CN106954356A - A kind of preparation method of housing, housing and terminal device - Google Patents
A kind of preparation method of housing, housing and terminal device Download PDFInfo
- Publication number
- CN106954356A CN106954356A CN201710241000.4A CN201710241000A CN106954356A CN 106954356 A CN106954356 A CN 106954356A CN 201710241000 A CN201710241000 A CN 201710241000A CN 106954356 A CN106954356 A CN 106954356A
- Authority
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- China
- Prior art keywords
- housing
- electric conduction
- routing layer
- conduction routing
- pad
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The present invention relates to electronic technology field, a kind of preparation method of housing, housing and terminal device are disclosed.The preparation method of the housing includes：Injection moulding housing；At least one electric conduction routing layer is arranged on housing；At least one pad is printed in the predeterminated position of housing；The welding electronic component on pad, electric conduction routing layer is used to electronic component being electrically connected to pass to mainboard.Embodiment of the present invention also discloses a kind of housing and a kind of terminal device.Allow to reduce the whole machine width degree of terminal device, while cost can be reduced.
Description
Technical field
The present invention relates to electronic technology field, more particularly to a kind of preparation method of housing, housing and terminal device.
Background technology
In recent years, continuing to develop and scientific and technological continuous progress with the communication technology, mobile phone, panel computer or notes
The mobile terminals such as this computer turn into use instrument essential in people's daily life.At present, the side switch in mobile terminal
Typically all button is thermally melted in rear shell, and flexible PCB (Flexible Printed Circuit, abbreviation FPC) is attached to fore shell,
The FPC of side switch is by zero insertion force (Zero Insertion Force, abbreviation zif) connector or plate to plate (Board-to-
Board, abbreviation BTB) connector is connected with mainboard.
But, inventor has found, there is problems in the prior art, and FPC plates are generally by 0.1mm's in the prior art
FPC, 0.2mm stiffening plate and 0.05mm conducting resinl are constituted, and the FPC plates of side switch are connected by connector with mainboard, and this causes
The whole machine wider width of mobile terminal, is unfavorable for the frivolous portable design of mobile terminal, meanwhile, cost is higher.
The content of the invention
The purpose of embodiment of the present invention is to provide a kind of preparation method of housing, housing and terminal device so that can
To reduce the whole machine width degree of terminal device, while cost can be reduced.
In order to solve the above technical problems, embodiments of the present invention provide a kind of preparation method of housing, including：Injection
Molded housing；At least one electric conduction routing layer is arranged on housing；At least one pad is printed in the predeterminated position of housing；In weldering
Welding electronic component on disk, electric conduction routing layer is used to electronic component being electrically connected to pass to mainboard.
Embodiments of the present invention additionally provide a kind of housing, including：At least one electric conduction routing layer and at least one weldering
Disk；Pad is printed on the predetermined position of housing, and pad is used for welding electronic component；Electric conduction routing layer is used for electronics member device
Part, which is electrically connected, passes to mainboard.
Embodiments of the present invention additionally provide a kind of terminal device, including housing, wherein, the housing includes at least one
Electric conduction routing layer and at least one pad；Pad is printed on the predetermined position of housing, and pad is used for welding electronic component；Lead
Electric routing layer is used to electronic component being electrically connected to pass to mainboard.
Embodiment of the present invention in terms of existing technologies, by arranged on housing at least one electric conduction routing layer,
And print at least one pad in the predeterminated position of housing so that the electronic component welded on pad can be by electric conduction routing
Layer, which is directly electrically connected, passes to mainboard, so, can save the installing space of FPC in the prior art, helps to reduce the whole machine of terminal
Width.Meanwhile, at least one routing layer is directly arranged on housing, and electronic component is electrically connected by routing layer passes to master
Plate, can save FPC plates and connector, so as to save cost.
In addition, at least one electric conduction routing layer is arranged on housing, including：Target area coating conductive silver on housing
Slurry, target area is the part of electric conduction routing to be produced layer；The conductive silver paste of coating is repaired by planographic technique PDS, is obtained
To at least one electric conduction routing layer.Embodiment of the present invention provides one kind and at least one electric conduction routing is specifically formed on housing
The method of layer, preparation method is efficiently convenient.
In addition, after injection moulding housing, before the target area coating conductive silver paste on housing, also including：In housing
The first insulating barrier of upper injection；When target area on housing applies conductive silver paste, conductive silver paste is coated in the first insulating barrier
Region corresponding with target area in.In embodiment of the present invention, the first insulating barrier is set between conductive silver paste and housing,
So, obtained by repairing conductive silver paste after electric conduction routing layer, the first insulating barrier ensure that conductor wiring layer and phase between housing
Mutually insulation, it is to avoid effect of signals of the housing to electric conduction routing layer.
In addition, obtaining after at least one electric conduction routing layer, also include：The second insulating barrier is molded on electric conduction routing layer.This
In invention embodiment, electric conduction routing layer on be molded the second insulating barrier, can avoid outer signals to electric conduction routing layer letter
Number interference, strengthen signal shielding.
Brief description of the drawings
Fig. 1 is the preparation method flow chart according to the housing of first embodiment of the invention；
Fig. 2 is the preparation method flow chart according to the housing of second embodiment of the invention；
Fig. 3 is the structural side view of the housing according to third embodiment of the invention；
Fig. 4 is the structural perspective of the housing according to third embodiment of the invention；
Fig. 5 is the structural side view of the housing according to four embodiment of the invention；
Fig. 6 is the structural perspective of the housing according to four embodiment of the invention；
Fig. 7 is the side view of the terminal device according to fifth embodiment of the invention；
Fig. 8 is the top view of the terminal device according to fifth embodiment of the invention.
Embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with each reality of the accompanying drawing to the present invention
The mode of applying is explained in detail.However, it will be understood by those skilled in the art that in each embodiment of the invention,
In order that reader more fully understands the application and proposes many ins and outs.But, even if without these ins and outs and base
Many variations and modification in following embodiment, can also realize the application technical scheme claimed.
The first embodiment of the present invention is related to a kind of preparation method of housing, as shown in Figure 1：
Step 101：Injection moulding housing.
Specifically, using injection molding technology by metal or the material such as nonmetallic, according to Shell model injection moulding housing,
It is consistent with prior art, it will not be repeated here.Certainly housing can also be obtained using other modes, such as using punching press or meter
Calculation machine numerical control CNC modes obtain metal shell, and no matter which kind of mode obtains housing, all should be within the protection domain of the application.
Step 102：Target area coating conductive silver paste on housing, wherein, target area is to be produced on housing leads
The region of electric routing layer.
Specifically, the target area of electric conduction routing layer to be produced is confirmed on the housing of injection moulding, and then, in housing
Target area on apply conductive silver paste, for be subsequently formed electric conduction routing layer.
Step 103：The conductive silver paste of coating is repaired by planographic technique PDS, at least one electric conduction routing layer is obtained.
Specifically, planographic technique PDS is a kind of technique that circuit is directly printed on conductive material, passes through plane
Typography PDS repairs the conductive silver paste for being coated in electric conduction routing layer segment to be produced on housing, can form high-precision electricity
Road interconnection architecture, so as to obtain at least one high-precision electric conduction routing layer so that electronic component is electrically connected by electric conduction routing layer
Pass to mainboard.
Step 104：At least one pad is printed in the predeterminated position of housing, wherein, electric conduction routing layer and weldering on housing
Disk is corresponded.
Specifically, by laser engraving, at least one pad can be carved out in the predeterminated position of housing so that pad
On can with welding electronic component, and housing electric conduction routing layer with pad correspond.
It should be noted that in embodiment of the present invention, it the mode such as can also corrode by plating or chemical medicinal liquid,
The predeterminated position of housing produces pad, and this is not limited by the present invention.
Step 105：The welding electronic component on pad, wherein, electric conduction routing layer is used to electronic component being electrically connected
To mainboard, above-mentioned electronic component can be metal clips.
Specifically, printed out on housing after at least one pad, can be by surface mounting technology SMT in above-mentioned weldering
Welding metal shell fragment on disk, electric conduction routing layer can be used for metal clips being electrically connected passing to mainboard.
In addition, electronic component can also be the devices such as switch, metal dome.
Embodiment of the present invention in terms of existing technologies, by arranged on housing at least one electric conduction routing layer,
And print at least one pad in the predeterminated position of housing so that the electronic component welded on pad can be by electric conduction routing
Layer, which is directly electrically connected, passes to mainboard, so, can save the installing space of FPC in the prior art, helps to reduce the whole machine of terminal
Width.Meanwhile, at least one routing layer is directly arranged on housing, and electronic component is electrically connected by routing layer passes to master
Plate, can save FPC plates and connector, so as to save cost.
Second embodiment of the present invention is related to a kind of preparation method of housing.Second embodiment is in first embodiment
On the basis of made further improvement, mainly the improvement is that：In the present embodiment, conduction to be produced is walked on housing
Line layer target area coating conductive silver paste when, conductive silver paste is coated in housing the first insulating barrier it is corresponding with target area
Region in, as shown in Figure 2.
Step 201：Injection moulding housing.
Specifically, using injection molding technology by metal or the material such as nonmetallic, according to Shell model injection moulding housing,
It is consistent with prior art, it will not be repeated here.Certainly housing can also be obtained using other modes, such as using punching press or meter
Calculation machine numerical control CNC modes obtain metal shell, and no matter which kind of mode obtains housing, all should be within the protection domain of the application.
Step 202：The first insulating barrier is molded on housing.
Specifically, after injection moulding housing, before conductive silver paste is coated on housing, it can be molded on housing
One layer of insulator, this layer of insulator can be used as the first insulating barrier.Wherein, above-mentioned insulator can use the megohmite insulants such as plastic cement,
Electric conduction routing layer for ensureing housing and being formed afterwards insulate.
Step 203：Conductive silver paste is coated in the region corresponding with the target area on housing of the first insulating barrier, its
In, target area is the region of electric conduction routing to be produced layer.
Specifically, after the insulating barrier of injection formed first, when conductive silver paste is coated on the target area of housing, be by
Conductive silver paste is coated in the region corresponding with the target area on housing of the first insulating barrier.
Step 204：The conductive silver paste of coating is repaired by planographic technique PDS, at least one electric conduction routing layer is obtained.
Specifically, planographic technique PDS is a kind of technique that circuit is directly printed on conductive material, passes through plane
Typography PDS repairs the conductive silver paste for being coated in electric conduction routing layer segment to be produced on housing, can form high-precision electricity
Road interconnection architecture, so as to obtain at least one high-precision electric conduction routing layer so that electronic component is electrically connected by electric conduction routing layer
Pass to mainboard.
Step 205：The second insulating barrier is molded on electric conduction routing layer.
Specifically, after electric conduction routing layer is formed, the second insulating barrier can be molded on electric conduction routing layer, only in electricity
The tie point of sub- device reserves Lu Tong areas and is electrically connected, to avoid other signals from disturbing the letter in the electric conduction routing layer on housing
Number transmission.
Step 206：At least one pad is printed in the predeterminated position of housing, wherein, electric conduction routing layer and weldering on housing
Disk is corresponded.
Specifically, by laser engraving, at least one pad can be carved out in the predeterminated position of housing so that pad
On can with welding electronic component, and housing electric conduction routing layer with pad correspond.
It should be noted that in embodiment of the present invention, it the mode such as can also corrode by plating or chemical medicinal liquid,
The predeterminated position of housing produces pad, and this is not limited by the present invention.
Step 207：The welding electronic component on pad, wherein, electric conduction routing layer is used to electronic component being electrically connected
To mainboard.
Specifically, printed out on housing after at least one pad, can be by surface mounting technology SMT in above-mentioned weldering
Welding electronic component on disk, electric conduction routing layer can be used for electronic component being electrically connected passing to mainboard.Wherein, electronic component can
Think any one in the devices such as switch, metal dome or metal clips.
In embodiment of the present invention, the first insulating barrier is set between electric conduction routing layer and housing, so, led by finishing
Electric silver paste is obtained after electric conduction routing layer, and first insulating barrier ensure that mutually insulated between conductor wiring layer and housing, it is to avoid shell
Effect of signals of the body to electric conduction routing layer.After electric conduction routing layer is formed, second can also be molded on electric conduction routing layer exhausted
Edge layer, only reserves Lu Tong areas and is electrically connected in the tie point of electronic device, this way it is possible to avoid on other signals interference housing
Electric conduction routing layer in signal transmission.
The step of various methods are divided above, be intended merely to description it is clear, can be merged into when realizing a step or
Some steps are split, multiple steps are decomposed into, as long as including identical logical relation, all protection domain in this patent
It is interior；To adding inessential modification in algorithm or in flow or introducing inessential design, but its algorithm is not changed
Core design with flow is all in the protection domain of the patent.
Third embodiment of the invention is related to a kind of housing, as shown in Figure 3 and Figure 4, and the housing includes two electric conduction routings
Layer 303 and two pads 301.
As shown in figure 3, two electric conduction routing layers 303 are coated with housing 300, as shown in shade in figure, wherein, two are led
A layer insulating can also be molded between electric routing layer 303, the insulating barrier can be used for avoiding the letter between two electric conduction routing layers
Number interfere with each other.As shown in figure 4, being also printed with two pads 301 on housing 300, pad 301 can be welded on housing 300
Predetermined position, the pad 301 can be used for welding electronic component 302.Wherein, the electric conduction routing layer 303 on housing 300 and weldering
Disk 301 is corresponded, and electric conduction routing layer 303 can be used for electronic component 302 being electrically connected passing to mainboard.
In embodiment of the present invention, electronic component 302 can be in the devices such as switch, metal dome or metal clips
Any one.
It should be noted that electric conduction routing layer 303 can make arbitrary shape, electric conduction routing according to the surface of housing 300
The trend of layer 303 can be more flexible than FPC plate, and it is more changeable that circuit can be done as needed, in addition, the painting shown in Fig. 3
Apply the layer of the electric conduction routing on housing 300 303 and give two, the electric conduction routing of formation is coated in actual applications, on housing
Layer is at least one, in process of production can according to actual needs, and coating forms multiple electric conduction routing layers on housing, herein
Repeat no more.
Embodiment of the present invention in terms of existing technologies, by arranged on housing at least one electric conduction routing layer,
And print at least one pad in the predeterminated position of housing so that the electronic component welded on pad can be by electric conduction routing
Layer, which is directly electrically connected, passes to mainboard, so, can save the installing space of FPC in the prior art, helps to reduce the whole machine of terminal
Width.Meanwhile, at least one routing layer is directly arranged on housing, and electronic component is electrically connected by routing layer passes to master
Plate, can save FPC plates and connector, so as to save cost.
It is seen that, present embodiment is the device embodiment corresponding with first embodiment, and present embodiment can be with
First embodiment is worked in coordination implementation.The relevant technical details mentioned in first embodiment still have in the present embodiment
Effect, in order to reduce repetition, is repeated no more here.Correspondingly, the relevant technical details mentioned in present embodiment are also applicable in
In first embodiment.
Four embodiment of the invention is related to a kind of housing.4th embodiment is made on the basis of the 3rd embodiment
It is further to improve, mainly the improvement is that：In the 4th embodiment, the is provided between housing and electric conduction routing layer
One insulating barrier, for ensureing that housing insulate with electric conduction routing layer, is also provided with the second insulating barrier, for keeping away on electric conduction routing layer
Exempt from outer signals to interfere the signal in electric conduction routing layer, as shown in figs. 5 and 6.
As shown in figs. 5 and 6, housing can include an electric conduction routing layer 303 and a pad 301.As shown in figure 5,
An electric conduction routing layer 303 is coated with housing 300, as shown in shade in figure.Set between housing 300 and electric conduction routing layer 303
There is the first insulating barrier 304, electric conduction routing layer 303 is provided with the second insulating barrier 305.As shown in fig. 6, being also printed with housing 300
One pad 301, pad 301 can be welded on the predetermined position of housing 300, and the pad 301 can be used for welding electronics member device
Part 302.Wherein, the electric conduction routing layer 303 on housing 300 is corresponding with pad 301, and electric conduction routing layer 303 can be used for electronics member
Device 302, which is electrically connected, passes to mainboard.
As shown in figure 5, the first insulating barrier 304 is provided between housing 300 and electric conduction routing layer 303, electric conduction routing layer
The second insulating barrier 305 is provided with 303, wherein, the insulating materials of the first insulating barrier 304 and the second insulating barrier 305 can be used
Natural gum etc., and the size of the first insulating barrier 304 is bigger than the size of electric conduction routing layer 303, so, the first insulating barrier can more have
Effect ground ensures mutually insulated between conductor wiring layer and housing.Meanwhile, the size of the second insulating barrier 305 is than electric conduction routing layer
303 size is big, so, can more effectively avoid interference of the outer signals to the signal of electric conduction routing layer.
Specifically, because the material of housing 300 can be polytype materials, housing such as metal, metal oxide
300 is conductive, so that housing 300 can influence the signal of electric conduction routing layer 303, therefore, by being walked in housing 300 and conduction
Set size to be more than the first insulating barrier 304 of electric conduction routing layer 303 between line layer 303, can effectively ensure housing 300 with leading
Electric routing layer 303 insulate.Meanwhile, outer signals can cause certain interference to electric conduction routing layer 303, therefore, in electric conduction routing
Set size to be more than the second insulating barrier 305 of electric conduction routing layer 303 on layer 303, only reserve dew copper in the tie point of electronic device
Area is electrically connected, and can be effectively prevented from interference of the outer signals to the signal of electric conduction routing layer 303.
In embodiment of the present invention, electronic component 302 can be in the devices such as switch, metal dome or metal clips
Any one.
It should be noted that electric conduction routing layer 303 can make arbitrary shape, electric conduction routing according to the surface of housing 300
The trend of layer 303 can be more flexible than FPC plate, and it is more changeable that circuit can be done as needed, in addition, the painting shown in Fig. 5
Apply the layer of the electric conduction routing on housing 300 303 and only give one, the conduction that formation is coated in actual applications, on housing is walked
Line layer is at least one, in process of production can according to actual needs, and coating forms multiple electric conduction routing layers on housing, this
Place is repeated no more.
In embodiment of the present invention, the first insulating barrier is set between electric conduction routing layer and housing, so, the first insulating barrier
Mutually insulated between conductor wiring layer and housing can be ensured, it is to avoid effect of signals of the housing to electric conduction routing layer.Led in formation
After electric routing layer, the second insulating barrier can also be molded on electric conduction routing layer, only reserve dew copper in the tie point of electronic device
Area is electrically connected, this way it is possible to avoid the signal transmission in the electric conduction routing layer on other signals interference housing.
Because second embodiment is mutually corresponding with present embodiment, therefore present embodiment can be mutual with second embodiment
It is engaged implementation.The relevant technical details mentioned in second embodiment are still effective in the present embodiment, implement second
The technique effect that can be reached in mode can similarly be realized in the present embodiment, in order to reduce repetition, no longer be gone to live in the household of one's in-laws on getting married here
State.Correspondingly, the relevant technical details mentioned in present embodiment are also applicable in second embodiment.
Fifth embodiment of the invention is related to a kind of terminal device, as illustrated in figs. 7 and 8.Terminal device includes being formed
The first insulating barrier 304, electric conduction routing layer 303, pad 301, electronic component 302 and housing 300 on housing 300.
Specifically, the first insulating barrier 304 is moulded on housing 300, and electric conduction routing layer 303 is by forming in the first insulation
On layer 304, so as to be printed on housing 300.Pad 301 is printed on the predetermined position of housing 300, pad 301 and can welded
Electronic component 302 is connect, wherein, electric conduction routing layer 303 can be used for electronic component 302 being electrically connected passing to mainboard.
In addition, in actual applications, the second insulating barrier can also be molded on electric conduction routing layer 303, this way it is possible to avoid its
The signal transmission in electric conduction routing layer 303 on his signal interference housing.
Embodiment of the present invention in terms of existing technologies, by arranged on housing at least one electric conduction routing layer,
And print at least one pad in the predeterminated position of housing so that the electronic component welded on pad can be by electric conduction routing
Layer, which is directly electrically connected, passes to mainboard, so, can save the installing space of FPC in the prior art, helps to reduce the whole machine of terminal
Width.Meanwhile, at least one routing layer is directly arranged on housing, and electronic component is electrically connected by routing layer passes to master
Plate, can save FPC plates and connector, so as to save cost.
It will be understood by those skilled in the art that the respective embodiments described above are to realize the specific embodiment of the present invention,
And in actual applications, can to it, various changes can be made in the form and details, without departing from the spirit and scope of the present invention.
Claims (10)
1. a kind of preparation method of housing, it is characterised in that including：
Injection moulding housing；
At least one electric conduction routing layer is arranged on the housing；
At least one pad is printed in the predeterminated position of the housing；
The welding electronic component on the pad, the electric conduction routing layer is used to the electronic component being electrically connected to pass to master
Plate.
2. the preparation method of housing according to claim 1, it is characterised in that described to arrange at least one on the housing
Individual electric conduction routing layer, including：
Target area coating conductive silver paste on the housing, the target area is electric conduction routing to be produced on the housing
The region of layer；
The conductive silver paste of coating is repaired by planographic technique PDS, at least one described electric conduction routing layer is obtained.
3. the preparation method of housing according to claim 2, it is characterised in that after the injection moulding housing, in institute
State before the target area coating conductive silver paste on housing, also include：
The first insulating barrier is molded on the housing；
When target area on the housing applies conductive silver paste, the conductive silver paste is coated in first insulating barrier
In region corresponding with the target area.
4. the preparation method of housing according to claim 2, it is characterised in that described at least one described conduction that obtains is walked
After line layer, also include：
The second insulating barrier is molded on electric conduction routing layer.
5. the preparation method of housing according to claim 1, it is characterised in that the electronic component is metal clips.
6. the preparation method of housing according to claim 1, it is characterised in that the electric conduction routing layer on the housing
Corresponded with the pad.
7. a kind of housing, it is characterised in that including：At least one electric conduction routing layer and at least one pad；
The pad is printed on the predetermined position of the housing, and the pad is used for welding electronic component；
The electric conduction routing layer is used to the electronic component being electrically connected to pass to mainboard.
8. housing according to claim 7, it is characterised in that be provided with first between the electric conduction routing layer and the housing
Insulating barrier, the electric conduction routing layer is provided with the second insulating barrier.
9. housing according to claim 8, it is characterised in that the size of the electric conduction routing layer is less than the described first insulation
The size of layer, and less than the size of second insulating barrier.
10. a kind of terminal device, it is characterised in that including：Housing any one of claim 7 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710241000.4A CN106954356A (en) | 2017-04-13 | 2017-04-13 | A kind of preparation method of housing, housing and terminal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710241000.4A CN106954356A (en) | 2017-04-13 | 2017-04-13 | A kind of preparation method of housing, housing and terminal device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106954356A true CN106954356A (en) | 2017-07-14 |
Family
ID=59476064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710241000.4A Pending CN106954356A (en) | 2017-04-13 | 2017-04-13 | A kind of preparation method of housing, housing and terminal device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106954356A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107369900A (en) * | 2017-07-31 | 2017-11-21 | 广东欧珀移动通信有限公司 | Antenna module and electronic equipment |
| CN108989511A (en) * | 2018-09-25 | 2018-12-11 | 苏州昀冢电子科技有限公司 | A kind of pedestal and voice coil motor with electronic component |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013059015A (en) * | 2011-08-12 | 2013-03-28 | Sharp Corp | Structure and manufacturing method of the same |
| CN106358402A (en) * | 2016-10-14 | 2017-01-25 | 上海摩软通讯技术有限公司 | Shell and manufacturing method thereof and terminal device |
-
2017
- 2017-04-13 CN CN201710241000.4A patent/CN106954356A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013059015A (en) * | 2011-08-12 | 2013-03-28 | Sharp Corp | Structure and manufacturing method of the same |
| CN106358402A (en) * | 2016-10-14 | 2017-01-25 | 上海摩软通讯技术有限公司 | Shell and manufacturing method thereof and terminal device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107369900A (en) * | 2017-07-31 | 2017-11-21 | 广东欧珀移动通信有限公司 | Antenna module and electronic equipment |
| CN107369900B (en) * | 2017-07-31 | 2023-09-05 | Oppo广东移动通信有限公司 | Antenna assembly and electronic equipment |
| CN108989511A (en) * | 2018-09-25 | 2018-12-11 | 苏州昀冢电子科技有限公司 | A kind of pedestal and voice coil motor with electronic component |
| CN108989511B (en) * | 2018-09-25 | 2023-05-12 | 苏州昀冢电子科技股份有限公司 | Base with electronic element and voice coil motor |
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Application publication date: 20170714 |