CN201204755Y - Multi-layer board type printed circuit board capable of ensuring power tube to earth well - Google Patents
Multi-layer board type printed circuit board capable of ensuring power tube to earth well Download PDFInfo
- Publication number
- CN201204755Y CN201204755Y CNU200820063772XU CN200820063772U CN201204755Y CN 201204755 Y CN201204755 Y CN 201204755Y CN U200820063772X U CNU200820063772X U CN U200820063772XU CN 200820063772 U CN200820063772 U CN 200820063772U CN 201204755 Y CN201204755 Y CN 201204755Y
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- printed circuit
- circuit board
- pcb
- power tube
- conductive metal
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Abstract
A multi-layer board type printed circuit board for good earth of power amplifier tube is equipped with conductive metal layers in mutual separation mode and power amplifier tube installation grooves in the mode of going through each structure layer. At least a conductive structure is connected between the conductive metal layers and the bottom metal layers except the conductive metal layers matching with the micro-strip line on the multi-layer board type printed circuit board. The utility model effectively solves the problem that the horizontal plane of the present printed circuit board is not unified, reducing debugging difficulty and signal coupling with the horizontal plane and improving the output performance of power amplifier.
Description
Technical field
The utility model relates to a kind of improvement to multilayer template printed circuit board arrangement.
Background technology
Development along with mobile communication, require radio frequency power amplification modules integrated higher, volume is littler, so in the design of printed circuit board (PCB) (PCB), the multi-layer sheet with the conductive metal layer form that is provided with in mutual separation mode more and more is applied in the power amplifier design.In the PCB of this multi-layer sheet form, be set at the coupling microstrip line that is opened in the power tube in the mounting groove on this multi-layer sheet and be usually located at the top layer (Top Layer layer) of PCB, the ground of microstrip line generally is positioned at the adjacent with it PCB second layer (representing for 1 layer with Midlayer usually).During use, this PCB generally is installed on the metal substrate, the direct and substrate contacts of the bottom of PCB (Bottom Layer), and power tube also is fixed on the metal substrate by the mode of screw or welding.The problem that this PCB that relates at present and use exists is, the source electrode of power tube all directly is connected with metal substrate with the bottom of PCB, the ground of microstrip line but (Midlayer1 layer) but is not connected with metal substrate simultaneously nearby, shown in Fig. 1 (a) and Fig. 1 (b).Just brought the skimble-scamble problem of power amplifier ground level thus, the matching and debugging difficulty, the coupling of ground level signal is serious, even the situation of its characteristic property of power amplifier output performance substantial deviation occurs.
The utility model content
At above-mentioned situation, the utility model will provide a kind of multilayer template printed circuit board (PCB) that improves structure, to solve the above problems.
The utility model makes the multilayer template printed circuit board (PCB) of power tube good earth, be to be provided with on the multilayer template printed circuit board (PCB) of conductive metal layer in mutual separation mode at present, offer in the mode that connects each structure sheaf on the architecture basics of power tube mounting groove, in multilayer template printed circuit board (PCB),, be connected with conductive structure at conductive metal layer and bottom surface metal interlevel at least with little band ground coupling except that being used to mate the conductive metal layer of microstrip line.
In present PCB design, the conductive metal layer of said coupling microstrip line in the above-mentioned multilayer template of the utility model printed circuit board (PCB) can be designed to the surface metal structure sheaf of this multilayer template printed circuit board (PCB), promptly common TopLayer layer usually; The conductive metal layer on the little band ground of said coupling then can be another adjacent with it conductive metal structure layer, also is 1 layer of common Midlayer.
In the multilayer template printed circuit board (PCB) of utility model said structure form of the present invention, the said conductive metal layer and this conductive structure of bottom surface metal interlevel that is connected the little band ground of coupling at least, most convenient be that employing is arranged on the form of the side-walls of said power tube mounting groove with it.
Because each structure sheaf is compact to design in the multilayer template printed circuit board (PCB), thickness is limited, therefore in the structure of the above-mentioned multilayer template of the utility model printed circuit board (PCB), need make on the one hand between the conductive metal layer that wherein mates little band ground and said this conductive structure has enough big positive engagement position, must prevent again simultaneously because of the excessive easily generation in junction and TopLayer between short circuit.Test shows that the junction of the conductive metal layer on the little band of this coupling ground and conductive structure is a kind of preferable ideal style for 0.1～0.2 millimeter with the conductive metal layer layer thickness greater than the little band of this coupling ground in the multilayer template printed circuit board (PCB).
On the other hand, for unlikely coupling to this coupling microstrip line and power tube itself in the multilayer template printed circuit board (PCB) has bigger influence, being used to mate the insulation spacing between the installation wall of the ora terminalis of power amplifier side of conductive metal layer of this microstrip line and said power tube mounting groove in the above-mentioned multilayer template of the utility model printed circuit board (PCB), is good to adopt the mode less than 0.2 millimeter.
This multilayer template printed circuit board (PCB) of the above-mentioned improvement structure of the utility model, because the bottom surface metal level of the source electrode of power tube, the ground of microstrip line (1 layer of Midlayer) and PCB can both directly be connected with metal substrate nearby simultaneously, thereby solved the skimble-scamble problem of ground level in the present similar printed circuit board (PCB) effectively, reduce the signal coupling between debugging difficulty and ground level, improved the output performance of power amplifier.
Below in conjunction with the embodiment of accompanying drawing illustrated embodiment, foregoing of the present utility model is described in further detail again.But this should be interpreted as that the scope of the above-mentioned theme of the utility model only limits to following example.Do not breaking away under the above-mentioned technological thought situation of the utility model, various replacements or change according to ordinary skill knowledge and customary means are made all should be included in the scope of the present utility model.
Description of drawings
Fig. 1 is the structure of the multi-layer sheet PCB of present design form, and (a) is the version of this PCB among the figure, (b) is its user mode when combining with power tube.
Fig. 2 is the structure of the utility model multi-layer sheet PCB, and (a) is the version of the utility model PCB among the figure, (b) is its user mode when combining with power tube.
Embodiment
Fig. 1 a and Fig. 1 b are respectively the typical structure of multi-layer sheet PCB of present design form and the user mode when combining with power tube thereof.Being provided with on the multilayer template printed circuit board (PCB) 10 of conductive metal layer 4, offer power tube mounting groove 1 in the mode that connects each structure sheaf in mutual separation mode.In each conductive metal layer, the coupling microstrip line 2 that is connected with power tube pin 9 is usually located at the top layer (Top Layer layer) of PCB, and the ground 3 of microstrip line generally is positioned at the adjacent with it PCB second layer (representing for 1 layer with Midlayer usually).During use, this printed circuit board (PCB) 10 generally is installed on the metal substrate 7, its bottom 5 (Bottom Layer) directly contacts with metal substrate 7, and power tube also is fixed on the metal substrate 7 by the mode of screw or welding, thereby its source electrode 8 also directly contacts with metal substrate 7.In its structure, because the source electrode 8 of power tube and the bottom 5 of PCB all directly are connected with metal substrate 7, the ground of microstrip line but (1 layer of Midlayer) 3 but is not connected with metal substrate simultaneously nearby, the disunity that has caused the power amplifier ground level, the matching and debugging difficulty, the coupling of ground level signal is serious, even the situation of its characteristic property of power amplifier output performance substantial deviation occurs.
Fig. 2 a and Fig. 2 b are respectively the version of the utility model multilayer template PCB of making the power tube good earth and the user mode when combining with power tube thereof.Be provided with in mutual separation mode on the multilayer template printed circuit board (PCB) 10 of conductive metal layer 4, offer power tube mounting groove 1 in the mode that connects each structure sheaf equally, wherein in this multilayer template printed circuit board (PCB) 10, its topsheet surface is the conductive metal layer 2 of the coupling microstrip line that is connected with power tube pin 9, another adjacent with it conductive metal structure layer 3 is little band ground, between the conductive metal layer 3 and this multilayer template printed circuit board (PCB) 10 bottom surface metal levels 5 on little band ground, be provided with along the side-walls of this power tube mounting groove 1 and make its interconnective conductive structure 6.Wherein, the junction of the conductive metal layer 3 on this little band ground of coupling and conductive structure 6 is greater than 0.1～0.2 millimeter of conductive metal layer 3 layer thickness on the little band of this coupling ground; Mate insulation spacing between the installation wall of the ora terminalis of power amplifier side of conductive metal layer 2 of this microstrip line and power tube mounting groove 1 less than 0.2 millimeter.
During use, this multilayer template printed circuit board (PCB) 10 is installed on the metal substrate 7 equally, its bottom surface metal level 5 directly contacts with metal substrate 7, and power tube also is fixed on the metal substrate 7 by the mode of screw or welding, and its source electrode 8 promptly also directly contacts with metal substrate 7.Because in its structure, the conductive metal layer 3 on the bottom surface metal level 5 of the source electrode 8 of power tube, multilayer template printed circuit board (PCB) 10 and little band ground can both directly be connected nearby with metal substrate 7, thereby solved the skimble-scamble problem of ground level in the present similar printed circuit board (PCB) effectively, reduce the signal coupling between debugging difficulty and ground level, improved the output performance of power amplifier.
In the practical set power tube, adopt welding manner, the flange of power tube directly is welded on to be provided with along the side-walls of this power tube mounting groove 1 makes on its interconnective conductive structure 6, the ground connection effect of power tube can be better.
Claims (5)
1. make the multilayer template printed circuit board (PCB) of power tube good earth, be provided with in mutual separation mode on the multilayer template printed circuit board (PCB) (10) of conductive metal layer (4), offer power tube mounting groove (1) in the mode that connects each structure sheaf, it is characterized in that in multilayer template printed circuit board (PCB) (10) except that the conductive metal layer that is used to mate microstrip line (2), at least and the conductive metal layer (3) of little band ground coupling and bottom surface metal level (5) between be connected with conductive structure (6).
2. the multilayer template printed circuit board (PCB) that makes the power tube good earth as claimed in claim 1, the conductive metal layer (2) that it is characterized in that said coupling microstrip line is the surface metal structure sheaf of multilayer template printed circuit board (PCB) (10), and the conductive metal layer (3) on the little band of said coupling ground is another adjacent with it conductive metal structure layer.
3. the multilayer template printed circuit board (PCB) that makes the power tube good earth as claimed in claim 1 is characterized in that the said conductive metal layer (3) on the little band of coupling ground and the side-walls that this conductive structure (6) between bottom surface metal level (5) is set at said power tube mounting groove (1) of being connected at least.
4. as the described multilayer template printed circuit board (PCB) that makes the power tube good earth of one of claim 1 to 3, the conductive metal layer (3) that it is characterized in that the little band of this coupling ground in the said multilayer template printed circuit board (PCB) (10) and the junction of conductive structure (6) are greater than 0.1～0.2 millimeter of conductive metal layer (3) layer thickness on the little band of this coupling ground.
5. as the described multilayer template printed circuit board (PCB) that makes the power tube good earth of one of claim 1 to 3, it is characterized in that being used to mate in the said multilayer template printed circuit board (PCB) (10) insulation spacing between the installation wall of the ora terminalis of power amplifier side of conductive metal layer (2) of this microstrip line and said power tube mounting groove (1) less than 0.2 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820063772XU CN201204755Y (en) | 2008-06-12 | 2008-06-12 | Multi-layer board type printed circuit board capable of ensuring power tube to earth well |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820063772XU CN201204755Y (en) | 2008-06-12 | 2008-06-12 | Multi-layer board type printed circuit board capable of ensuring power tube to earth well |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201204755Y true CN201204755Y (en) | 2009-03-04 |
Family
ID=40427068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU200820063772XU Expired - Fee Related CN201204755Y (en) | 2008-06-12 | 2008-06-12 | Multi-layer board type printed circuit board capable of ensuring power tube to earth well |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201204755Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103517557A (en) * | 2012-06-19 | 2014-01-15 | 深南电路有限公司 | Method for processing groove on printed circuit board, printed circuit board and electronic device |
-
2008
- 2008-06-12 CN CNU200820063772XU patent/CN201204755Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103517557A (en) * | 2012-06-19 | 2014-01-15 | 深南电路有限公司 | Method for processing groove on printed circuit board, printed circuit board and electronic device |
| CN103517557B (en) * | 2012-06-19 | 2016-08-03 | 深南电路有限公司 | Process the method for groove and printed circuit board (PCB) and electronic equipment on a printed circuit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: CHENGDU NTS TECHNOLOGY CO., LTD. Free format text: FORMER NAME: NTS TECHNOLOGY (CHENGDU) CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 610041, Sichuan high tech Zone, Chengdu Tianfu Road, South extension line, high-tech incubator Park, building 3, 6 Patentee after: Chengdu NTS Technology Co., Ltd. Address before: 610041, Chengdu high tech Zone in Sichuan province Tianfu Avenue South extension line, high-tech incubator Garden 6, building 3 Patentee before: NTS Technology (Chengdu) Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090304 Termination date: 20140612 |