controlled depth milling described second board set surface after described pressing.
Optionally, the bottom surface of described blind slot is surrounded by described heat radiating metal base.
Optionally, described second board set includes high frequency sheet material, described high frequency sheet material as a top layer sheet material of described tri-plate collection, or, described high frequency sheet material is as surface sheet material around described blind slot on described printed circuit board (PCB).
On the other hand the embodiment of the present invention also provides for a kind of method processing groove on a printed circuit, including:
First board set processes the groove that the size with heat radiating metal base matches；
Heat radiating metal base is fixedly arranged in the described groove processed in described first board set；
Second board set and described first board set are carried out pressing and forms tri-plate collection；
Described second board set surface after described pressing carries out slotting to form the blind slot for mounting related components, and wherein, the part or all of bottom surface of described blind slot is positioned on described heat radiating metal base, and at least one surface exposure of described heat radiating metal base；
Described blind slot is carried out metalized.
Optionally, the described blind slot degree of depth in the vertical direction of described tri-plate collection plate face, more than the thickness of the second board set after described pressing.
Optionally, described carry out also including after pressing forms tri-plate collection by the second board set and described first board set:
Enclose at described heat radiating metal primitive period and offer one or more hole；Arranging conductive materials in the one or more hole, wherein, described heat radiating metal base contacts with the conductive materials in described hole.
Optionally, described tri-plate collection includes at least two-layer base material, wherein, there is at least one of which base material in described at least two-layer base material internal layer ground electric layer, conductive materials in described hole also contacts with described internal layer ground electric layer, so that described internal layer ground electric layer is turned on by the conductive materials in described hole with described heat radiating metal base.
Optionally, described described second board set surface after described pressing carries out slotting forming the blind slot for mounting related components, including: carry out slotting to form the blind slot for mounting related components by the controlled depth milling described second board set surface after described pressing.
Optionally, the bottom surface of described blind slot is surrounded by described heat radiating metal base.
Optionally, described second board set includes high frequency sheet material, described high frequency sheet material as a top layer sheet material of described tri-plate collection, or, described high frequency sheet material is as surface sheet material around described blind slot on described printed circuit board (PCB).
On the other hand the embodiment of the present invention also provides for a kind of printed circuit board (PCB), it may include:
First board set of pressing and the second board set；
Wherein, the groove processed in the first board set is provided with heat radiating metal base, and at least one surface exposure of described heat radiating metal base；Carrying out slotting from the second board set surface of pressing and be formed with the blind slot for mounting related components, the part or all of bottom surface of described blind slot is positioned on described heat radiating metal base；
Wherein, the described blind slot degree of depth in the vertical direction of described printed circuit board face, more than the thickness of the second board set of pressing.
Optionally, described blind slot is the blind slot being carried out metalized.
Optionally, enclosing at described heat radiating metal primitive period and offer one or more hole, wherein, also have conductive materials in described hole, described heat radiating metal base contacts with the conductive materials in described hole.
Optionally, described printed circuit board (PCB) includes at least two-layer base material, there is at least one of which base material in described at least two-layer base material internal layer ground electric layer, described internal layer ground electric layer contacts with the conductive materials in described hole, and described internal layer ground electric layer is turned on by the conductive materials in described hole with described heat radiating metal base.
Optionally, the bottom surface of described blind slot is surrounded by described heat radiating metal base.
Optionally, described second board set includes high frequency sheet material, described high frequency sheet material as a top layer sheet material of described printed circuit board (PCB), or, described high frequency sheet material is as surface sheet material around described blind slot on described printed circuit board (PCB).
On the other hand the embodiment of the present invention also provides for a kind of printed circuit board (PCB), it may include:
First board set of pressing and the second board set；
Wherein, the groove processed in the first board set is provided with heat radiating metal base, and at least one surface exposure of described heat radiating metal base；Carrying out slotting from the second board set surface of pressing and be formed with the blind slot for mounting related components, the part or all of bottom surface of described blind slot is positioned on described heat radiating metal base；Described blind slot is the blind slot being carried out metalized.
Optionally, the described blind slot degree of depth in the vertical direction of described printed circuit board face, more than the thickness of the second board set of pressing.
Optionally, enclosing at described heat radiating metal primitive period and offer one or more hole, wherein, also have conductive materials in described hole, described heat radiating metal base contacts with the conductive materials in described hole.
Optionally, described printed circuit board (PCB) includes at least two-layer base material, there is at least one of which base material in described at least two-layer base material internal layer ground electric layer, described internal layer ground electric layer contacts with the conductive materials in described hole, and described internal layer ground electric layer is turned on by the conductive materials in described hole with described heat radiating metal base.
Optionally, the bottom surface of described blind slot is surrounded by described heat radiating metal base.
Optionally, described second board set includes high frequency sheet material, described high frequency sheet material as a top layer sheet material of described printed circuit board (PCB), or, described high frequency sheet material is as surface sheet material around described blind slot on described printed circuit board (PCB).
On the other hand the embodiment of the present invention also provides for a kind of electronic equipment, including:
Components and parts and the printed circuit board (PCB) as described in above-described embodiment；
Wherein, during described components and parts are installed on described blind slot.
Therefore, the embodiment of the present invention, in carrying out the PCB course of processing, first processes the groove that the size with heat radiating metal base matches in the first board set；Heat radiating metal base is fixedly arranged in the groove processed in the first board set；Second board set and the first board set are carried out pressing and forms tri-plate collection；Then carry out from the second board set surface of pressing slotting to form the blind slot for mounting related components, wherein, the part or all of bottom surface of this blind slot is positioned on this heat radiating metal base, and at least one surface exposure of this heat radiating metal base, wherein, the blind slot degree of depth in the vertical direction of tri-plate collection plate face, more than the thickness of the second board set after pressing.So, only can need to carry out one step press in the PCB course of processing, be conducive to shortening the process-cycle；Components and parts can be mounted on a surface of PCB, and the heat that the work of these components and parts produces can be delivered to the another side of PCB by heat radiating metal base, and heat dispersion ensure that；Owing to being at PCB locally embedding heat radiating metal base, advantageously reduce heat sink material cost, and be conducive to reducing overall volume and the weight of PCB, the development of PCB miniaturization high integration can be promoted；And owing to being the locally embedding heat radiating metal base at PCB, the associativity making heat radiating metal base and pcb board part is preferable.
Further, bottom surface for blind slot is surrounded by heat radiating metal base, and the degree of depth that blind slot is in the vertical direction of tri-plate collection plate face, the structure of the thickness of the second board set of pressing is concentrated more than tri-plate, after components and parts are arranged in this blind slot, components and parts can contact more fully with heat radiating metal base, and heat dispersion and structural stability can get a promotion further, and heat radiating metal base can be as the earth terminal of components and parts.
Further, enclose the electric conductivity hole processed at heat radiating metal primitive period, the components and parts that heat radiating metal base is installed can be played the effect of signal shielding, further improving product performance.Further, heat radiating metal base can be by the conductive materials in electric conductivity hole and internal layer ground electric layer conducting ground connection, and heat radiating metal base can become the earth terminal of components and parts.So, internal layer ground electric layer can be turned on heat radiating metal base direct interconnection by the conductive materials in electric conductivity hole, and the ground connection performance of heat radiating metal base and components and parts is relatively reliable, also helps heat radiation performance；And owing to the earth-return circuit length between internal layer ground electric layer and heat radiating metal base can be reduced, advantageously reduce the generation of secondary inductance and parasitic capacitance, and then advantageously reduce the impact on transmission signal of secondary inductance and parasitic capacitance, and then be conducive to improving high-frequency signal or the transmission performance of other signal, and be conducive to promoting the integrated level of miniaturization of PCB.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in describing below is only some embodiments of the present invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the components and parts radiator structure schematic diagram of a kind of common PCB that the embodiment of the present invention provides；
Fig. 2 is the schematic flow sheet of a kind of method processing groove on PCB that the embodiment of the present invention provides；
What Fig. 3-a was that the embodiment of the present invention provides a kind of 311 processes the schematic diagram of the groove that the size with heat radiating metal base matches in the first board set；
Fig. 3-b is that the another kind that the embodiment of the present invention provides 311 processes the schematic diagram of the groove that the size with heat radiating metal base matches in the first board set；
Fig. 3-c is that the schematic diagram in the groove processed in the first board set 311 put into by heat radiating metal base by a kind of of embodiment of the present invention offer；
Fig. 3-d is that the schematic diagram in the groove processed in the first board set 311 put into by heat radiating metal base by the another kind that the embodiment of the present invention provides；
Fig. 3-e is a kind of schematic diagram that first board set 311 and the second board set 312 carry out pressing that the embodiment of the present invention provides；
Fig. 3-f is that the first board set 311 and the second board set 312 are carried out pressing schematic diagram by the another kind that the embodiment of the present invention provides；
Fig. 3-g is a kind of schematic diagram carrying out from the second board set 312 surface slotting to form the blind slot for mounting related components that the embodiment of the present invention provides；
Fig. 3-h is the schematic diagram that the another kind that the embodiment of the present invention provides carries out from the second board set 312 surface slotting to form the blind slot for mounting related components；
Fig. 3-i is the schematic diagram that the another kind that the embodiment of the present invention provides carries out from the second board set 312 surface slotting to form the blind slot for mounting related components；
Fig. 3-j is the schematic diagram that the another kind that the embodiment of the present invention provides carries out from the second board set 312 surface slotting to form the blind slot for mounting related components；
Fig. 3-k is the schematic diagram that the another kind that the embodiment of the present invention provides carries out from the second board set 312 surface slotting to form the blind slot for mounting related components；
Fig. 3-l is a kind of from the schematic diagram enclosing perforate at heat radiating metal primitive period of embodiment of the present invention offer；
Fig. 4 is the schematic diagram of a kind of electronic equipment that the embodiment of the present invention provides.
Detailed description of the invention
The embodiment of the present invention provides a kind of method processing groove on a printed circuit and printed circuit board (PCB) and electronic equipment, to promoting product miniaturization integrated and cost control.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of protection of the invention.
It is described in detail the most respectively.
Seeing the components and parts radiator structure that Fig. 1, Fig. 1 are a kind of common PCB of citing, wherein, heat-dissipating metal sheet is as a surface of PCB.Practice finds, due on PCB, real may only have PA part or the components and parts of some other middle low power to the region that cooling requirements is higher, as long as and the heat radiation in other region of PCB may increase surface area by punching on PCB and just reach the requirement of heat radiation, therefore, the volume of the upper required heat radiating metal block of PCB can be reduced to less completely.In the PCB of structure shown in Fig. 1, the use cost of heat radiating metal block is of a relatively high, and small product size is the most relatively large, and the miniaturization hindering PCB is integrated, and make it easy to greatly come off owing to heat radiating metal block is long-pending, the most relatively small (being usually no more than 200 newton) is pressed on the top that can bear；And the twice pressing processing of this structure need, the process-cycle is longer.
The present invention processes an embodiment of the method for groove on PCB, it may include: in the first board set, process the groove that the size with heat radiating metal base matches；Heat radiating metal base is fixedly arranged in this groove processed in the first board set；Second board set and the first board set are carried out pressing and forms tri-plate collection；The second board set surface after pressing carries out slotting to form the blind slot for mounting related components, and wherein, the part or all of bottom surface of this blind slot is positioned on this heat radiating metal base, and at least one surface exposure of this heat radiating metal base.
See Fig. 2, a kind of method processing groove on PCB that the embodiment of the present invention provides, it may include herein below:
201, in the first board set, process the groove (such as groove or blind slot) that the size with heat radiating metal base matches.
Wherein, if the first board set such as can include dry tablet pcb board material (such as FR4 sheet material etc.), can be bonding by prepreg or other material between each pcb board material in the first board set.
For ease of being better understood from and implementing, by accompanying drawing 3-a～Fig. 3-k in the present embodiment, the process processing groove on PCB is carried out illustrated exemplary.
See Fig. 3-a and Fig. 3-b, Fig. 3-a and Fig. 3-b be citing in the first board set, 311 process two kinds of schematic diagrams of the groove that the size with heat radiating metal base matches.Wherein, Fig. 3-a illustrates out in the first board set 311, processes the groove 302 that the size with heat radiating metal base matches, and Fig. 3-b illustrates out in the first board set 311, processes the blind slot 303 that the size with heat radiating metal base matches.
202, heat radiating metal base is fixedly arranged in the groove processed in the first board set.
Wherein, heat radiating metal base can be copper, aluminum, alloy or is made up of other material that heat conductivility is good.
See the two kinds of schematic diagrams being fixedly arranged on by heat radiating metal base 304 in the groove processed in the first board set 311 that Fig. 3-c and Fig. 3-d, Fig. 3-c and Fig. 3-d is citing.Wherein, Fig. 3-c illustrates out heat radiating metal base 304 is fixedly arranged in the groove 302 processed in the first board set 311, and Fig. 3-d illustrates out heat radiating metal base 304 is fixedly arranged on the blind slot 303 processed in the first board set 311.
203, the second board set and the first board set are carried out pressing and form tri-plate collection.
Wherein, if the second board set such as can include dry tablet pcb board material (such as FR4 sheet material etc.), can be bonding by prepreg or other material between each pcb board material in the second board set.
In some embodiments of the invention, the second board set can include high frequency sheet material etc., and this high frequency sheet material can be as a top layer sheet material of tri-plate collection, and high frequency sheet material can obtain high-quality signal transmission performance.The most in other embodiments of the present invention, the second board set may also comprise intermediate frequency sheet material or low frequency sheet material, and this intermediate frequency sheet material or low frequency sheet material also can be as top layer sheet materials of tri-plate collection.
Seeing Fig. 3-e and Fig. 3-f, Fig. 3-e and Fig. 3-f is the second board set 312 and the first board set 311 being carried out pressing and form two kinds of schematic diagrams of tri-plate collection 313 of citing.
204, carry out from the second board set surface of pressing slotting to form the blind slot for mounting related components.
Wherein, the part or all of bottom surface of this blind slot is positioned on this heat radiating metal base, and at least one surface exposure of this heat radiating metal base.Wherein, the bottom surface of this blind slot can be surrounded by heat radiating metal base, it is possible to is not surrounded by heat radiating metal base.
In some embodiments of the invention, such as, can pass through controlled depth milling or alternate manner, carry out from the second board set surface of pressing slotting to form the blind slot for mounting related components.
Wherein, the above-mentioned blind slot degree of depth in the vertical direction of tri-plate collection plate face, the thickness of the second board set of pressing can be concentrated more than or equal to tri-plate.It is understood that when the blind slot degree of depth in the vertical direction of tri-plate collection plate face is more than the thickness of the second board set of tri-plate concentration pressing, it is meant that part heat radiating metal base will be milled during processing blind slot；And when the blind slot degree of depth in the vertical direction of tri-plate collection plate face is equal to the thickness of the second board set of tri-plate concentration pressing, it is meant that part heat radiating metal base will not be milled during processing blind slot.
See several schematic diagrams that second board set 312 surface of pressing from tri-plate collection 313 that Fig. 3-g～Fig. 3-k, Fig. 3-g～Fig. 3-k is citing carries out slotting to form the blind slot for mounting related components.
Wherein, Fig. 3-g whole bottom surfaces for the blind slot 305 of mounting related components that fluting formed of illustrating out are positioned at heat radiating metal base 304, and the bottom surface of this blind slot 305 is surrounded by heat radiating metal base 304.Fig. 3-h bottom surface for the blind slot 306 of mounting related components that fluting formed of illustrating out is not surrounded by heat radiating metal base 304, but whole bottom surfaces of this blind slot 306 are still located on heat radiating metal base 304.Fig. 3-i illustrate out fluting formed the portion bottom surface for the blind slot 307 of mounting related components be positioned at heat radiating metal base 304；Fig. 3-j illustrates out the degree of depth in the vertical direction of tri-plate collection 313 plate face of the blind slot 308 for mounting related components that fluting formed equal to the second board set 312 thickness of pressing in tri-plate collection 313, not milling part heat radiating metal base 304 during blind slot 308 of i.e. slotting out, whole bottom surfaces of blind slot 308 are positioned at heat radiating metal base 304.Fig. 3-k illustrates out the degree of depth in the vertical direction of tri-plate collection 313 plate face of the blind slot 309 for mounting related components that fluting formed equal to the thickness of the second board set 312 of pressing in tri-plate collection 313, do not mill part heat radiating metal base 304 during blind slot 309 of i.e. slotting out, and the portion bottom surface of blind slot 309 is positioned at heat radiating metal base 304.Certainly, also can carry out other deformation as required, illustrate the most one by one.
It should be noted that, the notching construction that Fig. 3-g is illustrated out, the bottom surface of blind slot is surrounded by heat radiating metal base, and the degree of depth that blind slot is in the vertical direction of tri-plate collection plate face, concentrate the thickness of the second board set of pressing more than tri-plate, based on this structure, after components and parts are arranged in this blind slot, components and parts can contact more fully with heat radiating metal base, and heat dispersion and structural stability can get a promotion further, and heat radiating metal base can be as the earth terminal of components and parts.
In some embodiments of the invention, also further blind slot can be carried out metalized, such as, by modes such as plating, surface-coated, blind slot can be metallized.After metallization blind slot, components and parts (such as PA, other power amplifier components and parts or other components and parts) can be arranged in metallization blind slot.Metallization blind slot is also beneficial to welding and the heat radiation of components and parts, and heat radiating metal base may be turned on internal layer ground electric layer or other wiring layer by the conductive materials on blind slot sidewall, can become the earth terminal of components and parts, components and parts also may be turned on internal layer ground electric layer or other wiring layer by the conductive materials on blind slot sidewall.So, internal layer ground electric layer can be turned on heat radiating metal base direct interconnection by the conductive materials on blind slot sidewall, and the ground connection performance of heat radiating metal base and components and parts is relatively reliable, also helps heat radiation performance；And owing to the earth-return circuit length between internal layer ground electric layer and heat radiating metal base can be reduced；Maybe can reduce the earth-return circuit length between components and parts and internal layer ground electric layer, and then advantageously reduce the generation of secondary inductance and parasitic capacitance, and then advantageously reduce the impact on transmission signal of secondary inductance and parasitic capacitance, and then be conducive to improving high frequency signal transmission performance, and be conducive to promoting the integrated level of miniaturization of PCB；Or when internal layer ground electric layer directly contacts conducting with metallization blind slot, it is to avoid in prior art internal layer electric layer must secondary inductance produced by by the way of plated-through hole and outer-layer circuit are connected to Metal Substrate and the parasitic capacitance impact on signal integrity.
In some embodiments of the invention, one or more hole is offered carrying out the second board set and the first board set may also include that to enclose at heat radiating metal primitive period after pressing forms tri-plate collection, in these one or more holes, conductive materials is set, wherein, this heat radiating metal base contacts with the conductive materials in hole.
See Fig. 4, exemplified in Fig. 4 around heat radiating metal base A1, offer multiple hole A2, hole A2 exemplified in Fig. 4 is cylindrical hole, certainly under other scene, hole can be cylindrical hole, prismatic hole (such as triangular prism shaped hole or four prism type hole or hexagon hole etc.) or irregular cylindrical hole (i.e. cross section is irregular shape), wherein, non-cylindrical hole is also referred to as slotted eye or groove.
In some embodiments of the invention, tri-plate collection can include at least two-layer base material, this at least has internal layer ground electric layer at least one of which base material in two-layer base material, the conductive materials arranged in the above-mentioned hole offered also can contact with this internal layer ground electric layer, so that this internal layer ground electric layer is turned on by the conductive materials in this hole with this heat radiating metal base.Certainly, the conductive materials in this hole, also can contact, so that this other wiring layer is by the conducting of the conductive materials in this hole and heat radiating metal base direct interconnection with other wiring layer in addition to ground electric layer on base material.
It is appreciated that and encloses, at heat radiating metal primitive period, the electric conductivity hole processed, also the components and parts installed on heat radiating metal base can be played the effect of signal shielding, the most further improving product performance.Further, heat radiating metal base can be by the conductive materials in electric conductivity hole and internal layer ground electric layer conducting ground connection, and heat radiating metal base can become the earth terminal of components and parts.So, internal layer ground electric layer can be turned on heat radiating metal base direct interconnection by the conductive materials in electric conductivity hole, and the ground connection performance of heat radiating metal base and components and parts is relatively reliable, and also helps heat radiation performance；And, owing to the earth-return circuit length between internal layer ground electric layer and heat radiating metal base can be reduced, advantageously reduce the generation of secondary inductance and parasitic capacitance, and then advantageously reduce the impact on transmission signal of secondary inductance and parasitic capacitance, and then be conducive to improving high frequency signal transmission performance, and be conducive to promoting the integrated level of miniaturization of PCB.
Heat radiating metal base and PCB associativity are also preferable, and the thrust that average energy bears can reach 658.4N.Such structure is possible not only to the TOP face (TOP face for example, high frequency sheet material) making components and parts be mounted on PCB, and components and parts can be connected with heat radiating metal base closely, advantageously ensure that excellent heat dispersion performance, the heat that components and parts work produces can be delivered to BOTTOM face, then give out PCB from the TOP face of PCB.
Therefore, the present embodiment, in carrying out the PCB course of processing, first processes the groove that the size with heat radiating metal base matches in the first board set；Heat radiating metal base is fixedly arranged in this groove processed in the first board set；Second board set and the first board set are carried out pressing and forms tri-plate collection；Then carrying out from the second board set surface of pressing slotting to form the blind slot for mounting related components, wherein, the part or all of bottom surface of this blind slot is positioned on this heat radiating metal base, and at least one surface exposure of this heat radiating metal base.So, the PCB course of processing only can need to carry out one step press, is conducive to shortening the process-cycle；Components and parts can be mounted on PCB mono-surface, and the heat that components and parts work produces can be delivered to another side by heat radiating metal base, and heat dispersion can be guaranteed；Further, owing to being the locally embedding heat radiating metal base at PCB, advantageously reduce material cost, and be conducive to reducing overall volume and the weight of PCB, the development of PCB miniaturization high integration can be promoted；And owing to being the locally embedding heat radiating metal base at PCB, the associativity making heat radiating metal base and pcb board part is preferable, test finds that average adhesion is up to 658.4N.
Further, bottom surface for blind slot is surrounded by heat radiating metal base, and the degree of depth that blind slot is in the vertical direction of tri-plate collection plate face, the structure of the thickness of the second board set of pressing is concentrated more than tri-plate, after components and parts are arranged in this blind slot, components and parts can contact more fully with heat radiating metal base, and heat dispersion and structural stability can get a promotion further, and heat radiating metal base can be as the earth terminal of components and parts.
Further, enclose the electric conductivity hole processed at heat radiating metal primitive period, the components and parts that heat radiating metal base is installed can be played the effect of signal shielding, further improving product performance.Further, heat radiating metal base can be by the conductive materials in electric conductivity hole and internal layer ground electric layer conducting ground connection, and heat radiating metal base can become the earth terminal of components and parts.So, internal layer ground electric layer can be turned on heat radiating metal base direct interconnection by the conductive materials in electric conductivity hole, and the ground connection performance of heat radiating metal base and components and parts is relatively reliable, also helps heat radiation performance；And owing to the earth-return circuit length between internal layer ground electric layer and heat radiating metal base can be reduced, advantageously reduce the generation of secondary inductance and parasitic capacitance, and then advantageously reduce the impact on transmission signal of secondary inductance and parasitic capacitance, and then be conducive to improving high-frequency signal or the transmission performance of other signal, and be conducive to promoting the integrated level of miniaturization of PCB.
It should be noted that, for aforesaid embodiment of the method, in order to be briefly described, so it to be all expressed as a series of combination of actions, but those skilled in the art should know, the present invention is not limited by described sequence of movement, because according to the present invention, some step can use other order or carry out simultaneously.Secondly, those skilled in the art also should know, embodiment described in this description belongs to preferred embodiment, necessary to involved action and the module not necessarily present invention.
The embodiment of the present invention also provides for a kind of printed circuit board (PCB), it may include:
First board set of pressing and the second board set；Wherein, the groove processed in the first board set is provided with heat radiating metal base, and at least one surface exposure of this heat radiating metal base；Carrying out slotting from the second board set surface of pressing and be formed with the blind slot for mounting related components, the part or all of bottom surface of this blind slot is positioned on this heat radiating metal base.
In some embodiments of the invention, the blind slot degree of depth in the vertical direction of printed circuit board face, more than or equal to the thickness of the second board set of pressing.
In some embodiments of the invention, the bottom surface of blind slot is surrounded by heat radiating metal base or is not surrounded by heat radiating metal base.
In some embodiments of the invention, the second board set can include high frequency sheet material, and this high frequency sheet material is as a top layer sheet material of printed circuit board (PCB), or, this high frequency sheet material is as surface sheet material around blind slot on printed circuit board (PCB), and wherein, high frequency sheet material can obtain high-quality signal transmission performance.The most in other embodiments of the present invention, the second board set may also comprise intermediate frequency sheet material or low frequency sheet material, and this intermediate frequency sheet material or low frequency sheet material also can be as top layer sheet materials of printed circuit board (PCB).
In some embodiments of the invention, blind slot can be the blind slot being carried out metalized, the most also can be the blind slot not being metallized process.
In some embodiments of the invention, enclosing at heat radiating metal primitive period and offer one or more hole, also have conductive materials in this hole, this heat radiating metal base contacts with the conductive materials in this hole.
In some embodiments of the invention, printed circuit board (PCB) can include at least two-layer base material, and this at least has internal layer ground electric layer at least one of which base material in two-layer base material, and this internal layer ground electric layer is turned on by the conductive materials in above-mentioned hole with heat radiating metal base.
It is appreciated that and encloses, at heat radiating metal primitive period, the electric conductivity hole processed, also the components and parts installed on heat radiating metal base can be played the effect of signal shielding, further improving product performance.Further, heat radiating metal base can be by the conductive materials in electric conductivity hole and internal layer ground electric layer conducting ground connection, and heat radiating metal base can become the earth terminal of components and parts.So, internal layer ground electric layer can be turned on heat radiating metal base direct interconnection by the conductive materials in electric conductivity hole, and the ground connection performance of heat radiating metal base and components and parts is relatively reliable, also helps heat radiation performance；And owing to the earth-return circuit length between internal layer ground electric layer and heat radiating metal base can be reduced, advantageously reduce the generation of secondary inductance and parasitic capacitance, and then advantageously reduce the impact on transmission signal of secondary inductance and parasitic capacitance, and then be conducive to improving high frequency signal transmission performance, and be conducive to promoting the integrated level of miniaturization of PCB.
The structure of the printed circuit board (PCB) that the present embodiment provides such as the most also can be carried out other deformation, illustrate the most one by one as shown in Fig. 3-h～Fig. 3-k illustrates as required.
Therefore, the printed circuit board (PCB) of the embodiment of the present invention includes: the first board set of pressing and the second board set；The groove processed in the first board set is provided with heat radiating metal base, and at least one surface exposure of this heat radiating metal base；The part or all of bottom surface of the blind slot for mounting related components carrying out slotting from the second board set surface of pressing and formed is positioned at this heat radiating metal base；Based on this PCB construction, components and parts can be mounted on a surface of PCB, and the heat that components and parts work produces can be delivered to another side by heat radiating metal base, and heat dispersion ensure that；Owing to being the locally embedding heat radiating metal base at PCB, advantageously reduce material cost, and be conducive to reducing overall volume and the weight of PCB, the development of PCB miniaturization high integration can be promoted；And owing to being the locally embedding heat radiating metal base at PCB so that the associativity of heat radiating metal base and other plate is preferable, and test finds that average adhesion is up to 658.4N.
Further, bottom surface for blind slot is surrounded by heat radiating metal base, and the degree of depth that blind slot is in the vertical direction of tri-plate collection plate face, the structure of the thickness of the second board set of pressing is concentrated more than tri-plate, after components and parts are arranged in this blind slot, components and parts can contact more fully with heat radiating metal base, and heat dispersion and structural stability can get a promotion further, and heat radiating metal base can be as the earth terminal of components and parts.
Further, enclose the electric conductivity hole processed at heat radiating metal primitive period, the components and parts that heat radiating metal base is installed can be played the effect of signal shielding, further improving product performance.Further, heat radiating metal base can be by the conductive materials in electric conductivity hole and internal layer ground electric layer conducting ground connection, and heat radiating metal base can become the earth terminal of components and parts.So, internal layer ground electric layer can be turned on heat radiating metal base direct interconnection by the conductive materials in electric conductivity hole, and the ground connection performance of heat radiating metal base and components and parts is relatively reliable, also helps heat radiation performance；And owing to the earth-return circuit length between internal layer ground electric layer and heat radiating metal base can be reduced, advantageously reduce the generation of secondary inductance and parasitic capacitance, and then advantageously reduce the impact on transmission signal of secondary inductance and parasitic capacitance, and then be conducive to improving high-frequency signal or the transmission performance of other signal, and be conducive to promoting the integrated level of miniaturization of PCB.
See Fig. 4, the embodiment of the present invention also provides for a kind of electronic equipment 400, it may include:
Components and parts 405(such as PA, other power amplifier components and parts or other components and parts) and printed circuit board (PCB)；
Wherein, printed circuit board (PCB) includes: the first board set 311 and the second board set 312 of pressing；
Wherein, the groove processed in the first board set 311 is provided with heat radiating metal base 304, and at least one surface exposure of this heat radiating metal base 304；The part or all of bottom surface of the blind slot for mounting related components carrying out slotting from the second board set 312 surface of pressing and formed is positioned at this heat radiating metal base 304.
Wherein, during components and parts 405 are installed on this blind slot.
In some embodiments of the invention, the blind slot degree of depth in the vertical direction of printed circuit board face, more than or equal to the thickness of the second board set 312 after pressing.
In some embodiments of the invention, the bottom surface of blind slot is surrounded by heat radiating metal base or is not surrounded by heat radiating metal base 304.
In some embodiments of the invention, blind slot can be the blind slot being carried out metalized, the most also can be the blind slot not being metallized process.
In some embodiments of the invention, enclosing at heat radiating metal primitive period and offer one or more hole, also have conductive materials in this hole, this heat radiating metal base contacts with the conductive materials in this hole.
In some embodiments of the invention, printed circuit board (PCB) can include at least two-layer base material, and this at least has internal layer ground electric layer at least one of which base material in two-layer base material, and this internal layer ground electric layer is turned on by the conductive materials in above-mentioned hole with heat radiating metal base.
It is appreciated that and encloses, at heat radiating metal primitive period, the electric conductivity hole processed, also the components and parts installed on heat radiating metal base can be played the effect of signal shielding, further improving product performance.Further, heat radiating metal base can be by the conductive materials in electric conductivity hole and internal layer ground electric layer conducting ground connection, and heat radiating metal base can become the earth terminal of components and parts.So, internal layer ground electric layer can be turned on heat radiating metal base direct interconnection by the conductive materials in electric conductivity hole, and the ground connection performance of heat radiating metal base and components and parts is relatively reliable, also helps heat radiation performance；And owing to the earth-return circuit length between internal layer ground electric layer and heat radiating metal base can be reduced, advantageously reduce the generation of secondary inductance and parasitic capacitance, and then advantageously reduce the impact on transmission signal of secondary inductance and parasitic capacitance, and then be conducive to improving high frequency signal transmission performance, and be conducive to promoting the integrated level of miniaturization of PCB.
In some embodiments of the invention, can include high frequency sheet material in the second board set 312, this high frequency sheet material is as a top layer sheet material of printed circuit board (PCB), and wherein, high frequency sheet material can obtain high-quality signal transmission performance.The most in other embodiments of the present invention, the second board set 312 may also comprise intermediate frequency sheet material or low frequency sheet material, and this intermediate frequency sheet material or low frequency sheet material also can be as top layer sheet materials of printed circuit board (PCB).
Printed circuit board arrangement in the electronic equipment 400 that the present embodiment provides, the most also can be carried out other deformation, illustrate the most one by one as shown in Fig. 3-h～Fig. 3-k illustrates as required.See the exemplified mode of mounting related components in the blind slot of the printed circuit board (PCB) of structure shown in Fig. 3-h of Fig. 4, Fig. 4.The mode of mounting related components in the blind slot of the printed circuit board (PCB) of other structure, can be by that analogy.
Electronic equipment in the present embodiment can be such as base station, terminal unit, router or other electronic equipment needing to use PCB.
Therefore, the electronic equipment of the embodiment of the present invention includes: components and parts (such as PA, other power amplifier components and parts or other components and parts) and printed circuit board (PCB), wherein, printed circuit board (PCB) includes: the first board set of pressing and the second board set；The groove processed in the first board set is provided with heat radiating metal base, and at least one surface exposure of this heat radiating metal base；The part or all of bottom surface of the blind slot for mounting related components carrying out slotting from the second board set surface of pressing and formed is positioned at this heat radiating metal base；Based on this PCB construction, components and parts can be mounted on a surface of PCB, and the heat that components and parts work produces can be delivered to another side by heat radiating metal base, and heat dispersion ensure that；Owing to being the locally embedding heat radiating metal base at PCB, advantageously reduce material cost, and be conducive to reducing overall volume and the weight of PCB, the development of PCB miniaturization high integration can be promoted；And owing to being the locally embedding heat radiating metal base at PCB, the associativity making heat radiating metal base and plate is preferable, test finds that average adhesion is up to 658.4N.
Further, bottom surface for blind slot is surrounded by heat radiating metal base, and the degree of depth that blind slot is in the vertical direction of tri-plate collection plate face, the structure of the thickness of the second board set of pressing is concentrated more than tri-plate, after components and parts are arranged in this blind slot, components and parts can contact more fully with heat radiating metal base, and heat dispersion and structural stability can get a promotion further, and heat radiating metal base can be as the earth terminal of components and parts.
Further, enclose the electric conductivity hole processed at heat radiating metal primitive period, the components and parts that heat radiating metal base is installed can be played the effect of signal shielding, further improving product performance.Further, heat radiating metal base can be by the conductive materials in electric conductivity hole and internal layer ground electric layer conducting ground connection, and heat radiating metal base can become the earth terminal of components and parts.So, internal layer ground electric layer can be turned on heat radiating metal base direct interconnection by the conductive materials in electric conductivity hole, and the ground connection performance of heat radiating metal base and components and parts is relatively reliable, also helps heat radiation performance；And owing to the earth-return circuit length between internal layer ground electric layer and heat radiating metal base can be reduced, advantageously reduce the generation of secondary inductance and parasitic capacitance, and then advantageously reduce the impact on transmission signal of secondary inductance and parasitic capacitance, and then be conducive to improving high frequency signal transmission performance, and be conducive to promoting the integrated level of miniaturization of PCB.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and does not has the part described in detail, may refer to the associated description of other embodiments in certain embodiment.
The method processing groove on a printed circuit provided the embodiment of the present invention above and printed circuit board (PCB) and electronic equipment are described in detail, principle and the embodiment of the present invention are set forth by specific case used herein, and the explanation of above example is only intended to help to understand method and the core concept thereof of the present invention；Simultaneously for one of ordinary skill in the art, according to the thought of the present invention, the most all will change, to sum up, this specification content should not be construed as limitation of the present invention.
Claims (10)
1. the method processing groove on a printed circuit, it is characterised in that including:
First board set processes the groove that the size with heat radiating metal base matches；
Heat radiating metal base is fixedly arranged in the described groove processed in described first board set；
Second board set and described first board set are carried out pressing and forms tri-plate collection；Described tri-plate collection includes at least two-layer base material, and this at least has internal layer ground electric layer at least one of which base material in two-layer base material；
Described second board set surface after described pressing carries out slotting to form the blind slot for mounting related components, wherein, whole bottom surfaces of described blind slot are positioned on described heat radiating metal base, and at least one surface exposure of described heat radiating metal base, wherein, the bottom surface of described blind slot is surrounded by described heat radiating metal base, and the described blind slot degree of depth in the vertical direction of described tri-plate collection plate face is more than the thickness of the second board set after pressing；
Described blind slot is carried out metalized.
Method the most according to claim 1, it is characterised in that described carry out also including after pressing forms tri-plate collection by the second board set and described first board set:
Enclose at described heat radiating metal primitive period and offer one or more hole,
Arranging conductive materials in the one or more hole, wherein, described heat radiating metal base contacts with the conductive materials in described hole.
Method the most according to claim 2, it is characterised in that
Conductive materials in described hole also contacts with described internal layer ground electric layer, to turn on described internal layer ground electric layer and described heat radiating metal base.
4. according to the method described in any one of claims 1 to 3, it is characterised in that
Described described second board set surface after described pressing carries out slotting forming the blind slot for mounting related components, including: carry out slotting to form the blind slot for mounting related components by the controlled depth milling described second board set surface after described pressing.
5. the method processing groove on a printed circuit, it is characterised in that including:
First board set processes the groove that the size with heat radiating metal base matches；
Heat radiating metal base is fixedly arranged in the described groove processed in described first board set；
Second board set and described first board set are carried out pressing and forms tri-plate collection；Described tri-plate collection includes at least two-layer base material, and this at least has internal layer ground electric layer at least one of which base material in two-layer base material；
Described second board set surface after described pressing carries out slotting to form the blind slot for mounting related components, and wherein, whole bottom surfaces of described blind slot are positioned on described heat radiating metal base, and at least one surface exposure of described heat radiating metal base；
Wherein, the bottom surface of described blind slot is surrounded by described heat radiating metal base；Described blind slot is carried out metalized.
6. a printed circuit board (PCB), it is characterised in that including:
First board set of pressing and the second board set；Described printed circuit board (PCB) includes at least two-layer base material, and at least one of which base material in described at least two-layer base material has internal layer ground electric layer；
Wherein, the groove processed in the first board set is provided with heat radiating metal base, and at least one surface exposure of described heat radiating metal base；Carrying out slotting from the second board set surface of pressing and be formed with the blind slot for mounting related components, whole bottom surfaces of described blind slot are positioned on described heat radiating metal base；The bottom surface of described blind slot is surrounded by described heat radiating metal base, and the described blind slot degree of depth in the vertical direction of described printed circuit board face, more than the thickness of the second board set of pressing；Described blind slot is the blind slot being carried out metalized.
Printed circuit board (PCB) the most according to claim 6, it is characterised in that
Enclosing at described heat radiating metal primitive period and offer one or more hole, wherein, also have conductive materials in described hole, described heat radiating metal base contacts with the conductive materials in described hole.
Printed circuit board (PCB) the most according to claim 7, it is characterised in that
Described internal layer ground electric layer contacts with the conductive materials in described hole, and described internal layer ground electric layer is turned on by the conductive materials in described hole with described heat radiating metal base.
9. a printed circuit board (PCB), it is characterised in that including:
First board set of pressing and the second board set；Described printed circuit board (PCB) includes at least two-layer base material, and at least one of which base material in described at least two-layer base material has internal layer ground electric layer；
Wherein, the groove processed in the first board set is provided with heat radiating metal base, and at least one surface exposure of described heat radiating metal base；Carrying out slotting from the second board set surface of pressing and be formed with the blind slot for mounting related components, whole bottom surfaces of described blind slot are positioned on described heat radiating metal base；The bottom surface of described blind slot is surrounded by described heat radiating metal base, and described blind slot is the blind slot being carried out metalized.
10. an electronic equipment, it is characterised in that including:
Components and parts and as described in any one of claim 6 to 9 printed circuit board (PCB)；
Wherein, during described components and parts are installed on described blind slot.
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| CN201210203134.4A CN103517557B (en) | 2012-06-19 | 2012-06-19 | Process the method for groove and printed circuit board (PCB) and electronic equipment on a printed circuit |
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| WO2015120582A1 (en) * | 2014-02-12 | 2015-08-20 | 华为终端有限公司 | Printed circuit board and method for manufacturing printed circuit board |
| CN104465552B (en) * | 2014-12-26 | 2018-05-04 | 苏州旭创科技有限公司 | Encapsulating structure and optical module |
| CN104869751A (en) * | 2015-05-19 | 2015-08-26 | 广州杰赛科技股份有限公司 | PCB and production process thereof |
| CN104837297B (en) * | 2015-05-27 | 2018-10-19 | 维沃移动通信有限公司 | A kind of circuit board and electronic equipment |
| CN106304616A (en) * | 2016-08-19 | 2017-01-04 | 浙江宇视科技有限公司 | The radiator structure of a kind of pcb board and the manufacture method of this radiator structure |
| CN107896419A (en) * | 2017-10-11 | 2018-04-10 | 安庆正邦照明科技有限公司 | A kind of PCB structure and its manufacture craft |
| CN107889345A (en) * | 2017-11-20 | 2018-04-06 | 生益电子股份有限公司 | A kind of high heat conduction PCB preparation method and high heat conduction PCB |
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| CN107734858A (en) * | 2017-11-20 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB manufacture method and PCB |
| CN107734836A (en) * | 2017-11-20 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB |
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| CN107896422A (en) * | 2017-11-21 | 2018-04-10 | 生益电子股份有限公司 | A kind of PCB of quick heat radiating |
| CN107896421B (en) * | 2017-11-21 | 2020-03-27 | 生益电子股份有限公司 | PCB capable of fast radiating |
| CN107896423B (en) * | 2017-11-21 | 2020-03-27 | 生益电子股份有限公司 | PCB capable of fast radiating |
| CN108184307A (en) * | 2018-01-16 | 2018-06-19 | 生益电子股份有限公司 | A kind of PCB and its manufacturing method |
| CN108184308B (en) * | 2018-01-16 | 2020-06-26 | 生益电子股份有限公司 | PCB manufacturing method and PCB |
| CN108260282A (en) * | 2018-01-16 | 2018-07-06 | 生益电子股份有限公司 | The manufacturing method and PCB of a kind of PCB |
| CN108419361A (en) * | 2018-05-15 | 2018-08-17 | 景旺电子科技(龙川)有限公司 | Bury copper billet printed circuit board and preparation method thereof |
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| CN111491489B (en) * | 2020-04-10 | 2022-11-15 | 深圳国人无线通信有限公司 | Printed board assembly |
| CN114126204B (en) * | 2021-11-19 | 2023-07-25 | 中国电子科技集团公司第二十九研究所 | Microwave digital mixing assembly based on metal matrix composite substrate |
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