CN203851101U - Small high-power microwave amplification module based on strip line mode - Google Patents
Small high-power microwave amplification module based on strip line mode Download PDFInfo
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- CN203851101U CN203851101U CN201420205193.XU CN201420205193U CN203851101U CN 203851101 U CN203851101 U CN 203851101U CN 201420205193 U CN201420205193 U CN 201420205193U CN 203851101 U CN203851101 U CN 203851101U
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Abstract
The utility model discloses a small high-power microwave amplification module based on a strip line mode. The small high-power microwave amplification module comprises a substrate (1), a power transistor (2), a bottom plate A (3) on which an input matching circuit is printed, a bottom plate B (4) on which an output matching circuit is printed, a cover plate A (5) and a cover plate B (6), wherein the input matching circuit is composed of an input impedance matching unit (31) and an input switching unit (32), and the output matching circuit is composed of an output switching unit (42) and an output impedance matching unit (41). The cover plate A (5) covers the input impedance matching unit (31) in a pressing mode and is connected with the bottom plate A (3) in a fastening mode to form a strip line circuit, and the cover plate B (6) covers the output impedance matching unit (41) in a pressing mode and is connected with the bottom plate B (4) in a fastening mode to form a strip line circuit. According to the small high-power microwave amplification module, the impedance matching units of the power transistor are sealed through strip lines, electromagnetic compatibility of the high-power microwave amplification module is improved in the aspect of electrical performance, spatial arrangement is effectively utilized in the aspect of structural design, and the size is reduced.
Description
Technical field
The utility model relates to a kind of HIGH-POWERED MICROWAVES amplification module, particularly relates to the small-sized high-power microwave amplification module based on strip line mode that a kind of Electro Magnetic Compatibility is strong, volume is little.
Background technology
Microwave amplification module is one of very important module in short-wave communication tedhnology, and it is the key modules that in reflector, afterbody provides gain and power output.It not only plays an important role in modern radio communication, and also plays central role in dual-use equipment.Along with the development of semiconductor technology, HIGH-POWERED MICROWAVES amplification module mainly adopts microstrip line mode to realize at present, and microstrip line is made up of conductor belt, one-sided dielectric layer and ground plate, and the Electric Field Distribution producing when its work is symmetrical and asymmetric up and down.As shown in Figure 1, in the time that reality is used, one side of one-sided dielectric layer 10 is connected with floor 9, the upper surface of opposite side is provided with operating circuit plate, because the mode of operation of microstrip line is " accurate TEM " ripple, there is effect of dispersion, interference-free for ensureing electromagnetic normal transmission, microstrip line circuit must ensure that air side has enough large free space 11, for the disturbance to electric field in circuit of the wall that can effectively avoid shielding box, the distance of free space 11 should be more than 10h (h is one-sided thickness of dielectric layers), and because of electromagnetic transmission, free space 11 is disabled, the utilization in the above space of 10h is also very difficult, so be unfavorable for realizing the design of HIGH-POWERED MICROWAVES amplification module miniaturization, simultaneously because its structure is open, thereby cause electromagnetic radiation large, the problems such as Electro Magnetic Compatibility is poor, adopt the microwave amplification module of microstrip line mode can only planar development, thereby cause space availability ratio low.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, provide a kind of strip line that utilizes to seal the impedance matching circuit of power transistor, and the direct small-sized high-power microwave amplification module based on strip line mode that the necessary feed circuit of HIGH-POWERED MICROWAVES amplification module is installed on strip line cover plate, thereby solve the large problem of HIGH-POWERED MICROWAVES amplification module electromagnetic radiation, improve the Electro Magnetic Compatibility of HIGH-POWERED MICROWAVES amplification module; The necessary feed circuit of HIGH-POWERED MICROWAVES amplification module is directly installed on strip line cover plate, is arranged thereby form solid space, improve space availability ratio, realize the more Miniaturization Design of HIGH-POWERED MICROWAVES amplification module.
The purpose of this utility model is achieved through the following technical solutions: the small-sized high-power microwave amplification module based on strip line mode, it comprise establish reeded substrate, be installed on power transistor in groove, be printed with input matching circuit form by input impedance matching unit and input adapter unit base plate A, be printed with by base plate B, the cover plate A, cover plate B, feed circuit A and the feed circuit B that export the output matching circuit that adapter unit and output impedance matching unit form, base plate A and base plate B are fixedly mounted on substrate; Cover plate A lid is pressed on input impedance matching unit and with base plate A and is fastenedly connected formation strip-line circuit, and cover plate B lid is pressed on output impedance matching unit and with base plate B and is fastenedly connected formation strip-line circuit; Input matching circuit is electrically connected with the input of power transistor, and output matching circuit is electrically connected with the output of power transistor; Feed circuit A is arranged on the upper surface of cover plate A and is electrically connected with input matching circuit, and feed circuit B is arranged on the upper surface of cover plate B and is electrically connected with output matching circuit.
Described input matching circuit is printed on the upper surface of base plate A or the lower surface of cover plate A, forms strip-line circuit by base plate A and cover plate A.
Described output matching circuit is printed on the upper surface of base plate B or the lower surface of cover plate B, forms strip-line circuit by base plate B and cover plate B.
Described feed circuit A and feed circuit B are printed on respectively the upper surface of cover plate, and feed circuit A is printed on the upper surface of cover plate A; Feed circuit B is printed on the upper surface of cover plate B.
Described feed circuit A is printed on independently on printed circuit board, forms feed circuit plate A, and feed circuit plate A is arranged on the upper surface of cover plate A, and is electrically connected with input matching circuit; Described feed circuit B is printed on independently on printed circuit board, forms feed circuit plate B, and feed circuit plate B is arranged on the upper surface of cover plate B, and is electrically connected with output matching circuit.
Compared with prior art, the utlity model has following beneficial effect:
1) the utility model adopts strip line mode to seal input matching circuit and output matching circuit, because strip line is made up of both sides ground plate, media of both sides layer and conductor belt, the Electric Field Distribution producing in its course of work is all symmetrical up and down, does not have effect of dispersion; Hermetically-sealed construction has solved the problem of HIGH-POWERED MICROWAVES amplification module electromagnetic leakage effectively, and then has strengthened the Electro Magnetic Compatibility of HIGH-POWERED MICROWAVES amplification module, has improved the stability of HIGH-POWERED MICROWAVES amplification module;
2) because all there is ground plate the both sides of strip line, on strip line cover plate, the necessary feed circuit of HIGH-POWERED MICROWAVES amplification module can be directly installed, thereby forming solid space arranges, and then improve space availability ratio, realize the more Miniaturization Design of HIGH-POWERED MICROWAVES amplification module, overcome microstrip circuit and in the time that reality is used, must reserve larger height free space, caused the low problem of utilance of solid space;
3) feed circuit is directly printed on cover plate upper surface, thereby has reduced the quantity of circuit board, thereby further reduced the volume of HIGH-POWERED MICROWAVES amplifying circuit module.
Brief description of the drawings
Fig. 1 is microstrip line schematic diagram;
Fig. 2 is structural representation of the present utility model;
Fig. 3 is strip-line circuit structural representation A of the present utility model;
Fig. 4 is strip-line circuit structural representation B of the present utility model;
Fig. 5 is object construction schematic diagram of the present utility model;
Fig. 6 is integrated circuit schematic diagram of the present utility model;
In figure, 1-substrate, 2-power transistor, 3-base plate A, 4-base plate B, 5-cover plate A, 6-cover plate B, 7-feed circuit plate A, 8-feed circuit plate B, 9-ground wire, 10-dielectric layer, 11-free space, 12-capacitance, 31-input impedance matching unit, 32-inputs adapter unit, and pad is drawn in 33-input, 41-output impedance matching unit, 42-exports adapter unit, and pad is drawn in 43-output.
Embodiment
Below in conjunction with accompanying drawing, the technical solution of the utility model is described in further detail, but protection range of the present utility model is not limited to the following stated.
As shown in Figure 2, small-sized high-power microwave amplification module based on strip line mode, it comprise establish reeded substrate 1, be installed on power transistor 2 in groove, be printed with the input matching circuit being formed by input impedance matching unit 31 and input adapter unit 32 base plate A3, be printed with base plate B4, cover plate A5, cover plate B6, feed circuit A and the feed circuit B of the output matching circuit being formed by output adapter unit 42 and output impedance matching unit 41, base plate A3 and base plate B4 are fixedly mounted on substrate 1; Cover plate A5 lid is pressed on input impedance matching unit 31 and with base plate A3 and is fastenedly connected formation strip-line circuit, and cover plate B6 lid is pressed on output impedance matching unit 41 and with base plate B4 and is fastenedly connected formation strip-line circuit; Input matching circuit is electrically connected with the input of power transistor 2, and output matching circuit is electrically connected with the output of power transistor 2; Feed circuit A is arranged on the upper surface of cover plate A5 and is electrically connected with input matching circuit, and feed circuit B is arranged on the upper surface of cover plate B6 and is electrically connected with output matching circuit.
Preferably, described input matching circuit is printed on the upper surface of base plate A3 or the lower surface of cover plate A5, forms strip-line circuit by base plate A3 and cover plate A5.
Preferably, described output matching circuit is printed on the upper surface of base plate B4 or the lower surface of cover plate B6, forms strip-line circuit by base plate B4 and cover plate B6.
Preferably, described feed circuit A and feed circuit B are printed on respectively the upper surface of cover plate, and feed circuit A is printed on the upper surface of cover plate A5; Feed circuit B is printed on the upper surface of cover plate B6.
Preferably, described feed circuit A is printed on independently on printed circuit board, forms feed circuit plate A7, and feed circuit plate A7 is arranged on the upper surface of cover plate A5, and is electrically connected with input matching circuit; Described feed circuit B is printed on independently on printed circuit board, forms feed circuit plate B8, and feed circuit plate B8 is arranged on the upper surface of cover plate B6, and is electrically connected with output matching circuit.
As shown in Figure 3, on base plate A3, be printed with the input matching circuit being formed by input impedance matching unit 31 and input adapter unit 32, cover plate A5 lid is pressed on input impedance matching unit 31 and by screw A and base plate A3 and is fastenedly connected, form strip-line circuit, make the impedance of input matching circuit lower, wavelength is shorter, is more conducive to carry out impedance matching, conversion with power transistor 2; Input adapter unit 32 adopts microstrip line circuit, and impedance matching transfers microstrip line to high value, utilizes the wider feature of live width under microstrip line pattern, takes into account device and install when guaranteeing power delivery, kills two birds with one stone; For convenience of being connected of power feed circuit and radio circuit, rationally micro-band mode and strip line mode are combined, input impedance matching unit 31 is provided with input and draws pad 33, be convenient to install inductance or lead resistance and carry out feed, after input adapter unit 32, be converted to micro-band interface, conveniently weld capacitance 12 and carry out intermodule cascade etc.; For ensureing the small size of whole module, the implementation that pad 33 is drawn in input is at cover plate A5 correspondence position gap; Input matching circuit is connected with feed circuit A by inductance or lead resistance, described feed circuit A comprises pulse modulated circuit and temperature-compensation circuit, pulse debug circuit and temperature-compensation circuit can directly be printed on the upper surface of cover plate A5, also can make printed circuit board independently and be arranged on the upper surface of cover plate A5, thereby formation stereoeffect, improve the utilance of solid space, realized the more HIGH-POWERED MICROWAVES amplification module of miniaturization.
As shown in Figure 4, on base plate B4, be printed with the output matching circuit that output adapter unit 42 and output impedance matching unit 41 form, cover plate B6 lid is pressed in output impedance matching unit 41 and is fastenedly connected by screw B and base plate B4, form strip-line circuit, make the impedance of output matching circuit lower, wavelength is shorter, is more conducive to carry out impedance matching, conversion with power transistor; Output adapter unit 42 adopts microstrip line circuit, and impedance matching transfers microstrip line to high value, utilizes the wider feature of live width under microstrip line pattern, takes into account device and install when guaranteeing power delivery, kills two birds with one stone; For convenience of being connected of power feed circuit and radio circuit, rationally micro-band mode and strip line mode are combined, output impedance matching unit 41 is provided with output and draws pad 43, be convenient to install inductance or lead resistance and carry out feed, after being matched to output adapter unit 42, be converted to micro-band interface, conveniently weld capacitance 12 and carry out intermodule cascade etc.; For ensureing the small size of whole module, the implementation that pad 43 is drawn in output is at cover plate B6 correspondence position gap; Input matching circuit is connected with feed circuit B by inductance or lead resistance, described feed circuit B comprises drain electrode accumulator and filter circuit, drain electrode accumulator and filter circuit can directly be printed on the upper surface of cover plate A5, also can make printed circuit board independently and be arranged on the upper surface of cover plate B6, thereby formation stereoeffect, improve the utilance of solid space, realized the more HIGH-POWERED MICROWAVES amplification module of miniaturization.
As shown in Figure 5, power transistor 2, base plate A3 and base plate B4 can be fixedly connected with substrate 1 by Reflow Soldering, also can be fixedly connected with substrate 1 by screw C, cover plate A5 and cover plate B6 are covered respectively and are pressed on base plate A3 and base plate B4 by screw A and screw B, feed circuit A and feed circuit B are directly installed on respectively the upper surface of cover plate A5 and cover plate B6, thereby formation stereoeffect, improve the utilization rate of solid space, reduce the volume of HIGH-POWERED MICROWAVES amplification module, realized the more miniaturization of HIGH-POWERED MICROWAVES amplification module.
In order to further illustrate the beneficial effect of the technical program, describe by following emulation, experiment:
The utility model has ensured the good electrical property of HIGH-POWERED MICROWAVES amplification module in having realized miniaturization, the HIGH-POWERED MICROWAVES amplification module that adopts the technical solution of the utility model design has been carried out to emulation, suppose that the parameter of power transistor that emulation uses is as shown in table 1
Table 1L wave band power transistor major parameter table
| Sequence number | Project | Parameter | Unit | Remarks |
| 1 | Working frequency range f | L-band | ? | Bandwidth 200MHz |
| 2 | Power output PL | 250W | W | ? |
| 3 | Gain G p | 17 | dB | ? |
| 4 | Efficiency | 55％ | ? | ? |
Complete circuit of the present utility model as shown in Figure 6.
For wherein crucial input matching circuit, output matching circuit simulation result as shown in table 2, table 3:
The affect comparison sheet of pad on input matching circuit drawn in the input of table 2 different conditions
The affect comparison sheet of pad on output matching circuit drawn in the output of table 3 different conditions
As above shown in table 2, table 3, in the match circuit of the technical program, draw pad relatively with use location about in the situation of skew ± 0.25mm, the deterioration of transmission characteristic S11 is less than 1dB (the most not good enough), the about 0.02dB of deterioration (the most not good enough) of reflection characteristic S21; And under same situation, length of lead-out wire, the state variation that change width ± 0.1mm is corresponding are less.Variable quantity in emulation is all far longer than the various error control abilities in the application of current engineering, thus draw pad different conditions on the impact of circuit completely in engineering application tolerance interval.
Adopt the technical program and adopt stripline technique scheme to carry out respectively the design of HIGH-POWERED MICROWAVES amplification module, the parameter of power transistor of supposing use is as shown in table 1, and wherein the dielectric constant of strip line and microstrip line is 10.2, thickness of dielectric layers is 1mm, conductive strips thickness is 0.035mm.Further the performance that adopts the technical solution of the utility model and adopt microstrip line mode technical scheme to carry out the design of HIGH-POWERED MICROWAVES amplification module is tested, its test data is as shown in table 4 and table 5:
The small-sized high-power microwave amplification module performance test data table of table 4 based on strip line mode
Table 5 microstrip line HIGH-POWERED MICROWAVES amplification module performance test data table
Note: in table, FL is 1.2GHz; FM is 1.3GHz; FH is 1.4GHz
Can be obtained by table 4 and table 5, adopt the designed HIGH-POWERED MICROWAVES amplification module of the technical solution of the utility model to realize the performance of device, and in power output, efficiency, be better than the HIGH-POWERED MICROWAVES amplification module that adopts microstrip line mode designed.Therefore, the utility model has ensured the good electrical performance indexes of HIGH-POWERED MICROWAVES amplification module in having realized miniaturization.
Test data to both volumes is as follows, and the volume of the HIGH-POWERED MICROWAVES amplification module that employing the technical program is designed is: 69mm × 22mm × 22mm; The volume of the HIGH-POWERED MICROWAVES amplification module that employing microstrip line mode is designed is: 95mm × 50mm × 29mm; Adopt the technical solution of the utility model design HIGH-POWERED MICROWAVES amplification module area only microstrip line mode 31%, shared volume is less than 25% of microstrip line mode.
Therefore, the utility model ensured simultaneously HIGH-POWERED MICROWAVES amplification module miniaturization and good electrical performance indexes.
Claims (5)
1. the small-sized high-power microwave amplification module based on strip line mode, it is characterized in that: it comprises establishes reeded substrate (1), be installed on the power transistor (2) in groove, be printed with the base plate A(3 of the input matching circuit being formed by input impedance matching unit (31) and input adapter unit (32)), be printed with the base plate B(4 of the output matching circuit being formed by output adapter unit (42) and output impedance matching unit (41)), cover plate A(5), cover plate B(6), feed circuit A and feed circuit B, base plate A(3) and base plate B(4) be fixedly mounted on substrate (1), cover plate A(5) lid be pressed in input impedance matching unit (31) upper and with base plate A(3) be fastenedly connected formation strip-line circuit, cover plate B(6) and lid be pressed in output impedance matching unit (41) upper and with base plate B(4) be fastenedly connected formation strip-line circuit, input matching circuit is electrically connected with the input of power transistor (2), and output matching circuit is electrically connected with the output of power transistor (2), feed circuit A is arranged on cover plate A(5) upper surface and be electrically connected with input matching circuit, feed circuit B is arranged on cover plate B(6) upper surface and be electrically connected with output matching circuit.
2. the small-sized high-power microwave amplification module based on strip line mode according to claim 1, it is characterized in that: described input matching circuit is printed on base plate A(3) upper surface or cover plate A(5) lower surface, by base plate A(3) and cover plate A(5) form strip-line circuit.
3. the small-sized high-power microwave amplification module based on strip line mode according to claim 1, it is characterized in that: described output matching circuit is printed on base plate B(4) upper surface or cover plate B(6) lower surface, by base plate B(4) and cover plate B(6) form strip-line circuit.
4. the small-sized high-power microwave amplification module based on strip line mode according to claim 1, is characterized in that: described feed circuit A and feed circuit B are printed on respectively the upper surface of cover plate, and feed circuit A is printed on cover plate A(5) upper surface; Feed circuit B is printed on cover plate B(6) upper surface.
5. the small-sized high-power microwave amplification module based on strip line mode according to claim 1, it is characterized in that: described feed circuit A is printed on independently on printed circuit board, form feed circuit plate A(7), feed circuit plate A(7) be arranged on cover plate A(5) upper surface, and be electrically connected with input matching circuit; Described feed circuit B is printed on independently on printed circuit board, forms feed circuit plate B(8), feed circuit plate B(8) be arranged on cover plate B(6) and upper surface, and be electrically connected with output matching circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420205193.XU CN203851101U (en) | 2014-04-24 | 2014-04-24 | Small high-power microwave amplification module based on strip line mode |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420205193.XU CN203851101U (en) | 2014-04-24 | 2014-04-24 | Small high-power microwave amplification module based on strip line mode |
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| CN203851101U true CN203851101U (en) | 2014-09-24 |
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| CN201420205193.XU Expired - Fee Related CN203851101U (en) | 2014-04-24 | 2014-04-24 | Small high-power microwave amplification module based on strip line mode |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103929132A (en) * | 2014-04-24 | 2014-07-16 | 成都锦江电子系统工程有限公司 | Small high-power microwave amplification module based on strip line mode |
| CN105338731A (en) * | 2015-12-02 | 2016-02-17 | 成都锦江电子系统工程有限公司 | Small strip-shaped linear power amplification module |
-
2014
- 2014-04-24 CN CN201420205193.XU patent/CN203851101U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103929132A (en) * | 2014-04-24 | 2014-07-16 | 成都锦江电子系统工程有限公司 | Small high-power microwave amplification module based on strip line mode |
| CN103929132B (en) * | 2014-04-24 | 2016-12-07 | 成都锦江电子系统工程有限公司 | Small-sized high-power microwave amplification module based on strip line mode |
| CN105338731A (en) * | 2015-12-02 | 2016-02-17 | 成都锦江电子系统工程有限公司 | Small strip-shaped linear power amplification module |
| CN105338731B (en) * | 2015-12-02 | 2018-05-22 | 成都锦江电子系统工程有限公司 | A kind of miniaturization strip line power amplifier module |
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| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140924 Termination date: 20170424 |
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| CF01 | Termination of patent right due to non-payment of annual fee |