CN204191077U - A kind of novel inverter bridge module heat-pipe radiator - Google Patents
A kind of novel inverter bridge module heat-pipe radiator Download PDFInfo
- Publication number
- CN204191077U CN204191077U CN201420618072.8U CN201420618072U CN204191077U CN 204191077 U CN204191077 U CN 204191077U CN 201420618072 U CN201420618072 U CN 201420618072U CN 204191077 U CN204191077 U CN 204191077U
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- heat
- substrate
- pipe
- heat pipe
- electronic devices
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Abstract
The utility model discloses a kind of novel inverter bridge module heat-pipe radiator, comprise substrate, substrate comprises relative heat-absorbent surface and radiating surface, and heat-absorbent surface is sticked on electronic devices and components, and radiating surface extension is provided with some radiating fins, is provided with heat pipe in substrate; The heat-absorbent surface of described substrate is provided with groove, heat pipe welding is embedded in the groove on heat-absorbent surface, the one side of heat pipe is sticked on electronic devices and components, the contact-making surface of the heat-absorbent surface of substrate, heat pipe and electronic devices and components is the flat surface of an one, is filled with high conductive filler metal material in the gap of groove and heat pipe.The utility model can make the thermal source of electronic devices and components better more reasonably conduct and pass to fin to substrate and by substrate, good heat dissipation effect, and production technology is simple.
Description
Technical field
The utility model relates to heat sink technology field, is specifically related to a kind of novel inverter bridge module heat-pipe radiator.
Background technology
Along with the continuous renewal of electronic component is regenerated, the speed of service of various equipment is also more and more faster, and the heat produced also gets more and more, and the radiating effect of radiator becomes an important technical indicator.
In prior art, radiator comprises the substrate be sticked on electronic component and the radiating fin be arranged on substrate, and substrate is provided with through hole, is inserted with heat pipe in through hole, is filled with working media in heat pipe.This radiator is also referred to as heat-pipe radiator.
Its weak point is; electronic devices and components thermal source and heat-pipe radiator contact heat resistance large; work in-process easily causes heat pipe to leak; the heat of thermal source all can not be delivered to substrate by heat pipe uniformly simultaneously; and the fin to be connected with substrate; cause radiating effect general, be difficult to do maximum protection to thermal source.
Utility model content
The purpose of this utility model is to overcome above-mentioned the deficiencies in the prior art, provides one that thermal source can be made better more reasonably to conduct and passes to fin to substrate and by substrate, good heat dissipation effect, the simple novel inverter bridge module heat-pipe radiator of production technology.
A kind of novel inverter bridge module heat-pipe radiator, comprise substrate, substrate comprises relative heat-absorbent surface and radiating surface, and heat-absorbent surface is sticked on electronic devices and components, is provided with heat pipe in substrate; The heat-absorbent surface of described substrate is provided with groove, heat pipe welding is embedded in the groove on heat-absorbent surface, the one side of heat pipe is sticked on electronic devices and components, the contact-making surface of the heat-absorbent surface of substrate, heat pipe and electronic devices and components is the flat surface of an one, is filled with high conductive filler metal material in the gap of groove and heat pipe.
Further describing as technique scheme:
Described substrate is profile-type one structure base board.
Further describing as technique scheme:
The plate entity of described substrate to be cross section be single plane, radiating surface extends and is provided with some radiating fins.
Further describing as technique scheme:
Described high conductive filler metal material is identical with the material of substrate.
Heat-pipe radiator of the present utility model, by heat pipe being embedded the heat-absorbent surface of radiator base plate, high conductive filler metal material is filled with in substrate in groove and the gap of heat pipe, to be combined together formula by welding procedure heat pipe and substrate, make heat pipe and heat source contact portion on substrate heat-absorbent surface divide surfacing by Cutting Process, thus decrease thermal resistance, thermal source is better more reasonably conducted to substrate by heat pipe, and substrate passes to fin, radiating effect is better.
And the utility model reduces the complexity of the production technology of heat-pipe radiator, reduces product cost.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model (not being with radiating fin);
Fig. 2 is structural representation of the present utility model (with radiating fin).
Embodiment
See Fig. 1 and Fig. 2, the novel inverter bridge module heat-pipe radiator of the one that the utility model provides, comprise substrate 1, substrate 1 comprises relative heat-absorbent surface 11 and radiating surface 12, heat-absorbent surface 11 is sticked at electronic devices and components 2 (such as: IGBT module, resistance etc.) on, radiating surface 12 extension is provided with some radiating fins 3, heat pipe 4 is provided with in substrate 1, in order to solve the technical problem described in background technology, the technical solution of the utility model is, the heat-absorbent surface 11 of substrate 1 is provided with groove 5, heat pipe 4 welding is embedded in the groove 5 on heat-absorbent surface 11, to be combined together formula by welding procedure heat pipe and substrate, the one side of heat pipe 4 is sticked on electronic devices and components 2, the heat-absorbent surface of substrate 1 is made by Cutting Process, heat pipe 4 and the contact-making surface of electronic devices and components 2 are the flat surface of an one, high conductive filler metal material is filled with in groove 5 and the gap of heat pipe 4.
Heat pipe 4 directly can absorb the thermal source that electronic devices and components 2 produce, make the heat of electronic devices and components 2 by heat pipe 4 evenly distribution on a heat sink, thus the efficiency of whole radiator is greatly improved.
As further describing technique scheme,
High conductive filler metal material is identical with the material of substrate, object is, heat pipe 4 and substrate 1 better can be combined together, thus increase the heat transfer between heat pipe 4 and substrate 1, thus the heat absorbing thermal source in heat pipe 4 can more efficiently must be absorbed by substrate 1, increase sink-efficiency further.
Certainly, said structure of the present utility model also can be applicable to other dissimilar radiator and the radiating electronic electric device with metal shell, heat pipe 4 also can adjusting size as required, substrate 1 can adopt profile-type one structure base board or substrate cross section to be the plate entity of single plane, when adopting the plate entity of single plane, radiating surface 12 extension of substrate is provided with some radiating fins 3.
The above is only preferred implementation of the present utility model, protection range of the present utility model be not only confined to above-described embodiment, and all technical schemes belonged under the utility model thinking all belong to protection range of the present utility model.It should be pointed out that for those skilled in the art, do not departing from the some improvements and modifications under the utility model principle prerequisite, these improvements and modifications also should be considered as protection range of the present utility model.
Claims (4)
1. a novel inverter bridge module heat-pipe radiator, comprise substrate, substrate comprises relative heat-absorbent surface and radiating surface, heat-absorbent surface is sticked on electronic devices and components, heat pipe is provided with in substrate, it is characterized in that: the heat-absorbent surface of described substrate is provided with groove, heat pipe welding is embedded in the groove on heat-absorbent surface, the one side of heat pipe is sticked on electronic devices and components, the contact-making surface of the heat-absorbent surface of substrate, heat pipe and electronic devices and components is the flat surface of an one, is filled with high conductive filler metal material in the gap of groove and heat pipe.
2. the novel inverter bridge module heat-pipe radiator of one according to claim 1, is characterized in that: described substrate is profile-type one structure base board.
3. the novel inverter bridge module heat-pipe radiator of one according to claim 1, is characterized in that: the plate entity of described substrate to be cross section be single plane, and radiating surface extends and is provided with some radiating fins.
4. the novel inverter bridge module heat-pipe radiator of the one according to claim 1,2 or 3, is characterized in that: described high conductive filler metal material is identical with the material of substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420618072.8U CN204191077U (en) | 2014-10-23 | 2014-10-23 | A kind of novel inverter bridge module heat-pipe radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420618072.8U CN204191077U (en) | 2014-10-23 | 2014-10-23 | A kind of novel inverter bridge module heat-pipe radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204191077U true CN204191077U (en) | 2015-03-04 |
Family
ID=52623037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420618072.8U Expired - Fee Related CN204191077U (en) | 2014-10-23 | 2014-10-23 | A kind of novel inverter bridge module heat-pipe radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204191077U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107871723A (en) * | 2017-11-02 | 2018-04-03 | 北京航天发射技术研究所 | A kind of heat sink of pre-buried heat pipe and its method applied to electronic equipment |
| CN109845424A (en) * | 2016-10-17 | 2019-06-04 | Zf 腓德烈斯哈芬股份公司 | For exporting the equipment and its manufacturing method of heat |
| CN110131796A (en) * | 2019-05-20 | 2019-08-16 | 广东美的暖通设备有限公司 | Radiator, air conditioner and its control method, computer readable storage medium |
| CN111465268A (en) * | 2020-04-14 | 2020-07-28 | 华为技术有限公司 | Radiator and manufacturing method thereof and electronic equipment |
| CN111526458A (en) * | 2020-04-26 | 2020-08-11 | 歌尔股份有限公司 | Speaker module and electronic equipment |
| CN111614232A (en) * | 2020-06-19 | 2020-09-01 | 西安精石电气科技有限公司 | Power module of energy storage converter and energy storage converter |
| CN113001128A (en) * | 2021-03-11 | 2021-06-22 | 杭州祥博传热科技股份有限公司 | Method for processing heat pipe radiator by adopting liquid welding |
-
2014
- 2014-10-23 CN CN201420618072.8U patent/CN204191077U/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109845424A (en) * | 2016-10-17 | 2019-06-04 | Zf 腓德烈斯哈芬股份公司 | For exporting the equipment and its manufacturing method of heat |
| CN109845424B (en) * | 2016-10-17 | 2021-11-09 | Zf 腓德烈斯哈芬股份公司 | Device for dissipating heat and method for producing the same |
| CN107871723A (en) * | 2017-11-02 | 2018-04-03 | 北京航天发射技术研究所 | A kind of heat sink of pre-buried heat pipe and its method applied to electronic equipment |
| CN110131796A (en) * | 2019-05-20 | 2019-08-16 | 广东美的暖通设备有限公司 | Radiator, air conditioner and its control method, computer readable storage medium |
| CN111465268A (en) * | 2020-04-14 | 2020-07-28 | 华为技术有限公司 | Radiator and manufacturing method thereof and electronic equipment |
| CN111465268B (en) * | 2020-04-14 | 2022-05-17 | 华为数字能源技术有限公司 | Radiator and manufacturing method thereof and electronic equipment |
| CN114980663A (en) * | 2020-04-14 | 2022-08-30 | 华为数字能源技术有限公司 | Radiator and manufacturing method thereof and electronic equipment |
| CN114980663B (en) * | 2020-04-14 | 2023-12-08 | 华为数字能源技术有限公司 | Radiator, manufacturing method thereof and electronic equipment |
| CN111526458A (en) * | 2020-04-26 | 2020-08-11 | 歌尔股份有限公司 | Speaker module and electronic equipment |
| CN111614232A (en) * | 2020-06-19 | 2020-09-01 | 西安精石电气科技有限公司 | Power module of energy storage converter and energy storage converter |
| CN111614232B (en) * | 2020-06-19 | 2021-07-27 | 西安精石电气科技有限公司 | Power module of energy storage converter and energy storage converter |
| CN113001128A (en) * | 2021-03-11 | 2021-06-22 | 杭州祥博传热科技股份有限公司 | Method for processing heat pipe radiator by adopting liquid welding |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 234000 hi tech Industrial Development Zone, Anhui, Suzhou Patentee after: Anhui Sewoll Electrical Technology Co., Ltd. Address before: 234000 hi tech Industrial Development Zone, Anhui, Suzhou Patentee before: ANHUI SAIWO ELECTRICAL TECHNOLOGY CO., LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150304 Termination date: 20171023 |