CN104837297A - Circuit board and electronic equipment - Google Patents
Circuit board and electronic equipment Download PDFInfo
- Publication number
- CN104837297A CN104837297A CN201510278868.2A CN201510278868A CN104837297A CN 104837297 A CN104837297 A CN 104837297A CN 201510278868 A CN201510278868 A CN 201510278868A CN 104837297 A CN104837297 A CN 104837297A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- pcb
- printed circuit
- electronic device
- support plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a circuit board and electronic equipment. The circuit board comprises a printed circuit board and an electronic device which is arranged on the printed circuit board. The printed circuit board is equipped with an open slot with a preset depth, and at least one part of the electronic device is arranged in the open slot. According to the technical scheme provided by the invention, the total thickness of the electronic equipment on a Z direction is reduced since the electronic device is arranged in the open slot of the printed circuit board, and thus the total thickness of the electronic equipment using the circuit board on the Z direction can meet the requirement of an ultimate ultra-thin body design.
Description
Technical field
The present invention relates to circuit board technology field, refer to a kind of circuit board and electronic equipment especially.
Background technology
At present, the upper electronic device fixed form of electronic equipment pcb board (printed circuit board (PCB)) is SMT (surface-assembled) paster or carries on shell fragment and pcb board and present point cantact, to realize the job control to device.
But this kind of pcb board electronic device fixed form, the minimum total height of Z-direction is that each device Z-direction height sum adds that SMT floats tin height.When device Z-direction height can not reduce, the electronic equipment Z-direction gross thickness assembled can not reduce.Therefore, ultimate attainment ultra-thin fuselage design cannot be met.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of circuit board and electronic equipment, solves electronic equipment Z-direction gross thickness in prior art and cannot meet the problem of ultimate attainment ultra-thin fuselage design.
In order to solve the problems of the technologies described above, the embodiment of the present invention provides a kind of circuit board, is applied to electronic equipment, comprising:
Printed circuit board (PCB) and the electronic device be arranged on described printed circuit board (PCB);
Wherein, described printed circuit board (PCB) is provided with the fluting of predetermined depth, being placed at least partially in described fluting of described electronic device.
Present invention also offers a kind of electronic equipment, comprising: above-mentioned circuit board.
The beneficial effect of technique scheme of the present invention is as follows:
In such scheme, described circuit board, by being arranged in the fluting of printed circuit board (PCB) by electronic device, decreases the gross thickness of Z-direction, and then makes to adopt the gross thickness of the electronic equipment of this circuit board in Z-direction can meet ultimate attainment ultra-thin fuselage design.
Accompanying drawing explanation
Fig. 1 is that in the embodiment of the present invention one, printed circuit board (PCB) coordinates schematic diagram with electronic device;
Fig. 2 is circuit board schematic top plan view in the embodiment of the present invention two;
Fig. 3 is the generalized section of Fig. 2 along A-A direction;
Fig. 4 is circuit board front elevational schematic in the embodiment of the present invention two;
Fig. 5 be printed circuit board (PCB) in the embodiment of the present invention three, electronic device and can conducting bracket coordinate schematic diagram;
Fig. 6 is can conductive bracket structure schematic diagram in the embodiment of the present invention three;
Fig. 7 is can conductive bracket structure schematic diagram in the embodiment of the present invention four;
Fig. 8 is circuit board elevational schematic view in the embodiment of the present invention four;
Fig. 9 is can conductive bracket structure schematic diagram in the embodiment of the present invention five;
Figure 10 is circuit board schematic top plan view in the embodiment of the present invention six;
Figure 11 is the generalized section of Figure 10 along B-B direction;
Figure 12 is circuit board schematic top plan view in the embodiment of the present invention seven;
Figure 13 is the generalized section of Figure 12 along C-C direction;
Figure 14 is that in the embodiment of the present invention eight, printed circuit board (PCB) coordinates schematic diagram with electronic device;
Figure 15 is that in the embodiment of the present invention eight, vocal structure coordinates schematic diagram with sounding through hole.
Embodiment
For making the technical problem to be solved in the present invention, technical scheme and advantage clearly, be described in detail below in conjunction with the accompanying drawings and the specific embodiments.
The present invention is directed to electronic equipment Z-direction gross thickness in existing technology and cannot meet the problem of ultimate attainment ultra-thin fuselage design, a kind of circuit board is provided, is applied to electronic equipment, comprising:
Printed circuit board (PCB) and the electronic device be arranged on described printed circuit board (PCB);
Wherein, described printed circuit board (PCB) is provided with the fluting of predetermined depth, being placed at least partially in described fluting of described electronic device.
The described circuit board that the embodiment of the present invention provides, by being arranged in the fluting of printed circuit board (PCB) by electronic device, decreases the gross thickness of Z-direction, and then makes to adopt the gross thickness of the electronic equipment of this circuit board in Z-direction can meet ultimate attainment ultra-thin fuselage design.
Embodiment one
As shown in Figure 1, it comprises printed circuit board (PCB) 1 and the electronic device 2 be arranged on described printed circuit board (PCB) 1 to the structural representation of the circuit board that embodiment one provides; Wherein, described printed circuit board (PCB) 1 is provided with the fluting 3 of predetermined depth.In this embodiment one, described fluting 3 is formed as the through hole run through on the first surface 4 and the second surface 7 relative with described first surface 4 of described printed circuit board (PCB) 1, the Part I 5 of described electronic device 2 is arranged in described fluting 3, and Part II 6 protrudes from the first surface of described printed circuit board (PCB) 1.
Wherein, electronic device 2 can only include Part I 5 and Part II 6, also can also comprise Part III 8; Further, as shown in Figure 1, the Part III 8 of described electronic device protrudes from the second surface 7 of described printed circuit board (PCB).
Embodiment two
In order to realize the function communicated, as shown in Figures 1 to 4, embodiment two is on the architecture basics of embodiment one, the first side 9 that described electronic device 2 is exposed by described fluting 3 is provided with can conductive connection part 10, described circuit board also comprises can conducting bracket 11, described can conducting bracket 11 comprise with described can the first structure 12 of being electrically connected of conductive connection part 10 and the second structure 13 of being electrically connected with described printed circuit board (PCB) 1.
Wherein, describedly the material of conducting bracket can be preferably metal, but be not limited to metal, electric conductivity is good, has the material of certain structural strength; Describedly conductive connection part and described first structure can to can be to contact and be connected, also can be and be weldingly connected.
It should be noted that, the outer surface of described electronic device adopts isolation material, but describedly can penetrate the outer surface of described electronic device by conductive connection part, and then is connected with the internal electrical of described electronic device, realizes the transmission of information.
Embodiment three
Concrete, as shown in Figure 4 and Figure 5, embodiment three is on the architecture basics of embodiment two, and described first structure 12 is formed as tabular, is oppositely arranged with described first side 9; Described second structure 13 comprises the first support plate 14 and the second support plate 15 being arranged on the relative both sides of the edge of described first structure 12, described first support plate 14 and described second support plate 15 respectively with described first structure 12 one-tenth predetermined angle, tip edge away from described first structure 12 is fixed on described printed circuit board (PCB) 1, and is electrically connected with described printed circuit board (PCB) 1.Described predetermined angle is chosen as 90 degree.
Wherein, as shown in Figure 6, described first structure 12 comprises first side edge, second side edge, the 3rd lateral edges and the four side edge of the formation closed pattern that is connected successively, and described first support plate 14 is connected with first side edge, and described second support plate 15 is connected with the 3rd lateral edges; Described second structure 13 can also comprise the 3rd support plate 16 and the 4th support plate 17, described 3rd support plate 16 is connected with second side edge, described 4th support plate 17 is connected with four side edge, and the first support plate 14, the 3rd support plate 16, second support plate 15 and the 4th support plate 17 are fixedly linked successively; As shown in Figure 4 and Figure 6, describedly can be formed as by described first structure 12 and the second structure 13 semi-closed structure that has accommodation space and gap by conducting bracket 11, described electronic device 2 is placed in described accommodation space.The geomery of described electronic device 2 and the geomery of described fluting and the geomery of accommodation space adapt.
Embodiment four
More specifically, as shown in Figure 7 and Figure 8, embodiment four is on the architecture basics of embodiment three, described first support plate 14 and described second support plate 15 are formed as the pin 18 bent respectively away from the tip edge of described first structure 12, described printed circuit board (PCB) 1 is provided with pin holes 19, and described pin 18 is connected with the grafting of described pin holes 19 (being weldingly connected with described printed circuit board (PCB)) again.The bending angle of described pin is chosen as 90 degree.
Embodiment five
More specifically, as shown in figs. 5 and 9, embodiment five is on the architecture basics of embodiment three, described first support plate 14 and described second support plate 15 are formed as tabular stand bar structure 20 away from the tip edge of described first structure 12 respectively, described tabular stand bar structure 20 is fixedly linked with the surface of described printed circuit board (PCB) 1, can adopt the mode that paster is weldingly connected.
Embodiment six
Further, in order to realize the object cushioning and locate, as shown in Figure 10 and Figure 11, embodiment six is on the architecture basics of embodiment one, described electronic device also comprises: second side 21 relative with described first side 9, described second side 21 is provided with elastic structure 22, and described elastic structure 22 is fixedly linked with the insulating device 23 on described electronic equipment.
Concrete, described elastic structure 22 and described insulating device 23 can extrude to contact and be connected.The material of described elastic structure can be the isolation material such as foam, also can be conductive material, high resilience.
Consider the practical development situation of application market, in embodiments of the invention, described can conductive connection part prioritizing selection be metal clips or metal feedback point.
Embodiment seven
Further, corresponding to electroacoustic electron-like device, as shown in Figure 12 and Figure 13, embodiment seven is on the architecture basics of embodiment one, described second side 21 is also provided with vocal structure 24, described insulating device 23 is provided with sounding through hole 25, and described vocal structure 24 is oppositely arranged with described sounding through hole 25.The size of described sounding through hole, shape, direction and position are not construed as limiting, and adapt with the size of described vocal structure, shape, direction and position.
Above-described embodiment one, embodiment two, embodiment three, embodiment four/embodiment five, embodiment six and embodiment seven combination in any can be formed and actual use desired structure, are not construed as limiting in this combining form to above-described embodiment.
Embodiment eight
As shown in figure 14, it comprises printed circuit board (PCB) 1 and the electronic device 2 be arranged on described printed circuit board (PCB) 1 to the structural representation of the circuit board that embodiment eight provides; Wherein, described printed circuit board (PCB) 1 is provided with the fluting 3 of predetermined depth.In this embodiment two, described fluting 3 is formed as blind hole at the first surface 4 of described printed circuit board (PCB) 1, and the Part I 5 of described electronic device 2 is arranged in described fluting 3, and Part II 6 protrudes from described first surface 4.
The described embodiment that realizes of the part of embodiment one to embodiment seven is all applicable in this embodiment eight, also can reach identical technique effect.
Except, as shown in figure 14, the elastic structure 22 (being arranged on the second side 21 relative with described first side 9) on described electronic device is be fixedly linked with described printed circuit board (PCB) 1 in this embodiment eight, different from embodiment six; As shown in figure 15, when described second side 21 is provided with vocal structure 24, described printed circuit board (PCB) 1 is provided with sounding through hole 25, and described vocal structure 24 is oppositely arranged with described sounding through hole 25, different from embodiment seven.
Due to conducting bracket in embodiment one to embodiment seven version and set-up mode etc. other realize embodiment and all can be applied to equally in the board structure of circuit of this embodiment eight, so do not repeat them here.
In summary, the electronic device fixed form that the embodiment of the present invention adopts a kind of pcb board to slot, can sink to electronic device higher for Z-direction size in pcb board fluting, and then reduces pcb board sub-assembly Z-direction gross thickness, thus realizes the ultimate attainment ultrathin design of fuselage.
The embodiment of the present invention additionally provides a kind of electronic equipment, comprising: above-mentioned circuit board.
Wherein, the described embodiment that realizes of foregoing circuit plate is all applicable in the embodiment of this electronic equipment, also can reach identical technique effect.
Above-described is the preferred embodiment of the present invention; should be understood that the ordinary person for the art; not departing under principle prerequisite of the present invention, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (12)
1. a circuit board, is applied to electronic equipment, it is characterized in that, comprising:
Printed circuit board (PCB) and the electronic device be arranged on described printed circuit board (PCB);
Wherein, described printed circuit board (PCB) is provided with the fluting of predetermined depth, being placed at least partially in described fluting of described electronic device.
2. circuit board as claimed in claim 1, is characterized in that, described in be recessed at described printed circuit board (PCB) first surface be formed as blind hole, the Part I of described electronic device is arranged in described fluting, and Part II protrudes from described first surface.
3. circuit board as claimed in claim 1, it is characterized in that, described be recessed at described printed circuit board (PCB) first surface and the second surface relative with described first surface on be formed as the through hole that runs through, the Part I of described electronic device is arranged in described fluting, and Part II protrudes from the first surface of described printed circuit board (PCB).
4. circuit board as claimed in claim 3, it is characterized in that, the Part III of described electronic device protrudes from the second surface of described printed circuit board (PCB).
5. the circuit board as described in any one of Claims 1-4, it is characterized in that, the first side that described electronic device is exposed by described fluting is provided with can conductive connection part, described circuit board also comprises can conducting bracket, described can conducting bracket comprise with described can the first structure of being electrically connected of conductive connection part and the second structure of being electrically connected with described printed circuit board (PCB).
6. circuit board as claimed in claim 5, it is characterized in that, described first structure is formed as tabular, is oppositely arranged with described first side; Described second structure comprises the first support plate and the second support plate that are arranged on the described first relative both sides of the edge of structure, described first support plate and described second support plate are tied with described first respectively and are formed predetermined angle, tip edge away from described first structure is fixed on described printed circuit board (PCB), and is electrically connected with described printed circuit board (PCB).
7. circuit board as claimed in claim 6, it is characterized in that, described first support plate and described second support plate are formed as the pin bent respectively away from the tip edge of described first structure, described printed circuit board (PCB) is provided with pin holes, and described pin is connected with described pin holes grafting.
8. circuit board as claimed in claim 6, it is characterized in that, described first support plate and described second support plate are formed as tabular stand bar structure away from the tip edge of described first structure respectively, and the surface of described tabular stand bar structure and described printed circuit board (PCB) is fixedly linked.
9. circuit board as claimed in claim 5, it is characterized in that, described electronic device also comprises: second side relative with described first side, described second side is provided with elastic structure, and the insulating device on described elastic structure and described printed circuit board (PCB) or described electronic equipment is fixedly linked.
10. circuit board as claimed in claim 5, is characterized in that, described can conductive connection part be metal clips or metal feedback point.
11. circuit boards as claimed in claim 9, it is characterized in that, described second side is also provided with vocal structure, and described printed circuit board (PCB) or described insulating device are provided with sounding through hole, described vocal structure and described sounding through hole are oppositely arranged.
12. 1 kinds of electronic equipments, is characterized in that, comprising: the circuit board as described in any one of claim 1 to 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510278868.2A CN104837297B (en) | 2015-05-27 | 2015-05-27 | A kind of circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510278868.2A CN104837297B (en) | 2015-05-27 | 2015-05-27 | A kind of circuit board and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104837297A true CN104837297A (en) | 2015-08-12 |
| CN104837297B CN104837297B (en) | 2018-10-19 |
Family
ID=53814855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510278868.2A Active CN104837297B (en) | 2015-05-27 | 2015-05-27 | A kind of circuit board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104837297B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201213334Y (en) * | 2008-06-27 | 2009-03-25 | 青岛海信电器股份有限公司 | Circuit board and electronic product |
| US20100006203A1 (en) * | 2008-07-10 | 2010-01-14 | Samsung Electro-Mechanics Co., Ltd. | Manufacturing method of printed circuit board having electro component |
| CN102458035A (en) * | 2010-10-20 | 2012-05-16 | 上海嘉捷通电路科技有限公司 | Structure of slotting printed board |
| CN202394755U (en) * | 2011-12-27 | 2012-08-22 | 东莞宇龙通信科技有限公司 | Key structure and mobile terminal with the same |
| CN103517557A (en) * | 2012-06-19 | 2014-01-15 | 深南电路有限公司 | Method for processing groove on printed circuit board, printed circuit board and electronic device |
-
2015
- 2015-05-27 CN CN201510278868.2A patent/CN104837297B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201213334Y (en) * | 2008-06-27 | 2009-03-25 | 青岛海信电器股份有限公司 | Circuit board and electronic product |
| US20100006203A1 (en) * | 2008-07-10 | 2010-01-14 | Samsung Electro-Mechanics Co., Ltd. | Manufacturing method of printed circuit board having electro component |
| CN102458035A (en) * | 2010-10-20 | 2012-05-16 | 上海嘉捷通电路科技有限公司 | Structure of slotting printed board |
| CN202394755U (en) * | 2011-12-27 | 2012-08-22 | 东莞宇龙通信科技有限公司 | Key structure and mobile terminal with the same |
| CN103517557A (en) * | 2012-06-19 | 2014-01-15 | 深南电路有限公司 | Method for processing groove on printed circuit board, printed circuit board and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104837297B (en) | 2018-10-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2728981A3 (en) | Connecting structure between circuit boards and battery pack having the same | |
| EP2081204A3 (en) | Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods | |
| CN105704928B (en) | A kind of printed circuit board | |
| JP2015198350A5 (en) | ||
| CN102883539A (en) | Manufacturing process improvement method for pluggable flexible printed circuit (FPC) | |
| CN204347092U (en) | A kind of packaged type wiring construction of intelligent electric meter | |
| KR20150062056A (en) | Electronic components embedded substrate and method for manufacturing thereof | |
| CN104837297A (en) | Circuit board and electronic equipment | |
| CN204118349U (en) | Connector | |
| CN103415162A (en) | Method for forming holes in steel net | |
| CN205946348U (en) | Circuit board that can buckle | |
| CN206061373U (en) | The package assembly of power module | |
| CN203984774U (en) | A kind of printed circuit board (PCB) | |
| CN208490034U (en) | A kind of soft or hard combination core plate of projector | |
| CN204205187U (en) | Connector combination | |
| CN106954356A (en) | A kind of preparation method of housing, housing and terminal device | |
| CN203181416U (en) | Jumper wire for printed circuit board and printed circuit board thereof | |
| CN202679795U (en) | Flexible printed circuit board and electronic component adopting same | |
| CN104955272A (en) | Printed circuit board | |
| JP2016046338A (en) | Flexible printed circuit board | |
| CN204560006U (en) | A kind of half flexible PCB | |
| CN105005423A (en) | Spliced capacitance touch board | |
| CN110087387A (en) | The flexible circuit board that bonding station accuracy is enhanced | |
| CN205282690U (en) | Electric connector | |
| CN204560024U (en) | A kind of half flexible circuit board assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |