CN105005423A - Spliced capacitance touch board - Google Patents
Spliced capacitance touch board Download PDFInfo
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- CN105005423A CN105005423A CN201510439373.3A CN201510439373A CN105005423A CN 105005423 A CN105005423 A CN 105005423A CN 201510439373 A CN201510439373 A CN 201510439373A CN 105005423 A CN105005423 A CN 105005423A
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- capacitive sensing
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Abstract
The invention discloses a spliced capacitance touch board, which comprises an imaging background unit and a capacitance sensing unit, wherein the imaging background unit is positioned in front of the capacitance sensing unit; the capacitance sensing unit is formed by splicing at least one sub capacitance sensing board; each sub capacitance sensing board comprises a hard base board, a plurality of parallel straight conducting wires arranged on one side of the hard base board and a plurality of second parallel straight conducting wires arranged on the other side of the hard base board; the first parallel straight conducting wires and the second parallel straight conducting wires are crossed; and the two adjacent first parallel straight conducting wires and the two adjacent second parallel straight conducting wires form one parallelogram lattice. The spliced capacitance touch board has the advantages that the small-dimension touch board can be obtained; the large-dimension touch board can also be obtained; the manufacturing process is simple; the cost is low; and the spliced capacitance touch board can be widely applied to the field of an electronic device.
Description
Technical field
The present invention relates to field of electronic devices, especially a kind of spliced capacitance contact board.
Background technology
The design fundamentals of existing capacitance contact board are: at the tow sides printing parallel conductive electric wire of a plastic sheeting, and the parallel conductive electric wire in front is mutually vertical with the parallel conductive electric wire of reverse side, like this, just can form numerous grid.When finger comes on capacitive sensing plate, certain of its transverse direction can change to the electric capacity between conductor wire to the electric capacity between conductor wire and vertical certain, therefore the position of these vertical and horizontal two pairs of conductor wires can be determined by the change of perception electric capacity, thus determine the position of finger on capacitive sensing plate.Restricted by printing technology, the specification of current capacitive sensing plate is fixing often, and the specification of the touch-screen of reality is Protean often, although current capacitive sensing plate can obtain undersized touch pad by cutting, but, this capacitive sensing plate can not connect each other, therefore it can only adapt to the change requirement of small size touch pad.If desired obtain large scale touch pad (as blackboard etc.) by this kind of capacitive sensing plate, then manufacture craft process can become very complicated, and yield rate is also lower; In addition, the paint principal ingredient that the printing due to conductor wire adopts is silver powder, and the manufacturing cost of this kind of capacitive sensing plate is higher.
Summary of the invention
In order to solve the problems of the technologies described above, the object of the invention is: provide one can obtain small size touch pad, can obtain large scale touch pad again, manufacture craft is simple, the spliced capacitance contact board that cost is low.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of spliced capacitance contact board, comprise imaging background cell and capacitive sensing unit, described imaging background cell is positioned at before capacitive sensing unit, and described capacitive sensing unit is spliced by least one block of sub-capacitive sensing plate; Described sub-capacitive sensing plate comprises hard substrate, be arranged on the many bar first straight parallel wires of hard substrate wherein in one side and the many second straight parallel wires be arranged on hard substrate another side, described first straight parallel wire is crossing with the second straight parallel wire, and described adjacent two first straight parallel wires and adjacent two second straight parallel wires form a parallelogram mesh.
Further, described sub-capacitive sensing plate is also provided with conducting bridge, and described adjacent two blocks of sub-capacitive sensing plates are spliced by conducting bridge.
Further, during described sub-capacitive sensing plate splicing, the first straight parallel wire of described adjacent two blocks of sub-capacitive sensing plates to be on same straight line and to be undertaken connecting by conducting bridge or the second straight parallel wire of adjacent two blocks of sub-capacitive sensing plates to be on same straight line and to be connected by conducting bridge.
Further, described first straight parallel wire is the straight wire of laterally parallel laying, described second straight parallel wire is the straight wire of vertical parallel laying, described first straight parallel wire is vertical with the second straight parallel wire, when described sub-capacitive sensing plate is horizontally-spliced, the first straight parallel wire of described adjacent two blocks of sub-capacitive sensing plates to be on same level straight line and to be connected by conducting bridge; When described sub-capacitive sensing plate vertically splices, the second straight parallel wire of described adjacent two blocks of sub-capacitive sensing plates to be on same vertical straight line and to be connected by conducting bridge.
Further, described first straight parallel wire and the second straight parallel wire are the wire that copper wires, other non-copper plain conductor or non-metallic conducting material are formed.
Further, also comprise line connection unit, described line connection unit is positioned at after capacitive sensing unit, and described first straight parallel wire is all connected with line connection unit with the second straight parallel wire.
Further, described conducting bridge is conductive metal wire or conduction viscose bar.
Further, the outside surface of described capacitive sensing unit is coated with and is covered with protective seam.
Further, also comprise frame, described imaging background cell and capacitive sensing unit are all arranged in frame, and described imaging background cell is positioned at the front portion of frame.
Further, described imaging background cell is backlight plane.
The invention has the beneficial effects as follows: comprise capacitive sensing unit, capacitive sensing unit is spliced by least one block of sub-capacitive sensing plate, both undersized capacitance contact board can be obtained by small size sub-capacitive sensing plate, also undersized capacitance contact board can be obtained by the mode that undersized for polylith capacitive sensing plate is carried out splicing, applied widely; Sub-capacitive sensing plate is formed by the hard substrate with the first straight parallel wire and the second straight parallel wire, current comparatively ripe hard base plate line plate manufacture craft can be adopted in conjunction with simple concatenation to obtain large scale touch pad, compared with the traditional approach based on plastic sheeting printed wiring board, manufacture craft is simpler, and the first straight parallel wire and the second straight parallel wire to printing material without particular/special requirement, can adopt non-silver powder material, cost is lower.Further, the outside surface of capacitive sensing unit is coated with and is covered with protective seam, can reduce the impact caused line capacitance because of the first straight parallel wire and the second straight parallel wire corrosion.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described.
Fig. 1 is the structural representation of a kind of spliced capacitance contact board of the present invention;
Fig. 2 be the hard substrate of sub-capacitive sensing plate wherein one side structural representation;
Fig. 3 is the structural representation of the hard substrate another side of sub-capacitive sensing plate.
Reference numeral: 1, imaging background cell; 2, capacitive sensing unit; 3, sub-capacitive sensing plate; 3a, hard substrate; 3b, the first straight parallel wire; 3C, the second straight parallel wire; 3d, conducting bridge; 4, frame; 5, protective seam; 6, line connection unit.
Embodiment
With reference to Fig. 1,2 and 3, a kind of spliced capacitance contact board, comprises imaging background cell 1 and capacitive sensing unit 2, and described imaging background cell 1 is positioned at before capacitive sensing unit 2, and described capacitive sensing unit 2 is spliced by least one block of sub-capacitive sensing plate 3; Described sub-capacitive sensing plate 3 comprises hard substrate 3a, be arranged on many first straight parallel wire 3bs of hard substrate 3a wherein in one side and many second straight parallel wire 3C be arranged on hard substrate 3a another side, described first straight parallel wire 3b is crossing with the second straight parallel wire 3C, and described adjacent two the first straight parallel wire 3b and adjacent two the second straight parallel wire 3C form a parallelogram mesh.
Wherein, imaging background cell, for projection imaging, generally adopts not reflective plane to realize.
With reference to Fig. 2 and 3, be further used as preferred embodiment, described sub-capacitive sensing plate 3 is also provided with conducting bridge 3d, and described adjacent two blocks of sub-capacitive sensing plates 3 are spliced by conducting bridge 3d.
With reference to Fig. 2 and 3, be further used as preferred embodiment, when described sub-capacitive sensing plate 3 splices, the first straight parallel wire 3b of described adjacent two blocks of sub-capacitive sensing plates 3 to be on same straight line and to be undertaken connecting by conducting bridge 3d or the second straight parallel wire 3C of adjacent two blocks of sub-capacitive sensing plates 3 to be on same straight line and to be connected by conducting bridge 3d.
With reference to Fig. 2 and 3, be further used as preferred embodiment, described first straight parallel wire 3b is the straight wire of laterally parallel laying, described second straight parallel wire 3C is the straight wire of vertical parallel laying, described first straight parallel wire 3b is vertical with the second straight parallel wire 3C, when described sub-capacitive sensing plate 3 is horizontally-spliced, the first straight parallel wire 3b of described adjacent two blocks of sub-capacitive sensing plates 3 to be on same level straight line and to be connected by conducting bridge 3d; When described sub-capacitive sensing plate 3 vertically splices, the second straight parallel wire 3C of described adjacent two blocks of sub-capacitive sensing plates 3 to be on same vertical straight line and to be connected by conducting bridge 3d.
Be further used as preferred embodiment, described first straight parallel wire 3b and the second straight parallel wire 3C is the wire that copper wires, other non-copper plain conductor or non-metallic conducting material are formed.
With reference to Fig. 2 and 3, be further used as preferred embodiment, also comprise line connection unit 6, described line connection unit 6 is positioned at after capacitive sensing unit 2, and described first straight parallel wire 3b is all connected with line connection unit 6 with the second straight parallel wire 3C.
Be further used as preferred embodiment, described conducting bridge 3d is conductive metal wire or conduction viscose bar.
With reference to Fig. 1, be further used as preferred embodiment, the outside surface of described capacitive sensing unit 2 is coated with and is covered with protective seam 5.
With reference to Fig. 1, be further used as preferred embodiment, also comprise frame 4, described imaging background cell 1 and capacitive sensing unit 2 are all arranged in frame 4, and described imaging background cell 1 is positioned at the front portion of frame 4.
Be further used as preferred embodiment, described imaging background cell 1 is backlight plane.
Below in conjunction with Figure of description and specific embodiment, the present invention is described in further detail.
With reference to Fig. 1,2 and 3, the first embodiment of the present invention:
Spliced capacitance contact board of the present invention comprises frame 4, is arranged on being positioned at imaging background cell 1 above and being positioned at the capacitive sensing unit 2 with line connection unit 6 below in frame 4.Wherein, capacitive sensing unit 2 is spliced by the sub-capacitive sensing plate 3 of more than a piece, and capacitive sensing plate 3 comprises hard substrate 3a, be arranged on hard substrate 3a wherein several copper straight lines (i.e. the first straight parallel wire) 3b of the upper laterally parallel laying of one side and several copper straight lines (i.e. the second straight parallel wire) 3C being arranged on vertical parallel laying on hard substrate 3a another side.During sub-capacitive sensing plate 3 horizontally-spliced (as shown in Figure 2), the corresponding copper straight line 3b of the horizontal parallel laying of adjacent two blocks of sub-capacitive sensing plates 3 to be on same level straight line and to be connected by conducting bridge 3d; When sub-capacitive sensing plate 3 vertically splices (as shown in Figure 3), the corresponding copper straight line 3C of adjacent two pieces of vertical parallel layings of sub-capacitive sensing plate to be on same vertical straight line and to be connected by conducting bridge 3d.
The present embodiment adopts the hard substrate with copper cash to form capacitance contact board, such plate can (centre be non-conductive hard substrate by common hard base plate line plate, two sides is copper coin) etching form, such manufacturing technology is one very proven technique, therefore, no matter be material cost, or cost of labor is all lower.And the interconnection technique between copper cash is also very ripe and reliable technology.Like this, just by sub-for polylith capacitive sensing plate being carried out simple concatenation to realize the object manufacturing large gauge touch-screen.
The outside surface of spliced sub-capacitive sensing plate 3 is coated with and is covered with protective seam 5, can prevent the electric capacity affected because of the corrosion of copper cash between copper cash.
Conducting bridge 3d is the conductive metal wire (as copper sheet etc.) be connected to by welding manner on copper straight line, or conduction viscose bar.
Compared with prior art, the present invention has the following advantages:
(1) capacitive sensing unit is comprised, capacitive sensing unit is spliced by least one block of sub-capacitive sensing plate, both undersized capacitance contact board can be obtained by small size sub-capacitive sensing plate, also undersized capacitance contact board can be obtained by the mode that undersized for polylith capacitive sensing plate is carried out splicing, applied widely;
(2) sub-capacitive sensing plate is formed by the hard substrate with the first straight parallel wire and the second straight parallel wire, current comparatively ripe hard base plate line plate manufacture craft can be adopted in conjunction with simple concatenation to obtain large scale touch pad, compared with the traditional approach based on plastic sheeting printed wiring board, manufacture craft is simpler;
(3) first straight parallel wires and the second straight parallel wire are to printing material without particular/special requirement, and can adopt non-silver powder material, cost is lower;
(4) outside surface of capacitive sensing unit is coated with and is covered with protective seam, can reduce the impact caused line capacitance because of the first straight parallel wire and the second straight parallel wire corrosion.
More than that better enforcement of the present invention is illustrated, but the invention is not limited to described embodiment, those of ordinary skill in the art also can make all equivalent variations or replacement under the prerequisite without prejudice to spirit of the present invention, and these equivalent distortion or replacement are all included in the application's claim limited range.
Claims (10)
1. a spliced capacitance contact board, it is characterized in that: comprise imaging background cell (1) and capacitive sensing unit (2), described imaging background cell (1) is positioned at before capacitive sensing unit (2), and described capacitive sensing unit (2) is spliced by least one piece of sub-capacitive sensing plate (3); Described sub-capacitive sensing plate (3) comprises hard substrate (3a), be arranged on the many bar first straight parallel wires (3b) of hard substrate (3a) wherein in one side and the many second straight parallel wires (3C) be arranged on hard substrate (3a) another side, described first straight parallel wire (3b) is crossing with the second straight parallel wire (3C), and described adjacent two first straight parallel wires (3b) and adjacent two second straight parallel wires (3C) form a parallelogram mesh.
2. the spliced capacitance contact board of one according to claim 1, is characterized in that: described sub-capacitive sensing plate (3) is also provided with conducting bridge (3d), and described adjacent two pieces of sub-capacitive sensing plates (3) are spliced by conducting bridge (3d).
3. the spliced capacitance contact board of one according to claim 2, it is characterized in that: during described sub-capacitive sensing plate (3) splicing, the first straight parallel wire (3b) of described adjacent two pieces of sub-capacitive sensing plates (3) to be on same straight line and to be undertaken connecting by conducting bridge (3d) or the second straight parallel wire (3C) of adjacent two pieces of sub-capacitive sensing plates (3) to be on same straight line and to be connected by conducting bridge (3d).
4. the spliced capacitance contact board of one according to claim 3, it is characterized in that: described first straight parallel wire (3b) is the straight wire of laterally parallel laying, the straight wire that described second straight parallel wire (3C) is vertical parallel laying, described first straight parallel wire (3b) is vertical with the second straight parallel wire (3C), when described sub-capacitive sensing plate (3) is horizontally-spliced, the first straight parallel wire (3b) of described adjacent two pieces of sub-capacitive sensing plates (3) to be on same level straight line and to be connected by conducting bridge (3d); When described sub-capacitive sensing plate (3) is vertically spliced, the second straight parallel wire (3C) of described adjacent two pieces of sub-capacitive sensing plates (3) to be on same vertical straight line and to be connected by conducting bridge (3d).
5. the spliced capacitance contact board of one according to claim 2, is characterized in that: described first straight parallel wire (3b) and the second straight parallel wire (3C) are the wire that copper wires, other non-copper plain conductor or non-metallic conducting material are formed.
6. the spliced capacitance contact board of one according to claim 2, it is characterized in that: also comprise line connection unit (6), described line connection unit (6) is positioned at after capacitive sensing unit (2), and described first straight parallel wire (3b) is all connected with line connection unit (6) with the second straight parallel wire (3C).
7. the spliced capacitance contact board of one according to claim 2, is characterized in that: described conducting bridge (3d) is conductive metal wire or conduction viscose bar.
8. the spliced capacitance contact board of the one according to any one of claim 1-7, is characterized in that: the outside surface of described capacitive sensing unit (2) is coated with and is covered with protective seam (5).
9. the spliced capacitance contact board of the one according to any one of claim 1-7, it is characterized in that: also comprise frame (4), described imaging background cell (1) and capacitive sensing unit (2) are all arranged in frame (4), and described imaging background cell (1) is positioned at the front portion of frame (4).
10. the spliced capacitance contact board of the one according to any one of claim 1-7, is characterized in that: described imaging background cell (1) is backlight plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510439373.3A CN105005423A (en) | 2015-07-23 | 2015-07-23 | Spliced capacitance touch board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510439373.3A CN105005423A (en) | 2015-07-23 | 2015-07-23 | Spliced capacitance touch board |
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| Publication Number | Publication Date |
|---|---|
| CN105005423A true CN105005423A (en) | 2015-10-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510439373.3A Pending CN105005423A (en) | 2015-07-23 | 2015-07-23 | Spliced capacitance touch board |
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| CN (1) | CN105005423A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109254692A (en) * | 2018-10-22 | 2019-01-22 | 深圳市志凌伟业技术股份有限公司 | A kind of light shield joining method of metal grill |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103631413A (en) * | 2012-08-24 | 2014-03-12 | 天津富纳源创科技有限公司 | Touch screen and touch-controlled display device |
| CN104331189A (en) * | 2014-11-19 | 2015-02-04 | 业成光电（深圳）有限公司 | Touch display device |
| CN204808297U (en) * | 2015-07-23 | 2015-11-25 | 广州中国科学院先进技术研究所 | Concatenation formula electric capacity touch pad |
-
2015
- 2015-07-23 CN CN201510439373.3A patent/CN105005423A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103631413A (en) * | 2012-08-24 | 2014-03-12 | 天津富纳源创科技有限公司 | Touch screen and touch-controlled display device |
| CN104331189A (en) * | 2014-11-19 | 2015-02-04 | 业成光电（深圳）有限公司 | Touch display device |
| CN204808297U (en) * | 2015-07-23 | 2015-11-25 | 广州中国科学院先进技术研究所 | Concatenation formula electric capacity touch pad |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109254692A (en) * | 2018-10-22 | 2019-01-22 | 深圳市志凌伟业技术股份有限公司 | A kind of light shield joining method of metal grill |
| CN109254692B (en) * | 2018-10-22 | 2021-07-09 | 深圳市志凌伟业技术股份有限公司 | Photomask splicing method of metal grids |
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Application publication date: 20151028 |
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