CN104837297B - A kind of circuit board and electronic equipment - Google Patents

A kind of circuit board and electronic equipment Download PDF

Info

Publication number
CN104837297B
CN104837297B CN201510278868.2A CN201510278868A CN104837297B CN 104837297 B CN104837297 B CN 104837297B CN 201510278868 A CN201510278868 A CN 201510278868A CN 104837297 B CN104837297 B CN 104837297B
Authority
CN
China
Prior art keywords
circuit board
printed circuit
electronic device
support plate
fluting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510278868.2A
Other languages
Chinese (zh)
Other versions
CN104837297A (en
Inventor
赵海龙
杜开文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vivo Mobile Communication Co Ltd
Original Assignee
Vivo Mobile Communication Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Priority to CN201510278868.2A priority Critical patent/CN104837297B/en
Publication of CN104837297A publication Critical patent/CN104837297A/en
Application granted granted Critical
Publication of CN104837297B publication Critical patent/CN104837297B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183Components mounted in and supported by recessed areas of the printed circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09072Hole or recess under component or special relationship between hole and component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The present invention provides a kind of circuit board and electronic equipments, wherein circuit board includes:Printed circuit board and the electronic device being set on the printed circuit board;The printed circuit board is equipped with the fluting of predetermined depth, and at least part of the electronic device is placed in the fluting.Scheme provided by the invention reduces the overall thickness of Z-direction, so that disclosure satisfy that ultimate attainment ultra-thin fuselage designs using overall thickness of the electronic equipment of the circuit board in Z-direction by being arranged electronic device in the fluting of printed circuit board.

Description

A kind of circuit board and electronic equipment
Technical field
The present invention relates to circuit board technology field, a kind of circuit board and electronic equipment are particularly related to.
Background technology
Currently, on electronic equipment pcb board (printed circuit board) electronic device fixed form be SMT (surface-assembled) patches or Included shrapnel is contacted with feed point on pcb board, to realize the job control to device.
But such pcb board electronic device fixed form, Z-direction minimum total height are that the sum of each device Z-direction height adds SMT floats tin height.When device Z-direction height cannot reduce, the electronic equipment Z-direction overall thickness assembled can not reduce.Therefore, It cannot be satisfied ultimate attainment ultra-thin fuselage design.
Invention content
The technical problem to be solved in the present invention is to provide a kind of circuit board and electronic equipment, solves electronics in the prior art and set Standby Z-direction overall thickness cannot be satisfied the problem of ultimate attainment ultra-thin fuselage design.
In order to solve the above-mentioned technical problem, the embodiment of the present invention provides a kind of circuit board, is applied to electronic equipment, including:
Printed circuit board and the electronic device being set on the printed circuit board;
Wherein, the printed circuit board is equipped with the fluting of predetermined depth, and at least part of the electronic device is placed in In the fluting.
The present invention also provides a kind of electronic equipment, including:Above-mentioned circuit board.
The above-mentioned technical proposal of the present invention has the beneficial effect that:
In said program, the circuit board reduces Z-direction by being arranged electronic device in the fluting of printed circuit board Overall thickness so that disclosure satisfy that ultimate attainment ultra-thin fuselage is set using overall thickness of the electronic equipment of the circuit board in Z-direction Meter.
Description of the drawings
Fig. 1 is printed circuit board and electronic device cooperation schematic diagram in the embodiment of the present invention one;
Fig. 2 is circuit board schematic top plan view in the embodiment of the present invention two;
Fig. 3 is diagrammatic cross-sections of the Fig. 2 along the directions A-A;
Fig. 4 is circuit board schematic elevation view in the embodiment of the present invention two;
Fig. 5 is printed circuit board, electronic device and electrically conductive support assorted schematic diagram in the embodiment of the present invention three;
Fig. 6 is electrically conductive supporting structure schematic diagram in the embodiment of the present invention three;
Fig. 7 is electrically conductive supporting structure schematic diagram in the embodiment of the present invention four;
Fig. 8 is circuit board elevational schematic view in the embodiment of the present invention four;
Fig. 9 is electrically conductive supporting structure schematic diagram in the embodiment of the present invention five;
Figure 10 is circuit board schematic top plan view in the embodiment of the present invention six;
Figure 11 is diagrammatic cross-sections of the Figure 10 along the directions B-B;
Figure 12 is circuit board schematic top plan view in the embodiment of the present invention seven;
Figure 13 is diagrammatic cross-sections of the Figure 12 along the directions C-C;
Figure 14 is printed circuit board and electronic device cooperation schematic diagram in the embodiment of the present invention eight;
Figure 15 is vocal structure and sounding through-hole cooperation schematic diagram in the embodiment of the present invention eight.
Specific implementation mode
To keep the technical problem to be solved in the present invention, technical solution and advantage clearer, below in conjunction with attached drawing and tool Body embodiment is described in detail.
Middle electronic equipment Z-direction overall thickness cannot be satisfied asking for ultimate attainment ultra-thin fuselage design to the present invention in view of the prior art Topic, provides a kind of circuit board, is applied to electronic equipment, including:
Printed circuit board and the electronic device being set on the printed circuit board;
Wherein, the printed circuit board is equipped with the fluting of predetermined depth, and at least part of the electronic device is placed in In the fluting.
The circuit board provided in an embodiment of the present invention is subtracted by being arranged electronic device in the fluting of printed circuit board The overall thickness of Z-direction is lacked, so that disclosure satisfy that using overall thickness of the electronic equipment of the circuit board in Z-direction ultimate attainment ultra-thin Fuselage designs.
Embodiment one
The structural schematic diagram for the circuit board that embodiment one is provided is as shown in Figure 1 comprising printed circuit board 1 and is set to Electronic device 2 on the printed circuit board 1;Wherein, the printed circuit board 1 is equipped with the fluting 3 of predetermined depth.The implementation In example one, 3 first surfaces 4 in the printed circuit board 1 of the fluting and the second surface 7 opposite with the first surface 4 On the through-hole that is formed through, in the fluting 3, second part 6 protrudes from for the setting of first part 5 of the electronic device 2 The first surface of the printed circuit board 1.
Wherein, electronic device 2 can only include first part 5 and second part 6, can also further include Part III 8;Into One step, as shown in Figure 1, the Part III 8 of the electronic device protrudes from the second surface 7 of the printed circuit board.
Embodiment two
In order to realize the function of communication, as shown in Figures 1 to 4, embodiment two is on the architecture basics of embodiment one, institute It states and is provided with electrically conductive interconnecting piece 10 in the first side 9 that electronic device 2 is exposed by the fluting 3, the circuit board also wraps Include electrically conductive holder 11, the electrically conductive holder 11 include the first structure 12 being electrically connected with the electrically conductive interconnecting piece 10 and with The second structure 13 that the printed circuit board 1 is electrically connected.
Wherein, the material of the electrically conductive holder is preferably metal, but is not limited to metal, and electric conductivity is good, is had certain The material of structural strength;The electrically conductive interconnecting piece can be to contact to be connected, or be weldingly connected with the first structure.
It should be noted that the outer surface of the electronic device uses isolation material, but the electrically conductive interconnecting piece is worn The outer surface of the saturating electronic device, and then be electrically connected with the inside of the electronic device, to realize the transmission of information.
Embodiment three
Specifically, as shown in Figure 4 and Figure 5, embodiment three is on the architecture basics of embodiment two, the first structure 12 Be formed as tabular, be oppositely arranged with the first side 9;Second structure 13 includes being arranged in 12 phase of the first structure To the first support plate 14 and the second support plate 15 of both sides of the edge, first support plate 14 and second support plate 15 are respectively with described At predetermined angle, the tip edge far from the first structure 12 is fixed on the printed circuit board 1 one structure 12, and with institute State the electrical connection of printed circuit board 1.The predetermined angle is chosen as 90 degree.
Wherein, as shown in fig. 6, the first structure 12 includes being sequentially connected the first side edge for constituting closed pattern, the Dual side-edge edge, third lateral edges and four side edge, first support plate 14 are connected with first side edge, second support plate 15 It is connected with third lateral edges;Second structure 13 can also include third support plate 16 and the 4th support plate 17, the third support plate 16 are connected with second side edge, and the 4th support plate 17 is connected with four side edge, and the first support plate 14, third support plate 16, Two support plates 15 and the 4th support plate 17 are fixedly linked successively;As shown in Figure 4 and Figure 6, the electrically conductive holder 11 is by first knot Structure 12 and the second structure 13 are formed as a semi-closed structure with accommodating space and gap, and the electronic device 2 is placed in described In accommodating space.The geomery of the electronic device 2 and the geomery of the fluting and the geomery of accommodating space It is adapted.
Example IV
More specifically, as shown in Figure 7 and Figure 8, example IV is on the architecture basics of embodiment three, described first The tip edge that plate 14 and second support plate 15 are respectively further from the first structure 12 is formed as the pin 18 of bending, the print Printed circuit board 1 is equipped with pin holes 19, and the pin 18 is connected with 19 grafting of the pin holes (to be welded with the printed circuit board again It connects connected).The bending angle of the pin is chosen as 90 degree.
Embodiment five
More specifically, as shown in figs. 5 and 9, embodiment five is on the architecture basics of embodiment three, described first The tip edge that plate 14 and second support plate 15 are respectively further from the first structure 12 is formed as plate stand bar structure 20, described Plate stand bar structure 20 and the surface of the printed circuit board 1 are fixedly linked, and the mode that patch is weldingly connected can be used.
Embodiment six
Further, in order to realize the purpose of buffering and positioning, as shown in Figure 10 and Figure 11, embodiment six is in embodiment On one architecture basics, the electronic device further includes:The second side 21 opposite with the first side 9, described second Side 21 is equipped with elastic structure 22, the elastic structure 22 and 23 stationary phase of insulating device on the electronic equipment Even.
Specifically, the elastic structure 22 is connected with extrudable contact of the insulating device 23.The elastic structure Material can be isolation materials or the conductive material such as foam, high resilience.
In view of the practical development situation of application market, in the embodiment of the present invention, the electrically conductive interconnecting piece preferentially selects It is selected as metal clips or metal feed point.
Embodiment seven
Further, correspond to electroacoustic electron-like device, as shown in Figure 12 and Figure 13, embodiment seven is in embodiment one On architecture basics, vocal structure 24 is additionally provided in the second side 21, the insulating device 23 is equipped with sounding through-hole 25, The vocal structure 24 is oppositely arranged with the sounding through-hole 25.Size, shape, direction and the position of the sounding through-hole are not It is construed as limiting, is adapted with size, shape, direction and the position of the vocal structure.
Above-described embodiment one, embodiment two, embodiment three, example IV/embodiment five, embodiment six and embodiment seven Structure needed for composition actual use can be arbitrarily combined, combining form of above-described embodiment is not construed as limiting at this.
Embodiment eight
The structural schematic diagram for the circuit board that embodiment eight is provided is as shown in figure 14 comprising printed circuit board 1 and setting In the electronic device 2 on the printed circuit board 1;Wherein, the printed circuit board 1 is equipped with the fluting 3 of predetermined depth.The reality It applies in example two, the fluting 3 is formed as blind hole in the first surface 4 of the printed circuit board 1, and the first of the electronic device 2 For the setting of part 5 in the fluting 3, second part 6 protrudes from the first surface 4.
The part realization embodiment of embodiment one to embodiment seven may be applicable in the embodiment eight, can also reach Identical technique effect.
In addition to as shown in figure 14, the elastic structure 22 on the electronic device (is set to and 9 phase of the first side To second side 21 on) in the embodiment eight be fixedly linked with the printed circuit board 1, it is different from embodiment six;Such as Shown in Figure 15, when being provided with vocal structure 24 in the second side 21, the printed circuit board 1 is equipped with sounding through-hole 25, the vocal structure 24 is oppositely arranged with the sounding through-hole 25, different from embodiment seven.
Since other realizations such as the structure type of conducting bracket and set-up mode are implemented in embodiment one to embodiment seven Example can be equally applicable in the board structure of circuit of the embodiment eight, so details are not described herein.
In summary, the embodiment of the present invention uses a kind of electronic device fixed form of pcb board fluting, can be by Z-direction ruler Very little higher electronic device is sunk in pcb board fluting, and then reduces pcb board sub-assembly Z-direction overall thickness, to realize that fuselage is ultimate attainment Ultrathin design.
The embodiment of the present invention additionally provides a kind of electronic equipment, including:Above-mentioned circuit board.
Wherein, the realization embodiment of foregoing circuit plate can also reach suitable for the embodiment of the electronic equipment Identical technique effect.
Above-described is the preferred embodiment of the present invention, it should be pointed out that the ordinary person of the art is come It says, under the premise of not departing from principle of the present invention, can also make several improvements and retouch, these improvements and modifications should also regard For protection scope of the present invention.

Claims (9)

1. a kind of circuit board is applied to electronic equipment, which is characterized in that including:
Printed circuit board and the electronic device being set on the printed circuit board;
Wherein, the printed circuit board is equipped with the fluting of predetermined depth, and at least part of the electronic device is placed in described In fluting;
It is provided with electrically conductive interconnecting piece in the first side that the electronic device is exposed by the fluting, the circuit board also wraps Include electrically conductive holder, the electrically conductive holder include the first structure being electrically connected with the electrically conductive interconnecting piece and with the printing Second structure of circuit board electrical connection;
The first structure is formed as tabular, is oppositely arranged with the first side;Second structure includes being arranged in institute State first support plate and the second support plate at first structure opposite sides edge, first support plate and second support plate respectively with institute First structure is stated into predetermined angle, the tip edge far from the first structure is fixed on the printed circuit board, and with institute State printed circuit board electrical connection;The predetermined angle is 90 degree;
The electronic device further includes:The second side opposite with the first side, the second side are equipped with elasticity and tie Component, the elastic structure are fixedly linked with the insulating device on the printed circuit board or the electronic equipment.
2. circuit board as described in claim 1, which is characterized in that the first surface shape for being recessed at the printed circuit board As blind hole, the first part of the electronic device is arranged in the fluting, and second part protrudes from the first surface.
3. circuit board as described in claim 1, which is characterized in that the first surface for being recessed at the printed circuit board and The first part of the through-hole being formed through on the second surface opposite with the first surface, the electronic device is arranged in institute It states in fluting, second part protrudes from the first surface of the printed circuit board.
4. circuit board as claimed in claim 3, which is characterized in that the Part III of the electronic device protrudes from the printing The second surface of circuit board.
5. circuit board as described in claim 1, which is characterized in that first support plate and second support plate are respectively further from institute The tip edge for stating first structure is formed as the pin of bending, and the printed circuit board is equipped with pin holes, the pin and institute Pin holes grafting is stated to be connected.
6. circuit board as described in claim 1, which is characterized in that first support plate and second support plate are respectively further from institute The tip edge for stating first structure is formed as plate stand bar structure, the surface of the plate stand bar structure and the printed circuit board It is fixedly linked.
7. such as Claims 1-4 any one of them circuit board, which is characterized in that the electrically conductive interconnecting piece is metal clips Or metal feed point.
8. circuit board as described in claim 1, which is characterized in that be additionally provided with vocal structure, the print in the second side Printed circuit board or the insulating device are equipped with sounding through-hole, and the vocal structure is oppositely arranged with the sounding through-hole.
9. a kind of electronic equipment, which is characterized in that including:Such as claim 1 to 8 any one of them circuit board.
CN201510278868.2A 2015-05-27 2015-05-27 A kind of circuit board and electronic equipment Active CN104837297B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510278868.2A CN104837297B (en) 2015-05-27 2015-05-27 A kind of circuit board and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510278868.2A CN104837297B (en) 2015-05-27 2015-05-27 A kind of circuit board and electronic equipment

Publications (2)

Publication Number Publication Date
CN104837297A CN104837297A (en) 2015-08-12
CN104837297B true CN104837297B (en) 2018-10-19

Family

ID=53814855

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510278868.2A Active CN104837297B (en) 2015-05-27 2015-05-27 A kind of circuit board and electronic equipment

Country Status (1)

Country Link
CN (1) CN104837297B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201213334Y (en) * 2008-06-27 2009-03-25 青岛海信电器股份有限公司 Circuit board and electronic product
CN102458035A (en) * 2010-10-20 2012-05-16 上海嘉捷通电路科技有限公司 Structure of slotting printed board
CN202394755U (en) * 2011-12-27 2012-08-22 东莞宇龙通信科技有限公司 Key structure and mobile terminal with the same
CN103517557A (en) * 2012-06-19 2014-01-15 深南电路有限公司 Method for processing groove on printed circuit board, printed circuit board and electronic device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100982795B1 (en) * 2008-07-10 2010-09-16 삼성전기주식회사 Manufacturing method of printed circuit board having electro component

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201213334Y (en) * 2008-06-27 2009-03-25 青岛海信电器股份有限公司 Circuit board and electronic product
CN102458035A (en) * 2010-10-20 2012-05-16 上海嘉捷通电路科技有限公司 Structure of slotting printed board
CN202394755U (en) * 2011-12-27 2012-08-22 东莞宇龙通信科技有限公司 Key structure and mobile terminal with the same
CN103517557A (en) * 2012-06-19 2014-01-15 深南电路有限公司 Method for processing groove on printed circuit board, printed circuit board and electronic device

Also Published As

Publication number Publication date
CN104837297A (en) 2015-08-12

Similar Documents

Publication Publication Date Title
EP2728981A3 (en) Connecting structure between circuit boards and battery pack having the same
CN105516407B (en) Mobile terminal and its circuit board assemblies
EP2081204A3 (en) Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods
TWI629921B (en) A printed circuit board
US20180035532A1 (en) Electronic Terminal
CN108495479A (en) A kind of flexible PCB shrapnel applying method and laminating apparatus
CN104837297B (en) A kind of circuit board and electronic equipment
JP5868658B2 (en) Structure
CN204918466U (en) Conducting adhesive tape
CN203691751U (en) Printed circuit board and display device
CN204518224U (en) A kind of metal-cored pcb board
CN103415162A (en) Method for forming holes in steel net
CN207969131U (en) A kind of flexible PCB shrapnel laminating apparatus
CN203984774U (en) A kind of printed circuit board (PCB)
CN205376351U (en) Button structure and input device suitable for handle
CN205082062U (en) Flexible circuit board
CN104955272A (en) Printed circuit board
CN207910091U (en) A kind of double layers of terminals
CN203788548U (en) Flexible circuit board
CN103915696B (en) Connector and connector assembly
CN206195071U (en) FFC connecting device's grafting is to bit architecture
CN204442833U (en) Abnormity rigid-flexible circuit board and there is its smart mobile phone
CN205961558U (en) Electrically conductive of paster and mobile terminal
CN205249602U (en) Two -sided flexible printed circuit board
CN204466041U (en) A kind of printed wiring board

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
EXSB Decision made by sipo to initiate substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant