CN105338731B - A kind of miniaturization strip line power amplifier module - Google Patents
A kind of miniaturization strip line power amplifier module Download PDFInfo
- Publication number
- CN105338731B CN105338731B CN201510872788.XA CN201510872788A CN105338731B CN 105338731 B CN105338731 B CN 105338731B CN 201510872788 A CN201510872788 A CN 201510872788A CN 105338731 B CN105338731 B CN 105338731B
- Authority
- CN
- China
- Prior art keywords
- printed board
- circuit
- matching circuit
- feed circuit
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0227—Split or nearly split shielding or ground planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microwave Amplifiers (AREA)
Abstract
The present invention relates to a kind of miniaturization strip line power amplifier modules, it includes substrate（1）, power transistor（2）, printed board A（3）, printed board B（4）, printed board C（5）, printed board D（6）, feed circuit A and feed circuit B.Printed board C（5）With printed board A（3）Form input matching circuit, printed board D（6）With printed board B（4）Form output matching circuit, input matching circuit and output matching circuit are and power transistor（2）Connection, feed circuit A and feed circuit B are connected respectively with input matching circuit and output matching circuit, and layer covered with gold leaf is respectively arranged on the side of printed board and faying face（7）And copper clad layers（8）.Strip-line circuit commonly is realized by the structure covered with gold leaf for covering copper and printed board side of printed board faying face in the present invention, not only saves process, additionally provides preferably effect altogether, is more advantageous to high-power, the high-frequency operation of power amplifier module.
Description
Technical field
The present invention relates to power amplifier module technical field, particularly a kind of miniaturization strip line power amplifier module.
Background technology
Power amplifier module not only plays an important role in modern wireless telecommunications, and in dual-use equipment
In occupation of critical role.With the continuous development of semiconductor technology, power amplifier module is mainly real using microstrip line mode at present
Existing, the method that strip-line circuit generally use copper sheet coats in engineering manufacturing process ensures that upper strata printed board is printed with lower floor
Plate commonly.But the processing step of copper sheet cladding is very cumbersome, and manufacture is of high cost, and time-consuming in operation, is easily damaged, unfavorable
In debugging, and it is not easy to realize at high frequencies.
The content of the invention
The shortcomings that it is an object of the invention to overcome the prior art, providing one kind can effectively save production cost, raising life
Produce the miniaturization strip line power amplifier module of efficiency.Side gold filled structure is used in the miniaturization strip line power amplifier module
Printed board form strip-line circuit, copper and printing are covered by printed board faying face commonly in strip-line circuit upper strata and lower floor
The side gold filled structure of plate realizes that the method compared to copper sheet cladding not only saves process, additionally provides preferably altogether
Effect is more advantageous to high-power, the high-frequency operation of power amplifier module.
The purpose of the present invention is achieved through the following technical solutions：A kind of miniaturization strip line power amplifier module, it is wrapped
Include set reeded substrate, the power transistor being installed in groove, printed board A, printed board B, printed board C, printed board D,
Feed circuit A and feed circuit B, printed board A and printed board B are mounted on substrate, printed board C be pressed against on printed board A and with
Printed board A forms the input matching circuit of power amplifier, and printed board D is pressed against on printed board B and forms power with printed board B
The output matching circuit of amplifier, input matching circuit are electrically connected with the input terminal of power transistor, output matching circuit and work(
The output terminal electrical connection of rate transistor, feed circuit A are electrically connected with input matching circuit, feed circuit B and output matching circuit
Electrical connection, feed circuit A and feed circuit B are used to implement amplifier tube feed sequencing and drain modulation.The printed board A, print
The side of making sheet B, printed board C and printed board D are both provided with layer covered with gold leaf, it is necessary to first be plated in printed board before manufacturing layer covered with gold leaf
One layer of nickel, the thickness for applying nickel plating are as far as possible small.The printed board A, printed board B, printed board C, the faying face of printed board D are respectively provided with
There are copper clad layers, the thickness of copper clad layers is at 15 ~ 20 μm.Printed board C and printed board D can make as needed to be structure as a whole or separates
It is fabricated separately, printed board C and printed board the D perforate at capacitance, for installing capacitance.
Preferably, the feed circuit A is arranged on the upper surface of printed board C and is electrically connected with input matching circuit, feedback
Circuit B is arranged on printed board D upper surfaces and is electrically connected with output matching circuit.At this point, printed board C and printed board D are fabricated to
Overall structure.
Preferably, it is additionally provided with metal cover board on the printed board C and printed board D.Metal cover board is used to compress up and down
Layer printed board, ensures the close contact of levels printed board.Metal cover board perforate at capacitance, for installing blocking electricity
Hold.
Preferably, metal cover board is provided on the printed board C and printed board D, is also set up on the metal cover board
There are printed board E, feed circuit A and feed circuit B to be arranged on printed board E, feed circuit A is electrically connected with input matching circuit
It connects, feed circuit B is electrically connected with output matching circuit.Printed board E is used to implement amplifier tube feed sequencing and drain modulation.
Preferably, to be additionally provided with printed board E, feed circuit A and feed circuit B on the printed board C and printed board D equal
It is arranged on printed board E, feed circuit A is electrically connected with input matching circuit, and feed circuit B is electrically connected with output matching circuit.
Printed board E is used to implement amplifier tube feed sequencing and drain modulation.
Preferably, the layer covered with gold leaf is arranged on three sides of printed board A, printed board B, printed board C and printed board D
On.The side adjacent with power transistor is without setting layer covered with gold leaf in printed board.
Preferably, set on the layer covered with gold leaf jagged.The size and location of notch is depending on process requirements.
In actual production, after all components are placed by more than position relationship, profit is screwed, printed board E with
Metal cover board can also be fixed together in advance, convenient for being dismounted during debugging.
The present invention has the following advantages：
1st, simplify production process, improve production efficiency, save production cost：Strip-line circuit upper strata printed board in the present invention
With being realized altogether by the side gold filled structure for covering copper and printed board of printed board faying face for lower floor's printed board, side gold filled
It is additional a kind of special process during PCB Production, does not influence the PCB Production cycle, and production cost is low, every
Hundreds of first cost of technology are only generated in one batch PCB Production.The structure realized altogether, a side are covered compared to traditional copper suitcase
Face eliminates the processing of copper sheet, saves the cost for making frock and makes the time needed for copper sheet；On the other hand, in power
In the assembling of amplification module, eliminate copper sheet cladding the step of, substantially reduce assembling and debugging needed for the time, save
Cost of labor.
2nd, power amplifier module capability and performance is more superior：The structure covered with gold leaf being directly made in printed board is coated compared to by hand
Copper sheet structure it is more stable and reliable, uniformity is more preferable, and covered with gold leaf has better inoxidizability and corrosion resistance than copper sheet.It is actual
Experiment and application also indicate that：The common ground effect that the levels printed board formed using gold filled is connected is more preferable, is more advantageous to power and puts
Big module is in long-term stable operation high-power, under high-frequency environment.Such as：Using S-band 200W power devices, using side
The power amplifier module that structure covered with gold leaf and copper sheet clad structure make, the gain measured at frequency 3.1GHz, power and efficiency
Index is satisfied by the test parameter requirement given by producer；And using measured by the power amplifier module of side gold filled structure fabrication
As a result it is better than the power amplifier module made of copper sheet clad structure.
Description of the drawings
Fig. 1 is the structure diagram in the specific embodiment of the invention 1；
Fig. 2 is the structure diagram in the specific embodiment of the invention 2；
Fig. 3 is the structure diagram in the specific embodiment of the invention 3；
Fig. 4 is the structure diagram in the specific embodiment of the invention 4；
Fig. 5 is the structure diagram covered with gold leaf of printed board A and printed board B in the present invention；
Fig. 6 is the structure covered with gold leaf of printed board C and printed board D in the specific embodiment of the invention 1 and specific embodiment 2
Schematic diagram；
Fig. 7 is the structure covered with gold leaf of printed board C and printed board D in the specific embodiment of the invention 3 and specific embodiment 4
Schematic diagram；
In figure：1- substrates, 2- power transistors, 3- printed boards A, 4- printed board B, 5- printed board C, 6- printed board D, 7- bag
Layer gold, 8- copper clad layers, 9- metal cover boards, 10- printed boards E, 11- notch.
Specific embodiment
The present invention will be further described below in conjunction with the accompanying drawings, but protection scope of the present invention is not limited to following institute
It states.
Specific embodiment 1
As shown in Fig. 1, Fig. 5 and Fig. 6, a kind of miniaturization strip line power amplifier module, it includes setting reeded base
Plate 1, the power transistor 2 being installed in groove, printed board A3, printed board B4, printed board C5, printed board D6, feed circuit A and
Feed circuit B.
Printed board A3 and printed board B4 installation on substrate 1, printed board C5 be pressed against on printed board A3 and with printed board A3
Form the input matching circuit of power amplifier；Printed board D6 is pressed against on printed board B4 and forms power amplification with printed board B4
The output matching circuit of device；Input matching circuit is electrically connected with the input terminal of power transistor 2, and output matching circuit is brilliant with power
The output terminal electrical connection of body pipe 2.
Feed circuit A is arranged on the upper surface of printed board C5 and is electrically connected with input matching circuit, and feed circuit B is arranged on
Printed board D6 upper surfaces are simultaneously electrically connected with output matching circuit, at this point, printed board C5 and printed board D6 form for integral manufacturing.
Printed board A3, printed board B4, printed board C5 and printed board D6 three sides on be both provided with layer 7 covered with gold leaf, print
The side adjacent with power transistor is without setting layer 7 covered with gold leaf on plate；Set jagged 11 on layer 7 covered with gold leaf, manufacture layer 7 covered with gold leaf it
It is preceding, it is necessary to first plate one layer of nickel in printed board, apply that the thickness of nickel plating is as far as possible small, and concrete structure is as shown in Figure 5 and Figure 6.
Printed board A3, printed board B4, printed board C5, printed board D6 faying face on be both provided with copper clad layers 8, copper clad layers
Thickness is 15 ~ 20 μm.Printed board C5 and printed board the D6 perforate at capacitance, for installing capacitance.
Specific embodiment 2
Present embodiment and specific embodiment 1 the difference is that：The printed board C5 and printed board D6
On be additionally provided with metal cover board 9, metal cover board 9 ensures the close contact of levels printed board for compressing levels printed board.
The perforate at capacitance of metal cover board 9, for installing capacitance.Concrete structure is as shown in Figure 2, Figure 5 and Figure 6.
Specific embodiment 3
Present embodiment and specific embodiment 2 the difference is that：Printed board C5 and printed board D6 separately make
It forms, and printed board E10 is additionally provided on metal cover board 9, feed circuit A and feed circuit B are arranged at printed board E10
On, feed circuit A is electrically connected with input matching circuit, and feed circuit B is electrically connected with output matching circuit.Concrete structure such as Fig. 3,
Shown in Fig. 5 and Fig. 7.
Specific embodiment 4
Present embodiment and specific embodiment 1 the difference is that：Printed board C5 and printed board D6 separately make
It forms；And printed board E10, feed circuit A and feed circuit B are additionally provided on printed board C5 and printed board D6 and is arranged at print
On making sheet E10, feed circuit A is electrically connected with input matching circuit, and feed circuit B is electrically connected with output matching circuit.Specific knot
Structure is as shown in Fig. 4, Fig. 5 and Fig. 7.
Claims (1)
1. a kind of miniaturization strip line power amplifier module, it is characterised in that：It includes setting reeded substrate（1）, installation
In the power transistor in groove（2）, printed board A（3）, printed board B（4）, printed board C（5）, printed board D（6）, feed circuit A
With feed circuit B, printed board A（3）With printed board B（4）Mounted on substrate（1）On, printed board C（5）It is pressed against printed board A（3）
It is upper and with printed board A（3）Form the input matching circuit of power amplifier, printed board D（6）It is pressed against printed board B（4）It is upper and with
Printed board B（4）Form the output matching circuit of power amplifier, input matching circuit and power transistor（2）Input terminal electricity
Connection, output matching circuit and power transistor（2）Output terminal electrical connection, feed circuit A is electrically connected with input matching circuit,
Feed circuit B is electrically connected with output matching circuit, the printed board A（3）, printed board B（4）, printed board C（5）With printed board D
（6）Side be both provided with layer covered with gold leaf（7）, the printed board A（3）, printed board B（4）, printed board C（5）, printed board D（6）
Faying face be both provided with copper clad layers（8）；The feed circuit A is arranged on printed board C（5）Upper surface and with input match
Circuit is electrically connected, and feed circuit B is arranged on printed board D（6）Upper surface is simultaneously electrically connected with output matching circuit；The printed board
C（5）With printed board D（6）On be additionally provided with metal cover board（9）；The printed board C（5）With printed board D（6）On be provided with gold
Belong to cover board（9）, the metal cover board（9）On be additionally provided with printed board E（10）, feed circuit A and feed circuit B are arranged at
Printed board E（10）On, feed circuit A is electrically connected with input matching circuit, and feed circuit B is electrically connected with output matching circuit；Institute
The printed board C stated（5）With printed board D（6）On be additionally provided with printed board E（10）, feed circuit A and feed circuit B are arranged at
Printed board E（10）On, feed circuit A is electrically connected with input matching circuit, and feed circuit B is electrically connected with output matching circuit；Institute
The layer covered with gold leaf stated（7）It is arranged on printed board A（3）, printed board B（4）, printed board C（5）With printed board D（6）Three sides on；
The layer covered with gold leaf（7）Upper setting is jagged（11）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510872788.XA CN105338731B (en) | 2015-12-02 | 2015-12-02 | A kind of miniaturization strip line power amplifier module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510872788.XA CN105338731B (en) | 2015-12-02 | 2015-12-02 | A kind of miniaturization strip line power amplifier module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105338731A CN105338731A (en) | 2016-02-17 |
| CN105338731B true CN105338731B (en) | 2018-05-22 |
Family
ID=55288896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510872788.XA Active CN105338731B (en) | 2015-12-02 | 2015-12-02 | A kind of miniaturization strip line power amplifier module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105338731B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201392834Y (en) * | 2009-04-21 | 2010-01-27 | 无锡华测电子系统有限公司 | Multilayer microwave integrated circuit |
| CN102665155A (en) * | 2012-04-28 | 2012-09-12 | 歌尔声学股份有限公司 | Printed circuit board (PCB) of Bluetooth earphone |
| CN202841691U (en) * | 2012-10-24 | 2013-03-27 | 浙江万正电子科技有限公司 | Circuit board with metallized covered edges |
| CN103545590A (en) * | 2013-10-24 | 2014-01-29 | 中国电子科技集团公司第四十一研究所 | Method for manufacturing microwave thin film attenuator |
| CN203851101U (en) * | 2014-04-24 | 2014-09-24 | 成都锦江电子系统工程有限公司 | Small high-power microwave amplification module based on strip line mode |
| CN205179508U (en) * | 2015-12-02 | 2016-04-20 | 成都锦江电子系统工程有限公司 | Miniaturized stripline power amplification module |
-
2015
- 2015-12-02 CN CN201510872788.XA patent/CN105338731B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201392834Y (en) * | 2009-04-21 | 2010-01-27 | 无锡华测电子系统有限公司 | Multilayer microwave integrated circuit |
| CN102665155A (en) * | 2012-04-28 | 2012-09-12 | 歌尔声学股份有限公司 | Printed circuit board (PCB) of Bluetooth earphone |
| CN202841691U (en) * | 2012-10-24 | 2013-03-27 | 浙江万正电子科技有限公司 | Circuit board with metallized covered edges |
| CN103545590A (en) * | 2013-10-24 | 2014-01-29 | 中国电子科技集团公司第四十一研究所 | Method for manufacturing microwave thin film attenuator |
| CN203851101U (en) * | 2014-04-24 | 2014-09-24 | 成都锦江电子系统工程有限公司 | Small high-power microwave amplification module based on strip line mode |
| CN205179508U (en) * | 2015-12-02 | 2016-04-20 | 成都锦江电子系统工程有限公司 | Miniaturized stripline power amplification module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105338731A (en) | 2016-02-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2015085933A1 (en) | Method for manufacturing leadless printed circuit board locally plated with hard gold | |
| CN109003779B (en) | Power module and method for manufacturing the same | |
| CN105282983A (en) | Lead wire etching technology with gold fingers with three surfaces wrapped by gold | |
| CN105210462B (en) | The manufacturing method and substrate having built-in components of substrate having built-in components | |
| CN103985961A (en) | Electromagnetic band gap structure, electromagnetic band gap structure combination and mobile terminal MIMO antenna | |
| CN105338731B (en) | A kind of miniaturization strip line power amplifier module | |
| CN205179508U (en) | Miniaturized stripline power amplification module | |
| CN108093567A (en) | A kind of thickness copper method for manufacturing printed circuit board | |
| CN102440081A (en) | High impedance trace | |
| CN209299596U (en) | A kind of steel net plate | |
| CN109348642A (en) | A kind of golden method of wiring board whole plate electricity | |
| CN104302120A (en) | Double-faced reflow soldering method for Roger substrate | |
| CN202178915U (en) | Blind hole double-face heat conducting circuit board | |
| CN203896582U (en) | High-efficiency heat radiation type PCB | |
| JP3119497U (en) | Current collector plate used in fuel cells | |
| CN203407083U (en) | A LED wire circuit board with one insulation bearing layer and a LED lamp belt | |
| CN207040003U (en) | A kind of high-frequency microwave circuit board | |
| CN206849831U (en) | A kind of insulation system of power electronic devices | |
| CN108492976B (en) | Coil structure and preparation method of composite coil structure | |
| CN203590670U (en) | Heat radiation structure of radio frequency power amplifier | |
| CN105188271B (en) | Addition process boss printed board manufacture craft | |
| CN206575692U (en) | A kind of compound steel mesh with fixed plate bit function | |
| CN105101613A (en) | Method for improving heat conduction capability of printed board of surface-mounted device | |
| CN206059641U (en) | NFC antenna and electronic equipment based on dual platen cabling | |
| CN215581909U (en) | Gold-plated circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |